CN216631827U - Chip array substrate cleaning device - Google Patents
Chip array substrate cleaning device Download PDFInfo
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- CN216631827U CN216631827U CN202122586375.9U CN202122586375U CN216631827U CN 216631827 U CN216631827 U CN 216631827U CN 202122586375 U CN202122586375 U CN 202122586375U CN 216631827 U CN216631827 U CN 216631827U
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- array substrate
- chip array
- substrate holding
- cleaning
- component
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Abstract
The utility model discloses a chip array substrate cleaning device, comprising: the cleaning tank is used for containing cleaning fluid; a chip array substrate holding member for holding the chip array substrate with a surface to be cleaned of the chip array substrate facing the ground; a rotating member connected to the chip array substrate holding member for driving the chip array substrate holding member to horizontally rotate; a moving member connected with the rotating member; and the control component controls the moving component to drive the rotating component and the chip array substrate holding component to move together during cleaning, so that the chip array substrate holding component drives the chip array substrate to enter the cleaning solution, and controls the rotating component to rotate to drive the chip array substrate to rotate in the cleaning solution. The utility model can clean the chip array substrate more safely and effectively.
Description
Technical Field
The utility model relates to the technical field of cleaning of Micro-LED chip array substrates, in particular to a chip array substrate cleaning device.
Background
The Micro light emitting diode (Micro light emitting diode) chip array substrate comprises thousands of Micro LED chips which are arranged in an array and have the size of 50 micrometers or less, and micron-sized gaps are formed between every two adjacent Micro LED chips.
The Micro-LED chip array substrate is generally formed by performing processes such as photolithography, etching, evaporation, cutting and the like on an LED epitaxial wafer, and liquid medicine, metal pollutants, impurity particles and the like used in each process may remain in gaps between adjacent Micro-LED chips to contaminate the substrate. Because each chip and wiring on the substrate are very fine, if the chip and wiring are polluted, the function of the circuit is easily damaged, and the whole substrate is failed. Therefore, how to clean the substrate safely and effectively is very important to the field.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provide a chip array substrate cleaning device which can clean a chip array substrate more safely and effectively.
In order to achieve the purpose, the technical scheme of the utility model is as follows:
a chip array substrate cleaning device comprises:
the cleaning tank is used for containing cleaning fluid;
a chip array substrate holding member for holding a chip array substrate with a surface to be cleaned of the chip array substrate facing a ground;
a rotating member connected to the chip array substrate holding member, the rotating member for driving the chip array substrate holding member to horizontally rotate;
a moving member connected with the rotating member; and
and the control component controls the moving component to drive the rotating component and the chip array substrate holding component to move together during cleaning, so that the chip array substrate holding component drives the chip array substrate to enter a cleaning solution, and controls the rotating component to rotate, the rotating component drives the chip array substrate holding component to rotate, the chip array substrate holding component rotates to drive the chip array substrate to rotate in the cleaning solution, and after cleaning, the control component controls the moving component to drive the rotating component and the chip array substrate holding component to move together, so that the chip array substrate holding component drives the chip array substrate to leave the cleaning solution.
The embodiment of the utility model has the following beneficial effects:
according to the embodiment of the utility model, the rotating component is controlled to drive the chip array substrate holding component to drive the chip array substrate to rotate in the cleaning solution, when the rotating component rotates, the surface to be cleaned faces downwards, and pollutants on the surface to be cleaned are easier to fall off and throw away under the dual actions of gravity and centrifugal force after being soaked by the cleaning solution, so that the damage to the chip array substrate caused by the direct friction of the surface to be cleaned by components such as a brush is avoided, and the pollutants in the micro-gaps on the surface to be cleaned can be effectively removed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Wherein:
fig. 1 is a schematic structural diagram of a chip array substrate cleaning apparatus according to an embodiment of the utility model.
Fig. 2 is a schematic top view of a cleaning apparatus for a chip array substrate according to another embodiment of the utility model.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention discloses a chip array substrate cleaning apparatus, including a cleaning tank 10, a chip array substrate holding member, a rotating member 30 connected to the chip array substrate holding member, a moving member connected to the rotating member 30, and a control member, wherein the cleaning tank 10 is used for holding a cleaning solution, the chip array substrate holding member is used for holding a chip array substrate and making a surface to be cleaned of the chip array substrate face the ground, the rotating member 30 is used for driving the chip array substrate holding member to rotate horizontally, during cleaning, the control member controls the moving member to drive the rotating member 30 and the chip array substrate holding member to move together, so that the chip array substrate holding member drives the chip array substrate to enter the cleaning solution and controls the rotating member 30 to rotate, the rotating member 30 rotates to drive the chip array substrate holding member to rotate, the chip array substrate holding member rotates to drive the chip array substrate to rotate in the cleaning solution, after cleaning, the control member controls the moving member to drive the rotating member 30 and the chip array substrate holding member to move together, so that the chip array substrate holding member drives the chip array substrate to leave the cleaning solution. The rotating member 30 is controlled to drive the chip array substrate holding member to drive the chip array substrate to rotate in the cleaning solution, during rotation, the surface to be cleaned is downward, pollutants on the surface to be cleaned are soaked by the cleaning solution and then are easy to fall off and throw away under the dual actions of gravity and centrifugal force, so that the surface to be cleaned is prevented from being directly rubbed by the members such as a brush and the like to damage the chip array substrate, and the pollutants in the micro-gap on the surface to be cleaned can be effectively removed.
It should be noted that the control component may control the rotation of the rotating component 30, including controlling the switch, rotation degree, rotation direction, etc. of the rotating component 30, and the control component may also control the switch, speed, direction, movement track, etc. of the moving component when controlling the movement of the moving component, and the control component controls the chip array substrate holding component, including controlling the opening and closing of the chip array substrate holding component, so as to pick up or release the chip array substrate, etc.
In the embodiment, the chip array substrate cleaning device is used for cleaning a Micro-LED chip array substrate, the Micro-LED chip array substrate comprises a substrate and a Micro-LED chip array arranged on the substrate in an array mode, the Micro-LED chip array comprises a plurality of Micro-LED chips, gaps are reserved between every two adjacent Micro-LED chips, the size of each Micro-LED chip is below 50 micrometers, and the number of the Micro-LED chips included in the Micro-LED chip array is 100-100000. Each Micro-LED chip includes an N-type layer, an active layer, and a P-type layer sequentially stacked on a substrate, and the Micro-LED chip is made of a semiconductor material, such as gallium phosphide, gallium aluminum arsenide, gallium nitride, or the like.
The preparation method of the Micro-LED chip array substrate comprises the following steps:
step 1: and forming a semiconductor epitaxial wafer. In a specific embodiment, the semiconductor epitaxial wafer comprises a substrate, an N-type layer, an active layer and a P-type layer which are sequentially stacked, the semiconductor epitaxial wafer is of a single-layer structure, in order to improve the growth quality of the semiconductor epitaxial wafer, the semiconductor epitaxial wafer further comprises a buffer layer positioned between the substrate and the N-type layer, in order to improve the uniformity of current transmission, a current spreading layer can be further formed on the P-type layer, and the like.
Step 2: and coating photoresist on the semiconductor epitaxial wafer, and forming patterned photoresist through exposure and development, wherein the patterned photoresist corresponds to the pattern of the Micro-LED chip array.
And step 3: and etching the semiconductor epitaxial wafer by using the patterned photoresist as a mask through an etching process to form a Micro-LED chip array, and removing the photoresist layer after etching.
And 4, step 4: and forming an anode and a cathode of the metal material by an evaporation method, wherein the cathode is electrically connected with the N-type layer, and the anode is electrically connected with the P-type layer.
And 5: and removing the substrate.
Of course, the method for manufacturing the Micro-LED chip array substrate with more functional layers and more complicated structure may further include more steps, which are not listed here.
Most of the above preparation steps require cleaning to remove contaminants, for example, the residue of photoresist needs to be removed after the Micro-LED chip array is formed, and the residue of metal particles needs to be cleaned to remove after the anode and the cathode are formed. The chip array substrate refers to an intermediate semi-finished substrate which is required to be cleaned and is obtained in any step in the preparation process of the Micro-LED chip array substrate.
Referring to fig. 1, in one embodiment, the chip array substrate holding member may be a clamping member or a suction member, wherein the clamping member is preferable to the suction member because the suction member is sucking the back surface of the chip array substrate, which may cause the back surface of the chip array substrate to be unable to be cleaned, and the chip array substrate may be easily dropped and damaged during the centrifugal rotation.
Further, the clamping member may include a pair of clamping jaws 21 matched in an opening and closing manner or two pairs of clamping jaws 21 matched in an opening and closing manner, preferably, two pairs of clamping jaws 21 matched in an opening and closing manner are adopted, so that not only the clamping force is enhanced, but also the clamping member can adapt to chip array substrates of different sizes, when the clamping member is the two pairs of clamping jaws 21 matched in an opening and closing manner, the opening and closing directions of the two pairs of clamping jaws 21 may be the same, that is, the two pairs of clamping jaws 21 are both clamped on two opposite sides of the chip array substrate, in this scheme, the clamping force is more advantageous, and also can be perpendicular, that is, the one pair of clamping jaws 21 are clamped on two opposite sides of the chip array substrate, the other pair of clamping jaws 21 is clamped on the other two opposite sides of the chip array substrate, and this scheme can prevent the chip array substrate from being thrown out in the rotating process.
Furthermore, the chip array substrate holding member can be made of a PP (polypropylene) material, a Teflon (polytetrafluoroethylene) material or a latex material, and the like, and the materials are low in hardness, not easy to clamp and damage the chip, anti-slip, capable of preventing the chip from falling off in the rotating process, and capable of resisting acid, alkali and high-temperature cleaning liquid.
Referring to fig. 1, in an embodiment, the moving member includes a vertical telescopic member 41 connected to the rotating member 30, and a horizontal moving member connected to the vertical telescopic member 41, wherein the vertical telescopic member 41 is used for driving the rotating member 30 and the chip array substrate holding member to move up and down in a vertical direction together, and the horizontal moving member is used for driving the vertical telescopic member 41, the rotating member 30 and the chip array substrate holding member to move away from or to reach above the cleaning tank 10 in a horizontal direction together.
Further, in an embodiment, the horizontal moving member includes a mounting base 421 and a supporting member 422 connected to the mounting base 421, the supporting member 422 is connected to the vertical telescopic member 41, and the supporting member 422 can rotate horizontally with respect to the mounting base 421, so as to drive the vertical telescopic member 41, the rotating member 30 and the chip array substrate holding member to rotate horizontally with respect to the mounting base 421.
Further, in an embodiment, the supporting member 422 includes a vertical portion 4221 horizontally and rotatably connected to the mounting base 421 and a horizontal portion 4222 connected to the vertical portion 4221, an end of the horizontal portion 4222 away from the vertical portion 4221 is connected to the vertical telescopic member 41, and the horizontal portion 4222 is a force arm and can provide a moving range of the horizontally moving member.
Further, the support member 422 further includes a guide portion 4223 connected to an end of the horizontal portion 4222 remote from the vertical portion 4221 and extending downward in a vertical direction, the guide portion 4223 is hollow inside, the guide portion 4223 is connected to the vertical telescopic member 41, and the vertical telescopic member 41 extends into the guide portion 4223 and moves up and down along the guide portion 4223.
Referring to fig. 2, in an embodiment, the number of the cleaning tanks 10 is more than 2, and the cleaning tanks 10 are disposed around the mounting base 421 to facilitate sequentially performing a plurality of steps of cleaning the chip array substrate. Each cleaning tank 10 can be respectively filled with different cleaning solutions according to needs, and the control member can control the rotation angle, speed and the like of the supporting member 422 so as to reach the upper part of different cleaning tanks 10, so that the chip array substrate can be respectively cleaned in different cleaning tanks 10.
Referring to fig. 2, in this embodiment, the number of the cleaning tanks 10 is 4, the cleaning tanks are distributed around the mounting base 421, the cleaning tanks 10 are respectively filled with a first cleaning solution, a second cleaning solution, a third cleaning solution and a fourth cleaning solution, the supporting member 422 first rotates to drive the vertical telescopic member 41, the rotating member 30 and the chip array substrate holding member to move together above the first cleaning tank 10, the vertical telescopic member 41 descends downward to drive the chip array substrate holding member to drive the chip array substrate into the first cleaning solution, then, the rotating member 30 starts to rotate to make the chip array substrate soak in the cleaning solution while continuously rotating to perform a centrifugal motion, after the cleaning is finished, the vertical telescopic member 41 ascends to drive the chip array substrate holding member together with the chip array substrate to leave the first cleaning solution, the supporting member 422 rotates to drive the vertical telescopic member 41, the fourth cleaning solution, and the chip array substrate holding member 30 rotates to move together with the chip array substrate, The rotating member 30 and the chip array substrate holding member are moved together to above the second washing bath 10, and washed again in the second washing bath 10, and so on until the washing in the fourth washing bath 10 is completed, and then a drying process is performed. The cleaning liquids in the respective cleaning tanks 10 may be the same or different, and when they are different, the concentrations of the cleaning liquids may be different in order, or the compositions of the cleaning liquids may be different. For example, taking the cleaning to remove the photoresist as an example, the cleaning tank 10 sequentially contains a first photoresist removing solution, a second photoresist removing solution, a third photoresist removing solution and clean water, and after the cleaning in the 4 cleaning tanks 10 is finished, a clean chip array substrate can be obtained, so that the automatic cleaning of the chip array substrate can be realized.
In one embodiment, the control member is disposed on the mounting base 421, and each cleaning tank 10 may further include a heating member for heating the cleaning solution and/or an ultrasonic oscillating member for providing ultrasonic oscillation to the cleaning solution, so as to improve the cleaning efficiency. The control means is also used to control the activation and heating parameters of the heating means (including but not limited to heating temperature and heating time, etc.) and to control the activation and oscillation parameters of the sonotrode (including but not limited to oscillation frequency, time, etc.).
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A chip array substrate cleaning device is characterized by comprising:
the cleaning tank is used for containing cleaning fluid;
a chip array substrate holding member for holding a chip array substrate with a surface to be cleaned of the chip array substrate facing a ground;
a rotating member connected to the chip array substrate holding member, the rotating member for driving the chip array substrate holding member to horizontally rotate;
a moving member connected with the rotating member; and
and the control component controls the moving component to drive the rotating component and the chip array substrate holding component to move together during cleaning, so that the chip array substrate holding component drives the chip array substrate to enter a cleaning solution, and controls the rotating component to rotate, the rotating component drives the chip array substrate holding component to rotate, the chip array substrate holding component rotates to drive the chip array substrate to rotate in the cleaning solution, and after cleaning, the control component controls the moving component to drive the rotating component and the chip array substrate holding component to move together, so that the chip array substrate holding component drives the chip array substrate to leave the cleaning solution.
2. The apparatus of claim 1, wherein the chip array substrate holding member is a clamping member or a suction member.
3. The apparatus of claim 2, wherein the clamping member comprises one pair of open-close matching clamping jaws or two pairs of open-close matching clamping jaws.
4. The apparatus of claim 3, wherein the chip array substrate holding member is made of PP material, Teflon material or latex material.
5. The apparatus of any one of claims 1 to 4, wherein the moving member comprises a vertically extending member connected to the rotating member for driving the rotating member and the chip array substrate holding member to move up and down in a vertical direction, and a horizontally moving member connected to the vertically extending member for driving the vertically extending member, the rotating member and the chip array substrate holding member to move together in a horizontal direction away from or above the cleaning tank.
6. The apparatus of claim 5, wherein the horizontal moving member comprises a mounting base and a supporting member connected to the mounting base, the supporting member is connected to the vertical telescopic member, and the supporting member can rotate horizontally relative to the mounting base, so as to rotate the vertical telescopic member, the rotating member and the chip array substrate holding member together horizontally relative to the mounting base.
7. The apparatus of claim 6, wherein the supporting member comprises a vertical portion horizontally and rotatably connected to the mounting base and a horizontal portion connected to the vertical portion, and an end of the horizontal portion away from the vertical portion is connected to the vertical telescopic member.
8. The apparatus of claim 7, wherein the supporting member further comprises a guide portion connected to an end of the horizontal portion away from the vertical portion and extending downward in a vertical direction, the guide portion being hollow inside and connected to the vertical extensible member, and the vertical extensible member extending into the guide portion and moving up and down along the guide portion.
9. The apparatus of any one of claims 6 to 8, wherein the number of the cleaning tanks is 2 or more, the cleaning tanks being disposed around the mounting base;
the control member is disposed on the mounting base.
10. The apparatus of claim 1, wherein the cleaning tank further comprises a heating member and/or an ultrasonic oscillating member, and the control member is further configured to control the heating member and/or the ultrasonic oscillating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122586375.9U CN216631827U (en) | 2021-10-26 | 2021-10-26 | Chip array substrate cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122586375.9U CN216631827U (en) | 2021-10-26 | 2021-10-26 | Chip array substrate cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216631827U true CN216631827U (en) | 2022-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122586375.9U Active CN216631827U (en) | 2021-10-26 | 2021-10-26 | Chip array substrate cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216631827U (en) |
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2021
- 2021-10-26 CN CN202122586375.9U patent/CN216631827U/en active Active
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