CN107817148A - A kind of adhering device and application method for accurately controlling banjo fixing butt jointing bondline thickness - Google Patents
A kind of adhering device and application method for accurately controlling banjo fixing butt jointing bondline thickness Download PDFInfo
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- CN107817148A CN107817148A CN201711193199.4A CN201711193199A CN107817148A CN 107817148 A CN107817148 A CN 107817148A CN 201711193199 A CN201711193199 A CN 201711193199A CN 107817148 A CN107817148 A CN 107817148A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 241000538562 Banjos Species 0.000 title abstract 2
- 238000006073 displacement reaction Methods 0.000 claims abstract description 5
- 239000012790 adhesive layer Substances 0.000 claims description 25
- 210000001503 joint Anatomy 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 238000012360 testing method Methods 0.000 abstract description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 4
- 238000009863 impact test Methods 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000003190 viscoelastic substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
- G01B5/066—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness of coating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
技术领域technical field
本发明涉及粘接工装技术领域，特别涉及一种可精确控制对接接头胶层厚度的粘接装置及使用方法。The invention relates to the technical field of bonding tooling, in particular to a bonding device capable of precisely controlling the thickness of a butt joint adhesive layer and a method for using it.
背景技术Background technique
胶接技术与螺纹连接、焊接、铆接等传统连接方式相比较，具有适用范围广、应力集中小、强度高、耐疲劳性能好，结构质量轻、密封性好等优点而广泛应用于航空航天、汽车、电子产品等领域。Compared with traditional connection methods such as threaded connection, welding and riveting, adhesive bonding technology has the advantages of wide application range, small stress concentration, high strength, good fatigue resistance, light structure weight and good sealing performance, so it is widely used in aerospace, Automobiles, electronic products and other fields.
当今，胶接技术已成为一种不可缺少的技术。但在实际应用中，胶接接头会经常受到冲击载荷的影响，由于胶粘剂为粘弹性材料，因此胶接接头的冲击强度受很多因素影响，在实际使用中需要对胶接接头的冲击强度进行测试。目前常用的冲击试验有摆锤剪切冲击试验、Charpy冲击试验和Izod冲击试验，而冲击试验中需要制备具有相同胶层厚度的Charpy冲击试样或Izod冲击试样，因为胶层厚度对胶接接头的冲击强度也有显著的影响，而如何制备胶层厚度一致的胶接接头冲击试样，需要设计粘接装置。通常使用的办法是在两个被粘接试样中间放入控制胶层厚度的垫片、细丝或者玻璃微珠，胶层固化之后再取出或者留在胶层内，这种方法制备的胶接接头试样由于放入了细丝或者玻璃微珠而使胶层存在缺陷，影响胶粘剂的强度测试。Today, bonding technology has become an indispensable technology. However, in practical applications, adhesive joints are often affected by impact loads. Since the adhesive is a viscoelastic material, the impact strength of adhesive joints is affected by many factors. In actual use, it is necessary to test the impact strength of adhesive joints. . At present, the commonly used impact tests include pendulum shear impact test, Charpy impact test and Izod impact test. In the impact test, it is necessary to prepare Charpy impact specimens or Izod impact specimens with the same adhesive layer thickness, because the thickness of the adhesive layer has a great influence on the bonding. The impact strength of the joint also has a significant impact, and how to prepare the impact test specimen of the glued joint with a uniform glue layer thickness requires the design of the bonding device. The commonly used method is to put spacers, filaments or glass beads to control the thickness of the adhesive layer between the two bonded samples. After the adhesive layer is cured, it is taken out or left in the adhesive layer. The adhesive prepared by this method The joint sample has defects in the adhesive layer due to the insertion of filaments or glass beads, which affects the strength test of the adhesive.
