CN109757068A - A kind of electrographite radiator - Google Patents

Abstract

A kind of electrographite radiator of the present invention, it includes an ontology and an electrographite thin slice, the ontology has the semiconductor module that can generate thermal energy, it is uniformly distributed on the artificial graphite flake to have multiple mesh, and it is attached to the one side of the ontology, to conduct the thermal energy of ontology generation and dissipate outward；Space needed for cooling mechanism can be reduced by frivolous electrographite thin slice, and it is attached directly to the outer surface of heat source, with splendid gas permeability and thermal conductivity, form better heat dissipation effect.

Description

A kind of electrographite radiator

Technical field

The present invention relates to a kind of graphite radiating structures, particularly relate to one kind and are attached on the outside of heat source, have mesh and have good The electrographite radiator of good thermal diffusivity.

Background technique

Circuit board employed in electronic product (layer), generated thermal energy when in order to which running is in time discharged are kept good Usually with made by the good material of thermal conductivity, such as using graphite as heat sink material cooling fin is made, to expire in good Operating ettectiveness The demand of sufficient electronic product.And promoted with science and technology, various high powers, dynamical 3C electronic product also consequentiality, and While promoting efficiency, various hardware components are also higher and higher in the requirement of heat dissipation；For high power hardware components, transporting Higher temperature can be generated when making, the module of common heat sinking function or auxiliary heat dissipation has been increasingly difficult to meet the requirements, if dissipating Thermal effect can not cooperate the output of thermal energy, will greatly limit the efficiency and quality that hardware components can play.

Summary of the invention

To solve existing technical problem, the purpose of the present invention is to provide a kind of electrographite radiators.It should Radiator can be very good to increase heat dissipation area, simultaneously, also have both ventilative and heat dissipation by the excellent heat dissipation performance of graphite Property.

To achieve the goals above, electrographite radiator provided in an embodiment of the present invention, which is characterized in that it includes There are an ontology and an electrographite thin slice；Wherein, which has the semiconductor module that can generate thermal energy, the artificial graphite flake It is attached to the one side of the ontology, to conduct the thermal energy of ontology generation and dissipate outward；Also, on the artificial graphite flake It is uniformly distributed to have multiple mesh, the aperture of each mesh between 1~2mm, and the spacing of those mesh to each other between 6~ Between 10mm.

Preferably, wherein the artificial graphite flake is process by Kapton graphitization.

Preferably, wherein the ontology is Silicon Wafer, which is attached to the ontology via an adhesive layer.

Preferably, the ontology is soft board that is flexible and having Flexible Reset, at least one metal circuitry is included at least； The artificial graphite flake is attached to the ontology via an insulating layer, and the ontology is equipped with one in the side far from electrographite thin slice Additional layers.

Preferably, wherein the ontology contains at least two metal circuitry, and every two metallic circuit interlayer is equipped with one Conductor layer.

Preferably, wherein the artificial graphite flake is in the side far from the ontology equipped with an additional layers.

Preferably, wherein the ontology is hard plate body, a base and at least one metal circuitry are included at least；It should Electrographite thin slice is attached to the base via an adhesive-layer, and via an insulating layer to be attached to the base remote for the metal circuitry Side from electrographite thin slice；The ontology is equipped with a soldermask layer in the side far from electrographite thin slice.

Preferably, wherein the ontology contains at least two metal circuitry, and two metallic circuit interlayers are equipped with one Conductor layer.

Preferably, wherein the conductor layer can be glass resin or polyimides.

Preferably, wherein the insulating layer can be thermosetting resin material or macromolecule resin material.

Preferably, wherein the material of the metal circuitry is metallic copper.

Preferably, wherein the base can be metal material, and the adhesive-layer can be heat-conducting glue, thermosetting resin material Or macromolecule resin material.

The main purpose of this creation is attached directly to the surface of electronic product heat source using the graphite flake of tool mesh, simplifies and dissipates The required space of heat engine structure, and excellent heat sinking function is provided.By the good thermal conductivity of graphite and the mesh unit of distribution, Effectively increase thermal diffusion area, ventilative and thermal diffusivity, better heat dissipation effect directly can be formed to heat source.

