CN109887859A - Light irradiation device and film forming device - Google Patents
Light irradiation device and film forming device Download PDFInfo
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- CN109887859A CN109887859A CN201811404713.9A CN201811404713A CN109887859A CN 109887859 A CN109887859 A CN 109887859A CN 201811404713 A CN201811404713 A CN 201811404713A CN 109887859 A CN109887859 A CN 109887859A
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Abstract
The present invention provides a kind of light irradiation device and film forming device that indium oxide predecessor can be made to activate well.The light irradiation device irradiates ultraviolet light to the substrate (W) for being formed with the coated film comprising indium oxide predecessor from multiple Excimer lamps (51).Arrangement pitch (p) of the irradiation interval (d) of multiple Excimer lamps (51) and substrate (W) obviously than multiple Excimer lamps (51) is short.Irradiation interval (d) is 2mm or more and 10mm or less.Space between multiple Excimer lamps (51) and substrate (W) is set as atmospheric environment.Substrate (W) is slided relative to multiple Excimer lamps (51) to move, thus ultraviolet light is equably radiated in containing aerobic environment in the coated film on substrate (W), and makes the optical activation well of indium oxide predecessor contained in coated film.
Description
Technical field
The present invention relates to the bases that a kind of formation to for semiconductor applications has the coated film of the predecessor comprising indium oxide
Plate irradiates ultraviolet light to make the light irradiation device of this indium oxide predecessor optical activation and including the film of this light irradiation device
Form device.
Background technique
Sputtering process is typically used when making the forming thin film of the metal oxides such as indium oxide.In sputtering process,
Make the ion collision target of argon etc. in vacuum chamber, and the build-up of particles got is made to make film on a surface of a substrate
Film forming.But sputtering process is in addition to the device for needing to generate high vacuum, have the drawback that when oxidize metal film at
When film, the characteristic decline of oxygen vacancy (oxygen vacancy) and film is generated.In addition, there is also be difficult in sputtering process
Adjust this problem of the ratio of components of film.
Therefore, it is studying using liquid phase method and is manufacturing the film of metal oxide.For example, in patent document 1, patent text
It offers in 2 and proposes there is following technology: the composition containing indium oxide predecessor is coated on substrate, the composition is irradiated
After the ultraviolet light of provision wavelengths range, composition is converted by the layer containing indium oxide by heat.
[existing technical literature]
[patent document]
[patent document 1] International Publication No. 2011/073005
[patent document 2] International Publication No. 2012/062575
Summary of the invention
[problem to be solved by the invention]
To containing indium oxide predecessor composition irradiation ultraviolet light be in order to make this indium oxide predecessor optical activation,
Disclosing in patent document 1, patent document 2 has using low-pressure mercury light irradiation ultraviolet light.But irradiated from Cooper-Hewitt lamp
The energy of ultraviolet light is low, therefore there are problems that indium oxide predecessor can not be made fully to activate this.
The present invention is winner in view of the project, and its purpose is to provide one kind, and indium oxide predecessor can be made to live well
The light irradiation device and film forming device of change.
[technical means to solve problem]
In order to solve the problem, the invention of technical solution 1 is a kind of coating to being formed with comprising indium oxide predecessor
The substrate of film irradiates ultraviolet light to make the light irradiation device of this indium oxide predecessor optical activation, comprising: multiple rodlike standards point
Sub- lamp arranges in parallel to each other along prescribed direction；And moving portion, make the substrate relative to multiple Excimer lamps,
It is relatively moved along the prescribed direction；And multiple Excimer lamps and the substrate by the moving portion movement
Irradiation interval it is shorter than the arrangement pitch of multiple Excimer lamps.
In addition, the invention of technical solution 2 is divided between the irradiation according to the light irradiation device of the invention of technical solution 1
2mm or more and 10mm or less.
In addition, the invention of technical solution 3 be according to the light irradiation device of the invention of technical solution 1 or technical solution 2, it is described
Moving portion moves back and forth the substrate relative to multiple Excimer lamps.
In addition, the invention of technical solution 4 is irradiated according to the light of the invention of any one of technical solution 1 to technical solution 3
Device will be set as between multiple Excimer lamps and the substrate by the moving portion movement containing aerobic environment.
In addition, the invention of technical solution 5 is the oxygen according to the light irradiation device of the invention of technical solution 4, in the environment
Concentration is 15% or more and 20% or less.
