CN109764981A - A kind of flexible force is thermally integrated sensor - Google Patents
A kind of flexible force is thermally integrated sensor Download PDFInfo
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- CN109764981A CN109764981A CN201811608998.8A CN201811608998A CN109764981A CN 109764981 A CN109764981 A CN 109764981A CN 201811608998 A CN201811608998 A CN 201811608998A CN 109764981 A CN109764981 A CN 109764981A
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Abstract
A kind of flexible force is thermally integrated sensor, and production method is the platinum electrode for first making interdigitated electrode structure on flexible substrates, then prepares the soft mold cavity plate with grid line structure；Piezoelectricity functional material is made again, by piezoelectricity functional material drop on soft mold cavity plate, carries out blade coating filling, forms the structure for being sufficient filling in grid line and not staying film outside grid line；Dehydrated alcohol is added dropwise in the flexible substrate with platinum electrode again, by the soft mold cavity plate pressing for having scratched piezoelectricity functional material in platinum electrode, is quickly placed into dry and be heated on platform, detach piezoelectricity functional material from soft mold cavity plate and be adhered on platinum electrode；Soft mold cavity plate is thrown off, platinum electrode-functional material laminated construction is formed；Packaging plastic is added dropwise on platinum electrode-functional material laminated construction, natural levelling all covers in laminated construction area, obtains flexible force after polarization and is thermally integrated sensor structure, can measure temperature and power, has the advantages that high sensitivity, at low cost, light-weight.
Description
Technical field
The invention belongs to technical field of micro-nano manufacture, and in particular to a kind of flexible force is thermally integrated sensor.
Background technique
With the development of science and technology with the higher requirement of product, vehicle appliance, aerospace, intelligence equipment etc. are led
Domain design is all more accurate, higher and higher to the portability of product, flexibility requirements, to many index real-time monitoring of product operation
Have become standard configuration.In numerous monitoring indexes, the measurement of power is very universal, usually have piezoelectric transducer, piezoresistive transducer,
Capacitance type sensor, electromagnetic sensor, the advantages such as wherein piezoelectric transducer is simple, small in size with its structure, sensitivity is high
With critical role.
In piezoelectric sensing material, PVDF is since its is light, and material is flexible, low-density, Low ESR and high pressure piezoelectric voltage constant
The advantages that be widely studied application.Trifluoro-ethylene (TrFE) is added in PVDF can improve the crystal structure of PVDF, improve poly-
The piezoelectric property of object film is closed, the application range of piezoelectric polymeric materials is further expanded.In manufacturing field, have to mechanical oscillation
Measurement and the active control detection of vibration, machine cut power and non-destructive testing application；In equipment field, have to underwater
The application of detection, acceleration analysis, intelligence wearing, robot technology etc.；In measuring of human health field, there is energy conversion, exhales
The monitoring of suction, heartbeat, motion state etc..
However, not considering influence of the temperature to piezoelectric material in the measurement application process of these power.P(VDF-
TrFE) material needs to make it have stronger ferroelectric properties by polarization, that is, possesses good piezoelectric property.Polarization process with
And in subsequent use process, temperature can all have certain influence to sensing material, and the piezoelectric efficiency of sensor can change with temperature,
So environment temperature can also interfere with the accuracy of sensor when sensor is worked.
Summary of the invention
In order to overcome the disadvantages of the above prior art, the purpose of the present invention is to provide a kind of flexible forces to be thermally integrated sensing
Device, flexible force is thermally integrated the complex function that sensor has measurement temperature and pressure, and its manufacture craft is simple, high sensitivity,
It is at low cost, it is light-weight, it can accomplish flexibility, the scope of application is more extensive.
To achieve the goals above, the present invention adopts the following technical scheme that:
A kind of flexible force is thermally integrated sensor, including flexible substrate 1, and production has the platinum electricity of interdigital structure in flexible substrate 1
Pole 4, production has piezoelectricity functional material 3 on platinum electrode 4, and platinum electrode 4,3 covering of piezoelectricity functional material are equipped with packaging plastic PDMS (184)
2。
A kind of production method that flexible force is thermally integrated sensor, comprising the following steps:
The first step selects flexible substrates Kapton as flexible substrate 1, aobvious by photoetching in flexible substrate 1
The platinum electrode 4 of the method production interdigitated electrode structure of shadow sputtering removing；
Flexible polymer material is had the soft mold of grid line structure by second step using silicon mould by the preparation of overmolded technique
Cavity plate 6；
Third step, the P (VDF-TrFE) for being configured as piezoelectric material P (VDF-TrFE) powder to have piezoelectricity function are molten
Liquid, as piezoelectricity functional material 3；
4th step carries out blade coating filling, shape by the drop of piezoelectricity functional material 3 on the soft mold cavity plate 6 of PDMS grid line structure
At the structure that film is sufficient filling with and do not stayed outside grid line in grid line；
Dehydrated alcohol 5 is added dropwise in the flexible substrate 1 with platinum electrode 4, will scratch piezoelectricity functional material 3 for 5th step
The pressing of soft mold cavity plate 6 in 4th area of platinum electrode, dehydrated alcohol 5 forms a floor liquid film in the area, be quickly placed into dry and be heated on platform,
When dehydrated alcohol 5 evaporates, it is adhered to piezoelectricity functional material 3 on platinum electrode 4 from detaching in soft mold cavity plate 6；It throws off soft
Female die of die 6 forms platinum electrode-functional material laminated construction；
Prepared packaging plastic PDMS (184) 2 is added dropwise on platinum electrode-functional material laminated construction 6th step, from
Right levelling packaging plastic PDMS (184) 2 all covers in laminated construction area；
7th step, by the 6th step, treated that structure is placed in 110 DEG C of incubators, and feedthrough connector part is to it with 20V/ μm
Size applies voltage, this process carries out one hour, that is, completes polarization, obtain flexible force and be thermally integrated sensor.
Piezoelectric material P (VDF-TrFE) powder is configured as the P (VDF- with piezoelectricity function in the third step
TrFE) solution, specifically: by P (VDF-TrFE) powder and dimethylformamide (DMF) solvent with 1.5:10 ratio in 60 DEG C of water
Lower magnetic agitation is bathed to being completely dissolved, standing and defoaming as has the function of piezoelectricity with P (VDF-TrFE) solution for being made 15%
P (VDF-TrFE) solution.
Flexible polymer material is dimethyl silicone polymer (PDMS) in the second step.
The invention has the benefit that
Flexible force of the present invention, which is thermally integrated sensor, to carry out temperature to pressure sensor by monitors temperature
Degree compensation, to improve the accuracy of pressure sensor, solves traditional sensors and has a single function, volume is big, and the scope of application has
The great number of issues such as limit.Meanwhile flexible force is thermally integrated that sensor structure is simple, and manufacture craft is simple, high sensitivity, measurement is convenient,
It can accomplish that the scope of application has been widened in flexibility, it can be in multiple monitoring occasions and integration of equipments, in aerospace, intelligence equipment etc.
Field has wide practical use.
Detailed description of the invention
Fig. 1 is the platinum electrode schematic diagram that sputtering forms interdigital structure on flexible substrates.
Fig. 2 is the schematic diagram that piezoelectricity functional material has been scratched on soft mold cavity plate.
Fig. 3 is the schematic diagram that piezoelectricity functional material is transferred using liquid bridge.
Fig. 4 is the schematic diagram for the platinum electrode-functional material laminated construction to be formed.
Fig. 5 is the top view of Fig. 4, and wherein platinum electrode is vertical with piezoelectricity functional material overlaps.
Fig. 6 is that the flexible force that present invention encapsulation polarization is completed is thermally integrated sensor structure schematic diagram.
Specific embodiment
Below in conjunction with attached drawing, the present invention will be described in detail.
A kind of flexible force is thermally integrated the manufacturing method of sensor, comprising the following steps:
The first step, sputtering method prepare platinum electrode 4: select flexible substrates Kapton as flexible substrate 1, it first will be soft
Property base polyimide film cut out to suitable size, cleaned up with deionized water, dry moisture, the spin coating on sol evenning machine
EPG535 photoresist, low speed 500rad/min, 9s, high speed 1500rad/min, 30s；Spin coating is put on 95 DEG C of baking platforms after completing
10min is set, photoresist is dried, carries out photoetching process after cooling；The flexible substrates Kapton that spin coating is completed carries out
8s is exposed, prepares 5 ‰ NaOH solutions as developer solution, developing time 20s forms the unglazed photoresist in structural area, non-structural district has
The film substrate of photoresist；The metal platinum that sputtering a layer thickness is 100 nanometers on a thin film substrate, the film that sputtering is completed is set
In alcoholic solution, 20min, ultrasonic 10min are impregnated, has the non-structural district metal platinum of photoresist to fall off, the metal platinum of structural area
The platinum electrode 4 to form interdigital structure is left, as shown in Figure 1；
Second step prepares the soft mold cavity plate 6 with grid line structure: selecting the silicon mould of suitable dimension, by PDMS ontology:
Curing agent is 10:1 mixing, and PDMS mixture is made, PDMS mixture is vacuumized 10min, is cast on silicon mould, takes out again
Vacuum 5min is placed on 60 DEG C of baking platforms, solidifies PDMS mixture, opens silicon mould after 1h, and being formed has grid line structure
Soft mold cavity plate 6；
Third step prepares piezoelectricity functional material 3: by P (VDF-TrFE) powder and dimethylformamide (DMF) solvent with
1.5:10 ratio magnetic agitation under 60 DEG C of water-baths can generate bubble, standing and defoaming is with i.e. system to being completely dissolved in whipping process
At 15% P (VDF-TrFE) solution, as piezoelectricity functional material 3；
4th step scratches piezoelectricity functional material 3: piezoelectricity functional material 3 is dripped the soft mold cavity plate 6 in PDMS grid line structure
On, blade coating filling is carried out, forms the structure for being sufficient filling in grid line and not staying film outside grid line, as shown in Figure 2；
5th step transfers piezoelectricity functional material 3: dehydrated alcohol 5 being added dropwise in the flexible substrate 1 with platinum electrode 4, will scrape
The pressing of soft mold cavity plate 6 of piezoelectricity functional material 3 is applied in 4th area of platinum electrode, dehydrated alcohol 5 forms a floor liquid film in the area, fastly
Speed is placed in dry and heat on platform, as shown in Figure 3；When dehydrated alcohol evaporates, liquid bridge power is greater than piezoelectricity functional material 3 and soft mold cavity plate
Adhesion strength between 6 is adhered to piezoelectricity functional material 3 on platinum electrode 4 from detaching in soft mold cavity plate 6；Throw off soft mode
Have cavity plate 6, form platinum electrode-functional material laminated construction, as shown in Figure 4, Figure 5, Fig. 5 is the top view of Fig. 4, be can be observed
The overlap joint vertical with piezoelectricity functional material 3 of platinum electrode 4；
6th step, device encapsulation: first preparing packaging plastic PDMS (184) 2, and by ontology: curing agent mixes for 10:1, vacuumizes
5min is added dropwise on platinum electrode-functional material laminated construction, natural levelling packaging plastic PDMS (184) 2, forms one layer
Film all covers in platinum electrode-functional material laminated construction area, as shown in fig. 6, encapsulation is on the one hand to protect lamination
Structure is not destroyed, and is prepared for polarization process, if not encapsulating, in polarization process piezoelectricity functional material 3 with
Air contact be easy it is breakdown, to lose good piezoelectric effect；
7th step, high-temperature poling: due to used piezoelectricity functional material 3 without polarization when do not have it is good
Piezoelectric effect, so need to carry out high-temperature poling to it just to have good using effect, by the 6th step, treated that structure is set
In 110 DEG C of incubators, feedthrough connector part applies voltage to it with 20V/ μm of size, this process is carried out one hour, that is, completed
Polarization, obtains flexible force and is thermally integrated sensor.
Referring to Fig. 6, a kind of flexible force is thermally integrated sensor, including flexible substrate 1, and production has interdigital knot in flexible substrate 1
The platinum electrode 4 of structure, production has piezoelectricity functional material 3 on platinum electrode 4, and platinum electrode 4,3 covering of piezoelectricity functional material are equipped with packaging plastic
PDMS(184)2。
The present invention carries out pressure sensor by increasing the method for temperature sensor on structuring piezoelectricity functional material
Temperature-compensating, meanwhile, flexible force is thermally integrated that sensor structure is simple, and manufacture craft is simple, high sensitivity, and measurement is convenient, can do
Widened the scope of application to flexibility, also widened temperature environment workable for sensor, can multiple monitoring occasions with set
It is standby integrated, have wide practical use in fields such as aerospace, intelligence equipments.
Claims (4)
1. a kind of flexible force is thermally integrated sensor, it is characterised in that: including flexible substrate (1), production has fork in flexible substrate (1)
Refer to the platinum electrode (4) of structure, making on platinum electrode (4) has piezoelectricity functional material (3), platinum electrode (4), piezoelectricity functional material (3)
Covering is equipped with packaging plastic PDMS184 (2).
2. the production method that a kind of flexible force is thermally integrated sensor, which comprises the following steps:
The first step selects flexible substrates Kapton as flexible substrate (1), aobvious by photoetching on flexible substrate (1)
The platinum electrode (4) of the method production interdigitated electrode structure of shadow sputtering removing；
Flexible polymer material is had the soft mold cavity plate of grid line structure by second step using silicon mould by the preparation of overmolded technique
(6)；
Piezoelectric material P (VDF-TrFE) powder is configured as P (VDF-TrFE) solution with piezoelectricity function by third step, is made
For piezoelectricity functional material (3)；
Piezoelectricity functional material (3) drop on the soft mold cavity plate (6) of PDMS grid line structure, is carried out blade coating filling, shape by the 4th step
At the structure that film is sufficient filling with and do not stayed outside grid line in grid line；
5th step is added dropwise dehydrated alcohol (5) in the flexible substrate (1) with platinum electrode (4), will scratch piezoelectricity functional material
(3) in platinum electrode (4) area, dehydrated alcohol (5) forms a floor liquid film in the area, is quickly placed into baking for soft mold cavity plate (6) pressing
It is heated on platform, when dehydrated alcohol (5) evaporates, detaches piezoelectricity functional material (3) from soft mold cavity plate (6) and be adhered to platinum
On electrode (4)；It throws off soft mold cavity plate (6), forms platinum electrode-functional material laminated construction；
Prepared packaging plastic PDMS184 (2) is added dropwise on platinum electrode-functional material laminated construction 6th step, flows naturally
Flat package glue PDMS184 (2) all covers in laminated construction area；
7th step, by the 6th step, treated that structure is placed in 110 DEG C of incubators, and feedthrough connector part is to it with 20V/ μm of size
Apply voltage, this process carries out one hour, that is, completes polarization, obtain flexible force and be thermally integrated sensor.
3. the production method that a kind of flexible force according to claim 2 is thermally integrated sensor, it is characterised in that: described
Piezoelectric material P (VDF-TrFE) powder is configured as P (VDF-TrFE) solution with piezoelectricity function in three steps, specifically:
By P (VDF-TrFE) powder and dimethylformamide (DMF) solvent with 1.5:10 ratio under 60 DEG C of water-baths magnetic agitation to complete
Fully dissolved, standing and defoaming are molten with P (VDF-TrFE) solution for being made 15%, the as P (VDF-TrFE) with piezoelectricity function
Liquid.
4. the production method that a kind of flexible force according to claim 2 is thermally integrated sensor, it is characterised in that: described
Flexible polymer material is dimethyl silicone polymer (PDMS) in two steps.
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| CN110323327A (en) * | 2019-06-28 | 2019-10-11 | 西安交通大学 | A kind of manufacturing method of the curved surface circuit of power/be thermally integrated perception |
| CN112928199A (en) * | 2021-01-29 | 2021-06-08 | 上海交通大学 | High-sensitivity flexible sensor and preparation method and application thereof |
| CN115452209A (en) * | 2022-07-25 | 2022-12-09 | 厦门大学 | Flexible multi-mode touch sensor based on asymmetric thermal rectification structure |
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