CN109841536A - Edge compensation system, wafer carrier system and wafer installation method - Google Patents
Edge compensation system, wafer carrier system and wafer installation method Download PDFInfo
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- CN109841536A CN109841536A CN201711227146.XA CN201711227146A CN109841536A CN 109841536 A CN109841536 A CN 109841536A CN 201711227146 A CN201711227146 A CN 201711227146A CN 109841536 A CN109841536 A CN 109841536A
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Abstract
The present invention relates to the edge compensation systems of the workbench for carrying wafer, comprising: support device, the support device are used to support and are lifted the marginal portion of the workbench；Actuation means, the actuation means are located at the lower section of the support device, for activating the support device so that the support device is lifted the marginal portion of the workbench；And control device, the control device are used to control the actuating amount of the actuation means, the marginal portion of the workbench are made to be lifted the abrasion with the edge of wafer to the marginal portion of the workbench in a controlled fashion.The present invention can compensate for abrasion microscope carrier height, and performance is stablized in silicon chip edge planarization when improving exposure, avoid that figure is out of focus after photoetching and stacking alignment is performed poor, and increase microscope carrier service life and product yield.Method the invention further relates to wafer carrier system and for wafer to be installed on the workbench.
Description
Technical field
The present invention relates to the applications of semiconductor lithography process, in particular to for carrying the edge compensation of the workbench of wafer
System, wafer carrier system and the method for wafer to be installed on the workbench.
Background technique
In the manufacturing process of semiconductor chip, the wafer placed on the table is exposed usually using exposure machine
Light, to form desired pattern on wafer.
Describe referring now to fig. 1 in the prior art wafer on the workbench of exposure machine place when there are the problem of.
Fig. 1 a to Fig. 1 c shows placement process of the wafer on the workbench of exposure machine in the prior art.
As shown, exposure machine include microscope carrier 110, the workbench 120 on microscope carrier 110 and be located at microscope carrier 110
The lifting unit (PIN) 130 of under type, lifting unit 130 can pass through microscope carrier 110 and workbench 120 in the end of lifting unit 130
Activate wafer W.
Firstly, as shown in Figure 1a, lifting unit 130 passes through microscope carrier 110 when needing for wafer W to be placed on workbench 120
A distance is stretched out with workbench 120 and from workbench 120, is then placed on wafer W on the end of lifting unit 130,
In, wafer W due to gravity effect and be bent downwardly its outer edge.
Later, decline lifting unit 130, so that wafer W to be placed on workbench 120, as shown in Figure 1 b.However, with
The decline of lifting unit 130, wafer W reclinate outer edge abrasion workbench 120 marginal portion.
Then, as illustrated in figure 1 c, wafer W is placed in workbench when lifting unit 130 is fully retracted under microscope carrier 110
When on 120, the workbench 120 that edge is worn will affect the flatness for the wafer W being placed on it, and further influence line
The uniformity of wide (CD)/stacking alignment (Overlay).As shown, height of the middle section of wafer W than outer edge part
Height, so that middle section does not contact workbench.
As the quantity of the wafer of processing increases, the abrasion for the edge of table that works is exacerbated, to more influence wafer
Flatness, to cause puzzlement to subsequent treatment process and increase rejection rate.
Therefore, it is necessary to the device that one kind can improve wafer planarization, which can compensate for the damage of the planarization of wafer
It loses, to avoid after photoetching figure out of focus and stacking alignment is performed poor, and increases service life and the product yield of workbench.
Disclosed above- mentioned information are only used for reinforcing the understanding to background of the invention in the background technology, therefore it may be wrapped
Containing the information for not being formed as the prior art that those of ordinary skill in the art are known.
Summary of the invention
In view of this, the embodiment of the present invention be desirable to provide it is a kind of for carrying the edge compensation system of the workbench of wafer,
At least to solve problems of the prior art.
The technical solution of the embodiment of the present invention is achieved in that according to an aspect of the invention, there is provided a kind of use
In the edge compensation system of the workbench of carrying wafer, comprising:
Support device, the support device are used to support and are lifted the marginal portion of the workbench；
Actuation means, the actuation means are located at the lower section of the support device, for activating the support device so that
The support device is lifted the marginal portion of the workbench；And
Control device, the control device are used to control the actuating amount of the actuation means, make the edge of the workbench
Part is lifted in a controlled fashion to compensate abrasion of the edge of wafer to the marginal portion of the workbench.
In a specific embodiment, the support device includes edge support rings.
Further, rake is arranged in the upper inside edges of the edge support rings, and the rake is towards the edge ring
Inside tilt down and contact the marginal portion of the workbench to be lifted the marginal portion of the workbench.
In a specific embodiment, the actuation means include piezoelectric actuators.
Further, the piezoelectric actuators include piezoelectric axis and piezoelectric unit, and the piezoelectric axis is arranged in the pressure
The top of electric unit and the support device is supported, the piezoelectric unit is for activating the piezoelectric axis.
Preferably, the piezoelectric axis has multiple, and multiple piezoelectric axis are distributed along circumferential direction.
Further, the piezoelectric unit includes one or more piezoelectric patches, and each piezoelectric patches is generated by applying voltage
Mechanical strain and activate the piezoelectric axis.
According to a specific embodiment, the actuation means include precision motor device.
Another aspect of the present invention further relates to a kind of wafer carrier system, including workbench and such as the above various aspects institute
The edge compensation system stated.
According to a specific embodiment, the wafer carrier system further includes microscope carrier, and the workbench passes through vacuum chuck
Mode be arranged on the microscope carrier.
According to a specific embodiment, the wafer carrier system is mounted in an exposure machine.
Another aspect of the present invention is related to a kind of method for wafer to be installed on the workbench, which is characterized in that packet
Include following steps:
Lifting device is risen into the top of workbench and is placed on wafer on the end of the lifting device,
In, the edge deformation of the wafer；
The lifting device is fallen, places the wafer on the workbench；And
The marginal portion of the workbench is lifted using actuation means, so that the marginal portion pair of the workbench
The edge of the deformation of the wafer of the standard on the lifting device and compensate the wafer deformation edge to the work
Make the abrasion of the marginal portion of platform.
The present invention is applied to silicon wafer by the brim height of control (specifically controlling using piezoelectric element) silicon wafer microscope carrier
Edge planarization and line width and the stacking alignment uniformity improve.
Above-mentioned general introduction is merely to illustrate that the purpose of book, it is not intended to be limited in any way.Except foregoing description
Schematical aspect, except embodiment and feature, by reference to attached drawing and the following detailed description, the present invention is further
Aspect, embodiment and feature, which will be, to be readily apparent that.
Detailed description of the invention
In the accompanying drawings, unless specified otherwise herein, otherwise indicate the same or similar through the identical appended drawing reference of multiple attached drawings
Component or element.What these attached drawings were not necessarily to scale.It should be understood that these attached drawings depict only according to the present invention
Disclosed some embodiments, and should not serve to limit the scope of the present invention.
Fig. 1 a to Fig. 1 c shows the schematic diagram of placement process of the wafer in the prior art on the workbench of exposure machine,
Wherein Fig. 1 a is shown on the end for the lifting unit that wafer is placed on exposure machine and its outer edge declines due to gravity, figure
1b shows the decline with lifting unit, and wafer wears the marginal portion of workbench, and Fig. 1 c shows wafer and is fully placed
On workbench；
Fig. 2 shows the edge compensation systems according to an embodiment of the invention being placed on the workbench of exposure machine
Schematic diagram；
Fig. 3 shows the vertical view of the connection between the edge bearing ring and last item ring of edge compensation system shown in Fig. 2
Figure；
Fig. 4 shows the side view of edge support rings shown in Fig. 3 and the partial enlarged view of the edge support rings；
Fig. 5 shows the side view of one of last item ring shown in Fig. 3；
Fig. 6 shows the top view of last item ring shown in Fig. 5；
Fig. 7 a to 7c shows wafer on the workbench of the exposure machine with edge compensation system according to the present invention
The schematic diagram of placement process, wherein Fig. 7 a is shown on the end for the lifting unit that wafer is placed on exposure machine and its outer edge
Decline due to gravity, Fig. 7 b shows the decline with lifting unit, and wafer wears the marginal portion of workbench, and Fig. 7 c is shown
Wafer is fully placed on workbench, and wherein edge compensation system is lifted the marginal portion of workbench to compensate the outside of wafer
The flatness of edge；And
Fig. 8 shows the flatness of the wafer handled on the exposure machine of the prior art and in exposure machine according to the present invention
The curve graph of the flatness of the wafer of upper processing.
Drawing reference numeral explanation:
The prior art:
110 microscope carriers；
120 workbench；
130 lifting units；
The present invention:
210 microscope carriers；
220 workbench；
The marginal portion 220A；
230 lifting devices (PIN)；
240 edge support rings；
240A rake；
250 piezoelectric actuators；
251 piezoelectric axis；
251A piezoelectric unit interconnecting piece；
252 piezoelectric units；
260 control devices；
W wafer；
The edge of WB wafer.
Specific embodiment
Hereinafter, certain exemplary embodiments are simply just described.As one skilled in the art will recognize that
Like that, without departing from the spirit or scope of the present invention, described embodiment can be modified by various different modes.
Therefore, attached drawing and description are considered essentially illustrative rather than restrictive.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected, can also be communication；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the interaction relationship of the connection or two elements inside two elements.For the ordinary skill in the art, may be used
To understand the concrete meaning of above-mentioned term in the present invention as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " side " and " above " include fisrt feature
Right above second feature and oblique upper, or first feature horizontal height is merely representative of higher than second feature.Fisrt feature is
Two features " under ", " lower section " and " following " include fisrt feature right above second feature and oblique upper, or be merely representative of
One characteristic level height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.Specific reality according to the present invention is described now according to attached drawing
Apply example.
Fig. 2 shows the edge compensation systems according to an embodiment of the invention being placed on the workbench of exposure machine
Schematic diagram.
As shown in Fig. 2, the workbench 220 of exposure machine is arranged on the microscope carrier (tool of exposure machine by way of vacuum chuck
Shown in figures 7a to 7c with appended drawing reference 210 to body) on, to be kept fixed relative to microscope carrier 210.Side according to the present invention
The lower section of the marginal portion 220A of workbench 220 is arranged in edge compensation system.
The edge compensation system includes the concretely support device of edge support rings 240, concretely piezoelectric actuated
The actuation means and control device 260 of device 250.
The lower section of the marginal portion 220A of the workbench 220 of exposure machine is arranged in edge support rings 240, and is used to support
And it is lifted the marginal portion 220A of the workbench 220.
The lower section of edge support rings 240 is arranged in piezoelectric actuators 250, is used for actuation edge support ring 240 so that should
The marginal portion 220A of the lifting workbench 220 of edge support rings 240.
As shown in Figure 2, piezoelectric actuators 250 include piezoelectric axis 251 and piezoelectric unit 252.The setting of piezoelectric axis 251 exists
The top of piezoelectric unit 252, and edge support rings 240 are used to support so that edge support rings 240 are lifted the side of workbench 220
220A is divided in edge.
Piezoelectric actuators 250 can by control device 260 in a controlled fashion actuation edge support ring 240 so that work
The marginal portion 220A for making platform 220 can be lifted in a controlled fashion.
Control device 260 can be any type, as long as its actuating amount that can control piezoelectric actuators.
The company between the edge bearing ring 240 and last item ring 251 of edge compensation system shown in Fig. 2 is shown in Fig. 3
The top view connect, Fig. 4 show the part of the side view of edge support rings 240 and the edge support rings 240 shown in Fig. 3
Enlarged drawing, Fig. 5 show the side view of one of last item ring 251 and Fig. 6 shown in Fig. 3 and show shown in Fig. 5
The top view of last item ring.
As shown in figure 3, edge support rings 240 are supported and are fixed on the top of piezoelectric axis 251, it is shown in this figure always
There are three piezoelectric axis 251 for meter tool, but the present invention is not limited to this.
Those skilled in the art can clearly learn, the piezoelectric axis 251 of other numbers can be set, for example, two, four
It is a, five or more, these piezoelectric axis 251 are distributed in the circumferential direction of edge support rings 240, and wherein piezoelectric axis 251 exists
It can be uniformly distributed in edge support rings 240, naturally it is also possible to uneven distribution, as long as it can steadily bearing edge support ring
240.
Edge support rings 240 are described in detail referring now to Fig. 4.
As shown in figure 4, the cylindrical shape of edge support rings 240, but the present invention is not limited thereto.
Those skilled in the art will clearly learn, the shape of edge support rings 240 most preferably with the workbench of exposure machine
220 shape is consistent, and however, it is not limited to this, as long as it can steadily support workbench 220 and can smoothly and evenly lift
Rise the marginal portion 220A of workbench 220.
With further reference to Fig. 4, the upper inside edges of edge support rings 240 are provided with rake 240A.
If the partial enlarged view in Fig. 4 clearly show rake 240A, rake 240A is towards edge support rings
240 inside contacts work downwards with 45 degree of overturning angles to form inclined-plane completely on the upside of the inner edge of edge support rings 240
Make the marginal portion 220A of platform 220 to be lifted the marginal portion 220A of workbench 220 as upward lifting fulcrum.But this hair
It is bright to be not limited thereto.
Although it will be apparent to one skilled in the art that be not shown specifically in this application, edge support rings 240 can be with
With the marginal portion 220A of the other way support workbench 220 in addition to rake, as long as it can uniformly and evenly be supported
Workbench.The shape for example, edge support rings can be stepped, and workbench is supported using the shoulder of its transition part.
In addition, rake 240A can also be with other angle tilts in addition to 45 degree of angles, as long as it can steadily be supported
The marginal portion 220A of workbench 220.
Piezoelectric axis 251 is described in detail referring now to Fig. 5 and Fig. 6.
As shown in figure 5, piezoelectric axis 251 is substantially l-shaped, wherein (specifically, this is vertical as shown in Figure 6 for L-shaped vertical portion
Partial inside) engagement edge support ring 240 outer surface, and L-shaped horizontal component (specifically, as shown in Figure 6 the water
The upside of flat part) engagement edge support ring 240 bottom surface.
As shown in Figure 5 and Figure 6, setting is used for and piezoelectricity list in piezoelectric unit interconnecting piece 251A in L-shaped horizontal component
Member 252 is connected.Specifically, in figs. 6 and 7, the piezoelectric unit interconnecting piece 251A is the bottom for leading to L-shaped horizontal component
The through-hole on surface, so that piezoelectric axis 251 is used as interlocking lever, material can be stainless steel, and however, it is not limited to this.
Piezoelectric axis 251 can be the other shapes in addition to L shape, such as Y shape, as long as it can connect edge support rings and pressure
Electric unit and between them passing movement.Alternatively, although being not shown in the present invention, piezoelectricity can be not provided with
Axis, but it is directly connected to piezoelectric unit with edge support rings.
Piezoelectric unit interconnecting piece 251A can also be slot or can even is that from protruding portion, as long as it can be with piezoelectricity list
Member connects and can transmit the movement of piezoelectric unit.
It is back to again with reference to Fig. 2 now, to describe piezoelectric unit 252 in detail.
Piezoelectric unit 252 includes multiple piezoelectric patches, and each piezoelectric patches includes two poles, i.e. anode and cathode, and adjacent
Piezoelectric patches the identical pole of polarity (positive or negative pole) is disposed proximate to, the anode as only shown each piezoelectric patches in Fig. 2.
It is applied with voltage on each piezoelectric patches, so that piezoelectric unit 252 can generate mechanical strain.
The quantity of piezoelectric patches is associated with mechanical strain caused by piezoelectric unit 252.For example, more specifically, every 50000
A piezoelectric patches after powered up, makes mechanical strain caused by piezoelectric unit increase 1 nanometer.It therefore, can be by changing piezoelectric patches
Quantity accurately control the moving distance of piezoelectric unit, so as to be lifted the edge of workbench 220 in a controlled fashion
Part 220A.
Therefore, piezoelectric unit 252 of the invention can activate piezoelectric axis 251 in a controlled fashion.But the present invention not office
It is limited to this.
For example, although it is of the invention it is attached be not shown in the figure, actuation means are also possible to precision motor device.The essence
Close motor apparatus can also actuation edge support ring 240 in a controlled fashion.
The invention further relates to a kind of wafer carrier systems comprising workbench 220 and edge compensation system as described above.
It is further preferred that the wafer carrier system can be installed in an exposure machine (not completely shown in figure).
It is especially Fig. 7 a to Fig. 7 c referring to the drawings and describes the method for wafer to be installed on the workbench in detail.
When needing for wafer W to be placed on the workbench 220 of exposure machine, as shown in Figure 7a, make lifting device 230 first
(being in the present invention specially PIN) passes through microscope carrier 210 and workbench 220 and stretches out a distance from the top of workbench 220.
Then wafer W is placed on the end of lifting device 230, wherein the edge WB of wafer W is downward due to gravity
Buckling deformation.
As shown in Figure 7b, make the decline of lifting device 230, the edge WB of the downsagging deformation of wafer W wears workbench
220 marginal portion 220A.
Control device 260 configures quantification according to the abrasion loss of the marginal portion 220A of workbench 220 for piezoelectric unit
Piezoelectric patches.
Apply voltage to piezoelectric unit 252, so that piezoelectric unit 252 generates upward mechanical strain.
The mechanical strain of piezoelectric unit 252 is transmitted to edge support rings 240 by piezoelectric axis 251, so that edge branch
Pushing out ring 240 is lifted the marginal portion 220A of workbench 220 upwards, so that the marginal portion 220A of workbench 220 is aligned in lifting
The edge WB of the deformation of wafer W on device 230, and compensate the edge WB of the deformation of wafer W when lifting device 230 declines
Abrasion to the marginal portion 220A of workbench 220, thus the flatness of wafer is improved, as shown in Figure 7 c, so that wafer quilt
It is flatly placed on workbench 220.
Referring to Fig. 8, the flatness for showing the wafer handled on the workbench of the exposure machine of the prior art (corresponds to work
Make platform abrasion loss) song with the flatness (corresponding to service wear amount) of the wafer that is handled on exposure machine according to the present invention
Line chart, wherein the longitudinal axis indicates the flatness of wafer, and horizontal axis indicates the quantity of handled wafer, moreover, wherein curve A is indicated
The curve graph of the prior art, curve B indicate curve graph of the invention.
As shown in curve A in Fig. 8, in the prior art, when handled wafer number is more than 50000, the mill of wafer
Damage amount increases and flatness is caused sharply to decline.
However, as shown in the curve B in Fig. 8, according to the present invention, abrasion loss, that is, flatness of wafer with processing wafer
The increase of quantity and decline more slow, i.e., to ensure that the flatness of wafer, also extend the service life of workbench.
According to the invention it is thus possible to edge compensation system compensates the height of the marginal portion of the workbench of exposure machine,
Performance is stablized in the edge planarization of wafer when so as to improve exposure, avoid after photoetching figure out of focus and stacking alignment performance not
It is good, increase microscope carrier service life and product yield.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in its various change or replacement,
These should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the guarantor of the claim
It protects subject to range.
Claims (12)
1. a kind of for carrying the edge compensation system of the workbench of wafer characterized by comprising
Support device is used to support and is lifted the marginal portion of workbench；
Actuation means, positioned at the lower section of the support device, for activating the support device so that the support device is lifted
The marginal portion of the workbench；And
Control device makes the marginal portion of the workbench in a controlled fashion for controlling the actuating amount of the actuation means
It is lifted to compensate abrasion of the edge of wafer to the marginal portion of the workbench.
2. edge compensation system as described in claim 1, which is characterized in that the support device includes edge support rings.
3. edge compensation system as claimed in claim 2, which is characterized in that the upper inside edges setting of the edge support rings is inclined
The inside of inclined portion, the rake towards the edge ring tilts down and contacts the marginal portion of the workbench.
4. edge compensation system as described in claim 1, which is characterized in that the actuation means include piezoelectric actuators.
5. edge compensation system as claimed in claim 4, which is characterized in that the piezoelectric actuators include piezoelectric axis and pressure
Electric unit, the piezoelectric axis are arranged in the top of the piezoelectric unit and support the support device, and the piezoelectric unit is used
In the actuating piezoelectric axis.
6. edge compensation system as claimed in claim 5, which is characterized in that the piezoelectric axis has multiple, and multiple institutes
Piezoelectric axis is stated to be distributed along circumferential direction.
7. edge compensation system as claimed in claim 5, which is characterized in that the piezoelectric unit includes one or more piezoelectricity
Piece, each piezoelectric patches activate the piezoelectric axis by applying voltage generation mechanical strain.
8. edge compensation system as described in claim 1, which is characterized in that the actuation means include precision motor device.
9. a kind of wafer carrier system, which is characterized in that including workbench and as described in any item of the claim 1 to 8
Edge compensation system.
10. wafer carrier system as claimed in claim 9, which is characterized in that further include microscope carrier, the workbench passes through vacuum
The mode of clamping is arranged on the microscope carrier.
11. wafer carrier system as claimed in claim 9, which is characterized in that the wafer carrier system is mounted on an exposure
In machine.
12. a kind of method for wafer to be installed on the workbench, which comprises the following steps:
Lifting device is risen into the top of workbench and is placed on wafer on the end of the lifting device, wherein institute
The edge for stating wafer is deformed；
The lifting device is fallen, places the wafer on the workbench；And
The marginal portion of the workbench is lifted using actuation means, so that the marginal portion of the workbench is aligned in
The edge of the deformation of the wafer on the lifting device and compensate the wafer deformation edge to the workbench
The marginal portion abrasion.
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| CN107240541A (en) * | 2016-03-29 | 2017-10-10 | 朗姆研究公司 | System and method for performing edge ring sign |
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Application publication date: 20190604 |