发明内容Contents of the invention
本发明的目的是提出一种可精确控制对接接头胶层厚度的粘接装置及操作方法，解决现有技术中胶层厚度无法精确控制，进而无法为胶粘剂的冲击强度测试提供合格试验件的问题。The purpose of the present invention is to propose a bonding device and operation method that can accurately control the thickness of the glue layer of the butt joint, so as to solve the problem that the thickness of the glue layer cannot be accurately controlled in the prior art, and thus cannot provide qualified test pieces for the impact strength test of the adhesive .
为了解决上述技术问题，本发明提出以下技术方案：一种可精确控制对接接头胶层厚度的粘接装置，它包括基座，所述基座的一端安装有螺杆调节组件，所述螺杆调节组件的一端固定有滑块，所述滑块同时与设置在基座上的滑槽构成滑槽直线运动，所述滑块与滑槽顶端设置的刻度尺相配合，指示滑动位移，所述基座侧部安装有侧向限位组件。In order to solve the above technical problems, the present invention proposes the following technical solutions: a bonding device that can precisely control the thickness of the butt joint adhesive layer, which includes a base, and a screw adjustment assembly is installed on one end of the base, and the screw adjustment assembly A slider is fixed at one end of the slider, and the slider and the chute arranged on the base form a linear motion of the chute at the same time. The slider cooperates with the scale set on the top of the chute to indicate the sliding displacement. The base Lateral limit components are installed on the side.
所述基座包括底板，所述底板的一端固定安装有前支撑板，另一端固定有后支撑板，在其侧面分别安装有侧固定板和侧支撑板。The base includes a base plate, one end of the base plate is fixedly mounted with a front support plate, the other end is fixed with a rear support plate, and a side fixing plate and a side support plate are respectively installed on the sides of the base plate.
所述螺杆调节组件包括丝杠螺母，所述丝杠螺母固定安装在基座的前支撑板上，所述丝杆螺母上通过丝杆传动配合安装有丝杆轴，所述丝杆轴的一端固定有旋钮，所述丝杆轴的另一端支撑在轴承上，所述轴承安装在滑块的中心孔，所述轴承的外圈由轴承端盖定位，所述轴承的内圈由安装在丝杆轴上的第一卡环进行轴向定位。The screw adjustment assembly includes a lead screw nut, which is fixedly installed on the front support plate of the base, and a screw shaft is mounted on the screw nut through screw drive, and one end of the screw shaft A knob is fixed, the other end of the screw shaft is supported on a bearing, and the bearing is installed in the center hole of the slider, the outer ring of the bearing is positioned by the bearing end cover, and the inner ring of the bearing is fixed by the wire The first snap ring on the shaft performs axial positioning.
所述刻度尺包括游标刻度尺和主刻度尺，所述游标刻度尺安装在滑块上，所述主刻度尺安装在基座的侧支撑板的滑槽顶部。The scale includes a vernier scale and a main scale, the vernier scale is installed on the slider, and the main scale is installed on the top of the chute of the side support plate of the base.
所述侧向限位组件包括两根导向轴，两根所述导向轴装配在基座的侧固定板上，两根所述导向轴的一端装有拉手，另一端固定有U型板，两根所述导向轴上安装有弹簧，所述U型板上固定有连接板，所述连接板上加工有插销孔，所述插销孔上配合安装有插销，所述U型板上加工有四组安装孔，所述安装孔上分别安装有限位轴，所述限位轴上安装有限位滚子，所述限位轴通过第二卡环进行轴向限位固定。The lateral limit assembly includes two guide shafts, the two guide shafts are assembled on the side fixing plate of the base, one end of the two guide shafts is equipped with a handle, and the other end is fixed with a U-shaped plate. A spring is installed on the guide shaft, a connecting plate is fixed on the U-shaped plate, a pin hole is processed on the connecting plate, a pin is installed on the pin hole, and four pin holes are processed on the U-shaped plate. A group of mounting holes, the mounting holes are respectively equipped with limit shafts, limit rollers are installed on the limit shafts, and the limit shafts are fixed axially by the second snap ring.
所述刻度尺中的游标刻度尺的测量精度为0.02mm。The measurement accuracy of the vernier scale in the scale is 0.02mm.
