CN109848013B - LCD baking chamber with improved organic vapor removal efficiency - Google Patents
LCD baking chamber with improved organic vapor removal efficiency Download PDFInfo
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- CN109848013B CN109848013B CN201810789828.8A CN201810789828A CN109848013B CN 109848013 B CN109848013 B CN 109848013B CN 201810789828 A CN201810789828 A CN 201810789828A CN 109848013 B CN109848013 B CN 109848013B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67098—Apparatus for thermal treatment
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Abstract
An organic vapor removal efficiency improving type LCD baking chamber according to the present invention comprises: a chamber having an opening/closing unit for opening and closing the inlet/outlet so that the glass substrate is placed on the hot plate, and the heated gas is introduced through the discharge unit and discharged to the discharge unit; and a ventilation performance improving part which is arranged at the spitting part and spits out the heating gas, induces the flow velocity of the organic steam generated in the cavity to be uniform, and guides the organic steam to the discharging part.
Description
Technical Field
The present invention relates to an organic vapor removal efficiency improving type LCD baking chamber, and more particularly, to an organic vapor removal efficiency improving type LCD baking chamber in which a ventilation performance improving part is provided in a gas supply structure in an LCD baking chamber to discharge a large area of gas with a pressure difference at a uniform gas flow rate, thereby improving ventilation and removal efficiency of organic vapor.
Background
In general, in a TFT (Thin Film Transistor) LCD manufacturing process, a Thin Film deposition process, a photoresist coating process, a baking process, an exposure process, a developing process, and an etching process are repeatedly performed to form a Thin Film Transistor, a pixel electrode, an RGB pixel, and a common electrode.
As described above, in the LCD manufacturing process, an Oven chamber (hereinafter, referred to as a chamber) is an apparatus as follows: a hot plate (hot plate) unit or an ultraviolet (IR) unit inside the chamber is used as a heat source, and before the glass substrate is put into the photoresist coating apparatus, the glass substrate is heated to be dried and preheated, or the glass substrate coated with the photosensitive film is heated for a certain time to be cured (Baking process).
The baking temperature of such a chamber is maintained at a high temperature around about 130 ℃, so that the photosensitive film is evaporated during the process to generate organic vapor (organic vapor). Various kinds of fine particles are contained in the organic vapor, and when left as they are, the vapor containing the fine particles adheres to the inside of the chamber to contaminate the chamber, thereby making it difficult to perform processes, or adheres to the glass substrate to deteriorate accuracy and quality.
As described above, in order to discharge the organic vapor generated inside the chamber, a gas supply system supplying a heating gas and an exhaust unit discharging the organic vapor inside the chamber to the outside by the inflowing gas are provided. In a conventional gas supply system, a nozzle having a slit-shaped through hole formed only in a local region is provided on a heated gas discharge surface of a chamber.
However, the conventional air supply nozzle has the following problems: since the plurality of heating gas supply ports are formed in each local area of the chamber, the heating gas supplied from the discharge surface cannot move uniformly, a vortex is generated between the area moving at a high speed and the area moving at a low speed, and the time for the organic vapor to remain in the chamber increases, thereby contaminating devices in the chamber or inducing process defects such as the occurrence of spots on the surface of the glass substrate.
Therefore, there is a demand for improvement of this problem.
The related art is korean registered patent publication No. 10-0722153 (2007.05.21, title of the invention: oven chamber for LCD glass substrate).
Disclosure of Invention
Technical problem to be solved
The present invention has been made in view of the above-mentioned needs, and it is an object of the present invention to provide an organic vapor removal efficiency improving type LCD baking chamber in which a ventilation performance improving portion is provided in a gas supply structure to discharge a large area of gas with a pressure difference at a uniform gas flow rate, thereby improving the ventilation and removal efficiency of organic vapor in a cavity.
Means for solving the problems
In order to achieve the above object, an organic vapor removal efficiency improving type LCD baking chamber according to the present invention comprises: a chamber having an opening/closing unit for opening and closing the inlet/outlet so that the glass substrate is placed on the hot plate, and the heated gas is introduced through the discharge unit and discharged to the discharge unit; and a ventilation performance improving part which is arranged on the spitting part, spits out the heating gas, induces the flow velocity of the organic steam generated in the chamber to be uniform, and guides the organic steam to the discharging part.
In the present invention, the ventilation performance improving portion is provided in the discharge portion of the chamber, and is provided with an area corresponding to an inner cross-sectional area of the chamber.