In addition, the invention of technical solution 6 is a kind of film forming device for forming the film comprising indium oxide, comprising: apply
Coating fluid containing indium oxide predecessor is coated on substrate and forms coated film on the substrate by cloth processing unit；Technology
The light irradiation device that scheme 1 is recorded into any one of technical solution 5；And heat treatment portion, to pass through the light irradiation device
And heat the substrate of the indium oxide predecessor optical activation to make the indium oxide predecessor thermal activation.
In addition, the invention of technical solution 7 is the film forming device according to the invention of technical solution 6, further includes: move in
Portion out moves in untreated substrate, and moves out the substrate handled；And conveying machine people, for the carrying-in/carrying-out portion,
The coating process portion, the heat treatment portion and the light irradiation device transport substrate；And around the conveying machine people
Configure the carrying-in/carrying-out portion, the coating process portion, the heat treatment portion and the light irradiation device.
In addition, the invention of technical solution 8 is the film forming device according to the invention of technical solution 6, further includes: move in
Portion moves in untreated substrate；Moving section moves out the substrate handled；1st conveying machine people, for the loading unit, described
Coating process portion and the light irradiation device transport substrate；And the 2nd conveying machine people, for the light irradiation device, described
Heat treatment portion and the moving section transport substrate；And it is configured between the 1st conveying machine people and the 2nd conveying machine people
The light irradiation device.
[The effect of invention]
According to technical solution 1 to the invention of technical solution 8, due to including multiple rodlike Excimer lamps, and multiple standards are divided
The irradiation interval of sub- lamp and the substrate by moving portion movement is shorter than the arrangement pitch of multiple Excimer lamps, therefore can be used and put
The energy for the ultraviolet light penetrated high Excimer lamp activates indium oxide predecessor well.
Detailed description of the invention
Fig. 1 is the figure for indicating the configured in one piece structure of film forming device of the invention.
Fig. 2 is the figure for indicating the structure in photo-irradiation treatment portion.
Fig. 3 is will to amplify the figure of expression near multiple Excimer lamps.
Fig. 4 is the flow chart for indicating the processing routine in film forming device.
Fig. 5 is the figure for indicating the configured in one piece structure of film forming device of the 2nd embodiment.
[explanation of symbol]
1,1a: film forming device
10: conveying machine people
11: the 1 conveying machine people
12: the 2 conveying machine people
20: loading machine/unloader
21: loading machine
22: unloader
30: coating process portion
40: heat treatment portion
50: photo-irradiation treatment portion
51: Excimer lamp
55: moving portion
56: carrying roller
57: driving portion
59: environment adjustment mechanism
AR2: arrow
D: irradiation interval
P: arrangement pitch
W: substrate
S1~S5: step
Specific embodiment
Hereinafter, while referring to attached drawing, detailed description of embodiments of the present invention.
The 1st embodiment > of <
Fig. 1 is the figure for indicating the configured in one piece structure of film forming device of the invention.Film forming device 1 of the invention
It is the device for forming the film containing indium oxide on a surface of a substrate.Substrate as process object can be glass substrate,
It is also possible to semiconductor wafer (being the glass substrate of rectangle in present embodiment).In addition, becoming the shape of the substrate of process object
Shape or size are also not particularly limited, and can be set as suitable shape or size.Film forming device 1 includes: loading machine/unloader
20, coating process portion 30, heat treatment portion 40, photo-irradiation treatment portion 50 and conveying machine people 10.In the 1st embodiment, use
Loading machine/unloader 20, coating process portion 30, heat treatment portion 40 and photo-irradiation treatment are configured with around conveying machine people 10
The layout of so-called cluster (cluster tool) type in portion 50.In addition, in Fig. 1 and later each figure, in order to hold
It is readily understood, optionally the size in each portion or quantity are exaggerated or simplified to describe.
Loading machine/unloader 20 is to move in untreated substrate in film forming device 1, and film formation is handled
The carrying-in/carrying-out portion that the substrate terminated is moved out from film forming device 1.Loading machine/unloader 20 include store it is untreated and
(province's sketch map such as the incorporating section of the substrate handled and the transfer robot of handover that substrate is carried out with conveying machine people 10
Show).
