CN109811244A - A kind of heat conductive electronic alloy material - Google Patents
A kind of heat conductive electronic alloy material Download PDFInfo
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- CN109811244A CN109811244A CN201711158114.9A CN201711158114A CN109811244A CN 109811244 A CN109811244 A CN 109811244A CN 201711158114 A CN201711158114 A CN 201711158114A CN 109811244 A CN109811244 A CN 109811244A
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- epoxy resin
- heat conductive
- alloy material
- conductive electronic
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Abstract
The invention discloses heat conductive electronic alloy materials, according to poidometer, it is made of 20~30 parts of copper, 10~15 parts of iron, 3~10 parts of silicon, 1~6 part of nickel, 0.1~1 part of zinc, 0.5~1 part of phosphorus, 3~10 parts of graphite powder, 0.5~1 part of ytterbium of fluorination, 0.5~1 part of titanium dioxide, 8~10 parts of epoxy resin and 4~6 parts of cycloaliphatic epoxy resin.The invention has good heating conduction, mechanical property, meets the development and application of heat conductive electronic material compositions.Rationally, production method is simple, while guaranteeing materials conductive performance for the design of electronic material formula, its mechanical strength and anti-corrosion effects are improved, simultaneously, paper production cost is dropped, the anti-fatigue performance of electronic material is improved, is bent the electron material of excellent in workability；Have the advantages that high stability, good corrosion resistance and thermal conductivity are good.
Description
Technical field
The present invention relates to alloy materials, and in particular to a kind of heat conductive electronic alloy material.
Background technique
Electronic material refers to the material used in electronic technology and microelectric technique, including dielectric material, semiconductor material
Material, piezoelectricity and ferroelectric material, conductive metal and its alloy material, magnetic material, photoelectron material, electromagnetic shielding material and
Other associated materials.Electronic material is the material base of modern electronics industry and scientific technological advance, while being sciemtifec and technical sphere again
Middle technology-intensive type subject.It is related to the multi-subject knowledges such as electronic technology, physical chemistry, solid state physics and Process ba- sis.
According to the chemical property of material, metal electron material, electronic ceramics, macromolecule electronics, vitreous electricity can be divided into
Medium, mica, gas-insulated medium material, inductor, insulating materials, magnetic material, electronics handware, electrotechnical ceramics material
Material, shielding material, piezoelectric crystal material, fine Electronic chemical materials, electronics gently build woven material, electronics tin solder material,
PCB making material, other electronic materials.
In recent years, electronic material etc. requires epoxide resin material to have better comprehensive performance, especially thermal conductivity,
Also need it with certain toughness simultaneously, so having become a research hotspot to the modification of epoxy resin.Graphite has good
Good chemical stability, corrosion resistance, thermal conductivity, be widely used in petrochemical industry, hydrometallurgy, soda acid production, synthetic fibers,
The industrial departments such as papermaking, for making the equipment such as heat exchanger.But graphite powder and organic material compatibility are very poor, for organic
Object modification is the defects of often leading to material mechanical performance decline.
To the product of heat conductive electronic alloy material, there is also poor chemical stabilities, poor corrosion resistance and thermally conductive in the prior art
Property difference disadvantage.
Summary of the invention
The object of the present invention is to provide a kind of heat conductive electronic alloy materials.The invention has stability height, corrosion resistance
Good and good thermal conductivity advantage.
Technical solution of the present invention: a kind of heat conductive electronic alloy material, according to poidometer, by 20~30 parts of copper, iron 10~
15 parts, 3~10 parts of silicon, 1~6 part of nickel, 0.1~1 part of zinc, 0.5~1 part of phosphorus, 3~10 parts of graphite powder, fluorination 0.5~1 part of ytterbium, titanium
0.5~1 part of white powder, 8~10 parts of epoxy resin and 4~6 parts of cycloaliphatic epoxy resin compositions.
Heat conductive electronic alloy material above-mentioned, according to poidometer, by 25 parts of copper, 13 parts of iron, 7 parts of silicon, 3 parts of nickel, zinc 0.5
Part, 0.7 part of phosphorus, 6 parts of graphite powder, fluorination 0.7 part of ytterbium, 5 parts of 0.7 part of titanium dioxide, 9 parts of epoxy resin and cycloaliphatic epoxy resin groups
At.
The weight ratio of heat conductive electronic alloy material above-mentioned, the fluorination ytterbium and titanium dioxide is 1:1.
Heat conductive electronic alloy material above-mentioned, the epoxy resin are four-functional group epoxy resin.
Heat conductive electronic alloy material above-mentioned, the cycloaliphatic epoxy resin are bis- ((3,4- epoxycyclohexyl) methyl
) adipate ester.
Beneficial effects of the present invention: compared with prior art, the invention has the following advantages that
The present invention utilizes copper, iron, silicon, nickel, zinc, phosphorus, graphite powder, fluorination ytterbium, titanium dioxide, epoxy resin and cycloaliphatic epoxy resin
Heat conductive electronic alloy material has been obtained, there is good heating conduction, mechanical property, meet the hair of heat conductive electronic material compositions
Exhibition application.Rationally, production method is simple, while guaranteeing materials conductive performance, improves its machine for the design of electronic material formula
Tool intensity and anti-corrosion effects, meanwhile, paper production cost is dropped, the anti-fatigue performance of electronic material is improved, is bent
The electron material of excellent in workability；Have the advantages that high stability, good corrosion resistance and thermal conductivity are good.
Specific embodiment
The embodiment of the present invention 1.
A kind of heat conductive electronic alloy material, according to poidometer, by 20~30 parts of copper, 10~15 parts of iron, 3~10 parts of silicon, nickel 1
~6 parts, 0.1~1 part of zinc, 0.5~1 part of phosphorus, 3~10 parts of graphite powder, fluorination 0.5~1 part of ytterbium, 0.5~1 part of titanium dioxide, epoxy
8~10 parts and 4~6 parts of cycloaliphatic epoxy resin compositions of resin.
The heat conductive electronic alloy material, according to poidometer, by 25 parts of copper, 13 parts of iron, 7 parts of silicon, 3 parts of nickel, zinc 0.5
Part, 0.7 part of phosphorus, 6 parts of graphite powder, fluorination 0.7 part of ytterbium, 5 parts of 0.7 part of titanium dioxide, 9 parts of epoxy resin and cycloaliphatic epoxy resin groups
At.
The weight ratio of the fluorination ytterbium and titanium dioxide is 1:1.
The epoxy resin is four-functional group epoxy resin.
The cycloaliphatic epoxy resin is bis- ((3,4- epoxycyclohexyl) methyl) adipate esters.
The embodiment of the present invention 2.
A kind of heat conductive electronic alloy material, according to poidometer, by 20 parts of copper, 10 parts of iron, 3 parts of silicon, 1 part of nickel, 0.1 part of zinc,
0.5 part of phosphorus, 3 parts of graphite powder, 0.5 part of ytterbium of fluorination, 0.5 part of titanium dioxide, 8 parts of epoxy resin and 4 parts of cycloaliphatic epoxy resin compositions.
The weight ratio of the fluorination ytterbium and titanium dioxide is 1:1.
The epoxy resin is four-functional group epoxy resin.
The cycloaliphatic epoxy resin is bis- ((3,4- epoxycyclohexyl) methyl) adipate esters.
The embodiment of the present invention 3.
A kind of heat conductive electronic alloy material, according to poidometer, by 30 parts of copper, 15 parts of iron, 10 parts of silicon, 6 parts of nickel, 1 part of zinc, phosphorus
1 part, 10 parts of graphite powder, 1 part of ytterbium of fluorination, 1 part of titanium dioxide, 10 parts of epoxy resin and 6 parts of cycloaliphatic epoxy resin compositions.
The weight ratio of the fluorination ytterbium and titanium dioxide is 1:1.
The epoxy resin is four-functional group epoxy resin.
The cycloaliphatic epoxy resin is bis- ((3,4- epoxycyclohexyl) methyl) adipate esters.
Claims (5)
1. a kind of heat conductive electronic alloy material, it is characterised in that: according to poidometer, by 20~30 parts of copper, 10~15 parts of iron, silicon 3
~10 parts, 1~6 part of nickel, 0.1~1 part of zinc, 0.5~1 part of phosphorus, 3~10 parts of graphite powder, fluorination 0.5~1 part of ytterbium, titanium dioxide 0.5
~1 part, 8~10 parts of epoxy resin and 4~6 parts of cycloaliphatic epoxy resin compositions.
2. heat conductive electronic alloy material according to claim 1, it is characterised in that: according to poidometer, by 25 parts of copper, iron 13
Part, 7 parts of silicon, 3 parts of nickel, 0.5 part of zinc, 0.7 part of phosphorus, 6 parts of graphite powder, fluorination 0.7 part of ytterbium, 0.7 part of titanium dioxide, 9 parts of epoxy resin
It is formed with 5 parts of cycloaliphatic epoxy resin.
3. heat conductive electronic alloy material according to claim 1 or 2, it is characterised in that: the fluorination ytterbium and titanium dioxide
Weight ratio is 1:1.
4. heat conductive electronic alloy material according to claim 1 or 2, it is characterised in that: the epoxy resin is tetrafunctional
Group's epoxy resin.
5. heat conductive electronic alloy material according to claim 1 or 2, it is characterised in that: the cycloaliphatic epoxy resin is
Bis- ((3,4- epoxycyclohexyl) methyl) adipate esters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711158114.9A CN109811244A (en) | 2017-11-20 | 2017-11-20 | A kind of heat conductive electronic alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711158114.9A CN109811244A (en) | 2017-11-20 | 2017-11-20 | A kind of heat conductive electronic alloy material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109811244A true CN109811244A (en) | 2019-05-28 |
Family
ID=66599350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711158114.9A Pending CN109811244A (en) | 2017-11-20 | 2017-11-20 | A kind of heat conductive electronic alloy material |
Country Status (1)
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| CN (1) | CN109811244A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110283356A (en) * | 2019-06-26 | 2019-09-27 | 南京睿扬光电技术有限公司 | A kind of efficiently fluorination ytterbium mixing material and its preparation process |
| CN112410646A (en) * | 2020-10-16 | 2021-02-26 | 扬州千裕电气有限公司 | Electronic composite material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101819839A (en) * | 2004-06-25 | 2010-09-01 | 株式会社日立制作所 | Rare-earth magnet |
| CN105400984A (en) * | 2015-11-13 | 2016-03-16 | 太仓荣中机电科技有限公司 | Electronic alloy material with balanced performance |
| CN107033542A (en) * | 2017-03-24 | 2017-08-11 | 苏州权素船舶电子有限公司 | A kind of heat-conducting metal electronic material |
-
2017
- 2017-11-20 CN CN201711158114.9A patent/CN109811244A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101819839A (en) * | 2004-06-25 | 2010-09-01 | 株式会社日立制作所 | Rare-earth magnet |
| CN105400984A (en) * | 2015-11-13 | 2016-03-16 | 太仓荣中机电科技有限公司 | Electronic alloy material with balanced performance |
| CN107033542A (en) * | 2017-03-24 | 2017-08-11 | 苏州权素船舶电子有限公司 | A kind of heat-conducting metal electronic material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110283356A (en) * | 2019-06-26 | 2019-09-27 | 南京睿扬光电技术有限公司 | A kind of efficiently fluorination ytterbium mixing material and its preparation process |
| CN112410646A (en) * | 2020-10-16 | 2021-02-26 | 扬州千裕电气有限公司 | Electronic composite material |
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Application publication date: 20190528 |