CN109786516A - LED packaging device and manufacturing method thereof - Google Patents
LED packaging device and manufacturing method thereof Download PDFInfo
- Publication number
- CN109786516A CN109786516A CN201811634250.5A CN201811634250A CN109786516A CN 109786516 A CN109786516 A CN 109786516A CN 201811634250 A CN201811634250 A CN 201811634250A CN 109786516 A CN109786516 A CN 109786516A
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat sink
- light
- pet film
- transmitting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 229920002799 BoPET Polymers 0.000 claims abstract description 34
- 239000000565 sealant Substances 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 9
- 238000009434 installation Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 230000035699 permeability Effects 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 206010023126 Jaundice Diseases 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000005487 naphthalate group Chemical group 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 230000008635 plant growth Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging device and a manufacturing method thereof, and the technical scheme is characterized in that a PET film is arranged on a mounting surface of a light-transmitting plate for being bonded with a substrate, a sealant is arranged between the lower surface of the PET film and the substrate, the light-transmitting plate is mutually fixed with the substrate through the sealant, the gas and water vapor permeability of the PET film is low, the light-transmitting plate has excellent gas, water, oil and peculiar smell resistance, the transparency is high, ultraviolet rays can be blocked, and the glossiness is good. The PET membrane can play better guard action to sealed glue between light-passing board and the base plate for the leakproofness between light-passing board and the base plate is good, and the reliability is high, and the holistic life of LED packaging hardware is longer relatively.
Description
Technical field
The present invention relates to LED technology fields, more specifically, it relates to a kind of LED package device and its manufacturing method.
Background technique
LED has many advantages, such as that light efficiency is high, the service life is long, energy saving and environmental protection, in many necks as new generation of green light source
Domain is widely applied.To protect the LED chip as light source, it usually needs be packaged to it.LED encapsulation dress in the prior art
It sets and is such that LED chip is fixed on substrate, light-transmitting plate lid closes LED chip, then is carried out with sealant to light-transmitting plate and substrate
Sealing bonding.When the LED chip of existing LED package device shines, light a part is refracted to outside through light-transmitting plate, and one
Divide the then multiple reflections in light-transmitting plate, final a part of light is mapped on sealant, and sealant is easy after light long-term irradiation
Jaundice, aging, embrittlement destroy the leakproofness of sealant, shorten the service life of LED package device.
With the development of LED technology, ultraviolet LED also starts to be widely used, such as indoor and outdoor disinfection, backlight, doctor
The fields such as treatment, food and drink and plant growth.In the prior art, ultraviolet LED is also to be packaged using above-mentioned LED package device
's.On the other hand, also usually silica gel is selected to be used as sealant in the prior art, is easy after silica gel cup ultraviolet light long-term irradiation to send out
Yellow, aging and embrittlement, destroy the leakproofness of sealant, seriously affect the reliability of ultraviolet LED, shorten LED encapsulation structure
Service life.
Summary of the invention
The first object of the present invention is to provide a kind of LED package device, reaches good airproof performance, high reliablity, and use the longevity
Order longer purpose.
Above-mentioned first technical purpose of the invention has the technical scheme that a kind of LED package device,
Including substrate, chip and light-transmitting plate, it is characterised in that: the light-transmitting plate is equipped with for the mounting surface with the substrate bonding
PET film is equipped with sealant between the lower surface and substrate of the PET film, the light-transmitting plate is realized by the sealant and institute
State being fixed to each other between substrate.
As what is advanced optimized, the substrate is equipped with interior baffle circle, after the light-transmitting plate installation, the PET film position
In the outside of the interior baffle circle.
As what is advanced optimized, the substrate along its edge be equipped with outer baffle circle, the outer baffle circle it is described it is interior every
The outside of ring washer, after the light-transmitting plate installation, the PET film is between the interior baffle circle and the outer baffle circle.
As what is advanced optimized, the lower surface of the light-transmitting plate is equipped with protrusion, and the mounting surface is under the protrusion
Surface, the PET film are set to the lower surface of the protrusion, the protrusion be inserted into the outer baffle circle and the interior baffle circle it
Between.
As what is advanced optimized, the sealant is silica gel or adhesive.
As what is advanced optimized, UV glue, the PET film are equipped between the upper surface of the PET film and the mounting surface
The mounting surface is fixed on by the UV glue.
As what is advanced optimized, further include it is heat sink, it is described it is heat sink be fixed on the substrate, the chip is fixed on described
It is heat sink.
As what is advanced optimized, the substrate is equipped with perforative mounting hole, and the lower surface of the substrate is equipped with holding tank,
The mounting hole and the holding tank are arranged concentrically, described heat sink T-shaped, described heat sink including vertical portion and horizontal component；
When the heat sink installation, the heat sink vertical portion is inserted into mounting hole, the heat sink horizontal part from bottom to top
The upper surface divided is bonded with the bottom of the holding tank, the upper surface of the heat sink horizontal component and the bottom of the holding tank
Between have adhesive.
It is equipped with as what is advanced optimized, in the substrate and accommodates pipe, be equipped with elastic spacing one in the receiving pipe, it is described
The positive stop end of elastic spacing one is equipped with stress inclined-plane, and the heat sink vertical portion is equipped with limit hole；
Described heat sink when not installing, the positive stop end of the elastic spacing one is stretched out from the receiving pipe is located at the installation
Hole；When the heat sink installation, the heat sink vertical portion is by elastic spacing one described in the stress slope driving to described
Pipe contract is accommodated, when the elastic spacing one is aligned with the limit hole, the elastic spacing one resets elongation so that it is limited
The limit hole is inserted at position end.
The second object of the present invention is to provide a kind of manufacturing method of LED package device, reaches good airproof performance, reliability
Height, and the purpose that the service life is longer.
Above-mentioned second technical purpose of the invention has the technical scheme that a kind of as aforementioned any one
The manufacturing method of LED package device described in a technical solution, it is characterised in that: the following steps are included:
A, a substrate, a chip, a light-transmitting plate and a PET film are provided；
B, the PET film is fixed on the light-transmitting plate, on the substrate according to fixation by the chip；
C, after completing step B, light-transmitting plate is fixed on substrate.
In conclusion having excellent the invention has the following advantages: the gas and vapor permeability of PET film are low
Gas and water, oil and peculiar smell performance are hindered, and transparency is high, can stop ultraviolet light, glossiness is good.PET film can be to light-transmitting plate and substrate
Between sealant play preferable protective action so that the good airproof performance between light-transmitting plate and substrate, and high reliablity, LED
The service life of packaging system entirety is relatively longer.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure after the LED package device assembly in embodiment；
Fig. 2 is the schematic diagram of the section structure after the LED package device in embodiment is decomposed.
In figure: 1, substrate；11, groove；12, interior baffle circle；13, outer baffle circle；14, mounting hole；15, holding tank；2, hot
It is heavy；21, vertical portion；211, limit hole；212, exert a force inclined-plane；213, it is bonded inclined-plane；22, horizontal component；3, chip；4, light transmission
Plate；41, raised；5, PET film；6, sealant；7, UV glue；8, adhesive；91, pipe is accommodated；92, elastic spacing one；921, stress
Inclined-plane.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
As depicted in figs. 1 and 2, which includes substrate 1, heat sink 2, chip 3 and light-transmitting plate 4, heat sink 2 installation
Fixed chip 3 is fixed on heat sink 2 on substrate 1, and the lid of light-transmitting plate 4 closes on substrate 1 and covers in chip 3.Light transmission
Plate 4 is circle, and the lower surface of light-transmitting plate 4 is circumferentially equipped with protrusion 41, and the lower surface of protrusion 41 is the installation Nian Jie with substrate 1
Face, mounting surface are equipped with PET film 5.Substrate 1 is also circle, and the upper surface of substrate 1 is circumferentially equipped with groove 11.Groove 11 by it is interior every
Ring washer 12 and the formation of outer baffle circle 13, outer baffle circle 13 are located at the outside of interior baffle circle 12, the internal diameter and outer diameter of interior baffle circle 12
Less than the internal diameter and outer diameter of outer baffle circle 13.When light-transmitting plate 4 is installed, protrusion 41 is inserted into groove 11, applies between PET film 5 and substrate 1
There is sealant 6, light-transmitting plate 4 realizes being fixed to each other between substrate 1 by sealant 6.PET film 5 is i.e. poly- to benzene using PET
Baffle film made of naphthalate (English: Polyethylene terephthalate, abbreviation PET), PET film 5
Gas and vapor permeability are low, have excellent resistance gas and water, oil and peculiar smell performance, and transparency is high, can stop ultraviolet light, light
Pool property is good.PET film 5 can play preferable protective action to the sealant 6 between light-transmitting plate 4 and substrate 1, so that light-transmitting plate 4
With the good airproof performance between substrate 1, and high reliablity, the service life of LED package device entirety are relatively longer.Interior baffle circle 12
With outer baffle circle 13 can the effectively inside and outside ultraviolet light of baffle, further ensure the reliability of sealant 6.
As optimization, common adhesive or silica gel is can be used in sealant 6, due to the baffle and protective action of PET film 5,
Its reliability can guarantee using adhesive and silica gel.UV glue 7 is coated between the upper surface and mounting surface of PET film 5, PET film 5 is logical
It crosses UV glue 7 and is fixed on mounting surface.Chip 3 can be ultraviolet lamp chip 3, or other chips 3.
As depicted in figs. 1 and 2, the centre of substrate 1 is equipped with perforative mounting hole 14, and heat sink 2 is T-shaped, and heat sink 2 include vertical
Part 21 and horizontal component 22, chip 3 are fixed on the upper surface of heat sink 2 vertical portion 21.The bottom of substrate 1, which is equipped with, to hold
Slot 15, holding tank 15 and mounting hole 14 are received with center setting.When heat sink 2 installation, heat sink 2 vertical portion 21 is inserted into from the bottom up
Mounting hole 14, and the upper surface of vertical portion 21 is higher by the upper surface of 1 plate of base, upper surface and the holding tank 15 of horizontal component 22
Bottom fitting, and the lower surface of horizontal component 22 is lower than the lower surface of substrate 1.The heat warp that chip 3 generates in use
It is exported by heat sink 2 to installation site, so that heat be shed, avoids 3 temperature of chip excessively high.The upper surface of horizontal component 22 and appearance
Receive slot 15 bottom between be coated with adhesive 8, heat sink 2 are fixed on heat sink 2 by adhesive 8.
As depicted in figs. 1 and 2, as optimization, interior be equipped with of substrate 1 accommodates pipe 91, accommodates in pipe 91 equipped with elastic spacing one
92, one end of elastic spacing one 92 is positive stop end, and positive stop end is equipped with stress inclined-plane 921.Heat sink 2 when not installing, elastic spacing one
92 positive stop end is stretched out from pipe 91 is accommodated positioned at mounting hole 14.Heat sink 2 vertical portion 21 is equipped with limit hole 211.Heat sink 2 installation
When, heat sink 2 push elastic spacing one 92 to receiving 91 contract of pipe, elastic spacing one 92 and limit hole by stress inclined-plane 921
When 211 alignment, elastic spacing one 92 resets elongation so that positive stop end is inserted into limit hole 211.Adhesive 8 when the temperature is excessively high may
Failure, elastic spacing one 92 and the cooperation limit of limit hole 211, further ensure the stability between heat sink 2 and substrate 1.Heat sink 2
Vertical portion 21 be equipped with force inclined-plane 212, the tilt angle on inclined-plane 212 that exerts a force and the tilt angle on stress inclined-plane 921 are mutually fitted
Match, force inclined-plane 212 and stress inclined-plane 921 contact, and preferably push elastic spacing one 92 to receiving 91 contract of pipe.Limit
The inner wall in position hole 211 is equipped with fitting inclined-plane 213.Fitting inclined-plane 213 can be bonded completely with stress inclined-plane 921.Elastic spacing one
When 92 positive stop end is located in limit hole 211, the positive stop end of elastic spacing one 92 is bonded completely with the inner wall of limit hole 211.Make
To advanced optimize, two groups of receiving pipe 91 and elastic spacing one 92 are symmetrically arranged in substrate 1, heat sink 2 vertical portion 21 is right
Title is set there are two limit hole 211, so that limit is more firm.
The manufacturing method of the LED package device is as follows:
A, a substrate 1, one heat sink 2, a chip 3, a light-transmitting plate 4 and a PET film 5 of above structure are provided；
B, PET film 5 is fixed on to the lower surface of the protrusion 41 of light-transmitting plate 4 by UV glue 7, heat sink 2 installation is fixed
On substrate 1, chip 3 is fixed on heat sink 2
C, after completing step B, light-transmitting plate is fixed on substrate.
Embodiments above is only explanation of the invention, is not limitation of the present invention, art technology
Personnel can according to need the modification that above embodiments are made with not creative contribution after reading this specification, but as long as
All by the protection of Patent Law in scope of the presently claimed invention.
Claims (10)
1. a kind of LED package device, including substrate and light-transmitting plate, it is characterised in that: the light-transmitting plate is used for and the substrate
The mounting surface of bonding is equipped with PET film, and sealant is equipped between the lower surface and substrate of the PET film, and the light-transmitting plate passes through institute
It states sealant and realizes being fixed to each other between the substrate.
2. LED package device according to claim 1, it is characterised in that: the substrate is equipped with interior baffle circle, described
After tabula rasa installation, the PET film is located at the outside of the interior baffle circle.
3. LED package device according to claim 2, it is characterised in that: the substrate is equipped with outer baffle circle along its edge,
The outer baffle circle is in the outside of the interior baffle circle, after the light-transmitting plate installation, the PET film be located at the interior baffle circle with
Between the outer baffle circle.
4. LED package device according to claim 3, it is characterised in that: the lower surface of the light-transmitting plate is equipped with protrusion, institute
The lower surface that mounting surface is the protrusion is stated, the PET film is set to the lower surface of the protrusion, and the protrusion is inserted into described outer
Between baffle circle and the interior baffle circle.
5. LED package device according to claim 1, it is characterised in that: the sealant is silica gel or adhesive.
6. LED package device according to claim 1, it is characterised in that: the upper surface of the PET film and the mounting surface
Between be equipped with UV glue, the PET film is fixed on the mounting surface by the UV glue.
7. LED package device according to claim 1, it is characterised in that: it further include heat sink and chip, the heat sink fixation
In the substrate, the chip is fixed on described heat sink.
8. LED package device according to claim 7, it is characterised in that: the substrate is equipped with perforative mounting hole, described
The lower surface of substrate is equipped with holding tank, and the mounting hole and the holding tank are arranged concentrically, described heat sink T-shaped, described heat sink
Including vertical portion and horizontal component；
When the heat sink installation, the heat sink vertical portion is inserted into mounting hole from bottom to top, the heat sink horizontal component
Upper surface is bonded with the bottom of the holding tank, between the upper surface of the heat sink horizontal component and the bottom of the holding tank
There is adhesive.
9. LED package device according to claim 8, it is characterised in that: be equipped in the substrate and accommodate pipe, the receiving
Elastic spacing one is equipped in pipe, the positive stop end of the elastic spacing one is equipped with stress inclined-plane, and the heat sink vertical portion is equipped with
Limit hole；
Described heat sink when not installing, the positive stop end of the elastic spacing one is stretched out from the receiving pipe is located at the mounting hole；Institute
When stating heat sink installation, the heat sink vertical portion is managed by elastic spacing one described in the stress slope driving to the receiving
Contract, when the elastic spacing one is aligned with the limit hole, the elastic spacing one resets elongation so that its positive stop end is inserted
Enter the limit hole.
10. a kind of manufacturing method of LED package device as described in any one of claims 1-9, it is characterised in that: including with
Lower step:
A, a substrate, a chip, a light-transmitting plate and a PET film are provided；
B, the PET film is fixed on the light-transmitting plate, on the substrate according to fixation by the chip；
C, after completing step B, light-transmitting plate is fixed on substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811634250.5A CN109786516A (en) | 2018-12-29 | 2018-12-29 | LED packaging device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811634250.5A CN109786516A (en) | 2018-12-29 | 2018-12-29 | LED packaging device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109786516A true CN109786516A (en) | 2019-05-21 |
Family
ID=66497992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811634250.5A Pending CN109786516A (en) | 2018-12-29 | 2018-12-29 | LED packaging device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109786516A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115377270A (en) * | 2022-08-31 | 2022-11-22 | 深圳市聚飞光电股份有限公司 | LED packaging structure |
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|---|---|---|---|---|
| US6239487B1 (en) * | 1998-02-11 | 2001-05-29 | Hyundai Electronics Industries Co., Ltd. | Lead frame with heat spreader and semiconductor package therewith |
| CN201050737Y (en) * | 2007-06-28 | 2008-04-23 | 陈发拼 | Reflecting film for lighting fixture |
| US20080180014A1 (en) * | 2007-01-29 | 2008-07-31 | Tennrich International Corp. | LED heat sink |
| CN100530716C (en) * | 2004-12-21 | 2009-08-19 | 3M创新有限公司 | Illumination assembly and method of making same |
| CN102130269A (en) * | 2010-01-19 | 2011-07-20 | 富士迈半导体精密工业（上海）有限公司 | Solid-state luminous element and light source module |
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| CN106960900A (en) * | 2017-03-15 | 2017-07-18 | 惠州市华瑞光源科技有限公司 | Quantum dot LED encapsulation structure |
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-
2018
- 2018-12-29 CN CN201811634250.5A patent/CN109786516A/en active Pending
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|---|---|---|---|---|
| US6239487B1 (en) * | 1998-02-11 | 2001-05-29 | Hyundai Electronics Industries Co., Ltd. | Lead frame with heat spreader and semiconductor package therewith |
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| US20080180014A1 (en) * | 2007-01-29 | 2008-07-31 | Tennrich International Corp. | LED heat sink |
| CN201050737Y (en) * | 2007-06-28 | 2008-04-23 | 陈发拼 | Reflecting film for lighting fixture |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115377270A (en) * | 2022-08-31 | 2022-11-22 | 深圳市聚飞光电股份有限公司 | LED packaging structure |
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Application publication date: 20190521 |