CN107033542A - A kind of heat-conducting metal electronic material - Google Patents
A kind of heat-conducting metal electronic material Download PDFInfo
- Publication number
- CN107033542A CN107033542A CN201710184434.5A CN201710184434A CN107033542A CN 107033542 A CN107033542 A CN 107033542A CN 201710184434 A CN201710184434 A CN 201710184434A CN 107033542 A CN107033542 A CN 107033542A
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- parts
- heat
- electronic material
- filler
- conducting metal
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/14—Carbides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/327—Aluminium phosphate
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses the raw material composition of a kind of heat-conducting metal electronic material, including following parts by weight：40 60 parts of epoxy resin；5 10 parts of triacetic acid sodium；10 25 parts of tungsten carbide powder；5 20 parts of thermal conductive metal particle；15 25 parts of filler.The beneficial effects of the invention are as follows：The present invention adds thermal conductive metal particle and its filler in raw material components, while the graphite in filler causes the electronic material being made to have excellent heat conductivility, and compatibility is good between each component, workable.
Description
Technical field
The present invention relates to technical field of electronic materials, more particularly, to a kind of heat-conducting metal electronic material.
Background technology
Electronics composite is forming high-tech industry group one large-scale, there is very wide market prospects
With particularly important strategic importance.Its epoxy resin has excellent cementability, heat endurance and excellent chemically-resistant medicine
Moral character, as the resin matrix of adhesive, coating and composite etc., is widely used in water conservancy, traffic, machinery, electronics, family
The fields such as electricity, automobile and Aero-Space.In recent years, require that epoxide resin material has in terms of electronic material preferably comprehensive
Energy, particularly thermal conductivity.But graphite has good chemical stability, corrosion resistance, thermal conductivity, using extremely extensive.
Therefore, in order to solve above-mentioned problem, the present invention is special to provide a kind of new technical scheme.
The content of the invention
It is an object of the invention to provide a kind of heat-conducting metal electronic material.
It is of the invention to be for the technical scheme that above-mentioned technological deficiency is used：
A kind of heat-conducting metal electronic material, includes the raw material composition of following parts by weight：
40-60 parts of epoxy resin；
5-10 parts of triacetic acid sodium；
10-25 parts of tungsten carbide powder；
5-20 parts of thermal conductive metal particle；
15-25 parts of filler.
Further, the raw material composition of following parts by weight is included：
40 parts of epoxy resin；
5 parts of triacetic acid sodium；
10 parts of tungsten carbide powder；
5 parts of thermal conductive metal particle；
15 parts of filler.
Further, the raw material composition of following parts by weight is included：
60 parts of epoxy resin；
10 parts of triacetic acid sodium；
25 parts of tungsten carbide powder；
20 parts of thermal conductive metal particle；
25 parts of filler.
Further, the thermal conductive metal particle is at least one of titanium diboride, zirconium dioxide, antimony trichloride.
Further, the filler is any one in graphite, titanium dioxide and aluminum phosphate.
The beneficial effects of the invention are as follows：The present invention adds thermal conductive metal particle and its filler in raw material components, fills out simultaneously
Graphite in material causes the electronic material being made to have excellent heat conductivility, and compatibility is good between each component, operable
Property is strong.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, the embodiment
It is only used for explaining the present invention, does not constitute the restriction to protection scope of the present invention.
Embodiment 1
A kind of heat-conducting metal electronic material, includes the raw material composition of following parts by weight：
40 parts of epoxy resin；
5 parts of triacetic acid sodium；
10 parts of tungsten carbide powder；
5 parts of titanium diboride；
15 parts of graphite.
Embodiment 2
A kind of heat-conducting metal electronic material, includes the raw material composition of following parts by weight：
50 parts of epoxy resin；
8 parts of triacetic acid sodium；
20 parts of tungsten carbide powder；
15 parts of zirconium dioxide；
20 parts of titanium dioxide.