In the present invention, the ventilation performance improving section includes: a flow rate maintaining unit provided in the discharge unit, for filtering impurities from the heated gas and reducing the pressure to uniformly maintain the discharge flow rate of the heated gas; and a nozzle box disposed outside the flow rate maintaining part, and introducing the heated gas supplied from the gas supply unit through a connection pipe, thereby guiding to the chamber.
In the present invention, the flow rate maintaining section includes a filter of a porous material.
In the present disclosure, the filter includes at least one of a pre-filter or a hepa filter.
In the present invention, the flow rate maintaining portion includes a punching plate formed with a plurality of punching holes.
In the present invention, a heated gas guide portion for guiding the heated gas by converting a direction of the heated gas supplied to the upper side through the connection pipe to a side surface is provided inside the nozzle box.
In the present invention, the heating gas guide part includes: the heating gas guide part includes: a separation plate which is provided inside the nozzle box so as to face an upper side and divides a space; a receiving space part formed at a lower side based on the separation plate, and receiving the heated gas supplied from the connection pipe; an isolation space part formed between a side surface of the nozzle box and an end of the separation plate in the housing space part, and guiding the heated gas upward; and a guide space part in which the direction of the heated gas is changed to a side surface, thereby guiding the heated gas to the flow velocity maintaining part.
In the present invention, the separation plate includes: an upper and lower extension part extending from a bottom surface of the inside of the nozzle box toward an upper side; and a guide extension corresponding to an upper side of the nozzle box, extending from the upper and lower extensions toward an opposite side of the chamber, and separated from a side surface of the nozzle box.
In the present invention, the flow rate maintaining portion is provided to the discharge portion of the chamber through a setting portion.
In the present invention, the setting portion includes: the setting portion includes a housing portion that supports an edge of the flow rate maintaining portion and is set to the chamber.
Effects of the invention
According to the LCD baking chamber with improved organic vapor removing efficiency, the air supply structure is provided with the ventilation performance improving part, so that the gas discharged in a large area has pressure difference and is discharged at uniform gas flow velocity, and the ventilation and removing efficiency of the organic vapor in the cavity can be improved.
In addition, the present invention utilizes the thermal deformation preventing part combined with the main frame part to pressurize and adjust the thermal deformation part of the main body part according to each point, and the minimization of the contact part between the main body part and the main frame part is realized while maintaining the function level of the main body part, thereby reducing the thermal deformation of the main body part as much as possible, preventing the leakage in the chamber and maintaining the uniformity of the temperature in the chamber.
Drawings
Fig. 1 is a perspective view of an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 2 is a main sectional view of an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 3 is an enlarged sectional view of a ventilation performance improving part in an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 4 is an enlarged sectional view of a ventilation performance improving part in an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention, to which a straight guide part is added.
Fig. 5 is a sectional view of a state of applying a punching plate according to a modification of a flow velocity maintaining part in a ventilation performance improving part of an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 6 is a schematic view illustrating flow velocity streamlines through a ventilation performance improving part in an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 7 is a schematic view illustrating the temperature inside a chamber formed by a ventilation performance improving part in an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 8 is a disassembled perspective view of an opening and closing part and a thermal deformation preventing part for opening and closing an entrance and an exit of an LCD baking chamber of an organic vapor removal efficiency improving type according to an embodiment of the present invention.
Fig. 9 is an assembled perspective view of fig. 8.
Fig. 10 is a front view of an opening and closing part and a thermal deformation preventing part according to an embodiment of the present invention.
Fig. 11 is a partially cut-away sectional perspective view of an opening and closing part and a thermal deformation preventing part according to an embodiment of the present invention.
Fig. 12 is a side sectional view of an opening and closing part and a thermal deformation preventing part according to an embodiment of the present invention.
Description of the reference numerals
100: a chamber; 110: a discharge section; 120: a discharge section; 130: an entrance and an exit; 200: a ventilation performance improving section; 210: a flow velocity maintaining section; 212: a filter; 214: punching a plate; 215: punching; 220: a nozzle box; 230: an air supply unit; 232: a gas heater; 234: a flow regulating valve; 240: a setting part; 242: a housing portion; 250: a gas guide section; 260: a separation plate; 262: an upper and lower extension portion; 264: a guide extension; 270: a housing space part; 280: an isolation space section; 290: a guide space part; 300: an opening/closing section; 310: a main body portion; 320: a main frame portion; 340: a contact portion; 350: a frame; 360: a connecting support part; 370: a rotation support; 380: a drive section; 382: a power section; 384: a straight portion; 386: a hinge portion; 400: a thermal deformation preventing portion; 410: a point connection portion; 420: a fastening hole portion; 430: a contact minimizing portion; 440: a bonding section; 442: a screw hole; 444: a coupling hole; 446: and (4) combining the components.
