CN106433123A - Halogen-free high-Tg printed circuit board and drilling method thereof - Google Patents
Halogen-free high-Tg printed circuit board and drilling method thereof Download PDFInfo
- Publication number
- CN106433123A CN106433123A CN201610900702.4A CN201610900702A CN106433123A CN 106433123 A CN106433123 A CN 106433123A CN 201610900702 A CN201610900702 A CN 201610900702A CN 106433123 A CN106433123 A CN 106433123A
- Authority
- CN
- China
- Prior art keywords
- pcb plate
- depth
- plate
- reverse side
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention provides a halogen-free high-Tg printed circuit board and a drilling method thereof. By using the scheme, total amount of chlorine element and bromine element in a copper clad plate is smaller than 500ppm, so that halogen-free requirements of European Union are met, and various industrial standards jointly agreed by IEC, JPCA and IPC are met; under the circumstance that drilling diameter of the circuit board is reduced, bumps and burrs generated at the hole edge of the circuit board after drilling are effectively prevented, temperature of a drill bit during drilling is lowered, and service life of the drill bit is prolonged; through set formula parameters, the circuit board is suitable for both high-precision back drilling and high-precision depth-controlled blind hole making.
Description
Technical field
The invention belongs to wiring board processing technique field, and in particular to a kind of high Tg printed wiring board of Halogen and its drilling side
Method.
Background technology
In recent years, miniaturization of electronic products, multifunction so that printed circuit board is sent out towards fine, slim, multiple stratification direction
Exhibition, as production is increasingly sophisticated with using technique, proposes more higher requirements to the performance of baseplate material.In PCB system
On work, sheet material (such as multi-layer sheet) will stand the repeatedly hot-working such as lamination, hot melt or hot air leveling；And in copper-clad plate application,
SMT（Surface mounting technology）The multiple welding of two-sided attachment and be heated using process, these are both needed to copper-clad plate and can bear
Higher temperature.Particularly the semiconductor mounting substrate such as BGA, CSP, MCM and high multi-layer sheet, are that its interconnection of raising can with installation
By property, more require that copper-clad plate possesses higher thermostability, heat-state mechanical strength and low-thermal-expansion rate etc..With glass cloth as strengthening
In the PCB baseplate material of material, the FR-4 copper-clad plate of epoxy systems is due to having such as high peel strength of copper foil, good
Insulating properties and Ke Jia fourth, and become the current universal product.But, common FR-4 glass sheet temperature is at 130-140 DEG C
Between, Z direction of principal axis thermal coefficient of expansion is big, and thermostability is low, is also easy to produce resin greasy dirt during drilling, shrinks big, unfavorable para-position etc. during processing
Shortcoming, using above there is certain limitation.Less there is hole for making substrate have in relatively low Z axle thermal coefficient of expansion, the course of processing
Wall resin shrinkage, PCB producer typically considers the thermostability copper-clad plate from higher Tg.
Meanwhile, with European Union ROHS and the formal enforcement of two instructions of WEEE, the PCB to upstream and copper-clad plate (CCL)
For manufacturing enterprise, it is meant that enterprise will not only guarantee that provided product meets command request, and to adapt to PCB and
The requirement of PCBA processing procedure change, can otherwise face the condition being eliminated.From in terms of present circumstances, instruction is rushed to PCB or CCL
Hit mainly：1st, the temperature resistance problem of unleaded solder problems and copper-clad plate material.Lead-free solder and traditional Sn-Pb solder
Compare, its fusing point is greatly improved.If Sn-Ag-Cu fusing point is 217 DEG C, 183 DEG C of the fusing point of relatively conventional Sn-Pb, 34 DEG C are improved
As many as, so as to propose new requirement to the thermostability of copper-clad plate material.And the T288 of tradition FR-4（During the resistance to thermal decomposition of base material
Between）About about 310 DEG C of 2min, Td (heat decomposition temperature of base material), its thermostability is difficult to meet leadless process requirement.2nd, according to Europe
The non-halogen requirement of the newest electronic product of alliance, the various industry standards of IEC, JPCA, IPC joint agreement, acceptable content of halogen：
Bromine is 900ppm, and chlorine is that 900ppm, the total content of halogen is up to 1500ppm.Common FR-4 copper-clad plate matrix resin be with four
Brominated epoxy resin based on bromine bisphenol-A, wherein tetrabromobisphenol A are made as the fire retardant of glass fiber reinforcement copper-clad plate
Copper-clad plate has good anti-flammability, but its content of halogen of the copper-clad plate based on brominated epoxy resin is much larger than
100000ppm.And its content of halogen of Halogen resin in the market has reached relevant industries requirement, but with covering which makes
Its fire resistance of copper coin does not reach V-0 level（UL94 standard）.