任意一种可精确控制对接接头胶层厚度的粘接装置的使用方法，它包括以下步骤：Any method for using a bonding device capable of precisely controlling the thickness of a butt joint adhesive layer, which includes the following steps:
Step1：首先将滑块移动到靠近前支撑板；将制备好但还未涂胶的被粘接试样A和被粘接试样B按胶接操作过程紧贴侧支撑板放置，并通过后支撑板进行末端限位；Step1: First, move the slider close to the front support plate; place the prepared but not glued bonded sample A and the bonded sample B against the side support plate according to the gluing operation process, and pass through the back The support plate carries out the end limit;
Step2：将连接板上的插销取出放置在侧固定板上方的插销孔内，使侧向限位组件中的限位滚子对被粘接试样进行侧向限位，旋转旋钮使滑块接触被粘接试样B，从而实现被粘接试样的运动精确可控；Step2: Take out the pin on the connecting plate and place it in the pin hole above the side fixing plate, so that the limit roller in the side limit component can limit the bonded sample laterally, and turn the knob to make the slider contact The bonded sample B, so as to realize the precise and controllable movement of the bonded sample;
Step3：继续旋转旋钮直至两被粘接面紧密接触之后，记下此时主刻度尺和游标刻度尺的刻度，然后将侧向限位组件中的拉手拉回并将插销插入连接板中的销孔内使侧向限位组件复位，并将滑块退回然后取出试样。Step3: Continue to rotate the knob until the two surfaces to be bonded are in close contact, record the scales of the main scale and vernier scale at this time, then pull back the handle in the lateral limit assembly and insert the pin into the pin in the connecting plate Reset the lateral limit assembly in the hole, return the slider and take out the sample.
本发明有如下有益效果：The present invention has following beneficial effect:
1、本发明通过侧支撑板、后支撑板和侧向限位组件可实现两被粘接试样的精确对准，通过主刻度尺和游标刻度尺实现对胶层厚度的精确控制，本粘接装置操作简单方便，可用于胶粘剂冲击强度测试中胶接接头试样的制备。1. The present invention can realize the precise alignment of the two bonded samples through the side support plate, the rear support plate and the lateral limit assembly, and realize the precise control of the thickness of the adhesive layer through the main scale and the vernier scale. The jointing device is simple and convenient to operate, and can be used for the preparation of adhesive joint samples in the impact strength test of adhesives.
附图说明Description of drawings
下面结合附图和实施例对本发明作进一步说明。The present invention will be further described below in conjunction with drawings and embodiments.
图1为本发明正面立体结构示意图。Figure 1 is a schematic diagram of the front three-dimensional structure of the present invention.
图2为本发明的侧面立体结构示意图。Fig. 2 is a schematic side view of the three-dimensional structure of the present invention.
图3为本发明的立体结构示意图。Fig. 3 is a schematic diagram of the three-dimensional structure of the present invention.
图4为本发明胶接接头粘接时的示意图。Fig. 4 is a schematic diagram of the bonding of the adhesive joint of the present invention.
图5为本实用新精确控制胶层厚度后的示意图。Fig. 5 is a schematic diagram of the utility model after the thickness of the adhesive layer is accurately controlled.
图中：基座1、螺杆调节组件2、滑块3、刻度尺4、侧向限位组件5、被粘接试样6；In the figure: base 1, screw adjustment component 2, slider 3, scale 4, lateral limit component 5, bonded sample 6;
底板101、前支撑板102、侧固定板103、侧支撑板104、后支撑板105；Bottom plate 101, front support plate 102, side fixing plate 103, side support plate 104, rear support plate 105;
旋钮201、丝杆轴202、丝杠螺母203、轴承端盖204、轴承205；Knob 201, screw shaft 202, screw nut 203, bearing end cover 204, bearing 205;
游标刻度尺401、主刻度尺402；Vernier scale 401, main scale 402;
U型板501、连接板502、拉手503、插销504、导向轴505、弹簧506、限位轴507、限位滚子508、第二卡环509；U-shaped plate 501, connecting plate 502, handle 503, latch 504, guide shaft 505, spring 506, limit shaft 507, limit roller 508, second snap ring 509;
被粘接试样601、胶层602、被粘接试样603。The sample to be bonded 601, the adhesive layer 602, and the sample to be bonded 603.