For up to above-mentioned effect, the electrographite radiator of this creation, the technological means mainly carried out includes an ontology An and electrographite thin slice；Wherein, which has the semiconductor module that can generate thermal energy, which is attached to this The one side of ontology, to conduct the thermal energy of ontology generation and dissipate outward；Also, uniformly distributed on the artificial graphite flake have Multiple mesh, the aperture of each mesh is between 1~2mm, and the spacing of those mesh to each other is between 6~10mm. The thickness of electrographite thin slice is preferred with person between 10~200 μm.

Preferably, the artificial graphite flake are process by Kapton graphitization.

Preferably, the ontology are Silicon Wafer, which is attached to the ontology via an adhesive layer.

Preferably, the ontology are soft board that is flexible and having Flexible Reset, include at least at least one metal circuitry；It should Electrographite thin slice is attached to the ontology via an insulating layer, and the ontology is attached equipped with one in the side far from electrographite thin slice Blooming layer.

Preferably, which includes at least two metal circuitries, and every two metallic circuits interlayer is equipped with a conductor layer.

Preferably, the artificial graphite flake further can be equipped with an additional layers in the side far from the ontology.

Preferably, the ontology are hard plate body, include at least a base and at least one metal circuitry；The artificial stone Black thin slice is attached to the base via an adhesive-layer, and the metal circuitry is attached to the base far from artificial via an insulating layer The side of graphite flake；Also, the ontology is equipped with a soldermask layer in the side far from electrographite thin slice.

Preferably, which includes at least two metal circuitries, and every two metallic circuits interlayer is equipped with a conductor layer.

Preferably, the conductor layer can be glass resin or polyimides.

Preferably, the insulating layer can be thermosetting resin material or macromolecule resin material.

Preferably, the material of the metal circuitry are metallic copper.

Preferably, the base can be made of the good metal material of thermal conductivity, such as metallic aluminium；And the adhesive-layer can be Heat-conducting glue, thermosetting resin material or macromolecule resin material.

Whereby, using the artificial graphite heat radiator of this creation, the electronics of various different frameworks or demand can be fully adapted to Product heat source, and have the characteristics that following: 1. possess high thermal conductivity number, and the thermally conductive number of horizontal direction is high, and heat property is good, helps raising pair The thermal diffusivity of heat source ontology；2. thermal expansion coefficients are low, process is stablized, and yield is high；3. heat transfer efficiency is better than aluminium or copper, and heat Resistance is lower than aluminium or copper；4. reducing small product size by enhancing efficiency, the cost of hardware design and assembling is effectively reduced；5. through high The thermally conductive and heat dissipation of efficiency, improves the service life of product and the stability used.

Compared with the prior art, electrographite radiator provided in an embodiment of the present invention can be fully adapted to various differences The electronic product heat source of framework or demand, and have the characteristics that following: 1. possess high thermal conductivity number, and the thermally conductive number of horizontal direction is high, heat Equal property is good, helps to improve the thermal diffusivity to heat source ontology；2. thermal expansion coefficients are low, process is stablized, and yield is high；3. heat transfer Efficiency is better than aluminium or copper, and thermal resistance is lower than aluminium or copper；4. reducing small product size by enhancing efficiency, hardware design is effectively reduced With the cost of assembling；5. improving the service life of product and the stability used through efficient thermally conductive and heat dissipation.

Detailed description of the invention

Fig. 1 is the structural schematic diagram for inventing artificial graphite heat radiator.

Fig. 2 is the structural schematic diagram for constituting the electrographite thin slice of the artificial graphite heat radiator of the present invention.

Fig. 3 and Fig. 4 is the other embodiments knot for constituting the electrographite thin slice of the artificial graphite heat radiator of the present invention Structure schematic diagram.

Fig. 5 is the structural schematic diagram of one embodiment of electrographite radiator of the invention.

Fig. 6 to Fig. 9 is the structural schematic diagram of another embodiment of the present invention.