Embodiment 3
A kind of heat-conducting metal electronic material, includes the raw material composition of following parts by weight：
60 parts of epoxy resin；
10 parts of triacetic acid sodium；
25 parts of tungsten carbide powder；
20 parts of antimony trichloride；
25 parts of aluminum phosphate.
The beneficial effects of the invention are as follows：The present invention adds thermal conductive metal particle and its filler in raw material components, fills out simultaneously
Graphite in material causes the electronic material being made to have excellent heat conductivility, and compatibility is good between each component, operable
Property is strong.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (5)
1. a kind of heat-conducting metal electronic material, it is characterised in that：Raw material composition including following parts by weight：
40-60 parts of epoxy resin；
5-10 parts of triacetic acid sodium；
10-25 parts of tungsten carbide powder；
5-20 parts of thermal conductive metal particle；
15-25 parts of filler.
2. a kind of heat-conducting metal electronic material according to claim 1, it is characterised in that：Include the raw material of following parts by weight
Composition：
40 parts of epoxy resin；
5 parts of triacetic acid sodium；
10 parts of tungsten carbide powder；
5 parts of thermal conductive metal particle；
15 parts of filler.
3. a kind of heat-conducting metal electronic material according to claim 1, it is characterised in that：Include the raw material of following parts by weight
Composition：
460 parts of epoxy resin；
10 parts of triacetic acid sodium；
25 parts of tungsten carbide powder；
20 parts of thermal conductive metal particle；
25 parts of filler.
4. a kind of heat-conducting metal electronic material according to claim 1, it is characterised in that：The thermal conductive metal particle is two
At least one of titanium boride, zirconium dioxide, antimony trichloride.
5. a kind of heat-conducting metal electronic material according to claim 1, it is characterised in that：The filler is graphite, titanium white
Any one in powder and aluminum phosphate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710184434.5A CN107033542A (en) | 2017-03-24 | 2017-03-24 | A kind of heat-conducting metal electronic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710184434.5A CN107033542A (en) | 2017-03-24 | 2017-03-24 | A kind of heat-conducting metal electronic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107033542A true CN107033542A (en) | 2017-08-11 |
Family
ID=59533790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710184434.5A Pending CN107033542A (en) | 2017-03-24 | 2017-03-24 | A kind of heat-conducting metal electronic material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107033542A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108504035A (en) * | 2017-05-18 | 2018-09-07 | 苏州权素船舶电子有限公司 | A kind of heat-conducting metal electronic material |
| CN109811244A (en) * | 2017-11-20 | 2019-05-28 | 贵州顽熊电子科技有限公司 | A kind of heat conductive electronic alloy material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN105062032A (en) * | 2015-08-17 | 2015-11-18 | 苏州凯欧曼新材料科技有限公司 | Impact-resistant thermally-conductive polymer material and preparation method thereof |
| CN105400134A (en) * | 2015-11-11 | 2016-03-16 | 吴江市莘塔前进五金厂 | Heat-conducting electronic material composition |
-
2017
- 2017-03-24 CN CN201710184434.5A patent/CN107033542A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN105062032A (en) * | 2015-08-17 | 2015-11-18 | 苏州凯欧曼新材料科技有限公司 | Impact-resistant thermally-conductive polymer material and preparation method thereof |
| CN105400134A (en) * | 2015-11-11 | 2016-03-16 | 吴江市莘塔前进五金厂 | Heat-conducting electronic material composition |
Non-Patent Citations (1)
| Title |
|---|
| 周文英 丁小卫: "《导热高分子材料》", 30 April 2014, 国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108504035A (en) * | 2017-05-18 | 2018-09-07 | 苏州权素船舶电子有限公司 | A kind of heat-conducting metal electronic material |
| CN109811244A (en) * | 2017-11-20 | 2019-05-28 | 贵州顽熊电子科技有限公司 | A kind of heat conductive electronic alloy material |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170811 |