具体实施方式Detailed ways
下面结合附图对本发明的实施方式做进一步的说明。Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
实施例1：Example 1:
如图1-5所示，一种可精确控制对接接头胶层厚度的粘接装置，它包括基座1，所述基座1的一端安装有螺杆调节组件2，所述螺杆调节组件2的一端固定有滑块3，所述滑块3同时与设置在基座1上的滑槽构成滑槽直线运动，所述滑块3与滑槽顶端设置的刻度尺4相配合，指示滑动位移，所述基座1侧部安装有侧向限位组件5。通过采用上述的粘接装置通过侧支撑板、后支撑板和侧向限位组件可实现两被粘接试样的精确对准，通过主刻度尺和游标刻度尺实现对胶层厚度的精确控制，本粘接装置操作简单方便，可用于胶粘剂冲击强度测试中胶接接头试样的制备。As shown in Figures 1-5, a bonding device that can precisely control the thickness of the butt joint adhesive layer includes a base 1, and a screw adjustment assembly 2 is installed on one end of the base 1, and the screw adjustment assembly 2 One end is fixed with a slider 3, and the slider 3 forms a linear movement of the chute with the chute arranged on the base 1 at the same time, and the slider 3 cooperates with the scale 4 provided at the top of the chute to indicate the sliding displacement, A lateral limit assembly 5 is installed on the side of the base 1 . By using the above-mentioned bonding device, the precise alignment of the two bonded samples can be realized through the side support plate, the rear support plate and the lateral limit assembly, and the precise control of the thickness of the adhesive layer can be realized through the main scale and vernier scale , the bonding device is simple and convenient to operate, and can be used for the preparation of adhesive joint samples in the impact strength test of adhesives.
进一步的，所述基座1包括底板101，所述底板101的一端固定安装有前支撑板102，另一端固定有后支撑板105，在其侧面分别安装有侧固定板103和侧支撑板104。Further, the base 1 includes a bottom plate 101, one end of the bottom plate 101 is fixedly mounted with a front support plate 102, the other end is fixed with a rear support plate 105, and a side fixing plate 103 and a side support plate 104 are respectively installed on its side. .
进一步的，所述螺杆调节组件2包括丝杠螺母203，所述丝杠螺母203固定安装在基座1的前支撑板102上，所述丝杆螺母203上通过丝杆传动配合安装有丝杆轴202，所述丝杆轴202的一端固定有旋钮201，所述丝杆轴202的另一端支撑在轴承205上，所述轴承205安装在滑块3的中心孔，所述轴承205的外圈由轴承端盖204定位，所述轴承205的内圈由安装在丝杆轴202上的第一卡环206进行轴向定位。通过所述的螺杆调节组件2能够通过螺纹传动配合精确控制胶层厚度。Further, the screw adjustment assembly 2 includes a lead screw nut 203, the lead screw nut 203 is fixedly installed on the front support plate 102 of the base 1, and a screw rod is mounted on the screw nut 203 through screw drive. shaft 202, one end of the screw shaft 202 is fixed with a knob 201, the other end of the screw shaft 202 is supported on a bearing 205, and the bearing 205 is installed in the center hole of the slider 3, and the outer surface of the bearing 205 The ring is positioned by the bearing end cover 204, and the inner ring of the bearing 205 is axially positioned by the first snap ring 206 installed on the screw shaft 202. The thickness of the adhesive layer can be precisely controlled through the threaded drive fit through the screw adjusting assembly 2 .