Therefore, find a kind of resin and its content of halogen is required less than 1500ppm, while requiring to think what matrix resin made
Sheet material fire resistance reaches V-0 level, and the new type resin with excellent heat resistance is extremely urgent.
Content of the invention
In view of this, the present invention provides a kind of high Tg printed wiring board of Halogen and its boring method, to solve background technology
Mentioned in problem, and be capable of assist side bore diameter reduce in the case of, after the drilling for effectively preventing, in circuit
The concavo-convex and burr that plate hole side produces, while reducing the temperature of drill point drill bit when drilling, improves the life-span of drill point.
The technical scheme is that：A kind of high Tg printed wiring board of Halogen, its each raw material by the component of quality is：Benzo
Piperazine Resin A 52-78 part, phenolic resin based activated carbon fiber 32.7-41.6 part, chlorinated polyethylene 11.4-13.5 part, glass fibers
Dimension 0.17-0.22 part, white carbon black 0.088-0.143 part, polyvinylpyrrolidone 2.6-4.3 part, aluminium hydroxide 8.3-10.7
Part, magnesium oxide 15.9-17.6 part and Polyethylene Glycol 43.8-48.7 part.
Further, its each raw material by the component of quality is：Benzoxazine resins A 56.3-67.5 part, phenolic aldehyde base activity
Carbon fiber 36.7-39.2 part, chlorinated polyethylene 12.2-12.9 part, glass fibre 0.19-0.21 part, white carbon black 0.097-
0.113 part, polyvinylpyrrolidone 3.6-4.1 part, aluminium hydroxide 9.7-10.3 part, magnesium oxide 16.3-17.3 part and poly- second
Glycol 45.3-47.1 part.
The high Tg printed wiring board of the Halogen of the present invention, in its raw material, chlorine element and bromo element total amount are less than 500ppm, reach
The non-halogen requirement of European Union, meets the various industry standards of IEC, JPCA, IPC joint agreement, and by mutual between raw material
Synergistic effect, significantly improves the heat-resisting and fire resistance of sheet material, and further improves the binding ability of sheet material and metal.
A kind of boring method of the high Tg printed wiring board of Halogen is comprised the following steps：
S1. a PCB plate hole to be drilled is provided, and what the thickness according to the PCB plate determined front pierces piercing for depth and reverse side
Depth, and front pierce depth be equal to reverse side pierce depth；
S2. a cover plate and drill are provided, according to the thickness for piercing depth and cover plate for piercing depth and reverse side in PCB plate front
Long to determine drill sword；
S3. determine the coordinate system of PCB plate front drilling, location hole is got in the front of printed wiring board using laser, by cover plate
It is installed on the front of PCB plate, and fixes PCB plate and cover plate respectively；
S4. by drill-through for drill cover plate, and pierced to form half bore from PCB plate front according to the depth that pierces in above-mentioned PCB plate front,
After the completion of to PCB plate lower plate；
S5. PCB plate is inverted, determines the coordinate system of PCB plate reverse side drilling, got using reverse side of the laser in printed wiring board
Location hole, cover plate is installed on the reverse side of PCB plate, and fixes PCB plate and cover plate respectively；
S6. by drill-through for drill cover plate, and pierced and above-mentioned half from PCB plate reverse side according to the depth that pierces of above-mentioned PCB plate reverse side
Hole connects to form through hole, after the completion of to PCB plate lower plate；
In step S1, the depth that pierces in front is calculated by the following method：
z=a+e-e/a*K
Wherein：Z pierces depth for front；
A is the thickness of cover plate；
E is the thickness of wiring board；
K is apex point offset.