Detailed Description
Hereinafter, an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention will be described with reference to the accompanying drawings.
In the drawings, the thickness of lines, the sizes of constituent elements, and the like are exaggerated for clarity and convenience of description. The terms described below are defined based on the functions of the present invention, and may be changed according to the intention or habit of the user or operator. Accordingly, these terms are defined based on the entire contents of the present specification.
Fig. 1 is a perspective view of an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention, fig. 2 is a main sectional view of the organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention, fig. 3 is an enlarged sectional view of a ventilation performance improving part in the organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention, fig. 4 is an enlarged sectional view of the ventilation performance improving part in the organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention with a straight guide part added thereto, fig. 5 is a sectional view of a state where a perforated plate is applied to a modified example of a flow velocity maintaining part in the ventilation performance improving part of the organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention, fig. 6 is a schematic view showing flow velocity flow lines passing through the ventilation performance improving part in the organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention,
fig. 7 is a schematic view illustrating the temperature inside the chamber formed by the ventilation performance improving part in the organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention.
Fig. 8 is a disassembled perspective view of an opening and closing part and a thermal deformation preventing part for opening and closing an entrance of an LCD baking chamber of an organic vapor removal efficiency improving type according to an embodiment of the present invention, fig. 9 is an assembled perspective view of fig. 8, fig. 10 is a front view of the opening and closing part and the thermal deformation preventing part according to an embodiment of the present invention, fig. 11 is a partially cut sectional perspective view of the opening and closing part and the thermal deformation preventing part according to an embodiment of the present invention, and fig. 12 is a side sectional view of the opening and closing part and the thermal deformation preventing part according to an embodiment of the present invention.
Referring to fig. 1 to 12, an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention includes a chamber 100 and a ventilation performance improving part 200.
The chamber 100 is constructed as follows: an inlet and outlet 130 for placing the glass substrate 20 on a hot plate 140 in the chamber 100 is formed, and the heated gas is introduced through the discharge unit 110 and discharged to the discharge unit 120.
The chamber 100 is an apparatus as follows: the opening/closing unit 300 opens and closes the entrance 130 to place the glass substrate 20 on the hot plate 140 provided therein, and then the glass substrate 20 is heated by the hot plate 140 to be dried and preheated before being placed in the photoresist coating apparatus, or the glass substrate 20 coated with a photosensitive film is heated for a predetermined time to bake the photosensitive film.
The discharge portion 110 is formed on one side surface of the chamber 100, and is a heated gas discharge portion for supplying a heated gas to discharge an organic vapor generated when the glass substrate 20 placed on the hot plate 140 is baked.
The discharge portion 120 is formed on the other side surface of the chamber 100 and on the opposite side surface of the discharge portion 110. The discharge unit 120 moves the organic vapor by the heated gas discharged from the discharge unit 110, and discharges the organic vapor to the outside.
The remaining two surfaces of the chamber 100 where the discharge portion 110 and the discharge portion 120 are not formed may be provided with a pair of ports 130 in a direction opposite to each other. The entrance 130 is formed to have a longitudinal hole for the entrance and exit of the glass substrate 20.
The ventilation performance improving unit 200 has the following structure: the organic vapor is uniformly induced by discharging the heated gas through the discharge part 110, and is uniformly guided to the discharge part 120, thereby improving the ventilation performance of the organic vapor in the chamber 100.
The prior art has the following problems: the plurality of discharge parts 110 are formed in a nozzle manner, and a vortex is generated in the heated gas discharged from the discharge parts 110, so that the heated gas cannot stably move in the chamber 100, and thus the organic vapor cannot be smoothly discharged, and the apparatus in the chamber 100 is contaminated by impurities in the organic vapor, thereby significantly reducing the apparatus performance. However, the ventilation performance improving unit 200 according to the present invention may stably discharge the heated gas to the exhaust unit 120 at a uniform and slow flow rate, thereby improving the ventilation efficiency of the organic vapor and solving the problems of contamination of the devices inside the chamber 100 or contamination of the glass substrate 20 with stains, which may result in a defective process.
Referring to fig. 2, the glass substrate 20 placed on the hot plate 140 is placed in a state slightly separated from the upper surface of the hot plate 140 by the lift pins 150, wherein the lift pins 150 are moved up and down through a plurality of through holes formed vertically through the hot plate 140.
The ventilation performance improving unit 200 is provided in the discharge unit 110 of the chamber 100, and has a large area corresponding to the inner cross-sectional area of the chamber 100.
The ventilation performance improving section 200 includes: a flow rate maintaining unit 210 provided in the discharge unit 110, for filtering impurities from the heated gas and reducing the pressure to uniformly maintain the discharge flow rate of the heated gas; and a nozzle box 220 disposed outside the flow rate maintaining part 210, and introducing the heated gas supplied from the gas supply unit 230 through a connection pipe 222 to be introduced into the chamber 100.
A gas heater 232 may be provided on the connection pipe 222 to heat the gas into a heated gas. A flow rate adjusting valve 234 may be provided on the connection pipe 222 to adjust the supply amount of the heating gas supplied through the gas supply unit 230.
Referring to fig. 2 and 3, the flow rate maintaining part 210 may include a filter 212 of a porous material. The filter 212 may include at least one of a pre-filter or a high efficiency particulate air filter (HEPA filter). The filter 212 may be applied with other kinds of filters than a pre-filter or a hepa filter, and may be applied with all materials capable of providing a uniform flow rate at a low speed, as needed.
Referring to fig. 5, the flow rate maintaining part 210 may include a punching plate 214 forming a plurality of punching holes 215.
The punching holes 215 of the punching plate 214 are arranged in the horizontal and vertical directions to form a plurality of rows in the vertical and horizontal directions, thereby reducing the pressure of the heated gas and the discharge flow rate, and making the heated gas straight to realize uniform movement. When the punching plate 214 is used as the flow rate maintaining part 210, it may be used alone, but may be used in combination with the filter 212 as needed. In this case, a more uniform flow rate of the heated gas can be obtained. Thereby, the heating gas is stably moved at a uniform flow rate in a state where a vortex is not formed inside the chamber 100, and thus, when the glass substrate 20 is baked by the hot plate 140, the generated organic vapor is effectively and stably discharged to the outside through the exhaust part 120, so that the inside ventilation performance of the chamber 100 can be improved.
A heated gas guide part 250 may be provided inside the nozzle box 220 to guide the heated gas by converting the direction of the heated gas supplied to the upper side through the connection pipe 222 to a side surface.
Referring to fig. 2 to 5, the heating gas guide 250 includes: a separation plate 260 provided inside the nozzle cartridge 220 to face upward so as to divide a space; a receiving space 270 formed at a lower side of the nozzle case 220 based on the separation plate 260 and receiving the heated gas supplied from the connection pipe 222; an isolation space 280 formed between the side surface of the nozzle box 220 and the end of the separation plate 260 in the receiving space 270 and guiding the heated gas to the upper side, and a guide space 290, wherein the heated gas is guided to the flow velocity maintaining unit 210 by changing the direction of the heated gas to the side surface in the isolation space 280.
The separation plate 260 may include: an upper and lower extension part 262 extending from an inner bottom surface of the nozzle cartridge 220 to an upper side; and a guide extension 264 corresponding to an upper side of the nozzle cartridge 220 and extending from the upper and lower extensions 262 toward an opposite side of the chamber 100, and separated from a side surface of the nozzle cartridge 220.
The guide extension 264 may be formed to be inclined downward toward the flow velocity maintaining part 210 in the guide space part 290. It should be noted that the guide extensions 264 may also be horizontally formed to correspond to the upper side of the nozzle cartridge 220.
The upper side surface of the nozzle box 220 is horizontally formed to make the heated gas have a straight-line shape, but may be formed to be inclined upward toward the flow velocity maintaining part 210 at an inclination angle corresponding to the inclination angle of the guide extending part 264 of the separation plate 260 as necessary.
