CN109769184B - Packaging structure of microphone - Google Patents
Packaging structure of microphone Download PDFInfo
- Publication number
- CN109769184B CN109769184B CN201910041597.7A CN201910041597A CN109769184B CN 109769184 B CN109769184 B CN 109769184B CN 201910041597 A CN201910041597 A CN 201910041597A CN 109769184 B CN109769184 B CN 109769184B
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- cover body
- infrared
- acoustic sensor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 5
- 230000031700 light absorption Effects 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The present disclosure relates to microphones, and particularly to a package structure of a microphone. The microphone packaging structure comprises a circuit substrate, and is characterized in that at least one black nickel-plated cover body is arranged on the circuit substrate, a first cover body is buckled on the circuit substrate to form a first cavity, an acoustic sensor is arranged in the cavity, and an application specific integrated circuit chip is connected with the acoustic sensor through signals. Due to the adoption of the technical scheme, the defects of the existing MEMS microphone are overcome, the black nickel-plated packaging structure of the outer shell is provided, light absorption is not reflected in an optical environment, optical noise is small, stability is good, a dustproof net does not need to be attached to the upper surface of the structure, the integral consistency with an installation environment is good, and safety and equipment performance are improved.
Description
Technical Field
The present disclosure relates to microphones, and particularly to a package structure of a microphone.
Background
The most widely used at present are small microphones, which are silicon microphones or microphones implemented as microelectromechanical systems (MEMS). Microelectromechanical Systems (MEMS) microphones are microphones manufactured based on (MEMS) technology, wherein the diaphragm and the backplate are important components in the MEMS microphone, which constitute a capacitor and are integrated on a silicon wafer, so as to realize the conversion of sound and electricity.
In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers is continuously reduced, and the performance requirements of people on these portable electronic products are also increasing, and in application, MEMS microphone chips and ASIC chips are usually disposed in a package structure surrounded by a substrate and a housing, and sound holes for sound to enter are disposed in the package structure. However, since the MEMS microphone chip has a very thin diaphragm, light coming in from the acoustic hole of the product can easily penetrate the diaphragm, and reach the area of the ASIC chip after being reflected, thereby causing optical noise.
Disclosure of Invention
The invention aims to provide a microphone packaging structure which solves the technical problems. The technical problems solved by the invention can be realized by adopting the following technical scheme:
the microphone packaging structure comprises a circuit substrate, and is characterized in that at least one black nickel-plated cover body is arranged on the circuit substrate, a first cover body is buckled on the circuit substrate to form a first cavity, an acoustic sensor is arranged in the cavity, and an application specific integrated circuit chip is connected with the acoustic sensor through signals.
Preferably, the circuit board comprises a first cover body, a second cover body is buckled on one side of the first cover body on the circuit board to form a first cavity, and an infrared emitter and an infrared receiver are arranged in the first cavity.
Preferably, the infrared emitter and the infrared receiver are respectively connected with the application specific integrated circuit chip, a through hole for infrared emission and infrared reception is formed in the second cover body, the emitting direction of the infrared emitter faces the through hole, and the receiving direction of the infrared receiver faces the through hole.
Preferably, an acoustic through hole is formed in the first cover body.
Preferably, the special integrated circuit chip determines time delay according to the time when the infrared emitter emits the test signal and the time when the infrared receiver receives the test signal, and obtains the approaching distance of the external object.
Preferably, the special integrated circuit chip is provided with a line input end pin and a bias current pin which are respectively connected to the acoustic sensor, the circuit substrate is provided with a power supply voltage pin connected to the power supply voltage pin on the special integrated circuit chip, the circuit substrate is provided with a grounding pin connected to the grounding pin on the special integrated circuit chip, and the circuit substrate is provided with a line output end pin connected to a data transmission pin on the special integrated circuit chip for transmitting the electric signal converted by the acoustic sensor.
Preferably, the asic chip is soldered on the circuit substrate and connected to the acoustic sensor and the circuit substrate by wires, respectively.
The beneficial effects are that: due to the adoption of the technical scheme, the invention solves the defects of the existing MEMS microphone, provides the black nickel-plated packaging structure of the outer shell, has the advantages of no reflection of light absorption in an optical environment, small optical noise, good stability, no need of attaching a dust screen to the upper surface of the structure, good integral consistency with the installation environment and capability of improving the safety and performance.
