CN107298809A - A kind of electronic material with low solidification temperature - Google Patents
A kind of electronic material with low solidification temperature Download PDFInfo
- Publication number
- CN107298809A CN107298809A CN201710752984.2A CN201710752984A CN107298809A CN 107298809 A CN107298809 A CN 107298809A CN 201710752984 A CN201710752984 A CN 201710752984A CN 107298809 A CN107298809 A CN 107298809A
- Authority
- CN
- China
- Prior art keywords
- parts
- solidification temperature
- electronic material
- low solidification
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
- C08L23/28—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
- C08L23/286—Chlorinated polyethylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of electronic material with low solidification temperature, including component have：Nickel, haloflex, synthetic base oil, solid paraffin, dioctyl phthalate, double ten four carbon alcohols esters, the content of the electronic material each component with low solidification temperature is：In parts by weight, 18 24 parts of nickel, 10 18 parts of haloflex, 6 13 parts of synthetic base oil, 5 11 parts of solid paraffin, 29 parts of dioctyl phthalate, double 11 17 parts of ten four carbon alcohols esters, wherein the solidification temperature of the electronic material with low solidification temperature is 10 30 degrees Celsius.By the above-mentioned means, the electronic material with low solidification temperature of the present invention, solidification can be realized at a lower temperature, in thermo-sensitive material and nonweldable material, having broad application prospects in the Electronic Assemblies industry of increasingly densification and miniaturization.
Description
Technical field
The present invention relates to field of electronic materials, more particularly to a kind of electronic material with low solidification temperature.
Background technology
Electronic material refers to the material used in electronic technology and microelectric technique, including dielectric material, semiconductor material
Material, piezoelectricity and ferroelectric material, conducting metal and its alloy material, magnetic material, photoelectron material, electromagnetic shielding material and
Other associated materials.Electronic material is the material base of modern electronics industry and scientific technological advance, while being sciemtifec and technical sphere again
Middle technology-intensive subject.It is related to the multi-subject knowledges such as electronic technology, physical chemistry, solid state physics and Process ba- sis.
According to the chemical property of material, can be divided into metal electron material, electronic ceramics, macromolecule electronics, glass dielectric, mica,
Gas-insulated medium material, inductor, insulating materials, magnetic material, electronics handware, electrotechnical ceramics material, shielding material, pressure
Crystal material, fine Electronic chemical materials, electronics gently build woven material, electronics tin solder material, PCB making materials and other electricity
Sub- material.Existing electronic material needs to solidify at high temperature, and using effect is bad.
The content of the invention
The present invention solves the technical problem of provide a kind of electronic material with low solidification temperature, using effect
It is good.
In order to solve the above technical problems, one aspect of the present invention is：There is provided a kind of with low solidification temperature
Electronic material, including component have：Nickel, haloflex, synthetic base oil, solid paraffin, dioctyl phthalate, double ten four carbon alcohols
Ester, the content of the electronic material each component with low solidification temperature is：In parts by weight, nickel 18-24 parts, chlorinated polyethylene
10-18 parts of alkene, 6-13 parts of synthetic base oil, 5-11 parts of solid paraffin, 2-9 parts of dioctyl phthalate, double ten four carbon alcohols ester 11-
17 parts, wherein the solidification temperature of the electronic material with low solidification temperature is 10-30 degrees Celsius.
In a preferred embodiment of the present invention, the content of the electronic material each component with low solidification temperature is：
In parts by weight, 18 parts of nickel, 18 parts of haloflex, 6 parts of synthetic base oil, 11 parts of solid paraffin, 2 parts of dioctyl phthalate,
Double 17 parts of ten four carbon alcohols esters, wherein the solidification temperature of the electronic material with low solidification temperature is 10 degrees Celsius.
In a preferred embodiment of the present invention, the content of the electronic material each component with low solidification temperature is：
In parts by weight, 24 parts of nickel, 10 parts of haloflex, 13 parts of synthetic base oil, 5 parts of solid paraffin, 9 parts of dioctyl phthalate,
Double 11 parts of ten four carbon alcohols esters, wherein the solidification temperature of the electronic material with low solidification temperature is 30 degrees Celsius.
In a preferred embodiment of the present invention, the content of the electronic material each component with low solidification temperature is：
In parts by weight, 19 parts of nickel, 17 parts of haloflex, 7 parts of synthetic base oil, 10 parts of solid paraffin, 3 parts of dioctyl phthalate,
Double 16 parts of ten four carbon alcohols esters, wherein the solidification temperature of the electronic material with low solidification temperature is 15 degrees Celsius.
In a preferred embodiment of the present invention, the content of the electronic material each component with low solidification temperature is：
In parts by weight, 23 parts of nickel, 11 parts of haloflex, 12 parts of synthetic base oil, 6 parts of solid paraffin, 8 parts of dioctyl phthalate,
Double 12 parts of ten four carbon alcohols esters, wherein the solidification temperature of the electronic material with low solidification temperature is 25 degrees Celsius.
In a preferred embodiment of the present invention, the content of the electronic material each component with low solidification temperature is：
In parts by weight, 20 parts of nickel, 15 parts of haloflex, 10 parts of synthetic base oil, 8 parts of solid paraffin, 6 parts of dioctyl phthalate,
Double 11-17 parts of ten four carbon alcohols esters, wherein the solidification temperature of the electronic material with low solidification temperature is 20 degrees Celsius.
The beneficial effects of the invention are as follows：The electronic material with low solidification temperature of the present invention, can be in relatively low temperature
It is lower to realize solidification, in thermo-sensitive material and nonweldable material, in increasingly densification and the Electronic Assemblies industry of miniaturization
Have broad application prospects.
Embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
All other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
Embodiment one：
A kind of electronic material with low solidification temperature is provided, including component have：It is nickel, haloflex, synthetic base oil, solid
Body paraffin, dioctyl phthalate, double ten four carbon alcohols esters.The content of the electronic material each component with low solidification temperature is：With weight
Measure part meter, 18 parts of nickel, 18 parts of haloflex, 6 parts of synthetic base oil, 11 parts of solid paraffin, 2 parts of dioctyl phthalate, double ten
17 parts of four carbon alcohols ester, wherein the solidification temperature of the electronic material with low solidification temperature is 10 degrees Celsius.
Embodiment two：
A kind of electronic material with low solidification temperature is provided, including component have：It is nickel, haloflex, synthetic base oil, solid
Body paraffin, dioctyl phthalate, double ten four carbon alcohols esters.The content of the electronic material each component with low solidification temperature is：With weight
Measure part meter, 24 parts of nickel, 10 parts of haloflex, 13 parts of synthetic base oil, 5 parts of solid paraffin, 9 parts of dioctyl phthalate, double ten
11 parts of four carbon alcohols ester, wherein the solidification temperature of the electronic material with low solidification temperature is 30 degrees Celsius.
Embodiment three：
A kind of electronic material with low solidification temperature is provided, including component have：It is nickel, haloflex, synthetic base oil, solid
Body paraffin, dioctyl phthalate, double ten four carbon alcohols esters.The content of the electronic material each component with low solidification temperature is：With weight
Measure part meter, 19 parts of nickel, 17 parts of haloflex, 7 parts of synthetic base oil, 10 parts of solid paraffin, 3 parts of dioctyl phthalate, double ten
16 parts of four carbon alcohols ester, wherein the solidification temperature of the electronic material with low solidification temperature is 15 degrees Celsius.
Example IV：
A kind of electronic material with low solidification temperature is provided, including component have：It is nickel, haloflex, synthetic base oil, solid
Body paraffin, dioctyl phthalate, double ten four carbon alcohols esters.The content for stating the electronic material each component with low solidification temperature is：With weight
Part meter, 23 parts of nickel, 11 parts of haloflex, 12 parts of synthetic base oil, 6 parts of solid paraffin, 8 parts of dioctyl phthalate, double 14
12 parts of carbon alcohol ester, wherein the solidification temperature of the electronic material with low solidification temperature is 25 degrees Celsius.
Embodiment five：
A kind of electronic material with low solidification temperature is provided, including component have：It is nickel, haloflex, synthetic base oil, solid
Body paraffin, dioctyl phthalate, double ten four carbon alcohols esters.The content of the electronic material each component with low solidification temperature is：With weight
Measure part meter, 20 parts of nickel, 15 parts of haloflex, 10 parts of synthetic base oil, 8 parts of solid paraffin, 6 parts of dioctyl phthalate, double ten
11-17 parts of four carbon alcohols ester, wherein the solidification temperature of the electronic material with low solidification temperature is 20 degrees Celsius.
The beneficial effects of the invention are as follows：
First, the electronic material with low solidification temperature can realize solidification at a lower temperature, for thermo-sensitive material and
In nonweldable material；
2nd, the electronic material with low solidification temperature has wide in the Electronic Assemblies industry of increasingly densification and miniaturization
Application prospect.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (6)
1. a kind of electronic material with low solidification temperature, it is characterised in that including component have：Nickel, haloflex, synthesis
Base oil, solid paraffin, dioctyl phthalate, double ten four carbon alcohols esters, the electronic material each component with low solidification temperature contain
Measure and be：In parts by weight, nickel 18-24 parts, 10-18 parts of haloflex, 6-13 parts of synthetic base oil, solid paraffin 5-11
Part, 2-9 parts of dioctyl phthalate, 11-17 parts of double ten four carbon alcohols esters, wherein the solidification of the electronic material with low solidification temperature
Temperature is 10-30 degrees Celsius.
2. the electronic material according to claim 1 with low solidification temperature, it is characterised in that described that there is low solidification temperature
The content of the electronic material each component of degree is：In parts by weight, 18 parts of nickel, 18 parts of haloflex, 6 parts of synthetic base oil,
11 parts of solid paraffin, 2 parts of dioctyl phthalate, double 17 parts of ten four carbon alcohols esters, wherein the electronic material with low solidification temperature
Solidification temperature be 10 degrees Celsius.
3. the electronic material according to claim 1 with low solidification temperature, it is characterised in that described that there is low solidification temperature
The content of the electronic material each component of degree is：In parts by weight, 24 parts of nickel, 10 parts of haloflex, synthetic base oil 13
Part, 5 parts of solid paraffin, 9 parts of dioctyl phthalate, double 11 parts of ten four carbon alcohols esters, wherein the electronics material with low solidification temperature
The solidification temperature of material is 30 degrees Celsius.
4. the electronic material according to claim 1 with low solidification temperature, it is characterised in that described that there is low solidification temperature
The content of the electronic material each component of degree is：In parts by weight, 19 parts of nickel, 17 parts of haloflex, 7 parts of synthetic base oil,
10 parts of solid paraffin, 3 parts of dioctyl phthalate, double 16 parts of ten four carbon alcohols esters, wherein the electronic material with low solidification temperature
Solidification temperature be 15 degrees Celsius.
5. the electronic material according to claim 1 with low solidification temperature, it is characterised in that described that there is low solidification temperature
The content of the electronic material each component of degree is：In parts by weight, 23 parts of nickel, 11 parts of haloflex, synthetic base oil 12
Part, 6 parts of solid paraffin, 8 parts of dioctyl phthalate, double 12 parts of ten four carbon alcohols esters, wherein the electronics material with low solidification temperature
The solidification temperature of material is 25 degrees Celsius.
6. the electronic material according to claim 1 with low solidification temperature, it is characterised in that described that there is low solidification temperature
The content of the electronic material each component of degree is：In parts by weight, 20 parts of nickel, 15 parts of haloflex, synthetic base oil 10
Part, 8 parts of solid paraffin, 6 parts of dioctyl phthalate, 11-17 parts of double ten four carbon alcohols esters, wherein the electricity with low solidification temperature
The solidification temperature of sub- material is 20 degrees Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710752984.2A CN107298809A (en) | 2017-08-29 | 2017-08-29 | A kind of electronic material with low solidification temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710752984.2A CN107298809A (en) | 2017-08-29 | 2017-08-29 | A kind of electronic material with low solidification temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107298809A true CN107298809A (en) | 2017-10-27 |
Family
ID=60132591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710752984.2A Pending CN107298809A (en) | 2017-08-29 | 2017-08-29 | A kind of electronic material with low solidification temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107298809A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667228A (en) * | 2021-09-28 | 2021-11-19 | 中科检测技术服务(重庆)有限公司 | Electronic material with low curing temperature and production device thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183881A (en) * | 2011-12-29 | 2013-07-03 | 深圳市宏商材料科技股份有限公司 | Environment-friendly type thermal shrinkage stress sleeving and preparation method |
| CN203482519U (en) * | 2013-09-13 | 2014-03-12 | 联想(北京)有限公司 | Electronic equipment |
| CN104277207A (en) * | 2014-10-31 | 2015-01-14 | 安徽神剑新材料股份有限公司 | Highly weather-resistant low temperature curable polyester resin |
| CN105400134A (en) * | 2015-11-11 | 2016-03-16 | 吴江市莘塔前进五金厂 | Heat-conducting electronic material composition |
| CN106433123A (en) * | 2016-10-17 | 2017-02-22 | 奥士康精密电路（惠州）有限公司 | Halogen-free high-Tg printed circuit board and drilling method thereof |
| CN107400490A (en) * | 2017-07-10 | 2017-11-28 | 东莞市沅邦电子材料有限公司 | A kind of low temperature curing type single-component epoxy glue |
-
2017
- 2017-08-29 CN CN201710752984.2A patent/CN107298809A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183881A (en) * | 2011-12-29 | 2013-07-03 | 深圳市宏商材料科技股份有限公司 | Environment-friendly type thermal shrinkage stress sleeving and preparation method |
| CN203482519U (en) * | 2013-09-13 | 2014-03-12 | 联想(北京)有限公司 | Electronic equipment |
| CN104277207A (en) * | 2014-10-31 | 2015-01-14 | 安徽神剑新材料股份有限公司 | Highly weather-resistant low temperature curable polyester resin |
| CN105400134A (en) * | 2015-11-11 | 2016-03-16 | 吴江市莘塔前进五金厂 | Heat-conducting electronic material composition |
| CN106433123A (en) * | 2016-10-17 | 2017-02-22 | 奥士康精密电路（惠州）有限公司 | Halogen-free high-Tg printed circuit board and drilling method thereof |
| CN107400490A (en) * | 2017-07-10 | 2017-11-28 | 东莞市沅邦电子材料有限公司 | A kind of low temperature curing type single-component epoxy glue |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667228A (en) * | 2021-09-28 | 2021-11-19 | 中科检测技术服务(重庆)有限公司 | Electronic material with low curing temperature and production device thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106756376B (en) | Tungsten-copper alloy and its processing method and application | |
| Liu et al. | The control of thermal expansion and impedance of Al–Zr2 (WO4)(PO4) 2 nano-cermets for near-zero-strain Al alloy and fine electrical components | |
| Wan et al. | Preparation and properties of superfine W–20Cu powders by a novel chemical method | |
| CN107298809A (en) | A kind of electronic material with low solidification temperature | |
| Movassagh-Alanagh et al. | Fabrication of microwave absorbing Fe3O4/MWCNTs@ CFs nanocomposite by means of an electrophoretic co-deposition process | |
| CN103000369B (en) | The preparation method of high withstand voltage chip ceramic capacitor | |
| Doshi et al. | Printing of electromagnetic interference shielding materials | |
| Lv et al. | NaNbO3‐Based Multilayer Ceramic Capacitors with Ultrahigh Energy Storage Performance | |
| KR100933371B1 (en) | Electromagnetic wave absorber including soft magnetic layer imparted with function of dielectric layer and method of forming soft magnetic layer | |
| Pavlovic et al. | Influence of electrolytic copper powder particle morphology on electrical conductivity of lignocellulose composites and formation of conductive pathways | |
| KR20090089277A (en) | Electromagnetic wave absorber compring magnetically soft body layer having function of dilectirc layer | |
| CN106636981A (en) | Soft magnet-based amorphous alloy product | |
| CN107586455A (en) | A kind of electronic material suitable for densification Electronic Assemblies | |
| Borra et al. | Sn whisker growth mitigation by using NiO sublayers | |
| CN109811244A (en) | A kind of heat conductive electronic alloy material | |
| CN107541091A (en) | It is a kind of that there is the very good electronic material being conductively connected | |
| CN107312238A (en) | A kind of electronic material with thin space ability | |
| CN113242774B (en) | Silver paste | |
| CN103357866B (en) | A kind of carbonyl iron dust high-temperature heat treatment method for metal magnetic powder core | |
| CN107312258A (en) | A kind of good electronic material of compressive resistance | |
| CN107502248A (en) | A kind of electronic material suitable for high integration Electronic Assemblies | |
| CN107501933A (en) | A kind of electronic material with high linear resolution | |
| JP2017025393A (en) | Copper powder and manufacturing method thereof | |
| KR20130058205A (en) | Metallic paste composition for formation of an electrode comprisiing graphite and ag-graphite composite electrodes usign the same | |
| CN106972006B (en) | A kind of EMI inhibition structure and suppressing method based on resistive shorts via hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171027 |