Figure 10 to Figure 11 is the structural schematic diagram of yet another embodiment of the invention.

[main appended drawing reference]

10 ... ontologies

11 ... Silicon Wafers

12 ... metal circuitries

13 ... conductor layers

14 ... bases

15 ... insulating layers

20 ... electrographite thin slices

21 ... mesh

D ... spacing

22 ... adhesive layers

23 ... insulating layers

24 ... adhesive-layers

30 ... additional layers

40 ... soldermask layers

Specific embodiment

Technical solution of the present invention is further described in detail below in conjunction with attached drawing.

As shown in Figure 1, electrographite radiator basic device of the invention includes an ontology 10 and an electrographite Thin slice 20；Ontology 10 is the heat source of electronic product, at least has the semiconductor module that can generate thermal energy, usually metallic conduction The circuit layer or wafer of material；The processed side surface for being attached to ontology 10 of electrographite thin slice 20, using high-termal conductivity, when When ontology 10 generates thermal energy, it can rapidly conduct thermal energy and discharge, achieve the purpose that heat dissipation.

As shown in Fig. 2, the main material of electrographite thin slice 20 is Kapton, it is sintered by graphitizable high temperature It forms, thickness is about between 10~200 μm.The mesh of multiple proper alignments and perforation is laid on electrographite thin slice 20 21, the aperture of each mesh 21 is between 1~2mm, and those space Ds of mesh 21 to each other are between 6~10mm.

The operation that provides of the production and processing of electrographite thin slice 20, mesh 21 can be before graphitization sintering or remaining graphite Change sintering to carry out；If carrying out perforation operation before sintering, sintered mesh 21, with 5~15% shrinkage ratio；And if in Perforation operation is carried out after sintering again, the integrality of mesh 21 can be kept.

As shown in Figure 3 to Figure 4, respectively other feasible mesh 21 of electrographite thin slice 20 lay kenel.Such as Fig. 2 institute Show, the mesh 21 that electrographite thin slice 20 is laid is in matrix-style proper alignment, and mesh shown in Fig. 3 21 is then with oblique Mode arranges, specifically can cloth sets out suitable 21 kenel of mesh when perforation operation on demand.Furthermore mesh 21 is than a circular one, The polygonal mesh 21 that diameter (outer) in the circle of 1~2mm is cut can be used, as shown in figure 4, the artificial graphite flake 20 Mesh 21 is the hexagon of garden inscribe.

As shown in figure 5, being the diagrammatic cross-section of one embodiment of the invention；Ontology 10 disclosed in this embodiment is half Electrographite thin slice 20 with mesh 21 is attached to this via an adhesive layer 22 when processing by the Silicon Wafer 11 of conductor material On body 10,22 material of adhesive layer can be thermosetting resin or macromolecule resin with thermal conductive resin.People is used with this The minimum design of 20 thickness of work graphite flake, volume needed for can significantly reducing setting radiator, and have using mesh 21 Effect ground increases gas permeability and thermal diffusion area, can form better heat dissipation effect to Silicon Wafer 11.

It as shown in Figures 6 to 9, is the cross section view of the feasible embodiment of another embodiment of invention；This embodiment Disclosed ontology 10, including at least there is at least one metal circuitry 12, usually with the metallic circuit of conductor, and ontology 10 whole design is at soft board device flexible and with Flexible Reset.

In specific embodiment disclosed in Fig. 6, ontology 10 is the metal circuitry 12 of single layer, and when processing will have net The electrographite thin slice 20 in hole 21 is attached to the side of metal circuitry 12 via an insulating layer 23, and ontology 10 is then in metal Circuit layer 12 is provided with an additional layers 30 far from the side of electrographite thin slice 20；Wherein, the material of metal circuitry 12 can For metallic copper, 23 material of insulating layer can be thermosetting resin or macromolecule resin with thermal conductive resin.It is used with this The minimum design of 20 thickness of electrographite thin slice, volume needed for can significantly reducing setting radiator, and utilize mesh 21 Effectively increase gas permeability and thermal diffusion area, can the metal circuitry 12 to soft board kenel form better heat dissipation effect.

In specific embodiment disclosed in Fig. 8, ontology 10 is the metal circuitry 12 of multilayer, and the present embodiment is shown Double-level-metal circuit layer 12 is equipped with a conductor layer 13 between every two metal circuitry 12；It will be with the artificial of mesh 21 when processing Graphite flake 20 is attached to the side of a wherein metal circuitry 12 via an insulating layer 23, and ontology 10 is then in far from artificial stone Tossing about for the metal circuitry 12 of black thin slice 20 is provided with an additional layers 30；Wherein, the material of metal circuitry 12 can be gold Belong to copper, 23 material of insulating layer can be thermosetting resin or macromolecule resin with thermal conductive resin, the material of conductor layer 13 Matter can be macromolecule material or polyimides.With this design minimum using 20 thickness of electrographite thin slice, can significantly reduce Volume needed for radiator is set, and effectively increase gas permeability and thermal diffusion area using mesh 21, it can be to soft board kenel Metal circuitry 12 form better heat dissipation effect.

Furthermore in feasible embodiment, the either soft board kenel of single-layer or multi-layer can be according to plate body device or circuit The demand of design is further equipped with an additional layers 30 far from the side of ontology 10 in electrographite thin slice 20, and two sides are all covered The additional layers 30 of tool insulation effect are stamped, the function of forming insulation with external environment is reached.

The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the scope of the present invention.It is all Within the spirit and principles in the present invention, made any modification, equivalent replacement and improvement etc. should be included in guarantor of the invention Within the scope of shield.

Claims (10)

1. a kind of electrographite radiator, which is characterized in that it includes an ontology and an electrographite thin slice；Wherein, should Ontology has the semiconductor module that can generate thermal energy, which is attached to the one side of the ontology, to conduct this The thermal energy of ontology generation simultaneously dissipates outward；Also, uniformly distributed on the artificial graphite flake to have multiple mesh, the hole of each mesh Diameter is between 1~2mm, and the spacing of those mesh to each other is between 6~10mm；Wherein the ontology is flexible and has The soft board of Flexible Reset includes at least at least one metal circuitry；The artificial graphite flake is attached to this via an insulating layer Ontology, and the ontology is equipped with an additional layers in the side far from electrographite thin slice.

2. electrographite radiator as described in claim 1, which is characterized in that wherein the ontology is Silicon Wafer, this is artificial Graphite flake is attached to the ontology via an adhesive layer.

3. electrographite radiator as described in claim 1, which is characterized in that wherein the ontology contains at least two metal Circuit layer, and every two metallic circuit interlayer is equipped with a conductor layer.

4. electrographite radiator as described in claim 1, which is characterized in that wherein the artificial graphite flake is somebody's turn to do in separate The side of ontology is equipped with an additional layers.

5. electrographite radiator as claimed in claim 2, which is characterized in that wherein the ontology is hard plate body, at least Include a base and at least one metal circuitry；The artificial graphite flake is attached to the base via an adhesive-layer, and should Metal circuitry is attached to side of the base far from electrographite thin slice via an insulating layer；The ontology is in far from electrographite The side of thin slice is equipped with a soldermask layer.

6. electrographite radiator as claimed in claim 5, which is characterized in that wherein the ontology contains at least two metal Circuit layer, and two metallic circuit interlayers are equipped with a conductor layer.

7. electrographite radiator as claimed in claim 5, which is characterized in that wherein the conductor layer can for glass resin or Polyimides.

8. electrographite radiator as claimed in claim 5, which is characterized in that wherein the insulating layer can be thermosetting tree Rouge material or macromolecule resin material.

9. electrographite radiator as claimed in claim 5, which is characterized in that wherein the material of the metal circuitry is gold Belong to copper.

10. electrographite radiator as claimed in claim 7, which is characterized in that wherein the base can be metal material, and The adhesive-layer can be heat-conducting glue, thermosetting resin material or macromolecule resin material.