Fig. 6 and 7 show a state in which the flow velocity maintaining unit 210 is provided in the discharge unit 110 to uniformly supply the heated gas, and fig. 5 shows a state in which the flow velocity maintaining unit 200 is made of a porous material including a filter 212, a punching plate 214, or the like, and the pressure of the heated gas is reduced when the heated gas passes through the pores or the punching holes 215 of the flow velocity maintaining unit 210, so that the flow velocity is significantly reduced, and a uniform streamline (streamline) is not formed by generating a vortex and moves. Thus, in fig. 6, it can be seen from the thermal infrared ray detection state in which the temperature and color inside the chamber 100 are uniformly distributed, that the uniform discharge of the organic vapor is realized, by realizing a uniform streamline by the flow rate maintaining unit 210.
The flow rate maintaining unit 210 can be disposed in the discharge unit 110 of the chamber 100 via the disposing unit 240.
The setting part 240 may include a housing part 242 supporting an edge of the flow rate maintaining part 210 and provided to the chamber 100.
Referring to fig. 4, the setting part 240 may further include a rectilinear guide part 244 provided at an entrance side of the case part 242 and guiding the rectilinear movement of the heated gas moving in the guide space part 290. The rectilinear guide portion 244 extends horizontally from the edge of the case portion 242 toward the guide space portion 270. The straight guide portion 244 is formed to horizontally protrude toward the guide space portion 290 side.
The straight guide part 244 formed at a lower portion of the case part 242 may be formed to extend toward a connection portion of the up-down extending part 262 and the guide extending part 284 so as to guide the heated gas moving along the inclined surface of the guide extending part 264 of the separation plate 260. Accordingly, the straight guide 244 formed to protrude from the lower edge of the case 242 can reduce or eliminate the distance from the separation plate 260, thereby preventing the vortex of the heated gas supplied through the guide space 290.
Referring to fig. 2 to 5, when observing the moving state of the heated gas, the heated gas flowing into the receiving space 270 of the nozzle box 220 through the connection pipe 222 is blocked by the upper and lower extensions 262 and the guide extensions 264 of the separation plate 260 to reduce the flow rate and stay, and then vertically moves upward again through the isolation space 280, changes the moving direction in the guide space 290, horizontally moves through the guide space 290, and decreases the pressure when passing through the flow rate maintaining part 210, so that the flow rate is reduced and uniformly moves, and the organic vapor is discharged to the discharge part 120.
At this time, the straight guide portion 244 protruding from the edge of the case portion 242 toward the guide space 290 side allows the heated gas entering the flow velocity maintaining portion 210 to enter at a uniform flow velocity over the entire side surface of the discharge portion 110 of the chamber 100.
Referring to fig. 8 to 12, an organic vapor removal efficiency improving type LCD baking chamber according to an embodiment of the present invention may include: an opening/closing unit 300 for opening and closing the inlet/outlet 130 of the chamber 100 to facilitate the removal of the glass substrate 20 and prevent the leakage of the heating gas; an opening and closing part and a thermal deformation preventing part 400 which can be provided at the opening and closing part 300 and minimize thermal deformation of the opening and closing part 300 due to high heat inside the chamber 100, thereby preventing leakage of organic vapor.
The opening and closing part 300 includes: a main body 310 that blocks the entrance 130; and a main frame part 330 which is disposed separately from the main body part 310 and which pressurizes the main body part 310 against the inlet and outlet 130 of the chamber 100 by a driving part 380.
A seal 320 may be provided on the inner side surface of the body 310 to be closely inserted into the inner edge of the inlet 130.
The main frame portion 330 includes: a contact part 340 disposed apart from the body part 310 and connected to the body part 310 by a thermal deformation preventing part 400; a frame 350 that supports a load by arranging two or more frames on one side surface of the contact portion 340 in at least one of the lateral direction and the longitudinal direction; and a connection support part 360 connected to both sides of the support frame 350.
The connection support portion 360 connects the plurality of frames 350, which are arranged to be separated toward the upper and lower sides, to each other in the lateral direction, and is coupled to the frames 350 by fastening elements such as screws or bolts.
The connection support portion 360 may be provided with a rotation support shaft 370, and the rotation support shaft 370 extends to both sides and is rotated by a driving portion 380 to open or close the opening/closing portion 300. The rotation support shaft 370 is formed to protrude from the lower side of the connection support portion 360 to both sides.
The driving part 380 may include: a power unit 382 for supplying power; the straight portion 384 is hinge-connected to the straight portion 384 by the hinge portion 386 and the moving force of the power portion 382, and converts the straight force into a rotational force to rotate the rotation support shaft 370, thereby opening or closing the opening/closing portion 300.
The power portion 382 may employ a pneumatic or hydraulic cylinder. The power unit 382 may employ various power members such as a motor. The hinge part 386 has a rotation support shaft 370 rotatably connected to one side thereof and a straight part 384 hinged to the other side thereof. The power unit 382 is connected to the rectilinear portion 384 by a shaft, and is rotatably connected to the opposite side of the rectilinear portion 384 by a support frame provided in the chamber 100.
The thermal deformation preventing part 400 may include: a plurality of point connection parts 410 formed on the body part 310 in at least one of a lateral direction or a longitudinal direction; a screw hole portion 420 formed through the contact portion 340 in the front-rear direction so as to correspond to the point connection portion 410; and a contact minimizing portion 430 connected to the point connecting portion 410 in a state of being fastened at the screw hole portion 420 to achieve minimization of hot air transferred from the main body portion 310 to the main frame portion 330 and to adjust deformation of the main body portion 310 by tightening or loosening.
The contact minimizing part 430 may be implemented by a tool which is a bolt or a screw having a hollow in a length direction.
The contact minimizing portion 430 is formed in plurality, and in a state of being fastened to the contact portion 340, selectively tightens or loosens in a point of the contact portion 340 according to a thermal deformation amount of the main body portion 310, adjusts a pressurizing amount with the main body portion 310, thereby performing a level (horizontal) maintaining function of the main body portion 310, and reduces a heat transfer contact area transferring heat to the contact portion 340, thereby minimizing deformation of the main body portion 310, preventing leakage of organic vapor, and preventing the main frame portion 330 from being heated through the contact portion 340.
Therefore, conventionally, the main frame portion 330 may be heated and may be deformed due to heat, and thus, it is difficult to touch with a hand, since the main body portion 310 and the main frame portion 330 are in surface contact with each other, and the hot air of the main body portion 310 is directly transmitted to the main frame portion 330, but according to the present invention, the heat transmission area is changed to point contact instead of surface contact by the contact minimizing portion 430, thereby minimizing the high heat transmitted to the main frame portion 310 of the main frame portion 330, and the heat transmission temperature may be lowered to such an extent that the main frame portion 330 can be touched with a hand.
After the thermal deformation preventing part 400 adjusts the thermal deformation of the main body part 310, the finishing part 440 is fastened to the contact minimizing part 430 and coupled to the point coupling part 410, so that the main frame part 330 can be fixed to the main body part 310.
Referring to fig. 8, 11, and 12, the ending part 440 may include: an insertion hole 442 formed through the center of the contact minimizing portion 430 in the front-rear direction; a screw fastening hole 444 formed at the point connection part 410; and a fastening member 446 coupled to the insertion hole 442 and fastened to the screw fastening hole 444 of the point connection portion 410 to fix the main frame portion 330 to the main body portion 310.
The insertion hole 442 may be a screw hole forming a straight through hole or an internal thread. The screw fastening hole 444 is a screw hole forming an internal thread.
When the insertion hole 442 is a straight through hole, the fastening member 446 is not threaded in a partial section inserted into the insertion hole 442, but is threaded only in a section fastened to the screw fastening hole 444. And, when the insertion hole 442 is a screw hole, the fastening member 446 is threaded throughout the entire section, is screw-coupled with the insertion hole 442, and is continuously fastened with the screw fastening hole 444, so that the main body part 310 and the main frame part 330 can be coupled with each other. In one embodiment of the present invention, the insertion hole 442 is formed as a straight through hole, and the fastening member 446 is not threaded in the section inserted into the insertion hole 442 but is externally threaded only at the end edge.
Therefore, according to the LCD baking chamber with improved organic vapor removal efficiency of an embodiment of the present invention, in the LCD baking chamber, the ventilation performance improving portion is disposed in the gas supply structure, so that the gas discharged in a large area has a pressure difference and is discharged at a uniform gas flow rate, thereby improving the ventilation and removal efficiency of the organic vapor in the cavity. In addition, the present invention can minimize the contact between the main body and the main frame part while maintaining the horizontal function of the main body by adjusting the thermal deformation of the main body by the thermal deformation preventing part combined with the main frame part, thereby reducing the thermal deformation of the main body as much as possible and preventing the leakage inside the chamber, so that the uniformity of the temperature inside the chamber can be maintained.
The present invention has been described with reference to the embodiments shown in the drawings, which are intended to be illustrative only, and various modifications and equivalent other embodiments will be apparent to those skilled in the art to which the present invention pertains.