进一步的，所述刻度尺4包括游标刻度尺401和主刻度尺402，所述游标刻度尺401安装在滑块3上，所述主刻度尺402安装在基座1的侧支撑板104的滑槽顶部。通过游标刻度尺401和主刻度尺402之间的配合保证了粘接的精度。通过所述的游标刻度尺401和主刻度尺402之间的配合能够保证粘接的精度。Further, the scale 4 includes a vernier scale 401 and a main scale 402, the vernier scale 401 is installed on the slider 3, and the main scale 402 is installed on the slide of the side support plate 104 of the base 1 Groove top. The cooperation between the vernier scale 401 and the main scale 402 ensures the precision of bonding. Through the cooperation between the vernier scale 401 and the main scale 402, the precision of bonding can be guaranteed.
进一步的，所述侧向限位组件5包括两根导向轴505，两根所述导向轴505装配在基座1的侧固定板103上，两根所述导向轴505的一端装有拉手503，另一端固定有U型板501，两根所述导向轴505上安装有弹簧506，所述U型板501上固定有连接板502，所述连接板502上加工有插销孔，所述插销孔上配合安装有插销504，所述U型板501上加工有四组安装孔，所述安装孔上分别安装有限位轴507，所述限位轴507上安装有限位滚子508，所述限位轴507通过第二卡环509进行轴向限位固定。通过所述的侧向限位组件5能够对试样进行侧向的限位。Further, the lateral limit assembly 5 includes two guide shafts 505, the two guide shafts 505 are assembled on the side fixing plate 103 of the base 1, one end of the two guide shafts 505 is equipped with a handle 503 , the other end is fixed with a U-shaped plate 501, two springs 506 are installed on the guide shafts 505, a connecting plate 502 is fixed on the described U-shaped plate 501, and a bolt hole is processed on the connecting plate 502, and the bolt A bolt 504 is mounted on the hole, and four sets of mounting holes are processed on the U-shaped plate 501. Limiting shafts 507 are respectively installed on the mounting holes, and limiting rollers 508 are installed on the limiting shafts 507. The limiting shaft 507 is axially limited and fixed by the second snap ring 509 . The sample can be laterally limited by the lateral limiting component 5 .
进一步的，所述刻度尺4中的游标刻度尺401的测量精度为0.02mm。通过上述的测量精度保证了试样的粘接精度，进而使其满足粘接要求。Further, the measurement accuracy of the vernier scale 401 in the scale 4 is 0.02 mm. The above-mentioned measurement accuracy ensures the bonding accuracy of the sample, and then makes it meet the bonding requirements.
实施例2：Example 2:
任意一种可精确控制对接接头胶层厚度的粘接装置的使用方法，它包括以下步骤：Any method for using a bonding device capable of precisely controlling the thickness of a butt joint adhesive layer, which includes the following steps:
Step1：首先将滑块3移动到靠近前支撑板102；将制备好但还未涂胶的被粘接试样A601和被粘接试样B603按胶接操作过程紧贴侧支撑板102放置，并通过后支撑板105进行末端限位；Step1: first move the slider 3 close to the front support plate 102; place the prepared but not yet glued bonded sample A601 and bonded sample B603 against the side support plate 102 according to the gluing operation process, And through the back support plate 105 to limit the end;
Step2：将连接板502上的插销504取出放置在侧固定板103上方的插销孔内，使侧向限位组件5中的限位滚子508对被粘接试样进行侧向限位，旋转旋钮201使滑块3接触被粘接试样B603，从而实现被粘接试样的运动精确可控；Step2: Take out the pin 504 on the connecting plate 502 and place it in the pin hole above the side fixing plate 103, make the limit roller 508 in the lateral limit assembly 5 limit the bonded sample laterally, and rotate The knob 201 makes the slider 3 contact the bonded sample B603, so as to realize the precise and controllable movement of the bonded sample;
Step3：继续旋转旋钮201直至两被粘接面紧密接触之后，记下此时主刻度尺402和游标刻度尺401的刻度，然后将侧向限位组件5中的拉手503拉回并将插销504插入连接板502中的销孔内使侧向限位组件5复位，并将滑块3退回然后取出试样。Step3: Continue to rotate the knob 201 until the two surfaces to be bonded are in close contact, record the scales of the main scale 402 and the vernier scale 401 at this time, and then pull back the handle 503 in the lateral limit assembly 5 and push the pin 504 Insert into the pin hole in the connecting plate 502 to reset the lateral limit assembly 5, return the slide block 3 and then take out the sample.