The beneficial effects of the present invention is：1. in the copper-clad plate for being made using the program, chlorine element and bromo element total amount are less than
500ppm, reaches the non-halogen requirement of European Union, meets the various industry standards of IEC, JPCA, IPC joint agreement；
2. plate property
3., in the case that the bore diameter of assist side reduces, after the drilling for effectively preventing, it is recessed that assist side hole side produces
Convex and burr, while reducing the temperature of drill point drill bit when drilling, improves the life-span of drill point.
4., by the way of laser positioning, location hole can be more accurately got on the axis of drilling position, more have
Beneficial to the precision for improving drilling, and the parameters of formula by setting, can be suitable for high-precision back drill, be simultaneously applicable to
During high-precision control depth blind hole makes.
Specific embodiment
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, this area is common
The every other embodiment obtained under the premise of creative work is not made by technical staff, belongs to the model of present invention protection
Enclose.
Embodiment 1
The present embodiment provides a kind of Halogen high Tg printed wiring board, and its each raw material by the component of quality is：Benzoxazine resins A
52-78 part, phenolic resin based activated carbon fiber 32.7-41.6 part, chlorinated polyethylene 11.4-13.5 part, glass fibre 0.17-
0.22 part, white carbon black 0.088-0.143 part, polyvinylpyrrolidone 2.6-4.3 part, aluminium hydroxide 8.3-10.7 part, magnesium oxide
15.9-17.6 part and Polyethylene Glycol 43.8-48.7 part.
Further, its each raw material by the component of quality is：Benzoxazine resins A 56.3-67.5 part, phenolic aldehyde base activity
Carbon fiber 36.7-39.2 part, chlorinated polyethylene 12.2-12.9 part, glass fibre 0.19-0.21 part, white carbon black 0.097-
0.113 part, polyvinylpyrrolidone 3.6-4.1 part, aluminium hydroxide 9.7-10.3 part, magnesium oxide 16.3-17.3 part and poly- second
Glycol 45.3-47.1 part.
Embodiment 2
The present embodiment provides a kind of Halogen high Tg printed wiring board, and its each raw material by the component of quality is：Benzoxazine resins A
63.4 parts, 37.7 parts of phenolic resin based activated carbon fiber, 12.5 parts of chlorinated polyethylene, 0.2 part of glass fibre, 0.0111 part of white carbon black,
3.8 parts of polyvinylpyrrolidone, 10.1 parts of aluminium hydroxide, 16.7 parts of magnesium oxide and 46.4 parts of Polyethylene Glycol.
Embodiment 3
The present embodiment provides a kind of Halogen high Tg printed wiring board, and its each raw material by the component of quality is：Benzoxazine resins A
56.3 parts, 36.7 parts of phenolic resin based activated carbon fiber, 12.9 parts of chlorinated polyethylene, 0.2 part of glass fibre, 0.0111 part of white carbon black,
3.8 parts of polyvinylpyrrolidone, 10.1 parts of aluminium hydroxide, 16.7 parts of magnesium oxide and 46.4 parts of Polyethylene Glycol.
Embodiment 4
The present embodiment provides a kind of Halogen high Tg printed wiring board, and its each raw material by the component of quality is：Benzoxazine resins A
67.5 parts, 39.2 parts of phenolic resin based activated carbon fiber, 12.2 parts of chlorinated polyethylene, 0.2 part of glass fibre, 0.0111 part of white carbon black,
3.8 parts of polyvinylpyrrolidone, 10.1 parts of aluminium hydroxide, 16.7 parts of magnesium oxide and 46.4 parts of Polyethylene Glycol.
Embodiment 5
The present embodiment provides a kind of Halogen high Tg printed wiring board, and its each raw material by the component of quality is：Benzoxazine resins A
63.4 parts, 37.7 parts of phenolic resin based activated carbon fiber, 12.5 parts of chlorinated polyethylene, 0.19 part of glass fibre, 0.097 part of white carbon black,
4.1 parts of polyvinylpyrrolidone, 9.7 parts of aluminium hydroxide, 17.3 parts of magnesium oxide and 45.3 parts of Polyethylene Glycol.
Embodiment 6
The present embodiment provides a kind of Halogen high Tg printed wiring board, and its each raw material by the component of quality is：Benzoxazine resins A
63.4 parts, 37.7 parts of phenolic resin based activated carbon fiber, 12.5 parts of chlorinated polyethylene, 0.21 part of glass fibre, 0.113 part of white carbon black,
3.6 parts of polyvinylpyrrolidone, 10.3 parts of aluminium hydroxide, 16.3 parts of magnesium oxide and 47.1 parts of Polyethylene Glycol.
Embodiment 7
The present embodiment provides a kind of boring method of the high Tg printed wiring board of Halogen as described in embodiment 1-6, including following step
Suddenly：
S1. a PCB plate hole to be drilled is provided, and what the thickness according to the PCB plate determined front pierces piercing for depth and reverse side
Depth, and front pierce depth be equal to reverse side pierce depth；
S2. a cover plate and drill are provided, according to the thickness for piercing depth and cover plate for piercing depth and reverse side in PCB plate front
Long to determine drill sword；
S3. determine the coordinate system of PCB plate front drilling, location hole is got in the front of printed wiring board using laser, by cover plate
It is installed on the front of PCB plate, and fixes PCB plate and cover plate respectively；
S4. by drill-through for drill cover plate, and pierced to form half bore from PCB plate front according to the depth that pierces in above-mentioned PCB plate front,
After the completion of to PCB plate lower plate；
S5. PCB plate is inverted, determines the coordinate system of PCB plate reverse side drilling, got using reverse side of the laser in printed wiring board
Location hole, cover plate is installed on the reverse side of PCB plate, and fixes PCB plate and cover plate respectively；
S6. by drill-through for drill cover plate, and pierced and above-mentioned half from PCB plate reverse side according to the depth that pierces of above-mentioned PCB plate reverse side
Hole connects to form through hole, after the completion of to PCB plate lower plate；
In step S1, the depth that pierces in front is calculated by the following method：
z=a+e-e/a*K
Wherein：Z pierces depth for front；
A is the thickness of cover plate；
E is the thickness of wiring board；
K is apex point offset.
In the case that the bore diameter of the present embodiment assist side reduces, after the drilling for effectively preventing, assist side hole
The concavo-convex and burr that side produces, while reducing the temperature of drill point drill bit when drilling, improves the life-span of drill point.Using laser positioning
Mode, can more accurately get location hole on the axis of drilling position, be more beneficial for improving the precision of drilling, and pass through
The parameters of formula of setting, can be suitable for and in high-precision back drill, be simultaneously applicable in the deep blind hole making of high-precision control.
Implementation result example
Sheet material according to the concerned countries standard of this area industry, to the high Tg printed wiring board of Halogen described in embodiment 1-6
Can be tested, as a result as shown in the table：
| Tg（Glass transition temperature）, DSC (20 °C/min) | 185-205°C |
| Peel strength (conventional electrolysis Copper Foil)（1OZ） | 2.6-3.3 N/mm |
| Td (heat decomposition temperature of base material) | (5% lose)>450°C |
| T288 (the resistance to thermal decomposition time of base material） | 14-22min |
| UL-94 combustion testing | V-0 |
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and do not carrying on the back
In the case of the spirit or essential attributes of the present invention, the present invention can be realized in other specific forms.Therefore, no matter from which
From the point of view of a bit, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention will by appended right
Ask rather than described above is limited, it is intended that all changes that will fall in the implication and scope of the equivalency of claim
Include in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment only includes one
Individual independent technical scheme, this narrating mode of description is only that those skilled in the art will should say for clarity
Bright book can also form those skilled in the art permissible through appropriately combined as an entirety, the technical scheme in each embodiment
The other embodiment of understanding.For the ins and outs of all not detailed descriptions in the present invention, all this area can be passed through arbitrary existing
Technology is had to realize.
Claims (3)
1. the high Tg printed wiring board of a kind of Halogen, it is characterised in that its each raw material by the component of quality is：Benzoxazine resins A
52-78 part, phenolic resin based activated carbon fiber 32.7-41.6 part, chlorinated polyethylene 11.4-13.5 part, glass fibre 0.17-
0.22 part, white carbon black 0.088-0.143 part, polyvinylpyrrolidone 2.6-4.3 part, aluminium hydroxide 8.3-10.7 part, magnesium oxide
15.9-17.6 part and Polyethylene Glycol 43.8-48.7 part.
2. the high Tg printed wiring board of Halogen according to claim 1, it is characterised in that its each raw material is by the component of quality
It is：Benzoxazine resins A 56.3-67.5 part, phenolic resin based activated carbon fiber 36.7-39.2 part, chlorinated polyethylene 12.2-
12.9 parts, glass fibre 0.19-0.21 part, white carbon black 0.097-0.113 part, polyvinylpyrrolidone 3.6-4.1 part, hydroxide
Aluminum 9.7-10.3 part, magnesium oxide 16.3-17.3 part and Polyethylene Glycol 45.3-47.1 part.
3. a kind of boring method of the high Tg printed wiring board of Halogen as described in any one of claim 1-2, it is characterised in that bag
Include following steps：
S1. a PCB plate hole to be drilled is provided, and what the thickness according to the PCB plate determined front pierces piercing for depth and reverse side
Depth, and front pierce depth be equal to reverse side pierce depth；
S2. a cover plate and drill are provided, according to the thickness for piercing depth and cover plate for piercing depth and reverse side in PCB plate front
Long to determine drill sword；
S3. determine the coordinate system of PCB plate front drilling, location hole is got in the front of printed wiring board using laser, by cover plate
It is installed on the front of PCB plate, and fixes PCB plate and cover plate respectively；
S4. by drill-through for drill cover plate, and pierced to form half bore from PCB plate front according to the depth that pierces in above-mentioned PCB plate front,
After the completion of to PCB plate lower plate；
S5. PCB plate is inverted, determines the coordinate system of PCB plate reverse side drilling, got using reverse side of the laser in printed wiring board
Location hole, cover plate is installed on the reverse side of PCB plate, and fixes PCB plate and cover plate respectively；
S6. by drill-through for drill cover plate, and pierced and above-mentioned half from PCB plate reverse side according to the depth that pierces of above-mentioned PCB plate reverse side
Hole connects to form through hole, after the completion of to PCB plate lower plate；
In step S1, the depth that pierces in front is calculated by the following method：
z=a+e-e/a*K
Wherein：Z pierces depth for front；
A is the thickness of cover plate；
E is the thickness of wiring board；
K is apex point offset.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610900702.4A CN106433123A (en) | 2016-10-17 | 2016-10-17 | Halogen-free high-Tg printed circuit board and drilling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610900702.4A CN106433123A (en) | 2016-10-17 | 2016-10-17 | Halogen-free high-Tg printed circuit board and drilling method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106433123A true CN106433123A (en) | 2017-02-22 |
Family
ID=58175201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610900702.4A Pending CN106433123A (en) | 2016-10-17 | 2016-10-17 | Halogen-free high-Tg printed circuit board and drilling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106433123A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107298809A (en) * | 2017-08-29 | 2017-10-27 | 太仓天润新材料科技有限公司 | A kind of electronic material with low solidification temperature |
| CN112752406A (en) * | 2020-11-24 | 2021-05-04 | 广州广合科技股份有限公司 | Drilling and forming method for carbon-hydrogen material in printed circuit board |
| US11584824B2 (en) | 2017-10-27 | 2023-02-21 | Eneos Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5139376A (en) * | 1991-10-23 | 1992-08-18 | Excellon Automation | Method and apparatus for controlled penetration drilling |
| JP2008094961A (en) * | 2006-10-12 | 2008-04-24 | Toray Ind Inc | Benzoxazine resin composition |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN103687338A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling circuit board with high-precision and depth-controlled hole |
| CN104744891A (en) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | Prepreg and application thereof |
-
2016
- 2016-10-17 CN CN201610900702.4A patent/CN106433123A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5139376A (en) * | 1991-10-23 | 1992-08-18 | Excellon Automation | Method and apparatus for controlled penetration drilling |
| JP2008094961A (en) * | 2006-10-12 | 2008-04-24 | Toray Ind Inc | Benzoxazine resin composition |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN103687338A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling circuit board with high-precision and depth-controlled hole |
| CN104744891A (en) * | 2013-12-27 | 2015-07-01 | 台燿科技股份有限公司 | Prepreg and application thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107298809A (en) * | 2017-08-29 | 2017-10-27 | 太仓天润新材料科技有限公司 | A kind of electronic material with low solidification temperature |
| US11584824B2 (en) | 2017-10-27 | 2023-02-21 | Eneos Corporation | Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device |
| TWI794314B (en) * | 2017-10-27 | 2023-03-01 | 日商Ｊｘｔｇ能源股份有限公司 | Composition for curable resin, cured product of the composition, method for producing the composition and the cured product, and semiconductor device |
| CN112752406A (en) * | 2020-11-24 | 2021-05-04 | 广州广合科技股份有限公司 | Drilling and forming method for carbon-hydrogen material in printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106433123A (en) | Halogen-free high-Tg printed circuit board and drilling method thereof | |
| JP2010540260A (en) | Improved system and method for drilling holes in a printed circuit board | |
| CN102079875B (en) | High-heat-resistance halogen-free phosphorus-free thermosetting resin composition, and bonding sheet and copper foil-coated laminated board made of same | |
| US20130316155A1 (en) | Halogen-free resin composition | |
| EP2290009A1 (en) | Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom | |
| JP3434808B2 (en) | Copper foil with resin and printed wiring board using the copper foil with resin | |
| EP2292696A1 (en) | Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg, laminate, and laminate for printed circuit made by the method | |
| CN104427755A (en) | Flexible circuit board and manufacturing method thereof | |
| CN103897350B (en) | A kind of compositions of thermosetting resin and use its prepreg made and laminate | |
| CN109749360B (en) | Thermosetting resin composition, copper-clad plate capable of being bent statically and printed circuit board prepared from thermosetting resin composition | |
| US20150147799A1 (en) | Halogen-free high-frequency resin composition | |
| CN106433124B (en) | A kind of halogen-free resin composition of high frequency, High-Speed Printed Circuit Board curing agent containing esters | |
| EP2952535A1 (en) | Halogen-free resin composition, and prepreg and laminate for printed circuits using same | |
| CN103144378B (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN101272662A (en) | Method for manufacturing multi-layer wiring substrate | |
| CN106304625A (en) | A kind of high Tg printed wiring board and processing method thereof | |
| JP2009155398A (en) | Epoxy resin composition, prepreg, metal clad laminate, and multilayer printed wiring board | |
| JP2009206326A (en) | Multi-layer printed wiring board and semiconductor device | |
| JP2008179768A (en) | Resin composition, prepreg, and laminated sheet | |
| CN106240132A (en) | A kind of manufacture method of halogen-free flameproof High Tg CCL | |
| CN105058927A (en) | High heat-resistance composite base copper clad laminate preparation method | |
| JP2012153829A (en) | Halogen-free epoxy resin composition, prepreg and printed circuit board made using the same | |
| CN104015461B (en) | A kind of Halogen Tg130 method for manufacturing cover clad laminate | |
| JP2002265634A (en) | Glass fiber nonwoven fabric for electric insulation, composite laminate and printed circuit board | |
| CN111531985A (en) | High-heat-resistance FR-4 material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |