CN102807351A - Novel daub for graphite bonding - Google Patents

Novel daub for graphite bonding Download PDF

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Publication number
CN102807351A
CN102807351A CN 201110142173 CN201110142173A CN102807351A CN 102807351 A CN102807351 A CN 102807351A CN 201110142173 CN201110142173 CN 201110142173 CN 201110142173 A CN201110142173 A CN 201110142173A CN 102807351 A CN102807351 A CN 102807351A
Authority
CN
China
Prior art keywords
daub
graphite
bonding
novel
clay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201110142173
Other languages
Chinese (zh)
Inventor
唐正勇
黄晓东
陆艺
曹蓉蓉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTONG SANXIN CARBON GRAPHITE EQUIPMENT CO Ltd
Original Assignee
NANTONG SANXIN CARBON GRAPHITE EQUIPMENT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANTONG SANXIN CARBON GRAPHITE EQUIPMENT CO Ltd filed Critical NANTONG SANXIN CARBON GRAPHITE EQUIPMENT CO Ltd
Priority to CN 201110142173 priority Critical patent/CN102807351A/en
Publication of CN102807351A publication Critical patent/CN102807351A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a novel daub for graphite bonding, and belongs to the field of graphite equipment bonding materials. The daub comprises the following components, by mass, 60-80% of water glass, 10-20% of a curing agent, and 10-20% of graphite powder. According to the daub for graphite bonding in the present invention, volatile components are less, and the water glass has low viscosity so as to gradually eliminate produced volatile component bubbles, such that no bubble exists inside the daub after curing, and the cured section is smooth; and the daub can resist a temperature of 400 DEG C while a heat temperature requires only 130 DEG C.

Description

The novel graphite bonding is used clay
Technical field
The present invention relates to graphite equipment with the bonding filler, be specifically related to a kind of novel graphite bonding and use clay.
Background technology
Traditional clay generally is made up of resin (resol, furane resin etc.), Graphite Powder 99, solidifying agent, and heat resistance is general maximum 180 ℃ (concrete heat resistance is by thermal treatment process, and heat treatment process temperature high temperature tolerance more is good more).Send out composition (for example moisture, free phenol, free aldehyde etc.) owing to contain multiple meeting in the resin, these volatile matters can send gradually in curing and heat treatment process, cause clay inside bubble to occur, influence bonding strength.There is bubble in this type clay section after fixed line.
Summary of the invention
Goal of the invention: the present invention provides the novel graphite bonding that a kind of temperature tolerance is good, thermal treatment temp is low, can there be bubble in cured glue mud inside to use clay in order to solve the deficiency of prior art.
The technical scheme that the present invention adopts: a kind of novel graphite bonding uses clay, said clay to comprise the water glass of following component by mass percent: 60-80%, the solidifying agent of 10-20%, the Graphite Powder 99 of 10-20%.
As optimization, the mass percentage content of silicon-dioxide is 30-60% in the said water glass.
As optimization, containing mass percent in the said solidifying agent is the 4-8% Sodium Silicofluoride 98min.
As optimization, said graphite powder particle degree is the 100-130 order.
Beneficial effect: novel graphite bonding of the present invention is less with the clay volatile component, and because water glass viscosity is very little, and the volatile matter bubble of generation can be got rid of gradually, does not therefore have bubble in cured glue mud inside, and the section after the curing is smooth.The type clay heat resistance can reach 400 ℃, and thermal treatment temp only needs 130 ℃ and gets final product.
Embodiment
Below in conjunction with specific embodiment the present invention is described further:
Embodiment 1
A kind of novel graphite bonding is used clay, and said clay comprises following component by mass percent: 60% water glass, 20% solidifying agent, 20% Graphite Powder 99, the mass percentage content of silicon-dioxide is 30% in the said water glass.
Containing mass percent in the said solidifying agent is 4% Sodium Silicofluoride 98min.
Said graphite powder particle degree equals 100 orders.
Embodiment 2
A kind of novel graphite bonding is used clay; Said clay comprises following component by mass percent: 70% water glass, 15% solidifying agent, 15% Graphite Powder 99; The mass percentage content of silicon-dioxide is 50% in the said water glass; Containing mass percent in the said solidifying agent is 6% Sodium Silicofluoride 98min, said graphite powder particle degree 120 orders.
Embodiment 3
A kind of novel graphite bonding is used clay; Said clay comprises following component by mass percent: 80% water glass, 10% solidifying agent, 10% Graphite Powder 99; The mass percentage content of silicon-dioxide is 60% in the said water glass; Containing mass percent in the said solidifying agent is 8% Sodium Silicofluoride 98min, said graphite powder particle degree 130 orders.

Claims (4)

1. a novel graphite bonding is used clay, and it is characterized in that: said clay comprises the water glass of following component by mass percent: 60-80%, the solidifying agent of 10-20%, the Graphite Powder 99 of 10-20%.
2. novel graphite bonding according to claim 1 is used clay, and it is characterized in that: the mass percentage content of silicon-dioxide is 30-60% in the said water glass.
3. novel graphite bonding according to claim 1 is used clay, and it is characterized in that: containing mass percent in the said solidifying agent is the 4-8% Sodium Silicofluoride 98min.
4. novel graphite bonding according to claim 1 is used clay, and it is characterized in that: said graphite powder particle degree is the 100-130 order.
CN 201110142173 2011-05-30 2011-05-30 Novel daub for graphite bonding Pending CN102807351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110142173 CN102807351A (en) 2011-05-30 2011-05-30 Novel daub for graphite bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110142173 CN102807351A (en) 2011-05-30 2011-05-30 Novel daub for graphite bonding

Publications (1)

Publication Number Publication Date
CN102807351A true CN102807351A (en) 2012-12-05

Family

ID=47231241

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110142173 Pending CN102807351A (en) 2011-05-30 2011-05-30 Novel daub for graphite bonding

Country Status (1)

Country Link
CN (1) CN102807351A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104017525A (en) * 2014-07-01 2014-09-03 唐山三友硅业有限责任公司 Repair method of graphite equipment
CN106630905A (en) * 2016-11-28 2017-05-10 浙江锦诚新材料股份有限公司 Acid-resistant and alkali-resistant cement and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104017525A (en) * 2014-07-01 2014-09-03 唐山三友硅业有限责任公司 Repair method of graphite equipment
CN106630905A (en) * 2016-11-28 2017-05-10 浙江锦诚新材料股份有限公司 Acid-resistant and alkali-resistant cement and preparation method thereof

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C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121205