Therefore, the true technical scope of the present invention should be defined based on the claims.
Claims (5)
1. An organic vapor removal efficiency improving type LCD baking chamber, comprising:
a chamber having an opening/closing unit for opening/closing the inlet/outlet so that the glass substrate is placed on the hot plate, and the heated gas is introduced through the discharge unit and discharged to the discharge unit; and
a ventilation performance improving part which is arranged on the spitting part, spits out the heating gas, induces the flow velocity of the organic steam generated in the chamber to be uniform, and guides the organic steam to the discharging part;
the ventilation performance improving section includes:
a flow rate maintaining unit provided in the discharge unit, for filtering impurities from the heated gas and reducing the pressure to uniformly maintain the discharge flow rate of the heated gas; and
a nozzle box disposed outside the flow rate maintaining part and guiding the heated gas supplied from the gas supply unit to the chamber by introducing the heated gas through a connection pipe,
the flow rate maintaining section includes a filter;
a heated gas guide part for converting the direction of the heated gas supplied to the upper side through the connection pipe to a side surface and guiding the heated gas is provided at the inner side of the nozzle box;
the heating gas guide part includes:
a separation plate which is provided inside the nozzle box so as to face an upper side and divides a space;
a receiving space portion formed at a lower side based on the separation plate and receiving the heated gas supplied from the connection pipe;
an isolation space part formed between a side surface of the nozzle box and an end of the separation plate in the housing space part, and guiding the heated gas upward; and
a guide space part in which the direction of the heated gas is changed to a side surface, thereby guiding the heated gas to the flow velocity maintaining part;
the separation plate includes:
an upper and lower extension part extending from a bottom surface of the inside of the nozzle box toward an upper side; and
a guide extension part disposed opposite to the connection pipe to bypass the heated gas supplied from the connection pipe, extending from the upper and lower extension parts toward a side surface of the nozzle box, and separated from the side surface of the nozzle box to form the isolation space part;
the heated air flowing into the accommodating space part is blocked by the upper and lower extension parts and the guide extension part, then bypasses to the isolation space part and moves to the guide space part;
the setting part includes: a housing portion supporting an edge of the flow rate maintaining portion and providing the flow rate maintaining portion to the chamber; and a rectilinear guide portion provided at an entrance side of the housing portion and guiding the heated gas moving in the guide space portion to move in a rectilinear manner, the rectilinear guide portion being formed to extend toward the separation plate and connected to the separation plate to prevent a vortex of the heated gas supplied through the guide space portion.
2. The organic vapor removal efficiency improving type LCD baking chamber according to claim 1,
the ventilation performance improving portion is provided with an area corresponding to an inside sectional area of the chamber.
3. The organic vapor removal efficiency improving type LCD baking chamber according to claim 1,
the filter is a porous material.
4. The LCD baking chamber of claim 3, wherein the organic vapor removal efficiency is improved,
the filter comprises a pre-filter.
5. An LCD baking chamber of improved organic vapor removal efficiency as defined in claim 3 wherein said filter comprises a HEPA filter.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170162562A KR20190063634A (en) | 2017-11-30 | 2017-11-30 | Organic vapor removal efficiency improvement type lcd bake chamber |
| KR10-2017-0162562 | 2017-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109848013A CN109848013A (en) | 2019-06-07 |
| CN109848013B true CN109848013B (en) | 2022-08-23 |
Family
ID=66848662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810789828.8A Active CN109848013B (en) | 2017-11-30 | 2018-07-18 | LCD baking chamber with improved organic vapor removal efficiency |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20190063634A (en) |
| CN (1) | CN109848013B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112099314B (en) * | 2020-11-10 | 2021-03-19 | 晶芯成(北京)科技有限公司 | Gas replacement device and photoresist baking equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101428570B1 (en) * | 2012-08-23 | 2014-08-11 | 주식회사 나래나노텍 | Gas Intake and Exhaust Device and Method for Heat Treatment of Substrate, and Heat Treatment Chamber and Apparatus of Substrate Having the Same |
-
2017
- 2017-11-30 KR KR1020170162562A patent/KR20190063634A/en not_active Application Discontinuation
-
2018
- 2018-07-18 CN CN201810789828.8A patent/CN109848013B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109848013A (en) | 2019-06-07 |
| KR20190063634A (en) | 2019-06-10 |
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