Coating process portion 30 is will to be coated on a surface of a substrate and on substrate containing the coating fluid of indium oxide predecessor
Form the processing unit of the coated film of this coating fluid.It as coating process portion 30, such as can be used: making the slit spray for spraying coating fluid
Mouth scans the substrate for remaining stationary state with fixed speed and the slit coater of applied coating solution or makes substrate on one side
The spin coater etc. that rotation one spreads coating fluid on the surface of the substrate in face of the rotation center ejection coating fluid of this substrate.
Heat treatment portion 40 is to make indium oxide predecessor optics contained in coated film to by photo-irradiation treatment portion 50
The substrate of activation is heated the processing unit to make this indium oxide predecessor thermal activation.As heat treatment portion 40, such as can be used
The heat-treatment furnace heated the substrate by blowing hot wind.Substrate is heated to about 350 DEG C by heat treatment portion 40.
Conveying machine people 10 and loading machine/unloader 20, coating process portion 30, heat treatment portion 40 and photo-irradiation treatment portion 50
The handover for carrying out substrate successively transports substrate into these processing units.
Fig. 2 is the figure for indicating the structure in photo-irradiation treatment portion 50.Photo-irradiation treatment portion 50 is light irradiation device of the invention,
It makes this indium oxide predecessor optical activation to the substrate irradiation ultraviolet light for being formed with the coated film comprising indium oxide predecessor.
Photo-irradiation treatment portion 50 includes multiple Excimer lamps 51 and the moving portion 55 for making substrate W movement.
More (being three in the 1st embodiment) Excimer lamps 51 are respectively rodlike lamp.In the 1st embodiment, with
The longitudinal direction of each Excimer lamp 51 mutually becomes parallel mode along horizontal direction and is arranged with three Excimer lamps 51.Standard point
Sub- lamp 51 is distinctive spectrum is issued when the discharge gas excited by discharge plasma reverts to ground state ultraviolet
The lamp of line (for accurate, vacuum ultraviolet (Vacuum Ultraviolet, VUV)).The Excimer lamp 51 of present embodiment is put
The vacuum ultraviolet of a length of 172nm of ejected wave.
Moving portion 55 includes multiple carrying rollers 56 and driving portion 57.Multiple carrying rollers 56 are with respective longitudinal direction along dampening
Square to the lower section for mutually becoming parallel mode and being arranged in multiple Excimer lamps 51.Driving portion 57 keeps multiple carrying rollers 56 synchronous
Rotation.Multiple carrying rollers 56 are rotated in the positive direction or the reverse direction by driving portion 57, thus such as the arrow AR2 institute in Fig. 2
As showing, is slided and moved along horizontal direction (that is, orientation of multiple Excimer lamps 51) by the substrate W that multiple carrying rollers 56 support
It is dynamic.In addition, the diameter and radical of multiple carrying rollers 56 can be set to correspond to the suitable diameter and radical of the size of substrate W.
Fig. 3 is will to amplify the figure of expression near multiple Excimer lamps 51.Multiple Excimer lamps 51 along horizontal direction every
It opens impartial interval and arranges in parallel to each other.The arrangement pitch p of multiple Excimer lamps 51 is 30mm~60mm.Between so-called arrangement
Every p, refer to the distance between centers of adjacent Excimer lamp 51.In addition, the diameter of rodlike each Excimer lamp 51 is about 20mm.
On the other hand, the irradiation interval d between multiple Excimer lamps 51 and the substrate W for passing through the movement of moving portion 55 is
2mm or more and 10mm or less.That is, multiple Excimer lamps 51 and the irradiation interval d by the mobile substrate W of moving portion 55 are obvious
Arrangement pitch p than multiple Excimer lamps 51 is short.In addition, strictly speaking, irradiation interval d is under the outside wall surface of Excimer lamp 51
The interval at end and the upper surface of substrate W when making substrate W be present in the lower section of this Excimer lamp 51 by moving portion 55.Three
Excimer lamp 51 is arranged along horizontal direction, and substrate W is moved by moving portion 55 along horizontal direction, therefore three quasi-molecules
The each of lamp 51 is as the irradiation interval d of substrate W.
In addition, being provided with environment adjustment mechanism 59 near the outside wall surface of each Excimer lamp 51.Environment adjustment mechanism 59
Exhaust gear and oxygen supply mechanism including illustration omitted, can adjust the ring in the space between corresponding Excimer lamp 51 and substrate W
Border.In addition, in the present embodiment, environment adjustment mechanism 59 does not carry out special environment adjustment, multiple Excimer lamps 51 and base
Space between plate W is atmospheric environment.