Drawings
Fig. 1 is a schematic diagram of the main structure of the present invention.
Fig. 2 is a top view of the internal structure of the present invention.
Fig. 3 is a top view of the external structure of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
The invention is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
Referring to fig. 1, a microphone package structure includes a circuit substrate 3, wherein at least one black nickel-plated cover body is disposed on the circuit substrate 3, a first cover body 2 is fastened on the circuit substrate to form a first cavity, an acoustic sensor 7 and an asic chip 6 are disposed in the cavity, and the acoustic sensor 7 is in signal connection with the asic chip 6.
The embodiment of the invention further comprises a second cover body 1, wherein the second cover body 1 is buckled on one side of the first cover body 2 on the circuit substrate 3 to form a second cavity, and an infrared emitter and an infrared receiver are arranged in the second cavity.
In the embodiment of the present invention, the infrared emitter and the infrared receiver are respectively connected with the asic chip 6, the second cover 1 is provided with a through hole for infrared emission and infrared reception, the emission direction of the infrared emitter faces the through hole, and the receiving direction of the infrared receiver faces the through hole.
In the embodiment of the present invention, the asic chip 6 determines a time delay according to the time of sending the test signal from the ir transmitter and the time of receiving the test signal from the ir receiver, and obtains the proximity distance of the external object.
The nickel plating layer adopted by the cover body in the embodiment of the invention has relatively high hardness, can improve the wear resistance of the surface of a product in performance, can reduce the cost structurally without attaching a dustproof net, and has the advantages of no reflection of black light absorption in a light environment, small light noise and good stability.
Referring to fig. 2, a metal housing 5 is disposed on the circuit substrate. A central base point P is taken on the circuit substrate 3, the point P is also taken as the central base point of the metal shell 5, an application specific integrated circuit chip 6 is welded at a position 0.105mm above the point P, and a line input terminal pin and a bias current pin are respectively connected to the acoustic sensor 7 on the application specific integrated circuit chip 6. The circuit substrate 3 is provided with a power supply voltage pin connected to a power supply voltage pin on the application specific integrated circuit chip 6, the circuit substrate 3 is provided with a grounding pin connected to a grounding pin on the application specific integrated circuit chip 6, and the circuit substrate 3 is provided with a line output end pin connected to a data transmission pin on the application specific integrated circuit chip 6 for transmitting the electric signal converted by the acoustic sensor 7.
In the embodiment of the invention, the special integrated circuit chip 6 is welded on the circuit substrate 3 and is respectively connected with the acoustic sensor 7 and the circuit substrate 3 through leads. The acoustic sensor 7 is provided on the circuit substrate 3. The infrared emitter is welded on the circuit substrate 3, and is arranged at a distance of 0.451mm from the center base point P and then 1.428mm from the center base point P, and the infrared receiver is arranged at a distance of 0.451mm from the infrared emitter and the infrared receiver just below the center base point P. Compared with the traditional MEMS microphone, the embodiment of the invention adopts the infrared sensor more for optimizing the system performance and the safety, thereby not only solving the problem of heat management requirement in the running process of the equipment, but also improving the overall function of the equipment.
Referring to fig. 3, which is a top view of the external structure of the embodiment of the present invention, the first cover 2 is a hollow rectangular shell, and an acoustic through hole is provided on the first cover 2. The second cover 1 is also a hollow rectangular shell, and the second outer shell is provided with through holes for infrared emission and infrared reception.
According to the embodiment, the black nickel-plated shell is adopted in the microphone packaging structure, so that the hardness is relatively high in quality, the wear resistance of the surface of a product can be improved in performance, the cost can be reduced structurally without attaching a dustproof net, the black light is not reflected in the light environment, the light noise is small, and the stability is good. The adopted infrared sensor not only can solve the problem of heat management requirement in equipment operation, but also can optimize system performance and durability while the appearance is continuously reduced.
The above description of the specific embodiments of the present invention has been given by way of example only, and the present invention is not limited to the above described specific embodiments. Any equivalent modifications and substitutions for this practical use will also occur to those skilled in the art, and are within the scope of the present invention. Accordingly, equivalent changes and modifications are intended to be included within the scope of the present invention without departing from the spirit and scope thereof.
Claims (4)
1. The microphone packaging structure comprises a circuit substrate, and is characterized in that at least one black nickel-plated cover body is arranged on the circuit substrate, a first cover body is buckled on the circuit substrate to form a first cavity, an acoustic sensor is arranged in the cavity, and an application specific integrated circuit chip is connected with the acoustic sensor through signals;
the circuit board also comprises a second cover body, wherein the second cover body is buckled on one side of the first cover body on the circuit board to form a second cavity, and an infrared emitter and an infrared receiver are arranged in the second cavity;
the infrared emitter and the infrared receiver are respectively connected with the special integrated circuit chip, a through hole for infrared emission and infrared reception is formed in the second cover body, the emission direction of the infrared emitter faces the through hole, and the receiving direction of the infrared receiver faces the through hole;
and the special integrated circuit chip determines time delay according to the time when the infrared transmitter transmits the test signal and the time when the infrared receiver receives the test signal, and obtains the approaching distance of an external object.
2. The microphone package of claim 1, wherein the first cover body is provided with an acoustic through hole, the circuit substrate is provided with a central base point P, the special integrated circuit chip is welded at a position 0.105mm above the central base point P, the circuit substrate is provided with an infrared emitter which is shifted to the right by 0.451mm and then shifted to the upper by 1.428mm, and the infrared receiver is arranged at a position 1.428mm below the central base point P, and the distance between the infrared emitter and the infrared receiver is 0.451mm.
3. The microphone package of claim 1 wherein the asic chip has a line input pin and a bias current pin each connected to the acoustic sensor, the circuit substrate has a supply voltage pin connected to the asic chip, the circuit substrate has a ground pin connected to the asic chip, and the circuit substrate has a line output pin connected to a data transmission pin on the asic chip for transmitting the electrical signal converted by the acoustic sensor.
4. The microphone package of claim 1, wherein the asic die is soldered to the circuit substrate and connected to the acoustic sensor and the circuit substrate by wires, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910041597.7A CN109769184B (en) | 2019-01-16 | 2019-01-16 | Packaging structure of microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910041597.7A CN109769184B (en) | 2019-01-16 | 2019-01-16 | Packaging structure of microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109769184A CN109769184A (en) | 2019-05-17 |
| CN109769184B true CN109769184B (en) | 2024-04-02 |
Family
ID=66452265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910041597.7A Active CN109769184B (en) | 2019-01-16 | 2019-01-16 | Packaging structure of microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109769184B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101129087A (en) * | 2005-09-14 | 2008-02-20 | 宝星电子株式会社 | Condenser microphone and pakaging method for the same |
| JP2010021225A (en) * | 2008-07-09 | 2010-01-28 | Sharp Corp | Electronic component and fabrication process therefor, and electronic apparatus equipped with electronic component |
| CN101713688A (en) * | 2009-12-11 | 2010-05-26 | 中国电子科技集团公司第十三研究所 | MEMS non-refrigerated two-band infrared detector and preparation method thereof |
| CN103533493A (en) * | 2010-09-03 | 2014-01-22 | 歌尔声学股份有限公司 | Silicon microphone, and packaging structure of application product |
| CN206658276U (en) * | 2017-04-24 | 2017-11-21 | 歌尔股份有限公司 | Microphone |
| CN207269268U (en) * | 2017-09-05 | 2018-04-24 | 深圳市艾辰电子有限公司 | A kind of silicon microphone of high SNR |
| CN208063457U (en) * | 2017-01-30 | 2018-11-06 | 苹果公司 | MEMS (MEMS) energy converter and MEMS (MEMS) microphone assembly |
| CN108807286A (en) * | 2018-07-06 | 2018-11-13 | 武汉耐普登科技有限公司 | sensor LGA package structure |
| CN109032433A (en) * | 2018-08-21 | 2018-12-18 | Oppo广东移动通信有限公司 | proximity sensor and electronic device |