本发明的工作过程和工作原理为：Work process and working principle of the present invention are:
首先将滑块移动到靠近前支撑板，将制备好但还未涂胶的被粘接试样A和被粘接试样B按胶接操作过程紧贴侧支撑板放置，并通过后支撑板进行末端限位，将连接板上的插销取出放置在侧固定板上方的孔内，使侧向限位组件中的限位滚子对被粘接试样进行侧向限位，旋转旋钮使滑块接触被粘接试样B，从而实现被粘接试样的运动精确可控，继续旋转旋钮直至两被粘接面紧密接触之后，记下此时主刻度尺和游标刻度尺的刻度，然后将侧向限位组件中的拉手拉回并将插销插入连接板中的销孔内使侧向限位组件复位，并将滑块退回然后取出试样。First, move the slider to the front support plate, place the prepared but not yet glued bonded sample A and bonded sample B against the side support plate according to the gluing operation process, and pass through the rear support plate To limit the end, take out the pin on the connecting plate and place it in the hole above the side fixing plate, so that the limit roller in the side limit component can limit the bonded sample laterally, and turn the knob to make the slide The block contacts the bonded sample B, so as to realize the precise and controllable movement of the bonded sample, continue to rotate the knob until the two bonded surfaces are in close contact, record the scales of the main scale and the vernier scale at this time, and then Pull back the handle in the lateral limit assembly and insert the pin into the pin hole in the connecting plate to reset the lateral limit assembly, return the slider and take out the sample.
粘接时，涂好胶之后的被粘接试样按原来的顺序将被粘接试样A和被粘接试样B按胶接操作过程紧贴侧支撑板放置，同样使被粘接试样A末端贴紧后支撑板，并将连接板上的插销取出放置在侧固定板上方的销孔内，使侧向限位组件中的限位滚子对被粘接试样进行侧向限位，根据所要制备胶接试样的胶层厚度计算涂胶之后主刻度尺和游标刻度尺的刻度，旋转旋钮使滑块推动被粘接试样B沿着侧支撑板运动，直到主刻度尺和游标刻度尺的刻度满足要求，从而使胶接接头的胶层厚度精确可控。刮除多余的胶粘剂，待胶层固化之后将拉手拉回，并通过插销将侧向限位组件复位，取出试样即可得到胶层厚度精确可控的对接胶接接头。When bonding, place the bonded sample A and the bonded sample B close to the side support plate according to the bonding operation process in the original order after the glue is applied, and also make the bonded sample The end of sample A is tightly attached to the rear support plate, and the pin on the connecting plate is taken out and placed in the pin hole above the side fixing plate, so that the limit roller in the lateral limit component can limit the bonded sample laterally. According to the thickness of the adhesive layer of the bonded sample to be prepared, calculate the scale of the main scale and the vernier scale after glue application, turn the knob to push the slider to move the bonded sample B along the side support plate until the main scale The scale of the vernier scale meets the requirements, so that the thickness of the adhesive layer of the adhesive joint can be accurately controlled. Scrape off the excess adhesive, pull back the handle after the adhesive layer is cured, reset the lateral limit assembly through the pin, and take out the sample to obtain a butt joint with an accurate and controllable adhesive layer thickness.
通过上述的说明内容，本领域技术人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改都在本发明的保护范围之内。本发明的未尽事宜，属于本领域技术人员的公知常识。Through the above description, those skilled in the art can make various changes and modifications without departing from the technical idea of the present invention, all of which are within the protection scope of the present invention. Matters not covered in the present invention belong to the common knowledge of those skilled in the art.
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