Then, the processing routine in the film forming device 1 with the structure is illustrated.Fig. 4 is to indicate film
Form the flow chart of the processing routine in device 1.
Firstly, untreated substrate W is moved in film forming device 1 (step S1).Specifically, by untreated base
Plate W is moved in loading machine/unloader 20 from the outside of film forming device 1.Before being moved in loading machine/unloader 20
The pattern of the elements such as transistor is formed on the surface of substrate W.As prior to towards move in loading machine/unloader 20 substrate W into
Capable processing can first carry out the surface cleaning processing of this substrate W.It as such cleaning treatment, can illustrate: using medical fluid to base
The cleaning of medical fluid that the surface of plate W is cleaned mechanically is got on the brush of depollution substance from the surface of substrate W using brush
Son cleaning etc..
The untreated substrate W being moved in loading machine/unloader 20 is received by conveying machine people 10, and is moved to coating
In processing unit 30.In addition, substrate W can moved in coating in the case where not carrying out surface cleaning processing as described
It is moved in photo-irradiation treatment portion 50 before in processing unit 30, and irradiates ultraviolet light from surface of the Excimer lamp 51 to substrate W, thus
The polluter of attachment on said surface is decomposed into removal.
Processing (step S2) is coated to the substrate W being moved in coating process portion 30.Coating process portion 30 will contain
The coating fluid of indium oxide predecessor is coated on the coated film for forming on the surface of substrate W and on substrate W this coating fluid.Herein,
So-called " indium oxide predecessor ", refers to and is changing into the substance of indium oxide and being activated, such as can illustrate indium halide alkoxide and (lead to
Formulas I nX (OR)2, R is alkyl and/or alkoxyalkyl, X F, Cl, Br or I in formula).It is dispersed in such indium oxide predecessor
Coating fluid is constituted in solvent or decentralized medium.As solvent or decentralized medium, can be used: alcohol, toluene, dimethylbenzene, diethyl ether
Deng.
The coating fluid is coated on substrate W and forms coated film by coating process portion 30.On substrate W, with the same
Film thickness forms the coated film containing indium oxide predecessor.The coated film after rigid coating in coating process portion 30 is containing a large amount of molten
The film of the moisture state of agent.Therefore, the evaporation of solvent contained in coated film can be made to make to apply by coating process portion 30
Cloth film is dry.The solvent as contained in coated film has volatility, so even at normal temperatures and pressures, also shorter
Evaporation in time.
Then, the substrate W for being formed with coated film is moved out from coating process portion 30 and is moved in illumination by conveying machine people 10
It penetrates in processing unit 50.Photo-irradiation treatment portion 50 makes the coated film irradiation ultraviolet light being formed on substrate W contained in coated film
Some indium oxide predecessor optical activations (step S3).
The substrate W moved in photo-irradiation treatment portion 50 by conveying machine people 10 is supported by multiple carrying rollers 56.Moreover,
Driving portion 57 makes multiple rotations of carrying roller 56 move substrate W along horizontal direction sliding.In the 1st embodiment, make base
After plate W is mobile from the side side in the arrangement region of multiple Excimer lamps 51 towards other side side, make substrate W from the other side
Side is mobile towards the side side.That is, moving portion 55 moves back and forth substrate W relative to multiple Excimer lamps 51.In addition,
In present embodiment, make substrate W relative to multiple 51 round trips of Excimer lamp, but round-trip number can be set as suitable time
Number.
In addition, the vacuum ultraviolet of a length of 172nm of multiple 51 radioactive waves of Excimer lamp.Moving portion 55 make substrate W relative to
Multiple Excimer lamps 51 move back and forth, thus on the upper surface of substrate W, the ultraviolet irradiation area from each Excimer lamp 51
It is scanned along the moving direction of substrate W in domain.Ultraviolet light is irradiated to the coated film being formed on substrate W as a result,.By to painting
Cloth film irradiates ultraviolet light, and makes indium oxide predecessor optical activation contained in coated film.
Movement speed by the mobile substrate W of moving portion 55 is, for example, 0.5m/min.Make substrate W with this movement speed
Moved back and forth relative to three Excimer lamps 51, thus from three Excimer lamps 51 for the upper surface substrate W each region it is total
Irradiation time becomes 40 seconds~60 seconds or so.
However, in order to activate indium oxide predecessor contained in coated film well, it is necessary to containing aerobic environment
In to coated film irradiate ultraviolet light.Therefore, in the present embodiment, by the space between multiple Excimer lamps 51 and substrate W
It is set as carrying out ultraviolet light irradiation in the state of atmospheric environment.On the other hand, the wavelength radiated from Excimer lamp 51 is 172nm's
Vacuum ultraviolet, which has, absorbs this property by oxygen.Therefore, make multiple Excimer lamps 51 and the base mobile by moving portion 55
The irradiation interval d of plate W is shorter than the arrangement pitch p of multiple Excimer lamps 51 and is set as 2mm or more and 10mm or less.If irradiation interval
D is more than 10mm, then from the vacuum ultraviolet radiated in Excimer lamp 51 almost by being present between Excimer lamp 51 and substrate W
The oxygen of atmospheric environment is absorbed without reaching in the coated film on substrate W.Even if if irradiation interval d be 10mm hereinafter, if quasi-molecule
For containing aerobic environment between lamp 51 and substrate W, the vacuum ultraviolet radiated from Excimer lamp 51 be not also absorbed completely and
In coated film on reachable substrate W.In addition, if the irradiation interval less than 2mm of d, Excimer lamp 51 and substrate W too close to,
And the worry that the upper surface for generating substrate W contacts when moving with a part of Excimer lamp 51.Because of such reason, and will be multiple
The irradiation interval d of Excimer lamp 51 and substrate W are limited to 2mm or more and 10mm or less.
In addition, the arrangement pitch p due to irradiation interval d obviously than multiple Excimer lamps 51 is short, the upper surface of substrate W
On the ultraviolet irradiation region from multiple Excimer lamps 51 become discrete state.Therefore, in the present embodiment, make
Substrate W is slided relative to multiple Excimer lamps 51 and is moved, thus ultraviolet light is equably radiated to the entire of the upper surface of substrate W
On face.More specifically, to become from irradiation time of each of multiple Excimer lamps 51 for the entire surface of the upper surface of substrate W
The same mode is obtained, the whole round-trip sliding movement of substrate W is made.It is not only ultraviolet in the entire surface of the upper surface of substrate W as a result,
The irradiation time of line becomes the same, even and if there are the deviation of exposure intensity, the upper tables of substrate W in multiple Excimer lamps 51
Irradiation condition in the entire surface in face also becomes the same.By the way that ultraviolet light is equably radiated at substrate in containing aerobic environment
In coated film on W, and make the optical activation well of indium oxide predecessor contained in coated film.In addition, when to coated film
When irradiating ultraviolet light, inhibit the fever of Excimer lamp 51, for example preferably heat substrate W exceedingly.
Thereafter, conveying machine people 10 moves out the substrate W that ultraviolet treatment with irradiation has terminated from photo-irradiation treatment portion 50
And it moves in heat treatment portion 40.Heat treatment is implemented to substrate W to make contained in the coated film on substrate W in heat treatment portion 40
Indium oxide predecessor thermal activation (step S4).Heat treatment in heat treatment portion 40 is also in atmospheric environment, i.e., containing aerobic ring
It is carried out in border.Substrate W is heated into or so 30 minutes~1 time with about 350 DEG C in heat treatment portion 40.To base in containing aerobic environment
Coated film on plate W is heated, and is thus made indium oxide predecessor thermal activation contained in coated film and is generated indium oxide.Its
As a result, forming the film containing indium oxide on substrate W by a series of processing.
After heat treatment, conveying machine people 10 substrate W is taken out from heat treatment portion 40 and move in again loading machine/
In unloader 20.Then, the substrate W handled moved out from loading machine/unloader 20 towards the outside of film forming device 1 and complete
It is handled in pairs in a series of film formation of substrate W.
In the 1st embodiment, the coated film containing indium oxide predecessor on substrate W is irradiated using Excimer lamp 51
Ultraviolet light.Compared with Cooper-Hewitt lamp, the energy for the ultraviolet light that Excimer lamp 51 radiates is high, therefore is suitable for making institute in coated film
The indium oxide predecessor optical activation contained.However, the vacuum ultraviolet that the wavelength radiated from Excimer lamp 51 is 172nm has
Have and this property is absorbed by oxygen.Therefore, for the viewpoint of the ultraviolet light illumination efficiency of Excimer lamp 51, preferably at multiple quasi- points
Oxygen is not present between sub- lamp 51 and substrate W.On the other hand, in order to make indium oxide predecessor contained in coated film live well
Change, it is necessary to ultraviolet light be irradiated to coated film in containing aerobic environment.That is, needing for the viewpoint in process containing aerobic
Environment, but for the viewpoint of ultraviolet light illumination efficiency, preferably oxygen-free environment.
In order to meet the opposite requirement, the space between multiple Excimer lamps 51 and substrate W is being set as big compression ring
Ultraviolet light irradiation is carried out in the state of border (oxygen concentration is about 20%).If atmospheric environment, then contain about 20% oxygen, therefore can
Activate indium oxide predecessor contained in coated film well.In addition, the atmospheric environment for being about 20% if oxygen concentration, then
The irradiation interval d of Excimer lamp 51 and substrate W is set as 10mm or less to keep the two close, is thus radiated from Excimer lamp 51
Vacuum ultraviolet be not absorbed completely and in the coated film on reachable substrate W.
Moreover, if keeping multiple Excimer lamp 51 and substrate W close and irradiating interval d obviously to become than multiple Excimer lamps 51
Arrangement pitch p it is short, then the range of exposures of each Excimer lamp 51 is limited, therefore makes substrate W relative to multiple Excimer lamps
51 sliding movements.Ultraviolet light is equably radiated in the coated film on substrate W in containing aerobic environment as a result, can make to apply
The optical activation well of indium oxide predecessor contained in cloth film.
The 2nd embodiment > of <
Then, the 2nd embodiment of the invention is illustrated.Fig. 5 is the film forming device for indicating the 2nd embodiment
The figure of the configured in one piece structure of 1a.The layout of the processing unit of the film forming device 1a of 2nd embodiment and the 1st embodiment
Film forming device 1 is different.The film forming device 1a of 2nd embodiment includes: loading machine 21, coating process portion 30, illumination
Penetrate processing unit 50, heat treatment portion 40, unloader 22, the 1st conveying machine people 11 and the 2nd conveying machine people 12.In addition, in Fig. 5,
Identical symbol is marked to component identical with the 1st embodiment.
In the 2nd embodiment, loading machine 21, coating process portion 30 and light are configured around the 1st conveying machine people 11
Treatment with irradiation portion 50.On the other hand, unloader 22, heat treatment portion 40 and light irradiation are configured around the 2nd conveying machine people 12
Processing unit 50.Photo-irradiation treatment portion 50 configures between the 1st conveying machine people 11 and the 2nd conveying machine people 12.
Loading machine 21 is the loading unit moved in untreated substrate W in film forming device 1a.Unloader 22 is will to locate
The moving section that the substrate W managed is moved out from film forming device 1a.Substrate is moved in and handled with untreatment base is carried out
The 1st embodiment both moved out loading machine/unloader 20 it is different, loading machine 21 is to move in dedicated unit, unloader
22 be to move out dedicated unit.
1st conveying machine people 11 and the 2nd conveying machine people 12 have identical with the conveying machine people 10 of the 1st embodiment
Structure.In addition, coating process portion 30, heat treatment portion 40 and photo-irradiation treatment portion 50 are component identical with the 1st embodiment.?
In 2nd embodiment, the 1st conveying machine people 11 transports base for loading machine 21, coating process portion 30 and photo-irradiation treatment portion 50
Plate W.In addition, the 2nd conveying machine people 12 transports substrate W for photo-irradiation treatment portion 50, heat treatment portion 40 and unloader 22.2nd
Ultraviolet light is irradiated to substrate W in the photo-irradiation treatment portion 50 of embodiment, and also plays substrate W from the 1st conveying machine people 11
The effect being handover in the 2nd conveying machine people 12.
In the 2nd embodiment, untreated substrate W is moved in loading machine 21 from the outside of film forming device 1a.
The untreated substrate W being moved in loading machine 21 is received by the 1st conveying machine people 11, and is moved in coating process portion 30.
In coating process portion 30, the coating process of the coating fluid containing indium oxide predecessor is carried out to substrate W.It is being coated processing
Afterwards, the substrate W for being formed with coated film is moved out from coating process portion 30 and is moved in photo-irradiation treatment portion by the 1st conveying machine people 11
In 50.
In a same manner as in the first embodiment, photo-irradiation treatment portion 50 slides substrate W relative to multiple Excimer lamps 51
It is mobile, the coated film irradiation ultraviolet light being formed on substrate W is made contained in coated film from multiple Excimer lamps 51 on one side
Indium oxide predecessor optical activation.In addition, moving substrate W back and forth relative to multiple Excimer lamps 51
It is dynamic, but in the 2nd embodiment, substrate W can also be made relative to multiple Excimer lamps 51 in one direction (from the 1st transporter
Device people 11 is towards the direction of the 2nd conveying machine people 12) it is mobile primary.In a same manner as in the first embodiment, make substrate W relative to more
A sliding of Excimer lamp 51 movement, the coated film being thus equably radiated at ultraviolet light in containing aerobic environment on substrate W
On, and make the optical activation well of indium oxide predecessor contained in coated film.
The substrate W that ultraviolet treatment with irradiation has terminated is moved out simultaneously from photo-irradiation treatment portion 50 by the 2nd conveying machine people 12
It moves in heat treatment portion 40.The heat treatment that substrate W is carried out in heat treatment portion 40, thus makes institute in the coated film on substrate W
The indium oxide predecessor thermal activation contained.
After heat treatment, the 2nd conveying machine people 12 takes out substrate W from heat treatment portion 40 and moves in unloader 22
In.Then, the substrate W handled is moved out from unloader 22 towards the outside of film forming device 1a and is completed for substrate W's
A series of film formation processing.
< variation >
More than, embodiments of the present invention are illustrated, but the present invention then removes the reality without departing from its purport
Applying can make various changes other than mode.For example, in said embodiment, will be between multiple Excimer lamps 51 and substrate W
Space be set as carrying out ultraviolet light irradiation in the state of atmospheric environment, but not limited to this, can also adjust machine by environment
Structure 59 adjusts the environment in this space.As described above, oxygen is needed in order to activate indium oxide predecessor well, relative to
This, preferably there is no oxygen for the viewpoint of ultraviolet light illumination efficiency.Therefore, environment adjustment mechanism 59 is with Excimer lamp 51 and base
Oxygen concentration in the environment in the space between plate W becomes 15% or more and 20% mode below and carries out environment adjustment.If standard point
Oxygen concentration in the environment in the space between sub- lamp 51 and substrate W is for 15% or more and 20% hereinafter, can then make institute in coated film
The indium oxide predecessor contained activates well.In addition, the irradiation interval d of Excimer lamp 51 and substrate W are set as 10mm or less
It is close both to make, be not thus absorbed completely from the vacuum ultraviolet radiated in Excimer lamp 51 and on reachable substrate W
In coated film.As a result, moved in the same manner as the embodiment by sliding substrate W relative to multiple Excimer lamps 51,
And ultraviolet light is equably radiated in the coated film on substrate W in containing aerobic environment, it can make contained in coated film
Indium oxide predecessor optical activation well.
In addition, in said embodiment, keeping substrate W mobile relative to multiple Excimer lamps 51, but can also exist on one side
Supporting substrate W under stationary state makes multiple Excimer lamps 51 mobile relative to this substrate W on one side.As long as that is, keeping substrate W opposite
It is relatively moved in multiple Excimer lamps 51.
In addition, being configured with three Excimer lamps 51 in said embodiment, but the number of Excimer lamp 51 can be set as suitable
Suitable number.
In addition, in said embodiment, come supporting substrate W and move its sliding by multiple carrying rollers 56, but
Substrate W can be made to float by air and slided mobile to replace the mode.
In addition, the configuration structure of the processing unit comprising photo-irradiation treatment portion 50 is not limited to the layout of Fig. 1, Fig. 2, as long as
It is the layout that can carry out the processing according to processing routine shown in Fig. 4.
[industrial availability]
Technology of the invention is suitable for forming the system for thin film transistor (TFT) (Thin Film Transistor, TFT) etc.
The film for the indium oxide excellent containing electrical characteristics made.
Claims (8)
1. a kind of light irradiation device is made to the substrate irradiation ultraviolet light for being formed with the coated film comprising indium oxide predecessor
The light irradiation device of the indium oxide predecessor optical activation, characterized by comprising:
Multiple rodlike Excimer lamps arrange in parallel to each other along prescribed direction；And
Moving portion makes the substrate relative to multiple Excimer lamps, relatively moves along the prescribed direction；And
The irradiation interval of multiple Excimer lamps and the substrate by the moving portion movement is divided than multiple standards
The arrangement pitch of sub- lamp is short.
2. light irradiation device according to claim 1, which is characterized in that
2mm or more and 10mm or less are divided between the irradiation.
3. light irradiation device according to claim 1 or 2, which is characterized in that
The moving portion moves back and forth the substrate relative to multiple Excimer lamps.
4. light irradiation device according to claim 1 or 2, which is characterized in that
It will be set as between multiple Excimer lamps and the substrate by the moving portion movement containing aerobic environment.
5. light irradiation device according to claim 4, which is characterized in that
Oxygen concentration in the environment is 15% or more and 20% or less.
6. a kind of film forming device is the film forming device to form the film comprising indium oxide, characterized by comprising:
Coating fluid containing indium oxide predecessor is coated on substrate and forms coating on the substrate by coating process portion
Film；
Light irradiation device according to any one of claim 1 to 5；And
Heat treatment portion adds the substrate of the indium oxide predecessor optical activation to by the light irradiation device
Heat makes the indium oxide predecessor thermal activation.
7. film forming device according to claim 6, it is characterised in that further include:
Carrying-in/carrying-out portion moves in untreated substrate, and moves out the substrate handled；And
Conveying machine people, for the carrying-in/carrying-out portion, the coating process portion, the heat treatment portion and the light irradiation device
Transport substrate；And
The carrying-in/carrying-out portion, the coating process portion, the heat treatment portion and institute are configured around the conveying machine people
State light irradiation device.
8. film forming device according to claim 6, it is characterised in that further include:
Loading unit moves in untreated substrate；
Moving section moves out the substrate handled；
1st conveying machine people transports substrate for the loading unit, the coating process portion and the light irradiation device；And
2nd conveying machine people transports substrate for the light irradiation device, the heat treatment portion and the moving section；And
The light irradiation device is configured between the 1st conveying machine people and the 2nd conveying machine people.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-233922 | 2017-12-06 | ||
| JP2017233922A JP2019098282A (en) | 2017-12-06 | 2017-12-06 | Light irradiation device and thin film formation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109887859A true CN109887859A (en) | 2019-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811404713.9A Pending CN109887859A (en) | 2017-12-06 | 2018-11-23 | Light irradiation device and film forming device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2019098282A (en) |
| CN (1) | CN109887859A (en) |
| TW (1) | TW201925528A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113000339A (en) * | 2021-04-08 | 2021-06-22 | 佛山泰上机械有限公司 | Device for generating skin feel by skin feel UV coating and method for producing skin feel plate |
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| US20160170316A1 (en) * | 2014-12-15 | 2016-06-16 | Tokyo Electron Limited | Light irradiation apparatus |
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2017
- 2017-12-06 JP JP2017233922A patent/JP2019098282A/en active Pending
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- 2018-11-22 TW TW107141558A patent/TW201925528A/en unknown
- 2018-11-23 CN CN201811404713.9A patent/CN109887859A/en active Pending
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| JP2001102170A (en) * | 1999-07-23 | 2001-04-13 | Semiconductor Energy Lab Co Ltd | Process for preparing el display and thin film forming apparatus |
| TW500630B (en) * | 1999-09-17 | 2002-09-01 | Hoya Schott Kk | An ultra-violet light emitting device and emitting method thereof |
| CN101187459A (en) * | 2006-11-21 | 2008-05-28 | 优志旺电机株式会社 | Quasimolecule light irradiator |
| CN102763174A (en) * | 2010-02-17 | 2012-10-31 | 住友金属矿山株式会社 | Process for producing transparent conductive film, transparent conductive film, element formed using same, transparent conductive substrate, and device formed using same |
| TW201526071A (en) * | 2013-12-06 | 2015-07-01 | Fujifilm Corp | Method of producing metal oxide film, metal oxide film, thin-film transistor, display device, image sensor, and x-ray sensor |
| US20160170316A1 (en) * | 2014-12-15 | 2016-06-16 | Tokyo Electron Limited | Light irradiation apparatus |
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| CN113000339A (en) * | 2021-04-08 | 2021-06-22 | 佛山泰上机械有限公司 | Device for generating skin feel by skin feel UV coating and method for producing skin feel plate |
| CN113000339B (en) * | 2021-04-08 | 2024-02-13 | 佛山泰上机械有限公司 | Device for generating skin feel by skin feel UV paint and method for producing skin feel plate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201925528A (en) | 2019-07-01 |
| JP2019098282A (en) | 2019-06-24 |
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