CN109852977B - Tin ball production process, cleaning agent and preparation method thereof - Google Patents
Tin ball production process, cleaning agent and preparation method thereof Download PDFInfo
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- CN109852977B CN109852977B CN201910181969.6A CN201910181969A CN109852977B CN 109852977 B CN109852977 B CN 109852977B CN 201910181969 A CN201910181969 A CN 201910181969A CN 109852977 B CN109852977 B CN 109852977B
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- 238000005260 corrosion Methods 0.000 claims abstract description 23
- 230000007797 corrosion Effects 0.000 claims abstract description 23
- 238000002845 discoloration Methods 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000003112 inhibitor Substances 0.000 claims abstract description 18
- 239000003945 anionic surfactant Substances 0.000 claims abstract description 17
- 150000007524 organic acids Chemical class 0.000 claims abstract description 16
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Natural products NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000004471 Glycine Substances 0.000 claims abstract description 10
- 125000003630 glycyl group Chemical group [H]N([H])C([H])([H])C(*)=O 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 46
- 238000004140 cleaning Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 14
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 8
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- -1 phenol compound Chemical class 0.000 claims description 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 239000005711 Benzoic acid Substances 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- 235000010233 benzoic acid Nutrition 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical group CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 claims description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 2
- PYPCLUOPAQYZSY-UHFFFAOYSA-N [Na].C(CCCCCCCCCCCCCCC)(=O)OC Chemical compound [Na].C(CCCCCCCCCCCCCCC)(=O)OC PYPCLUOPAQYZSY-UHFFFAOYSA-N 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims description 2
- 239000008367 deionised water Substances 0.000 claims description 2
- 229910021641 deionized water Inorganic materials 0.000 claims description 2
- 239000012153 distilled water Substances 0.000 claims description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 2
- 229940074391 gallic acid Drugs 0.000 claims description 2
- 235000004515 gallic acid Nutrition 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- 235000011090 malic acid Nutrition 0.000 claims description 2
- 239000001630 malic acid Substances 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 239000011975 tartaric acid Substances 0.000 claims description 2
- 235000002906 tartaric acid Nutrition 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 2
- 239000012498 ultrapure water Substances 0.000 claims description 2
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 claims 1
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 claims 1
- VDEUYMSGMPQMIK-UHFFFAOYSA-N benzhydroxamic acid Chemical compound ONC(=O)C1=CC=CC=C1 VDEUYMSGMPQMIK-UHFFFAOYSA-N 0.000 claims 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 14
- 230000003373 anti-fouling effect Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 150000001413 amino acids Chemical class 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000002888 zwitterionic surfactant Substances 0.000 description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001559 benzoic acids Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a tin ball production process, a cleaning agent and a preparation method thereof. The tin ball production process disclosed by the invention uses a cleaning agent to clean the tin ball, wherein the cleaning agent comprises the following components in percentage by mass: 20% -50% of organic acid, 1% -2% of anti-discoloration agent, 1% -3% of corrosion inhibitor, 0.1% -1% of passivating agent, 1% -2% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine. The preparation method of the cleaning agent comprises the steps of mixing the components. The cleaning agent used in the tin ball production process can remove various dirt and impurities on the surface of the tin ball, but the corrosion to the tin ball is not obvious, and the color of the surface of the tin ball is not influenced.
Description
Technical Field
The invention relates to a tin ball production process, a cleaning agent and a preparation method thereof.
Background
Solder balls are widely applied in the integrated circuit packaging process, and along with the rapid development of electronic information technology, the large-scale integrated circuits are increasingly used, wherein the IC chips need to be packaged by the solder balls, and the packaging lead frame needs to be plated with anode solder balls, so that the high-quality requirement is provided for solder ball manufacture.
The current method for producing tin balls comprises various processes such as casting method, forging method, cold heading method, spraying method, oblique rolling forming method and the like. In the processes, the surface of the solder ball is stained with oil dirt organic dirt, dust, mud ash and other impurities, so that the cleaning process of the solder ball is increased in the process. At present, physical cleaning processes such as water soaking overflow, ultrasonic megason and the like are mostly adopted. The physical cleaning is not only difficult to clean the solder ball thoroughly, but also can not form a protective layer on the surface of the solder ball, so that the solder ball is secondary pollution in the transportation and use processes. This also results in the need to clean the solder ball again before application and use in order to remove dirt, dust, mud, and surface oxide layer impurities from the solder ball surface. If the impurities are not cleaned cleanly, the subsequent application (such as electroplating and welding) yield is affected, so that the application production yield and effect are difficult to improve.
Therefore, if the high-efficiency cleaning process is added in the production of the solder balls, the solder balls can be cleaned cleanly, and an anti-oxidation and anti-fouling surface protection layer can be formed, so that the application quality and efficiency of the solder balls can be greatly improved, and the secondary cleaning before the application of the solder balls can be omitted. But at the same time, the protection layer on the surface of the solder ball is ensured not to have negative effect on the application of the solder ball. Currently, there is a need to address such industrial challenges. Such difficulties can be addressed either physically or chemically.
Disclosure of Invention
The invention aims to overcome the defects that the cleaning agent used in the existing tin ball production process is not thorough in cleaning the surface of the tin ball, secondary pollution is easy to cause in the transportation and use processes, secondary cleaning is needed before use, and the like. The cleaning agent used in the tin ball production process can effectively remove various dirt and impurities on the surface of the tin ball, but has no obvious corrosion effect on the tin ball and does not influence the color of the surface of the tin ball. Meanwhile, a surface protection layer is formed on the surface of the solder ball, so that secondary pollution is effectively prevented, and negative effects on the application of the solder ball are avoided. In addition, the cleaning agent in the tin ball production process does not contain inorganic acid, is smokeless, efficient, environment-friendly, nontoxic and harmless, and is simple and convenient to use.
The invention mainly solves the technical problems by the following technical means:
the invention provides a tin ball production process, which uses a cleaning agent to clean tin balls, wherein the cleaning agent comprises the following components in percentage by mass: 20% -50% of organic acid, 1% -2% of anti-discoloration agent, 1% -3% of corrosion inhibitor, 0.1% -1% of passivating agent, 1% -2% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
Wherein the mass fraction of the organic acid is preferably 25% -40%, more preferably 30% -35%. The mass fraction of the anti-discoloration agent is preferably 1.3-1.7%, more preferably 1.5-1.6%. The mass fraction of the corrosion inhibitor is preferably 1.5% -2.5%, more preferably 1.7% -2%. The mass fraction of the passivating agent is preferably 0.2% -0.5%, more preferably 0.3% -0.4%. The mass fraction of the anionic surfactant is preferably 1.2% -1.7%, more preferably 1.4% -1.5%.
Wherein, the sum of the mass fractions of the components in the cleaning agent is 100%, so the water is preferably used in the amount of 100% of the sum of the mass fractions of the components.
Wherein the organic acid is preferably dicarboxylic acid and/or tricarboxylic acid, more preferably one or more of citric acid, oxalic acid, adipic acid, maleic acid, malic acid, itaconic acid, malonic acid, oxalic acid and tartaric acid.
Wherein the anti-discoloration agent can be conventional in the art, is preferably a mercaptan compound, and is more preferably one or more of propanethiol, 4-methyl-4H-1, 2, 4-triazole-3-mercaptan and 5-amino-1, 3, 4-thiadiazole-2-mercaptan.
Wherein the corrosion inhibitor can be conventional in the art, and is preferably one or more of phenol compounds, benzoic acid compounds and hydroxamic acid compounds. The phenol compound is preferably one or more of hydroquinone, catechol and catechol. The benzoic acid compound is preferably benzoic acid and/or gallic acid. The hydroxamic acid compound is preferably benzoic hydroxamic acid.
Wherein the anionic surfactant may be an anionic surfactant conventional in the art, preferably a sulfonate compound. The sulfonate compound is preferably one or more of sodium dodecyl benzene sulfonate, sodium methyl palmitate sulfonate and sodium dodecyl sulfonate.
Wherein the water is preferably one or more of deionized water, distilled water, pure water and ultrapure water.
In a preferred embodiment of the invention, the cleaning agent in the tin ball production process consists of the following components in percentage by mass: 20-50% of organic acid, 1-2% of anti-discoloration agent, 1-3% of corrosion inhibitor, 0.1-1% of passivating agent, 1-2% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
In a preferred embodiment of the invention, the cleaning agent in the tin ball production process consists of the following components in percentage by mass: 25% -40% of organic acid, 1.3% -1.7% of anti-discoloration agent, 1.5% -2.5% of corrosion inhibitor, 0.2% -0.5% of passivating agent, 1.2% -1.7% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
In a preferred embodiment of the invention, the cleaning agent in the tin ball production process consists of the following components in percentage by mass: 30% -35% of organic acid, 1.5% -1.6% of anti-discoloration agent, 1.7% -2% of corrosion inhibitor, 0.3% -0.4% of passivating agent, 1.4% -1.5% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
In the tin ball production process, the operation of cleaning the tin ball by using the cleaning agent comprises the following steps of: and (3) carrying out overflow circulation cleaning and drying on the tin balls and the cleaning agent.
The size of the solder balls may be conventional in the art, for example, the solder balls may have a diameter of 0.5mm, 10mm, 15mm, or 20mm.
The overflow cycle cleaning is preferably performed in a cleaning tank.
The overflow speed of the overflow circulation cleaning is preferably 1-3m 3 /min。
The overflow cycle cleaning time is not particularly limited, and is determined according to the cleanliness of the solder balls, preferably 1-2 hours.
The overflow cycle cleaning temperature is preferably room temperature.
The room temperature in the present invention means 10-30 ℃.
The drying method is preferably drying with nitrogen.
The invention also provides a cleaning agent, which comprises the components and the amounts of the cleaning agent in the tin ball production process.
The invention also provides a preparation method of the cleaning agent, which comprises the following steps: and mixing the components of the cleaning agent. The mixing is preferably carried out by adding the solid component in the cleaning agent into the liquid component and stirring uniformly. The temperature of the mixing may be room temperature.
The above preferred conditions can be arbitrarily combined on the basis of not deviating from the common knowledge in the art, and thus, each preferred embodiment of the present invention can be obtained.
The reagents and materials used in the present invention are commercially available.
The invention has the positive progress effects that: the tin ball production process can clean the tin ball by adopting the cleaning agent disclosed by the invention, so that various dirt and impurities on the surface of the tin ball can be removed, but the corrosion to the tin ball is not obvious, and the color of the surface of the tin ball is not influenced. Meanwhile, a protective layer is formed on the surface of the solder ball, so that secondary pollution of the solder ball can be effectively avoided, and negative influence on application of the solder ball is avoided. In addition, the cleaning agent used in the tin ball production process does not contain inorganic acid, is smokeless, efficient, environment-friendly, nontoxic and harmless, is simple and convenient to use and operate, has a wide market application prospect, and is beneficial to the wide application of tin balls.
Detailed Description
The invention is further illustrated by means of the following examples, which are not intended to limit the scope of the invention. The experimental methods, in which specific conditions are not noted in the following examples, were selected according to conventional methods and conditions, or according to the commercial specifications.
In the following examples and comparative examples, the preparation method of the cleaning agent includes the following steps: and mixing the components of the cleaning agent.
Examples 1 to 13
Table 1 cleaning agent components
TABLE 2 mass fractions of the components
Comparative examples 1 to 14
Table 3 Components of the cleaning agent
Table 4 mass fractions of the components
Wherein the upper and lower limits of the amounts of the respective components were explored in comparative examples 1 to 10; the effect of using amino acids other than glycine as passivating agents was explored in comparative example 11; the effect of using cationic, nonionic or zwitterionic surfactants was explored in comparative examples 12-14.
Effect examples
And (3) corrosion rate testing:
the size is 2 x 2cm 2 Immersing tin sheets with the purity of 99.99% in a cleaning agent for 1h at room temperature, drying by nitrogen, and measuring the thickness of the tin sheets before and after immersion treatment by using a WEISTRON Landolt FP1100 high-precision four-point probe measuring instrument; tin corrosion rate was calculated as the thickness change (before and after the soak treatment) divided by the soak treatment time.
The cleaning effect testing step:
at room temperature, soaking the tin balls in a cleaning agent for overflow circulation cleaning, wherein the overflow speed of the overflow circulation cleaning is 1m 3 And/min, wherein the cleaning time is 1h, and the cleaning is followed by drying with nitrogen. The color change of the solder balls was observed with naked eyes. Observing the cleaning effect of the surface of the tin ball by using an SNE-4500G table scanning electron microscope under the condition of amplifying 1000 times; the cleaning effect is considered to be ideal if the surface is clean and smooth after cleaning and has no foreign matters. Standing the cleaned tin ball in air for 1 month, and observing the antifouling effect and the antioxidant effect of the cleaned tin ball by using an SNE-4500G table scanning electron microscope, wherein the pollution is indicated if more particles exist on the surface of the tin ball after the cleaning; if the surface becomes black and darkens, the surface of the solder ball is proved to be oxidized. The diameter of the solder balls washed in examples 1-11 was 15mm, the diameter of the solder balls washed in example 12 was 0.5mm, and the diameter of the solder balls washed in example 13 was 20mm.
The results of each test are shown in Table 5.
TABLE 5
Cleaning effect
| ◎ | Complete removal of |
| ○ | Small amount of residue |
| △ | More residual |
| × | A large amount of residue |
Degree of discoloration
| ◎ | No color change |
| ○ | Slight discoloration |
| △ | Heavy discoloration |
| × | Severe discoloration |
Antifouling effect
| ◎ | No pollution |
| ○ | Small amount of pollution |
| △ | More pollution |
| × | A great deal of pollution |
Antioxidant effect
| ◎ | No oxidation |
| ○ | Slightly oxidized |
| △ | More oxidation |
| × | Oxidation in large quantities |
As can also be seen from the above examples 1 to 13 and comparative examples 1 to 14, the cleaning agent used in the process for producing solder balls of the present invention has a low corrosion rate to tin relative to the cleaning agent of the comparative example, and bothAt the position ofIn the range, the tin sheet has no abnormal color change after being cleaned, the dirt and impurities are removed with ideal effect, and the surface after being cleaned is clean, smooth and free of foreign matters. After the cleaned tin ball is kept stand in the air for 1 month, the surface of the tin ball is free from contamination, so that the secondary pollution of the tin ball can be effectively avoided, and the antifouling effect is ideal. From examples 12 and 13, it can be seen that the cleaning agent used in the solder ball production process of the present invention can be used for cleaning solder balls with different particle diameters, and the effect is ideal.
As can be seen from comparative effect examples 1-2, when the organic acid content is higher than 50%, the tin corrosion rate is too high, resulting in excessive tin loss, and when the organic acid content is lower than 20%, the cleaning effect is poor, especially the cleaning of oily stains is not thorough. As can be seen from comparative effect examples 3 to 4, when the content of the discoloration inhibitor is less than 1%, the surface of the solder ball becomes dark during cleaning, and when the content of the discoloration inhibitor is more than 2%, the cleaning effect is poor, especially the surface oxide cleaning is not complete. As can be seen from comparative effect examples 5 to 6, when the content of the corrosion inhibitor is higher than 3%, the cleaning effect is poor, especially the surface oxide is not thoroughly cleaned, and when the content of the corrosion inhibitor is lower than 1%, the tin loss is serious. As can be seen from comparative effect examples 7-8, the content of the passivating agent is higher than 1% or lower than 0.1% to accelerate the secondary pollution of the solder ball, so that the antifouling effect of the solder ball surface is difficult to ensure within 1 month; it is presumed that the passivating agent has van der waals or electrostatic antifouling effect in preventing secondary pollution. As can be seen from comparative effect examples 9 to 10, the anionic surfactant content of more than 2% and less than 1% resulted in poor cleaning effect. As can be seen from comparative effect example 11, no antifouling effect was obtained when glycine was substituted for other amino acids. From comparative effect examples 12 to 14, it is apparent that when the anionic surfactant is replaced with the cationic surfactant, the nonionic surfactant or the zwitterionic surfactant, no good cleaning effect can be achieved by the combination of other components; presumably, the cleaning agent may have poor surface tension or wettability.
Claims (11)
1. The tin ball production process is characterized in that a cleaning agent is used for cleaning tin balls, wherein the cleaning agent comprises the following components in percentage by mass: 20% -50% of organic acid, 1% -2% of anti-discoloration agent, 1% -3% of corrosion inhibitor, 0.1% -1% of passivating agent, 1% -2% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine;
the anionic surfactant is one or more of sodium dodecyl benzene sulfonate, sodium methyl palmitate sulfonate and sodium dodecyl sulfonate;
the corrosion inhibitor is one or more of phenol compounds, benzoic acid compounds and hydroxamic acid compounds; wherein the phenol compound is one or more of hydroquinone, catechol and catechol; the benzoic acid compound is benzoic acid and/or gallic acid; the hydroxamic acid compound is benzohydroxamic acid;
the organic acid is one or more of citric acid, oxalic acid, adipic acid, maleic acid, malic acid, itaconic acid, malonic acid, oxalic acid and tartaric acid;
the anti-discoloration agent is propanethiol, 4-methyl-4H-one or more of 1,2, 4-triazole-3-thiol and 5-amino-1, 3, 4-thiadiazole-2-thiol.
2. The solder ball production process according to claim 1, wherein the mass fraction of the organic acid in the cleaning agent is 25% -40%;
and/or the mass fraction of the anti-discoloration agent is 1.3% -1.7%;
and/or the mass fraction of the corrosion inhibitor is 1.5% -2.5%;
and/or, the mass fraction of the passivating agent is 0.2% -0.5%;
and/or the mass fraction of the anionic surfactant is 1.2% -1.7%.
3. The solder ball production process according to claim 2, wherein the mass fraction of the organic acid is 30% -35%;
and/or the mass fraction of the anti-discoloration agent is 1.5% -1.6%;
and/or, the mass fraction of the corrosion inhibitor is 1.7% -2%;
and/or, the mass fraction of the passivating agent is 0.3% -0.4%;
and/or the mass fraction of the anionic surfactant is 1.4% -1.5%.
4. The solder ball manufacturing process of claim 1, wherein the water is one or more of deionized water, distilled water, pure water, and ultra pure water.
5. The solder ball production process according to any one of claims 1 to 4, wherein the cleaning agent consists of the following components in mass fraction: 20-50% of organic acid, 1-2% of anti-discoloration agent, 1-3% of corrosion inhibitor, 0.1-1% of passivating agent, 1-2% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
6. The solder ball production process according to any one of claims 1 to 4, wherein the cleaning agent consists of the following components in mass fraction: 25% -40% of organic acid, 1.3% -1.7% of anti-discoloration agent, 1.5% -2.5% of corrosion inhibitor, 0.2% -0.5% of passivating agent, 1.2% -1.7% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
7. The solder ball production process according to any one of claims 1 to 4, wherein the cleaning agent consists of the following components in mass fraction: 30% -35% of organic acid, 1.5% -1.6% of anti-discoloration agent, 1.7% -2% of corrosion inhibitor, 0.3% -0.4% of passivating agent, 1.4% -1.5% of anionic surfactant and water, wherein the sum of the mass fractions of the components is 100%; the passivating agent is glycine.
8. The solder ball manufacturing process according to claim 1, wherein the cleaning of the solder balls using the cleaning agent comprises the steps of: and (3) carrying out overflow circulation cleaning and drying on the tin balls and the cleaning agent.
9. The solder ball manufacturing process according to claim 8, wherein the solder ball has a diameter of 0.5mm, 10mm, 15mm or 20mm;
and/or, the overflow circulation cleaning is carried out in a cleaning tank;
and/or the overflow speed of the overflow circulation cleaning is 1-3m 3 /min；
And/or the overflow circulation cleaning time is 1-2h;
and/or, the overflow circulation cleaning temperature is 10-30 ℃;
and/or drying by using nitrogen.
10. A cleaning agent characterized in that the components and the amounts of the cleaning agent in the tin ball production process according to any one of claims 1 to 9 are as described in the claims.
11. A method of preparing the cleaning agent as claimed in claim 10, comprising the steps of: and mixing the components of the cleaning agent.
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316858A (en) * | 2000-05-01 | 2001-11-16 | Asahi Kagaku Kogyo Co Ltd | Corrosion inhibitor composition and acid cleaning solution composition for metal added the same |
| WO2010051689A1 (en) * | 2008-11-10 | 2010-05-14 | 安集微电子（上海）有限公司 | Rinse solution for removing thick film resist |
| CN101720352A (en) * | 2007-05-17 | 2010-06-02 | 高级技术材料公司 | Be used for removing the new antioxidant of filling a prescription behind the CPM |
| JP2011068882A (en) * | 2009-08-27 | 2011-04-07 | Sanyo Chem Ind Ltd | Cleaning agent for magnetic disk substrate |
| WO2012024680A1 (en) * | 2010-08-20 | 2012-02-23 | 3M Innovative Properties Company | Rust removing composition |
| CN106086910A (en) * | 2016-08-24 | 2016-11-09 | 天津普罗米化工有限公司 | A kind of environmentally-friendly water-based mordant |
| CN106635450A (en) * | 2016-12-01 | 2017-05-10 | 东莞市联洲知识产权运营管理有限公司 | Biodegradable organic acid cleaning agent and application thereof in aspects of fruits and vegetables |
| CN107357143A (en) * | 2017-07-25 | 2017-11-17 | 上海新阳半导体材料股份有限公司 | A kind of cleaning agent, its preparation method and application |
| JP2018002907A (en) * | 2016-07-04 | 2018-01-11 | 油化産業株式会社 | Detergent composition |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6773873B2 (en) * | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
| JP4069443B2 (en) * | 2002-11-26 | 2008-04-02 | 栗田工業株式会社 | Scale cleaning agent for metal surface containing aluminum or aluminum alloy and method for cleaning scale of metal surface containing aluminum or aluminum alloy using the same |
| TWI362415B (en) * | 2003-10-27 | 2012-04-21 | Wako Pure Chem Ind Ltd | Novel detergent and method for cleaning |
| DE102006006022A1 (en) * | 2006-02-08 | 2007-08-09 | Clariant International Limited | Process for cleaning metal parts |
| EP2207872B1 (en) * | 2007-10-29 | 2013-07-03 | Ekc Technology, Inc. | Novel nitrile and amidoxime compounds and methods of preparation |
| EP2877565B1 (en) * | 2012-07-25 | 2017-09-13 | Basf Se | Use of branched polyesters on the basis of citric acid as additive in detergents, cleaning agents, washing agents or a formula for treating water |
| TW201500542A (en) * | 2013-04-22 | 2015-01-01 | Advanced Tech Materials | Copper cleaning and protection formulations |
| WO2016161072A1 (en) * | 2015-03-31 | 2016-10-06 | Air Products And Chemicals, Inc. | Cleaning formulations |
-
2019
- 2019-03-11 CN CN201910181969.6A patent/CN109852977B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001316858A (en) * | 2000-05-01 | 2001-11-16 | Asahi Kagaku Kogyo Co Ltd | Corrosion inhibitor composition and acid cleaning solution composition for metal added the same |
| CN101720352A (en) * | 2007-05-17 | 2010-06-02 | 高级技术材料公司 | Be used for removing the new antioxidant of filling a prescription behind the CPM |
| WO2010051689A1 (en) * | 2008-11-10 | 2010-05-14 | 安集微电子（上海）有限公司 | Rinse solution for removing thick film resist |
| JP2011068882A (en) * | 2009-08-27 | 2011-04-07 | Sanyo Chem Ind Ltd | Cleaning agent for magnetic disk substrate |
| WO2012024680A1 (en) * | 2010-08-20 | 2012-02-23 | 3M Innovative Properties Company | Rust removing composition |
| JP2018002907A (en) * | 2016-07-04 | 2018-01-11 | 油化産業株式会社 | Detergent composition |
| CN106086910A (en) * | 2016-08-24 | 2016-11-09 | 天津普罗米化工有限公司 | A kind of environmentally-friendly water-based mordant |
| CN106635450A (en) * | 2016-12-01 | 2017-05-10 | 东莞市联洲知识产权运营管理有限公司 | Biodegradable organic acid cleaning agent and application thereof in aspects of fruits and vegetables |
| CN107357143A (en) * | 2017-07-25 | 2017-11-17 | 上海新阳半导体材料股份有限公司 | A kind of cleaning agent, its preparation method and application |
Non-Patent Citations (1)
| Title |
|---|
| Mechanism of Corrosion and Corrosion Inhibition of Tin in Aqueous Solutions Containing Tartaric Acid;Rabab M. El-Sherif等;Int. J. Electrochem. Sci.;第6469 - 6482页 * |
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