CN109786292B

CN109786292B - Cleaning device for light-emitting diode chip

Info

Publication number: CN109786292B
Application number: CN201811600205.8A
Authority: CN
Inventors: 林晓文; 高百卉
Original assignee: HC Semitek Zhejiang Co Ltd
Current assignee: HC Semitek Zhejiang Co Ltd
Priority date: 2018-12-26
Filing date: 2018-12-26
Publication date: 2021-01-12
Anticipated expiration: 2038-12-26
Also published as: CN109786292A

Abstract

The invention discloses a cleaning device for a light-emitting diode chip, and belongs to the technical field of semiconductors. This belt cleaning device includes the base, wafer ring microscope carrier, the manipulator, carousel and first swing arm, wafer ring microscope carrier is located the base, wafer ring microscope carrier is used for bearing the weight of the brilliant ring, the carousel rotates and sets up on the base, carousel and wafer ring microscope carrier interval arrangement, first swing arm rotates and connects on the base, the axis of rotation of first swing arm is parallel with the axis of rotation of carousel, be provided with first cleaning head on the first swing arm, first cleaning head is located the carousel top, the manipulator is located on the base and is located between wafer ring microscope carrier and the carousel, the manipulator is used for shifting the wafer ring that wafer ring microscope carrier bore to the carousel on can controlling. Through set up first cleaning head on first swing arm for can wash the LED chip of placing on the carousel through first cleaning head, avoid the problem that the cleaning efficiency is low that leads to by artifical washing, improve the cleaning efficiency.

Description

Cleaning device for light-emitting diode chip

Technical Field

The invention relates to the technical field of semiconductors, in particular to a cleaning device for a light-emitting diode chip.

Background

An LED (Light Emitting Diode) has the advantages of small size, long service life, low power consumption, and the like, and is currently widely used in automobile signal lamps, traffic signal lamps, display screens, and lighting devices.

When the LED is manufactured, an epitaxial wafer needs to be manufactured first, and then the epitaxial wafer is manufactured into an LED chip. In the manufacturing process, certain pollution is inevitably formed on the LED chip, so the LED chip needs to be cleaned after the manufacturing of the LED chip is completed.

At present, the LED chip is usually cleaned in a manual mode, and the cleaning efficiency is low.

Disclosure of Invention

The embodiment of the invention provides a cleaning device for a light-emitting diode chip, which can improve the cleaning efficiency of the light-emitting diode chip. The technical scheme is as follows:

the embodiment of the invention provides a cleaning device for a light-emitting diode chip, which comprises a base, a wafer ring carrying platform, a manipulator, a turntable and a first swing arm, wherein the wafer ring carrying platform is positioned on the base and used for carrying a wafer ring, the turntable is rotationally arranged on the base, the turntable and the wafer ring carrying platform are arranged at intervals, the first swing arm is rotationally connected to the base, the rotation axis of the first swing arm is parallel to the rotation axis of the turntable, a first cleaning head is arranged on the first swing arm and positioned above the turntable, the manipulator is positioned on the base and positioned between the wafer ring carrying platform and the turntable, and the manipulator is used for transferring the wafer ring carried by the wafer ring carrying platform to the turntable in an operable and controllable manner.

Optionally, the wafer ring carrier includes a rack and a lifting mechanism, the lifting mechanism is connected to the base, and the rack is connected to the lifting mechanism.

Optionally, the rack comprises two side plates connected with the lifting mechanism, the two side plates are vertically arranged and are parallel and right opposite to each other, and a plurality of horizontal ribs are arranged on the opposite surfaces of the two side plates.

Optionally, the first cleaning head is circular, and the first cleaning head is provided with a plurality of uniformly distributed water spraying holes.

Optionally, the first cleaning head has an even distribution of bristles thereon.

Optionally, the cleaning device further comprises a second swing arm, the second swing arm is rotatably connected to the base, a rotation axis of the second swing arm is parallel to a rotation axis of the turntable, a second cleaning head is arranged on the second swing arm, and a plurality of spray holes are formed in the second cleaning head and used for spraying air flow or water flow.

Optionally, the cleaning device further comprises a cleaning cover, the cleaning cover is located on the base, the rotary table and the first swing arm are located in the cleaning cover, and the cleaning cover is provided with a movable door for the manipulator to pass through.

Optionally, a dripper is arranged in the cleaning cover and is positioned right above the turntable.

Optionally, the cleaning cover is a transparent structure.

Optionally, a crystal-member ring clamp is arranged on the turntable.

The technical scheme provided by the embodiment of the invention has the beneficial effects that at least: through setting up wafer ring microscope carrier on the base for can arrange the wafer ring that carries the LED chip of treating wasing in on the wafer ring microscope carrier. Through setting up carousel and manipulator on the base, the manipulator is located on the base and the manipulator is located between wafer ring microscope carrier and the carousel for can shift the wafer ring to the carousel through the manipulator. Through set up first swing arm on the base, because the axis of rotation of first swing arm is parallel with the axis of rotation of carousel, consequently first swing arm can be at the plane internal rotation that is on a parallel with the carousel. Through set up first cleaning head on first swing arm for can wash the LED chip of placing on the carousel through first cleaning head, avoid the problem that the cleaning efficiency is low that leads to by artifical washing, improve the cleaning efficiency.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a cleaning apparatus for an led chip according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a first swing arm according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a crystal ring carrier according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a turntable according to an embodiment of the present invention;

fig. 5 is a partial structural schematic view of a second swing arm according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a cleaning cover according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a cleaning apparatus for an led chip according to an embodiment of the present invention. As shown in fig. 1, the cleaning apparatus includes a base 10, a wafer ring stage 20, a robot 30, a turntable 40, and a first swing arm 50.

The wafer-level ring carrier 20 is located on the base 10, and the wafer-level ring carrier 20 is used for carrying the wafer-level ring. The turntable 40 is rotatably disposed on the base 10, and the turntable 40 is spaced apart from the wafer ring carrier 20. The first swing arm 50 is rotatably connected to the base 10, and the rotation axis of the first swing arm 50 is parallel to the rotation axis of the turntable 40.

Fig. 2 is a schematic structural diagram of a first swing arm according to an embodiment of the present invention. As shown in fig. 2, the first swing arm 50 is provided with a first cleaning head 51, and the first cleaning head 51 is located above the turntable 40. The robot 30 is located on the base 10 between the ring carrier 20 and the turntable 40, and the robot 30 is configured to controllably transfer a ring carried by the ring carrier 20 onto the turntable 40.

Through setting up wafer ring microscope carrier on the base for can arrange the wafer ring that carries the LED chip of treating wasing in on the wafer ring microscope carrier. Through setting up carousel and manipulator on the base, the manipulator is located on the base and the manipulator is located between wafer ring microscope carrier and the carousel for can shift the wafer ring to the carousel through the manipulator. Through set up first swing arm on the base, because the axis of rotation of first swing arm is parallel with the axis of rotation of carousel, consequently first swing arm can be at the plane internal rotation that is on a parallel with the carousel. Through set up first cleaning head on first swing arm for can wash the LED chip of placing on the carousel through first cleaning head, avoid the problem that the cleaning efficiency is low that leads to by artifical washing, improve the cleaning efficiency.

The LED chip can be set up on blue membrane, and blue membrane is fixed on brilliant ring, and when wasing, can place the wafer ring that carries the LED chip on wafer ring microscope carrier 20 to make things convenient for manipulator 30 to snatch brilliant ring 1, transfer brilliant ring 1 to on the carousel 40.

Fig. 3 is a schematic structural diagram of a crystal-membered ring carrier according to an embodiment of the present invention. As shown in fig. 3, the wafer ring stage 20 may include a rack 21 and a lifting mechanism 22, the lifting mechanism 22 is connected to the base 10, and the rack 21 is connected to the lifting mechanism 22. When the LED chips are cleaned, the lifting mechanism 22 can drive the material rack 21 to lift, so that the manipulator 30 can take the crystal-membered ring 1 off the material rack 21.

Alternatively, the stack 21 may include two side plates 211 connected to the lifting mechanism 22. The two side plates 211 are vertically arranged, the two side plates 211 are opposite in parallel, and a plurality of horizontal convex ribs 2111 are arranged on the opposite surfaces of the two side plates 211. When cleaning, a plurality of crystal-shape rings 1 can be placed on the material frame 21, and each crystal-shape ring 1 is supported by one horizontal rib 2111 on each of the two side plates 211, so that the crystal-shape rings 1 can be placed on the material frame 21 layer by layer. When the manipulator 30 takes one crystal-membered ring 1 from the rack 21, the lifting mechanism 22 can drive the rack 21 to ascend or descend, so that the manipulator 30 can take the next crystal-membered ring 1.

The rack 21 can further comprise a top plate 212 and a bottom plate 213 which are connected with the two side plates 211, the bottom plate 213 is connected with the lifting mechanism 22, the top plate 212, the bottom plate 213 and the two side plates 211 form a frame structure in a surrounding mode, the wafer ring 1 can be placed into the rack 21 from one side of the rack 21 before the LED chips are cleaned, and the wafer ring 1 can be taken away from the other side of the rack 21 by the manipulator 30 when the LED chips are cleaned.

As shown in fig. 3, the lifting mechanism 22 may include a lifting rail 222 and a linear motor 221, the linear motor 221 is disposed on the lifting rail 222, the lifting rail 222 is fixed on the base 10, and the material rack 21 is connected to the linear motor 221, so that the linear motor 221 can drive the material rack 21 to lift.

As shown in fig. 1, a position sensor 90 may be disposed on the base 10, and the position sensor 90 may be connected to the lifting mechanism 22 to control the lifting of the lifting mechanism 22. The position sensor 90 may be a proximity switch, for example, and the lifting mechanism 22 may control the lifting mechanism 22 to stop lifting when the lifting mechanism 22 drives the rack 21 to lift and the proximity switch detects a crystal-membered ring 1, and after the robot 30 removes the crystal-membered ring 1, the proximity switch controls the lifting mechanism 22 to start lifting again until the proximity switch detects a crystal-membered ring 1 again.

Fig. 4 is a schematic structural diagram of a turntable according to an embodiment of the present invention. As shown in fig. 4, a crystal member ring holder 41 may be provided on the turntable 40. The crystal-member ring clamp 41 can fix the crystal-member ring 1 on the turntable 40 when cleaning the LED chip, so as to prevent the crystal-member ring 1 from loosening.

Illustratively, the wafer ring clamp 41 may include a plurality of sliders 411, and the plurality of sliders 411 are slidably disposed on the turntable 40. Each of the plurality of sliders 411 may move in a radial direction of the turntable 40 (the dotted line in fig. 4 is a moving track of the slider 411). The plurality of sliders 411 may be moved radially outward of the rotary plate 40 before the crystal-member ring 1 is transferred to the rotary plate 40, and the plurality of sliders 411 may be moved radially inward of the rotary plate 40 after the crystal-member ring 1 is transferred to the rotary plate 40, thereby holding the crystal-member ring 1.

The slide block 411 may further be provided with a limiting protrusion 412, the limiting protrusion 412 protrudes out of the surface of the slide block 411 along the radial direction of the turntable 40, when the slide block 411 clamps the crystal-member ring 1, the orthographic projection of the limiting protrusion 412 on the turntable 40 is located on the crystal-member ring 1, so as to further prevent the crystal-member ring 1 from being loosened.

As shown in fig. 4, a plurality of vacuum suction holes 40a may be further formed on the turntable 40, and the plurality of vacuum suction holes 40a may be connected to a vacuum generator. After the crystal-membered ring 1 is placed on the turntable 40, the plurality of vacuum suction holes 40a can adsorb the blue film fixed on the crystal-membered ring 1, which can further facilitate the cleaning of the LED chip.

Referring to fig. 2, the first cleaning head 51 may have a circular shape, and the first cleaning head 51 has a plurality of shower holes 511 uniformly distributed thereon. When the LED chip is cleaned, the first swing arm 50 is rotated to enable the first cleaning head 51 to be located right above the rotary table 40, and the water spraying holes 511 can spray water onto the rotary table 40 to clean the LED chip.

As shown in FIG. 2, the first cleaning head 51 may also have bristles 512 uniformly distributed thereon. The turntable 40 drives the LED chips to rotate together in the rotating process, and the bristles 512 can scrub the LED chips, so that the cleaning effect can be improved.

The orthographic projection of the first cleaning head 51 on the plane of the rotating disc 40 can be larger than the area of the rotating disc 40, so that the first cleaning head 51 can have a large enough area for arranging the bristles 512 and the water spraying holes 511, and the first cleaning head 51 can cover the whole rotating disc 40 during cleaning, thereby ensuring that all the LED chips can be cleaned.

As shown in fig. 1, the cleaning device may further include a second swing arm 60, the second swing arm 60 is rotatably connected to the base 10, and a rotation axis of the second swing arm 60 is parallel to a rotation axis of the turntable 40. Fig. 5 is a partial structural schematic diagram of a second swing arm according to an embodiment of the present invention. As shown in fig. 5, the second swing arm 60 is provided with a second cleaning head 61, the second cleaning head 61 is provided with a plurality of spray holes 611, and the plurality of spray holes 611 are used for spraying air flow or water flow. In the cleaning process, after the bristles 512 of the first cleaning head 51 brush for a period of time, the first swing arm 50 can be rotated to separate the first cleaning head 51 from the turntable 40, and then the second swing arm 60 is rotated to make the second cleaning head 61 face the turntable 40, and the plurality of spray holes 611 can spray water flow with higher pressure to wash away dirt on the LED chip. The LED chips can be dried by spraying air flow through the plurality of spray holes 611, and the cleaning efficiency is further improved. After drying, the crystal-member ring 1 on the turntable 40 can be taken away to clean the LED chip on the next crystal-member ring 1. Specifically, the crystal-shape ring 1 on the turntable 40 can be taken away manually, or directly taken away by a manipulator of the equipment for performing the subsequent process, or the crystal-shape ring 1 can be put back on the material rack 21 by the manipulator 30, and after all the LED chips are cleaned, all the crystal-shape ring 1 on the material rack 21 is taken away.

As shown in fig. 1, the cleaning apparatus may further include a cleaning hood 70. The cleaning cover 70 is located on the base 10, and the turntable 40 and the first swing arm 50 are located in the cleaning cover 70. Fig. 6 is a schematic structural diagram of a cleaning cover according to an embodiment of the present invention. As shown in fig. 6, the cleaning hood 70 has a movable door 71 through which the robot 30 passes. By providing the cleaning cover 70, water can be prevented from splashing to other devices in the process of cleaning the LED chip.

Alternatively, the cleaning cover 70 may be a transparent structure, so that during the process of cleaning the LED chip, a worker can observe the cleaning condition through the cleaning cover 70.

As shown in fig. 6, a drip chamber 80 may be disposed in the cleaning cover 70, and the drip chamber 80 is located right above the turntable 40. The dripper 80 may drip a cleaning agent onto the LED chip when the LED chip is cleaned, so as to improve the cleaning effect. Illustratively, a dripper 80 may be provided on the top of the cleaning hood 70.

The cleaning cover 70 can be further provided with a vertical guide rail 72 and a linear motor 73, the movable door 71 is connected with the linear motor 73, and the linear motor 73 can drive the movable door 71 to move along the vertical guide rail 72, so that the opening and closing of the movable door 71 can be controlled.

As shown in fig. 6, an activation switch 74 may be disposed on an outer wall of the cleaning hood 70, and the activation switch 74 may be used to control the activation of the cleaning device, such as the activation of the lifting mechanism 22, the activation of the robot 30, the activation of the turntable 40, the first swing arm 50, the second swing arm 60, and the like.

As shown in FIG. 1, a water outlet 10a may be further disposed on the base 10, the water outlet 10a is disposed in the washing cover 70, the water outlet 10a can drain water during the washing process, and the water used during the washing process may be deionized water.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A cleaning device for a light-emitting diode chip is characterized by comprising a base (10), a wafer ring carrying platform (20), a manipulator (30), a rotary plate (40) and a first swing arm (50), wherein the wafer ring carrying platform (20) is positioned on the base (10), the wafer ring carrying platform (20) is used for carrying a wafer ring, the rotary plate (40) is rotatably arranged on the base (10), the rotary plate (40) and the wafer ring carrying platform (20) are arranged at intervals, the first swing arm (50) is rotatably connected onto the base (10), the rotating axis of the first swing arm (50) is parallel to the rotating axis of the rotary plate (40), a first cleaning head (51) is arranged on the first swing arm (50), the first cleaning head (51) is positioned above the rotary plate (40), the manipulator (30) is positioned on the base (10) and is positioned between the wafer ring carrying platform (20) and the rotary plate (40), the manipulator (30) is used for controllably transferring a wafer ring carried by the wafer ring carrying platform (20) to the turntable (40), a wafer ring fixture (41) and a plurality of vacuum suction holes (40a) are arranged on the turntable (40), the wafer ring fixture (41) comprises a plurality of sliders (411), the sliders (411) are arranged on the turntable (40) in a sliding mode, the sliders (411) can move along the radial direction of the turntable (40), limiting protrusions (412) are arranged on the sliders (411), the limiting protrusions (412) protrude out of the surface of the sliders (411) along the radial direction of the turntable (40), and when the sliders (411) clamp the wafer ring, the orthographic projection of the limiting protrusions (412) on the turntable (40) is located on the wafer ring.

2. The cleaning apparatus according to claim 1, wherein the crystal-membered ring stage (20) comprises a rack (21) and an elevating mechanism (22), the elevating mechanism (22) is connected to the base (10), and the rack (21) is connected to the elevating mechanism (22).

3. The cleaning device according to claim 2, wherein the rack (21) comprises two side plates (211) connected with the lifting mechanism (22), the two side plates (211) are vertically arranged, the two side plates (211) are oppositely arranged in parallel, and a plurality of horizontal ribs (2111) are arranged on the opposite surfaces of the two side plates (211).

4. The washing device according to claim 1, characterized in that the first cleaning head (51) is circular, the first cleaning head (51) having a plurality of spray holes (511) uniformly distributed thereon.

5. A cleaning device according to claim 4, characterized in that the first cleaning head (51) has an even distribution of bristles (512).

6. The cleaning device according to any one of claims 1 to 5, further comprising a second swing arm (60), wherein the second swing arm (60) is rotatably connected to the base (10), a rotation axis of the second swing arm (60) is parallel to a rotation axis of the turntable (40), a second cleaning head (61) is disposed on the second swing arm (60), the second cleaning head (61) has a plurality of spray holes (611), and the plurality of spray holes (611) are used for spraying air flow or water flow.

7. The cleaning device according to any one of claims 1 to 5, further comprising a cleaning cover (70), wherein the cleaning cover (70) is positioned on the base (10), the rotating disc (40) and the first swing arm (50) are positioned in the cleaning cover (70), and the cleaning cover (70) is provided with a movable door (71) for the manipulator (30) to pass through.

8. The cleaning device according to claim 7, wherein a dripper (80) is provided in the cleaning cover (70), and the dripper (80) is positioned directly above the turntable (40).

9. The cleaning device according to claim 7, wherein the cleaning hood (70) is of a transparent construction.