CN113667228A - Electronic material with low curing temperature and production device thereof - Google Patents

Electronic material with low curing temperature and production device thereof Download PDF

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Publication number
CN113667228A
CN113667228A CN202111141201.XA CN202111141201A CN113667228A CN 113667228 A CN113667228 A CN 113667228A CN 202111141201 A CN202111141201 A CN 202111141201A CN 113667228 A CN113667228 A CN 113667228A
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Prior art keywords
electronic material
curing temperature
low curing
antioxidant
parts
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CN202111141201.XA
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Chinese (zh)
Inventor
彭善峰
刘沛钦
叶林
聂超
陈婷
唐毅
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Zhongke Testing Technology Service Chongqing Co ltd
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Zhongke Testing Technology Service Chongqing Co ltd
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Priority to CN202111141201.XA priority Critical patent/CN113667228A/en
Publication of CN113667228A publication Critical patent/CN113667228A/en
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    • C—CHEMISTRY; METALLURGY
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • C08L23/28—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
    • C08L23/286—Chlorinated polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00—Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/08—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives within vertical containers
    • B02C18/10—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives within vertical containers with drive arranged above container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C18/00—Disintegrating by knives or other cutting or tearing members which chop material into fragments
    • B02C18/06—Disintegrating by knives or other cutting or tearing members which chop material into fragments with rotating knives
    • B02C18/16—Details
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34922—Melamine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2272—Ferric oxide (Fe2O3)
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K2201/001—Conductive additives
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
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    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Polymers & Plastics (AREA)
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  • Food Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to the technical field of electronic materials, in particular to an electronic material with low curing temperature and a production device thereof; the electronic material with low curing temperature provided by the invention can be cured at a lower temperature, has good conductive, antioxidant, flame retardant and aging resistant properties, is used for thermosensitive materials and non-weldable materials, has wide application prospect in increasingly high-density and miniaturized electronic assembly industry, and solves the problems that some electronic materials need to be cured at a high temperature and are poor in use effect.

Description

Electronic material with low curing temperature and production device thereof
Technical Field
The invention relates to the technical field of electronic materials, in particular to an electronic material with low curing temperature and a production device thereof.
Background
Electronic materials refer to materials used in electronics and microelectronics, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and alloys thereof, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials, and other related materials. Electronic materials are the material basis for the development of modern electronic industry and science and technology, and are also the technology-intensive disciplines in the field of science and technology.
According to the chemical properties of the materials, the materials can be classified into metal electronic materials, electronic ceramics, polymer electronics, glass dielectrics, mica, gas-insulated dielectric materials, inductors, insulating materials, magnetic materials, electronic hardware, electrical ceramic materials, shielding materials, piezoelectric crystal materials, electronic fine chemical materials, electronic light construction materials, electronic tin solder materials, PCB manufacturing materials and other electronic materials. The existing electronic material needs to be cured at high temperature, and the using effect is poor.
Disclosure of Invention
The invention aims to provide an electronic material with low curing temperature and a production device thereof, and aims to solve the problems that the existing electronic material needs to be cured at high temperature and has poor use effect.
In order to achieve the above object, the present invention provides an electronic material having a low curing temperature, the components of which include 24 parts by weight of nickel, 18 parts by weight of chlorinated polyethylene, 8 parts by weight of synthetic base oil, 2 parts by weight of dioctyl ester, 15 parts by weight of ditetradecanol ester, 8 parts by weight of flame retardant, 10 parts by weight of conductive modifier and 10 parts by weight of antioxidant.
The flame retardant is prepared from any one or a mixture of more than one of tin oxide, zinc oxide, iron oxide, zinc sulfate, melamine, zinc borate, sodium borate and chlorinated paraffin, and the mixture of one or more than one of the tin oxide, the zinc oxide, the iron oxide, the zinc sulfate, the melamine, the zinc borate, the sodium borate and the chlorinated paraffin is matched with each other to play a synergistic effect, improve the flame retardant property of the electronic material, reduce the cost of raw materials and avoid harming human bodies and the environment.
The conductive modifier is a mixture of any one or more of conductive mica powder, aluminum borate whiskers, conductive carbon black, lubricating oil base oil and a silane coupling agent, the conductive effect of the electronic material is improved through one or more of the conductive mica powder, the aluminum borate whiskers, the conductive carbon black, the lubricating oil base oil and the silane coupling agent, and the raw materials are matched to play a synergistic effect, so that the consumption of the conductive filler can be reduced, and the conductive modifier has excellent dispersing performance.
The antioxidant is selected from one or a mixture of more of metal titanium powder, antioxidant B215, antioxidant B225, antioxidant 1010 and antioxidant 1076, and the antioxidant performance of the electronic material is remarkably improved through one or a mixture of more than one of the metal titanium powder, the antioxidant B215, the antioxidant B225, the antioxidant 1010 and the antioxidant 1076, so that the service life of the electronic material is prolonged.
The chlorinated polyethylene comprises plastic-grade chlorinated polyethylene and rubber-grade chlorinated polyethylene, and the chlorinated polyethylene is matched with other high polymer materials, so that the oxidation resistance and the aging resistance of the electronic material are improved, and the service life of the electronic material is prolonged.
In a second aspect, the invention further provides an electronic material production device with a low curing temperature, which comprises a preparation tank, a crushing assembly, a heating assembly and a cooling assembly, wherein the crushing assembly comprises a rotating motor, a stirring rod and a plurality of crushing blades, the rotating motor is fixedly connected with the preparation tank and is positioned at the top of the preparation tank, the stirring rod is fixedly connected with the rotating motor and penetrates through the preparation tank and is positioned in the preparation tank, the crushing blades are fixedly connected with the stirring rod and are positioned on the outer side wall of the stirring rod, the preparation tank is used for mixing raw materials to prepare an electronic material with a low curing temperature, the crushing assembly is used for crushing the raw materials to improve the preparation efficiency of the preparation tank, the heating assembly is used for heating the raw materials in the preparation tank, and the cooling assembly is used for cooling and heating the prepared raw materials.
Wherein, the preparation jar is including a jar body, inlet pipe and discharging pipe, the inlet pipe with jar body fixed connection, and run through jar body, the discharging pipe with jar body fixed connection, and run through jar body, jar body does crushing unit, heating element and cooling module provide the installation condition, the inlet pipe is past jar internal leading-in raw materials, the discharging pipe will the raw materials that the jar body was prepared are derived.
Wherein, heating element includes electric heat net and a plurality of piece that generates heat, the electric heat net with jar body fixed connection, and be located jar side wall, it is a plurality of generate heat the piece with puddler fixed connection all is located puddler one side, the electric heat net circular telegram bottom heating that generates heat jar internal raw materials, when the puddler rotates stirring raw materials, the piece that generates heat the inside heating raw materials, makes the raw materials heating more abundant to improve heating efficiency.
Wherein, the cooling module still includes cooler bin, liquid pump, first pipe and cooling tube, the cooler bin with jar body fixed connection, and be located jar external lateral wall, the liquid pump with cooler bin fixed connection, and be located the cooler bin is close to jar body one side, the cooling tube with jar body fixed connection, and be located the jar is internal, first pipe with liquid pump fixed connection, and with cooling tube fixed connection, and run through the jar body, the second pipe with cooling tube fixed connection, and with cooler bin fixed connection, and run through the jar body, liquid pump circular telegram operation will the cooling fluid is leading-in the cooler bin first pipe, first pipe is leading-in with the cooling fluid in the cooler bin, the cooling fluid passes through the heat transfer effect and absorbs the heat of jar internal raw materials, the cooling fluid that has heat in the cooler bin leads back through the second pipe the cooler bin cools off and circulates and makes The application is as follows.
The electronic material with low curing temperature has good electric conduction, oxidation resistance, flame retardance and aging resistance, realizes curing at lower temperature, is used for thermosensitive materials and unweldable materials, has wide application prospect in increasingly high-density and miniaturized electronic assembly industry, and solves the problems that some electronic materials need to be cured at high temperature and have poor use effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural view of an electronic material production apparatus having a low curing temperature according to the present invention;
FIG. 2 is a front view of an electronic material production apparatus having a low curing temperature provided by the present invention;
FIG. 3 is a side view of an electronic material production apparatus having a low curing temperature provided by the present invention;
FIG. 4 is a cross-sectional view taken along plane A-A of FIG. 3;
fig. 5 is a schematic structural view of a cooling pipe of an electronic material production apparatus having a low solidification temperature according to the present invention.
In the figure: 1-preparation tank, 2-crushing component, 3-heating component, 4-cooling component, 11-tank body, 12-feeding pipe, 13-discharging pipe, 21-rotating motor, 22-stirring rod, 23-crushing blade, 31-electric heating net, 32-heating block, 41-cooling box, 42-liquid pump, 43-first conduit, 44-cooling pipe and 45-second conduit.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 5, the present invention provides an electronic material having a low curing temperature, the components of which include, by weight, 24 parts of nickel, 18 parts of chlorinated polyethylene, 8 parts of synthetic base oil, 2 parts of dioctyl phthalate, 15 parts of ditetradecanol ester, 8 parts of flame retardant, 10 parts of conductive modifier, and 10 parts of antioxidant.
In the embodiment, the flame retardant improves the flame retardant property of the electronic material, reduces the cost of raw materials, the conductive modifier improves the conductive effect of the electronic material, the antioxidant improves the antioxidant property of the electronic material, has good conductive, antioxidant, flame retardant and aging resistant properties, realizes curing at a lower temperature, is used for thermosensitive materials and non-weldable materials, has a wide application prospect in increasingly high-density and miniaturized electronic assembly industry, and solves the problem that some electronic materials need to be cured at a high temperature and have poor use effect.
Further, the flame retardant is any one or a mixture of several of tin oxide, zinc oxide, iron oxide, zinc sulfate, melamine, zinc borate, sodium borate and chlorinated paraffin, the conductive modifier is any one or a mixture of several of conductive mica powder, aluminum borate whiskers, conductive carbon black, lubricating oil base oil and a silane coupling agent, the antioxidant is any one or a mixture of several of metallic titanium powder, antioxidant B215, antioxidant B225, antioxidant 1010 and antioxidant 1076, and the chlorinated polyethylene comprises plastic-grade chlorinated polyethylene and rubber-grade chlorinated polyethylene.
In this embodiment, one or more of the tin oxide, the zinc oxide, the iron oxide, the zinc sulfate, the melamine, the zinc borate, the sodium borate, and the chlorinated paraffin are used in combination to achieve a synergistic effect, thereby improving the flame retardant performance of the electronic material, reducing the cost of raw materials, and avoiding the harm to the human body and the environment, one or more of the conductive mica powder, the aluminum borate whisker, the conductive carbon black, the lubricant base oil, and the silane coupling agent are used in combination to improve the conductive effect of the electronic material, and one or more of the raw materials are used in combination to achieve a synergistic effect, thereby reducing the amount of conductive filler, and having excellent dispersibility, one or more of the metallic titanium powder, the antioxidant B215, the antioxidant B225, the antioxidant 1010, and the antioxidant 1076, the chlorinated polyethylene is matched with other high polymer materials, so that the oxidation resistance and the aging resistance of the electronic material are improved, and the service life of the electronic material is prolonged.
In a second aspect, the invention further provides an electronic material production apparatus with a low curing temperature, which includes a preparation tank 1, a pulverizing assembly 2, a heating assembly 3 and a cooling assembly 4, wherein the pulverizing assembly 2 includes a rotating motor 21, a stirring rod 22 and a plurality of pulverizing blades 23, the rotating motor 21 is fixedly connected with the preparation tank 1 and is located at the top of the preparation tank 1, the stirring rod 22 is fixedly connected with the rotating motor 21 and penetrates through the preparation tank 1 and is located in the preparation tank 1, the plurality of pulverizing blades 23 are fixedly connected with the stirring rod 22 and are all located on the outer side wall of the stirring rod 22, the preparation tank 1 includes a tank body 11, a feed pipe 12 and a discharge pipe 13, the feed pipe 12 is fixedly connected with the tank body 11 and penetrates through the tank body 11, the discharge pipe 13 is fixedly connected with the tank body 11 and penetrates through the tank body 11, the heating assembly 3 comprises an electric heating net 31 and a plurality of heating blocks 32, the electric heating net 31 is fixedly connected with the tank body 11 and is positioned on the inner side wall of the tank body 11, the heating blocks 32 are fixedly connected with the stirring rod 22 and are positioned on one side of the stirring rod 22, the cooling assembly 4 further comprises a cooling box 41, a liquid pump 42, a first conduit 43, a cooling pipe 44 and a second conduit 45, the cooling box 41 is fixedly connected with the tank body 11 and is positioned on the outer side wall of the tank body 11, the liquid pump 42 is fixedly connected with the cooling box 41 and is positioned on one side of the cooling box 41 close to the tank body 11, the cooling pipe 44 is fixedly connected with the tank body 11 and is positioned in the tank body 11, the first conduit 43 is fixedly connected with the liquid pump 42 and is fixedly connected with the cooling pipe 44 and penetrates through the tank body 11, and the second conduit 45 is fixedly connected with the cooling pipe 44, and is fixedly connected with the cooling box 41 and penetrates through the tank body 11.
In this embodiment, the tank 11 provides installation conditions for the pulverization module 2, the heating module 3, and the cooling module 4, raw materials are introduced into the tank 11 through the inlet pipe 12, raw materials prepared in the tank 11 are discharged through the outlet pipe 13, the stirring rod 22 is driven by the output shaft of the rotary motor 21 to rotate and stir the raw materials in the tank 11, the pulverization blade 23 cuts and pulverizes the raw materials when the stirring rod 22 rotates, the production efficiency of electronic materials is improved, the electric heating net 31 heats the raw materials in the tank 11 at the bottom by heating when electricity is supplied, the heating block 32 heats the raw materials internally when the stirring rod 22 rotates and stirs the raw materials, the raw materials are heated more sufficiently and the heating efficiency is improved, the liquid pump 42 is operated by supplying electricity to introduce the cooling liquid in the cooling tank 41 into the first conduit 43, and the first conduit 43 introduces the cooling liquid into the cooling pipe 44, the cooling liquid absorbs the heat of the raw material in the tank 11 through the heat transfer effect, and the cooling liquid with the heat in the cooling pipe 44 is guided back to the cooling tank 41 through the second conduit 45 for cooling and recycling, so that the cooling rate of the electronic material prepared in the preparation tank 1 is increased.
The electronic material with low curing temperature of the invention realizes curing at lower temperature, is used for thermosensitive materials and unweldable materials, has wide application prospect in the increasingly high-density and miniaturized electronic assembly industry, and has synergistic effect by the mutual cooperation of one or more than one of the tin oxide, the zinc oxide, the iron oxide, the zinc sulfate, the melamine, the zinc borate, the sodium borate and the chlorinated paraffin, so as to improve the flame retardant property of the electronic material, reduce the cost of raw materials and avoid harming human bodies and environment, and one or more than one of the conductive mica powder, the aluminum borate whisker, the conductive carbon black, the lubricating oil base oil and the silane coupling agent improves the conductive effect of the electronic material, and the synergistic effect is realized by the cooperation of the raw materials, the chlorinated polyethylene is matched with other high polymer materials to improve the oxidation resistance and ageing resistance of the electronic material and prolong the service life of the electronic material, so that the problems that the electronic material needs to be cured at high temperature and has poor using effect are solved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. An electronic material having a low curing temperature,
the electronic material comprises, by weight, 24 parts of nickel, 18 parts of chlorinated polyethylene, 8 parts of synthetic base oil, 2 parts of dioctyl phthalate, 15 parts of ditetradecanol ester, 8 parts of flame retardant, 10 parts of conductive modifier and 10 parts of antioxidant.
2. An electronic material having a low curing temperature as set forth in claim 1,
the flame retardant is any one or a mixture of more of tin oxide, zinc oxide, ferric oxide, zinc sulfate, melamine, zinc borate, sodium borate and chlorinated paraffin.
3. An electronic material having a low curing temperature as set forth in claim 1,
the conductive modifier is any one or a mixture of more of conductive mica powder, aluminum borate whiskers, conductive carbon black, lubricating oil base oil and a silane coupling agent.
4. An electronic material having a low curing temperature as set forth in claim 1,
the antioxidant is selected from one or more of metal titanium powder, antioxidant B215, antioxidant B225, antioxidant 1010 and antioxidant 1076.
5. An electronic material having a low curing temperature as set forth in claim 1,
the chlorinated polyethylene includes plastic grade chlorinated polyethylene and rubber grade chlorinated polyethylene.
6. An electronic material production apparatus having a low curing temperature for producing an electronic material having a low curing temperature according to claim 1,
including preparation jar, crushing unit, heating element and cooling module, crushing unit is including rotating motor, puddler and a plurality of crushing blade, rotate the motor with preparation jar fixed connection, and be located preparation tank deck portion, the puddler with rotate motor fixed connection, and run through the preparation jar, and be located in the preparation jar, it is a plurality of crushing blade with puddler fixed connection all is located the puddler lateral wall.
7. An electronic material production apparatus having a low curing temperature according to claim 6,
the preparation jar is including a jar body, inlet pipe and discharging pipe, the inlet pipe with jar body fixed connection, and run through jar body, the discharging pipe with jar body fixed connection, and run through jar body.
CN202111141201.XA 2021-09-28 2021-09-28 Electronic material with low curing temperature and production device thereof Pending CN113667228A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107298809A (en) * 2017-08-29 2017-10-27 太仓天润新材料科技有限公司 A kind of electronic material with low solidification temperature
CN211221559U (en) * 2019-10-24 2020-08-11 安徽钢腾塑胶模具科技有限公司 Hot melting device for plastic production
CN211837921U (en) * 2020-03-04 2020-11-03 王辉兰 Reation kettle for chemical industry equipment
CN213791584U (en) * 2020-09-03 2021-07-27 山东沾化天元精细化工有限公司 Fine chemical reaction kettle
CN214020282U (en) * 2020-11-02 2021-08-24 苏州永业纺织材料有限公司 Dissolving device is used in chemical auxiliary production

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107298809A (en) * 2017-08-29 2017-10-27 太仓天润新材料科技有限公司 A kind of electronic material with low solidification temperature
CN211221559U (en) * 2019-10-24 2020-08-11 安徽钢腾塑胶模具科技有限公司 Hot melting device for plastic production
CN211837921U (en) * 2020-03-04 2020-11-03 王辉兰 Reation kettle for chemical industry equipment
CN213791584U (en) * 2020-09-03 2021-07-27 山东沾化天元精细化工有限公司 Fine chemical reaction kettle
CN214020282U (en) * 2020-11-02 2021-08-24 苏州永业纺织材料有限公司 Dissolving device is used in chemical auxiliary production

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