| CN209949422U (en) * | 2019-01-16 | 2020-01-14 | 钰太芯微电子科技（上海）有限公司 | Packaging structure of microphone |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005053765B4 (en) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS package and method of manufacture |
| JP2009246116A (en) * | 2008-03-31 | 2009-10-22 | Yamaha Corp | Lead frame, package body, package, semiconductor device, and microphone package |
| EP2252077B1 (en) * | 2009-05-11 | 2012-07-11 | STMicroelectronics Srl | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof |
| US8695402B2 (en) * | 2010-06-03 | 2014-04-15 | Honeywell International Inc. | Integrated IR source and acoustic detector for photoacoustic gas sensor |
| US9809448B2 (en) * | 2013-03-13 | 2017-11-07 | Invensense, Inc. | Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same |
| US20160150327A1 (en) * | 2014-11-25 | 2016-05-26 | Knowles Electronics, Llc | Photosensitive Microphone |
-
2019
- 2019-01-16 CN CN201910041597.7A patent/CN109769184B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101129087A (en) * | 2005-09-14 | 2008-02-20 | 宝星电子株式会社 | Condenser microphone and pakaging method for the same |
| JP2010021225A (en) * | 2008-07-09 | 2010-01-28 | Sharp Corp | Electronic component and fabrication process therefor, and electronic apparatus equipped with electronic component |
| CN101713688A (en) * | 2009-12-11 | 2010-05-26 | 中国电子科技集团公司第十三研究所 | MEMS non-refrigerated two-band infrared detector and preparation method thereof |
| CN103533493A (en) * | 2010-09-03 | 2014-01-22 | 歌尔声学股份有限公司 | Silicon microphone, and packaging structure of application product |
| CN208063457U (en) * | 2017-01-30 | 2018-11-06 | 苹果公司 | MEMS (MEMS) energy converter and MEMS (MEMS) microphone assembly |
| CN206658276U (en) * | 2017-04-24 | 2017-11-21 | 歌尔股份有限公司 | Microphone |
| CN207269268U (en) * | 2017-09-05 | 2018-04-24 | 深圳市艾辰电子有限公司 | A kind of silicon microphone of high SNR |
| CN108807286A (en) * | 2018-07-06 | 2018-11-13 | 武汉耐普登科技有限公司 | sensor LGA package structure |
| CN109032433A (en) * | 2018-08-21 | 2018-12-18 | Oppo广东移动通信有限公司 | proximity sensor and electronic device |
| CN209949422U (en) * | 2019-01-16 | 2020-01-14 | 钰太芯微电子科技（上海）有限公司 | Packaging structure of microphone |
Non-Patent Citations (3)
| Title |
|---|
| Investigation on Performance and Vacuum Package of MEMS Infrared Focal Plane Arrays;Yi Ou;《IEEE Electron Device Letters》;第34卷(第3期);全文 * |
| MEMS芯片激光封装技术的研究;陈一梅;《万方数据库》;全文 * |
| 面向MEMS麦克风自动贴片的视觉系统研究;朱吉锋;《中国优秀硕士学位论文全文数据库 信息科技辑》;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109769184A (en) | 2019-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106657485B (en) | Mobile terminal | |
| US8379881B2 (en) | Silicon based capacitive microphone | |
| US7729500B2 (en) | Microphone array with electromagnetic interference shielding means | |
| CN109413554B (en) | Directional MEMS microphone | |
| CN114520947B (en) | Microphone assembly and electronic equipment | |
| US8411881B2 (en) | Electret capacitor microphone with one-piece vocal cavity component | |
| US20130070952A1 (en) | Speaker module and electronic apparatus thereof | |
| CN109218940B (en) | Terminal | |
| CN102387454A (en) | Silicon microphone and packaging structure of product applying same | |
| CN109769184B (en) | Packaging structure of microphone | |
| US20210235195A1 (en) | Vibration Diaphragm, Vibration Assembly, Sound Generator and Sound Generator Module | |
| CN105657618A (en) | Loudspeaker module shell and manufacturing method for same | |
| CN209949422U (en) | Packaging structure of microphone | |
| WO2021109248A1 (en) | Antenna impedance matching circuit, antenna system, printed circuit board and mobile terminal | |
| CN111935621B (en) | Microphone structure and electronic equipment | |
| CN101257736B (en) | Miniature capacitor type microphone | |
| CN107147976B (en) | Acoustic generator and electronic device comprising same | |
| US20200407215A1 (en) | Mems microphone and mobile terminal | |
| US20230054296A1 (en) | Combo antenna module and method for manufacturing same | |
| US20180255400A1 (en) | Miniature sounder | |
| CN105120408B (en) | Earphone | |
| CN111010467A (en) | Electronic device | |
| US10299046B2 (en) | MEMS microphone package | |
| US11910155B2 (en) | MEMS speaker | |
| CN218998278U (en) | Microphone structure and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |