CN109749700A - The adhesive bonding method of substrate - Google Patents
The adhesive bonding method of substrate Download PDFInfo
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- CN109749700A CN109749700A CN201811312052.7A CN201811312052A CN109749700A CN 109749700 A CN109749700 A CN 109749700A CN 201811312052 A CN201811312052 A CN 201811312052A CN 109749700 A CN109749700 A CN 109749700A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The present invention provides the adhesive bonding method of a kind of thickness of controllable adhesive layer, substrate that is adjustable or repairing bonding position.This method is using ultraviolet hardening liquid silicone rubber adhesive by the method for opposite a pair of of first substrate and the second substrate bonding comprising: by described adhesive coating process on the first substrate, to described adhesive irradiation ultraviolet light to make the process of described adhesive semi-solid preparation, the process for making the bonding process of the second substrate stacking and irradiation ultraviolet light make described adhesive formal solidification via the adhesive layer after semi-solid preparation.
Description
Technical field
The present invention relates to the adhesive bonding method of substrate, more particularly to having used ultraviolet hardening liquid silicone rubber adhesive
Multilager base plate adhesive bonding method.
Background technique
As to the substrates such as Liquid Crystal Module (LCM) or flexible printed circuit board (FPC), sticking touch control panel, cover-plate glass,
Substrate that overlay film, FPD etc. are another and used adhesive when image display device is made, using have acrylic resin,
The adhesive of epoxylite and silicone.Be bonded by the adhesive using such curing type, can tight,
Improve the reflection of display identity and durability, inhibition sunlight etc..Currently, in these laminated materials using have acrylic compounds or
The resin of epoxies, but in recent years, especially optical high transparency and light resistance, excellent heat resistance and be low elasticity mould
The silicone rubber adhesive of amount attracts attention (patent document 1,2).
As image display device is transferred to from the display device of miniature dimensions the display device of big size, as will be hot
The adhesive of the different material fitting of expansion rate, has studied the silicone rubber adhesive of more low elastic modulus, also, aobvious for image
The composition of showing device, being investigated also to thicken as the adhesive of laminated material, and it is mutual that adaptation can follow different substrate
The structure of thermal change.However, in order to use the silicone rubber adhesive of heat-curing type or ultraviolet hardening and obtain regulation thickness
The adhesive phase of degree, takes following methods: the adhesive by will be called box dam glue is coated on the adhesion area of first substrate
Periphery, further to its inside filling adhesive after, the second substrate is bonded, carry out heating or ultraviolet light irradiation, thus make
It solidifies, bonds.However, box dam glue is indispensable in the process, also, due to before being heated or before irradiation ultraviolet light
For liquid, therefore exist and be not easy after adjusting bonding position and being bonded the second substrate, can not be carried out due to bonding securely
The technical issues of reparation.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-005354 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2014-169412 bulletin
Summary of the invention
The technical problem to be solved in the present invention
The present invention completes in view of the foregoing, its purpose is to provide a kind of thickness of controllable adhesive layer, can adjust
Or repair the adhesive bonding method of the substrate of bonding position.
Solve the technological means of technical problem
In order to reach above-mentioned technical problem, the present invention provides a kind of adhesive bonding method, to use ultraviolet hardening liquid
The method that silicone rubber adhesive bonds opposite a pair of of first substrate and the second substrate comprising: described adhesive is coated with
Process on the first substrate, to described adhesive irradiation ultraviolet light to make the process of described adhesive semi-solid preparation, be situated between
The bonding process of the second substrate stacking and irradiation ultraviolet light is set to keep described adhesive formal by the adhesive layer after semi-solid preparation
Cured process.
If such method, then it can control the thickness of adhesive layer, can adjust or repair bonding position.
Furthermore it is preferred that: use following (B) for containing 0.01~10 mass parts relative to following (A) ingredients of 100 mass parts
Ultraviolet hardening liquid organopolysiloxane composition made of ingredient, it is viscous as the ultraviolet hardening liquid silicon rubber
Mixture.
(A) ingredient: the structure indicated in molecule at least two general formulas (1), and relative to whole siloxane units, have
Machine polysiloxane unit does not have SiO4/2And SiO3/2Unit and only by SiO2/2、SiO1/2The organic of the straight-chain that unit is constituted gathers
Siloxanes, (B) ingredient: Photoepolymerizationinitiater initiater.
[chemical formula 1]
In formula, m 0, an integer of 1 or 2, R1For hydrogen atom, phenyl or halogenophenyl, R2For hydrogen atom or methyl, R3It is one
The substituted or non-substituted alkyl that the carbon atom number that may be the same or different of valence is 1~10, Z1For-R4-、-R4O- or-R4
(CH3)2SiO- (wherein, R4The substituted or non-substituted alkyl that the carbon atom number that may be the same or different for divalent is 1~10) table
The bivalent group shown, Z2For oxygen atom or divalent can same or different carbon atom number be 1~10 it is substituted or non-substituted
Alkyl.
If such composition, then ultraviolet hardening liquid silicone rubber adhesive is suitable as.
It is preferred that: use further (C) ingredient containing 1~100 mass parts relative to (A) ingredient described in 100 mass parts
Made of ultraviolet hardening liquid organopolysiloxane composition, as the ultraviolet hardening liquid silicon rubber bond
Agent,
(C) ingredient:, which having the structure of at least one general formula (2) expression, to be averaged in molecule and relative to whole siloxane units
SiO with 1~50mol%4/2And/or SiO3/2The organopolysiloxane of the branched of unit.
[chemical formula 2]
In formula, m ' is 0, an integer of 1 or 2, R1’For hydrogen atom, phenyl or halogenophenyl, R2’For hydrogen atom or methyl, R3’
The substituted or non-substituted alkyl that the carbon atom number that may be the same or different for monovalence is 1~10, Z1’For-R4’-、-R4’O- or-
R4’(CH3)2SiO- (wherein, R4’The substituted or non-substituted hydrocarbon that the carbon atom number that may be the same or different for divalent is 1~10
Base) indicate bivalent group, Z2’For oxygen atom or divalent can the same or different carbon atom number substitution that is 1~10 or non-
Substituted alkyl.
If the adhesive comprising such (C) ingredient, then the mechanical strength after solidifying is good.
Invention effect
As previously discussed, ultraviolet hardening liquid silicone rubber adhesive used in the present invention can without using priming paint or
Solvent, heat and by suitable light irradiation fit in adherend.At this point, the semi-solid preparation of the adhesive as used in the present invention
Control is easy, therefore for this technical problem of the control of the thickness of adhesive layer, can also be by the way that adhesive is coated on the first base
Ultraviolet light is irradiated after plate immediately, so that it is guaranteed that certain thickness adhesive layer, at this point, due to the shape for the semi-solid preparation with adherence
State, therefore the adjustment of bonding position or repair this technical problem and be possibly realized.Also, ultraviolet curing used in the present invention
The second substrate can be bonded, and irradiate again ultraviolet by type silicone rubber adhesive by with the state for the semi-solid preparation that there is adhesion to feel
Line, to fully bond.
Detailed description of the invention
Fig. 1 is the schematic diagram of the planar stretch adhesion test in the embodiment of the present invention.
Description of symbols
1: glass plate (first substrate)；2: glass plate (the second substrate)；3: adhesive layer.
Specific embodiment
As described above, seeking the adhesive bonding method of the thickness of controllable adhesive layer, substrate that is adjustable or repairing bonding position
Exploitation.
Further investigation has been repeated to above-mentioned technical problem in present inventor, as a result, it has been found that, by making adhesive layer
To have the state of the semi-solid preparation of adhesion sense to be bonded substrate, the thickness of adhesive layer can control, can adjust or repair fitting position
It sets, so as to complete the present invention.
That is, the present invention is a kind of adhesive bonding method, being will be opposite using ultraviolet hardening liquid silicone rubber adhesive
The method of a pair of of first substrate and the second substrate bonding comprising: described adhesive is coated with shape on the first substrate
At the process of adhesive layer, ultraviolet light is irradiated to the adhesive layer to make the process of the adhesive layer semi-solid preparation, via semi-solid preparation
The bonding process that the second substrate is laminated and irradiation ultraviolet light are made the adhesive layer formal solidification by the adhesive layer afterwards
Process.
Hereinafter, the present invention is described in detail, but the present invention is not limited to this.
< adhesive bonding method >
The present invention is the adhesive bonding method for including following process: ultraviolet hardening liquid silicone rubber adhesive is coated on
The work for forming the process of adhesive layer on one substrate, making the adhesive layer semi-solid preparation to adhesive layer irradiation ultraviolet light
The bonding process and irradiation ultraviolet light that the second substrate is laminated are made the bonding via the adhesive layer after semi-solid preparation by sequence
The process of layer formal solidification.
The present invention is suitable as following adhesive bonding methods: having used to liquid crystal display (LCD), organic el display
(OLED), the flat-panel monitors such as plasma display (PDP), flexible display (FPD) or the board-like FPD of touch surface, 3D display
Substrates, the sticking touch control panels such as the Liquid Crystal Module (LCM) of device, e-book etc., flexible printed circuit board (FPC), cover cover-plate glass
The bonding side of the multilager base plate of used ultraviolet hardening liquid silicone rubber adhesive when the substrate that film, FPD etc. are another
Method.
In addition, adhesive bonding method of the invention can be suitable for the manufacture of image display device, particularly preferable as between liquid
The adhesive bonding method of ultraviolet hardening liquid silicone rubber adhesive between crystal module and cover-plate glass or overlay film.
[coating adhesive and the process for forming adhesive layer]
In adhesive bonding method of the invention, ultraviolet hardening liquid silicone rubber adhesive described below is coated on first
Adhesive layer is formed on substrate.
Equably coating adhesive is applied, net the process about coating method by spraying, flow coat, curtain on the first substrate
Adhesive is coated into preferably 10~3000 microns, is more preferably by painting (screen coating), injection and their combination
50~1000 microns, particularly preferably 100~800 microns of thickness forms adhesive layer.If 10 microns or more of thickness, then
It is capable of the bumps on more reliably absorptive substrate surface, in addition, if 3000 microns of thickness below, then it can be by ultraviolet curing
The relevant cost of type silicone rubber adhesive is suppressed to lower, good economy performance.
As first substrate, can enumerate Liquid Crystal Module, flexible printed circuit board, touch panel, cover-plate glass, overlay film,
Flat-panel monitor etc..
(ultraviolet hardening liquid silicone rubber adhesive)
In adhesive bonding method of the invention, ultraviolet hardening liquid silicone rubber adhesive is used.Purple used in the present invention
Outside line curable liquid silicone rubber adhesive is excellent in solvent-free lower coating, and the control of the semi-solid preparation after irradiating ultraviolet light is held
Easily, the bonding force after formal solidification is excellent.
Ultraviolet hardening liquid silicone rubber adhesive used in the present invention, it is preferable to use containing it is described below at
The ultraviolet hardening polysiloxane composition divided.In addition, in the following description, the weight average molecular weight of polystyrene conversion is
The value measured using gel permeation chromatography.
(A) ingredient-
As (A) ingredient, the structure indicated in molecule at least two general formulas (1) can be used, and relative to whole
Siloxane unit, organopolysiloxane unit do not have SiO4/2And SiO3/2Unit and only by SiO2/2、SiO1/2What unit was constituted
The organopolysiloxane of straight-chain.
[chemical formula 3]
In formula, m 0, an integer of 1 or 2, R1For hydrogen atom, phenyl or halogenophenyl, R2For hydrogen atom or methyl, R3It is one
The substituted or non-substituted alkyl that the carbon atom number that may be the same or different of valence is 1~10, Z1For-R4-、-R4O- or-R4
(CH3)2SiO- (wherein, R4The substituted or non-substituted alkyl that the carbon atom number that may be the same or different for divalent is 1~10) table
The bivalent group shown, Z2For oxygen atom or divalent can same or different carbon atom number be 1~10 it is substituted or non-substituted
Alkyl.
In general formula (1), as R3The substitution or non-take that the carbon atom number that may be the same or different of the monovalence of expression is 1~10
The alkyl in generation can usually enumerate the substituted or non-substituted alkyl that carbon atom number is 1~10, and carbon atom number, which is preferably listed out, is
1~8 or so substituted or non-substituted alkyl, specifically, methyl, ethyl, propyl, isopropyl, butyl, isobutyl can be enumerated
The alkyl such as base, tert-butyl, amyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl, decyl；Phenyl, tolyl, xylyl,
The aryl such as naphthalene；The aralkyl such as benzyl, phenethyl, phenylpropyl；Vinyl, allyl, acrylic, isopropenyl, cyclobutenyl, oneself
The alkyl of the alkenyls such as alkenyl, cyclohexenyl group, octenyl etc.；Part or all of the hydrogen atom of these alkyl is by fluorine, bromine, chlorine etc.
Halogen atom, cyano etc. replace made of substituted hydrocarbon radical, the halogenated alkyl such as chloromethyl, chloropropyl, bromoethyl, three chloropropyls,
Cyano ethyl etc., and also contain ehter bond (ethereal oxygen original comprising a part in these substituted or non-substituted alkyl in hydrocarbon chain
Son), the group of amido bond etc..
As R4Or Z2The example for the substituted or non-substituted alkyl that the carbon atom number of the divalent of expression is 1~10, can enumerate
Alkylidenes such as methylene, ethylidene, trimethylene etc. out, the hydrogen atom of these alkyl part or all can by fluorine, bromine,
The halogen atoms such as chlorine, cyano etc. replace, and also comprising the group containing ehter bond, amido bond etc. in their hydrocarbon chain.
In above-mentioned general formula (1), Z1For-R4When the bivalent group indicated, Z2Preferably oxygen atom, Z1For-R4O- or-R4
(CH3)2When the bivalent group that SiO- is indicated, Z2Preferably the carbon atom number that may be the same or different of divalent be 1~10 substitution or
Non-substituted alkyl.
In a preferred embodiment, structure that the structure that above-mentioned general formula (1) indicates is indicated as the following general formula (3)
And exist.
[chemical formula 4]
In formula, m, R1、R2、R3And R4As shown in the above-mentioned definition about general formula (1).As the concrete example of the general formula (3),
It can enumerate with flowering structure.
[chemical formula 5]
The organopolysiloxane of (A) ingredient out illustrated below.As (A) ingredient, a kind of can also combine that can be used alone makes
With these two or more organopolysiloxanes.
[chemical formula 6]
In formula, the arrangement of each siloxane unit with parantheses can be random, or block.
As the viscosity of (A) ingredient, the viscosity at 25 DEG C with 100~200,000mPas is suitably, preferably
Range is 500~50,000mPas, and preferred range is 1,000~5,000mPas.(A) viscosity of ingredient is greater than
When 100mPas, solidfied material will not be really up to the mark obtained from ultraviolet light irradiates adhesive used in the present invention, can be suitble to
As device used for image display, when the viscosity of (A) ingredient is less than 200,000mPas, workability is not poor.
(B) ingredient-
As the Photoepolymerizationinitiater initiater of (B) ingredient, can arbitrarily make used as in the photocuring that acrylic functional is rolled into a ball
Photoepolymerizationinitiater initiater and well known Photoepolymerizationinitiater initiater.For example, for benzoin and replacing benzoin (for example, Arrcostab takes
For benzoin), rice Chi (Michler ' s) ketone, such as 2,2- diethoxy acetophenone (" DEAP ") Dialkoxy acetophenones, hexichol
Ketone and substituted benzophenone, acetophenone and substituted acetophenone, Oxoxanthone and substitution Oxoxanthone, 2,2- acylphosphine oxide etc..
As the concrete example of ideal Photoepolymerizationinitiater initiater, there are diethoxy acetophenone, benzoin methylether, benzoin ethyl ether, benzoin
Isopropyl ether, diethoxy Oxoxanthone, the thio xanthones of chlorine, azodiisobutyronitrile, N methyldiethanol amine benzophenone, phenyl
Bis- (2,4,6- trimethylbenzoyl) phosphine oxides and their mixture.Visible light initiator can also be used, as its example,
There are camphorquinone peroxy esters (camphorquinone peroxy ester) initiator and non-fluorene carboxylic acid peroxy esters (non
fluorene carboxylic acid peroxy ester).Especially desirable Photoepolymerizationinitiater initiater is DEAP in the present invention.
Photoepolymerizationinitiater initiater can also be obtained from commercially available, such as can be by old チ バ ス ペ シ ャ Le テ ィ ー ケ ミ カ
Le ズ company is obtained with product name IRGACURE and DAROCURE.Specifically, for example there is (the 1- hydroxyl of IRGACURE 184
Cyclohexyl-phenyl ketone), IRGACURE 907 (2- methyl-1-[4- (methyl mercapto) phenyl]-2- morpholine-1- acetone), IRGACURE
369 (2- benzyl -2-N, N- dimethylamino -1- (4- morpholinyl phenyl) -1- butanone), (the 1- hydroxy-cyclohexyl of IRGACURE 500
The combination of phenyl ketone and benzophenone), IRGACURE651 (2,2- dimethoxy -2- phenyl acetophenone), IRGACURE 1700
(bis- (2,6- Dimethoxybenzoyl -2,4,4- trimethylphenyl) phosphine oxides and 2- hydroxy-2-methyl -1- phenyl -1- acetone
Combination), IRGACURE 819 [bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl], (the 2- hydroxyl of DAROCURE 1173
Base-2- methyl-1-phenyl-1- propane) and 4265 (2,4,6- trimethyl benzoyl diphenyl base-phosphine oxide and 2- hydroxyl-2-
The combination of methyl-1-phenyl-1- acetone), as visible light (blue) Photoepolymerizationinitiater initiater, there are dl-camphorium and IRGACURE
784 (bis- (η5- 2,4- cyclopentadiene -1- base)-bis- [the fluoro- 3- of 2,6- bis- (1H- pyrroles -1- base) phenyl] titaniums).
Relative to (A) ingredient of 100 mass parts, the blended amount of the Photoepolymerizationinitiater initiater as (B) ingredient is usually 0.01
~10 mass parts, from the desired reactivity of the present invention and deep curability aspect, particularly preferably 0.1~5 mass
Part.
(B) ingredient can be used alone can also be applied in combination it is two or more.Photoepolymerizationinitiater initiater may be to make
Polymer obtained from initiator is reacted with each other and combined.Such Photoepolymerizationinitiater initiater is recorded in U.S. Patent No. 4,477,
No. 326 and No. 4,587,276.
As other radical initiators of peroxide initiator can also use simultaneously with (B) ingredient.Relative to 100 mass
(A) ingredient of part, blended amount at this time is preferably 0.1~5 mass parts.By using and adding peroxide initiator simultaneously,
For can not adhesive used in the present invention of direct irradiation ultraviolet light position, can be according to 60~100 DEG C of left sides of required heating
The right side, thus by adhesive curing used in the present invention.
(C) ingredient-
(C) organopolysiloxane of ingredient is to have the structure of at least one general formula (2) expression in molecule and relative to complete
Portion's siloxane unit averagely has the SiO of 1~50mol%4/2And/or SiO3/2The organopolysiloxane of the branched of unit.
[chemical formula 7]
In formula, m ' is 0, an integer of 1 or 2, R1’For hydrogen atom, phenyl or halogenophenyl, R2’For hydrogen atom or methyl, R3’
The substituted or non-substituted alkyl that the carbon atom number that may be the same or different for monovalence is 1~10, Z1’For-R4’-、-R4’O- or-
R4’(CH3)2SiO- (wherein, R4’The substituted or non-substituted hydrocarbon that the carbon atom number that may be the same or different for divalent is 1~10
Base) indicate bivalent group, Z2’For oxygen atom or divalent can the same or different carbon atom number substitution that is 1~10 or non-
Substituted alkyl.
For (C) ingredient, premised on the use of (A) ingredient, relative to (A) described in 100 mass parts, (C) at
It is suitable for being divided into the range of 1~100 mass parts.If (C) ingredient is 1 mass parts or more, it is expected that improving desired
The mechanical strength of solidfied material, if (C) ingredient is 100 below the mass, the hardness of obtained solidfied material will not be really up to the mark, is suitble to use
Make adhesive of the invention.
The organopolysiloxane of (C) ingredient out illustrated below.These organopolysiloxanes can be used alone as (C) ingredient
One kind also can be used in combination two or more.
(c-1)
By following MA unit (SiO1/2) and M unit (SiO1/2) and Q unit (SiO4/2) composition and these units rub
The organopolysiloxane that your ratio is MA:M:Q=1:4:5 and the weight average molecular weight of polystyrene conversion is 5,000.
MA unit:
[chemical formula 8]
M unit:
[chemical formula 9]
Q unit:
[chemical formula 10]
(c-2)
By following MA-D unit (SiO2/2) and D unit (SiO2/2) and T unit (SiO3/2) composition and molar ratio be MA-
The organopolysiloxane that D:D:T=2:6:7 and the weight average molecular weight of polystyrene conversion are 3,500.
MA-D unit:
[chemical formula 11]
D unit:
[chemical formula 12]
T unit:
[chemical formula 13]
It is identical as (A) ingredient as the viscosity of (C) ingredient, with the viscosity of 100~200,000mPas at 25 DEG C
It is that suitably, preferred range is 500~50,000mPas, preferred range is 1,000~10,000mPas.(C)
When the viscosity of ingredient is greater than 100mPas, solidfied material is not obtained from ultraviolet light irradiates adhesive used in the present invention
Can be really up to the mark, it can be suitable as device used for image display, when the viscosity of (C) ingredient is less than 200,000mPas, workability is not
Difference.
Other compositions-
According to required, other compositions can be blended in adhesive used in the present invention.
Reactive diluent:
Hardness adjustment of viscosity and solidfied material for adhesive etc. assigns durability when being placed in high temperature, particularly resistance to
The transparency after damp and hot and the purpose of to the adhesiveness of substrate, can add the reactive diluent without containing silicone.
As the reactive diluent for not containing silicone, have by H2C=CGCO2(methyl) esters of acrylic acid that Q is indicated, on
It states in formula, G is the alkyl that hydrogen, halogen or carbon atom number are 1~about 4；Q be selected from carbon atom number be 1~about 16 alkyl,
Naphthenic base, alkenyl, cycloalkenyl, alkylaryl, aralkyl or aryl, it is therein any one can according to required and by silane, silicon,
Oxygen, halogen, carbonyl, hydroxyl, ester, carboxylic acid, urea, urethanes, carbamate, amine, amide, sulphur, sulphonic acid ester, sulfone etc.
Replace or blocks.
The more specific example of (methyl) esters of acrylic acid especially desirable as reactive diluent, there is polyethylene glycol two
Two (the first of bisphenol-A of (methyl) acrylate, such as Ethoxylated bisphenol-A (methyl) acrylate (" EBIPA " or " EBIPMA ")
Base) acrylate, tetrahydrofuran (methyl) acrylate and two (methyl) acrylate, acrylic acid citronellyl acrylate and methacrylic acid
Citronellyl acrylate, hydroxypropyl (methyl) acrylate, hexylene glycol two (methyl) acrylate (" HDDA " or " HDDMA "), three hydroxyl first
Base propane three (methyl) acrylate, tetrahydro dicyclopentadienyl (methyl) acrylate, ethoxylated trimethylolpropane three
Acrylate (" ETTA "), triethylene glycol diacrylate and triethylene glycol dimethacrylate (" TRIEGMA "), dioxanes
Ethylene glycol two (methyl) acrylate (dioxane glycol di (meta) acrylate) is (for example, Nippon Kayaku
Co., Ltd. manufacture KAYARAD R-604, dioxanes glycol diacrylate), tristane dihydroxymethyl two (methyl)
Acrylate is (for example, the KAYARAD R-684 of Nippon Kayaku Co., Ltd. manufacture, tristane dihydroxymethyl dipropyl
Olefin(e) acid ester etc.) and isobornyl acrylate and isobornyl methacrylate.Certainly, these (methyl) esters of acrylic acid can
One kind is used alone, it can also combine and two or more be used as reactive diluent.
When using reactive diluent, relative to (A) ingredient of 100 mass parts, the reaction of 0.05~50 mass parts is blended
Property diluent.
Modifying agent:
For adhesive used in the present invention, after must have the durability, particularly wet-heat resisting when being placed in high temperature
The transparency and to the bondings of the various substrates such as glass, acrylic acid, polycarbonate, PET, in special-purpose, also may include
Make desired solidify or the other compositions of uncured characteristic changing.For example, can be contained with 5 mass % amounts below such as methyl
Acryloyloxypropyltrimethoxysilane, trialkyl-or triallyl-isocyanuric acid ester, glycydoxy three
The adhesion promotor of methoxy silane, vinyltrimethoxysilane etc..
Furthermore it is possible to which the amount until about 30 weight % adds non-(methyl) acrylic acid silicone diluent or plasticizer.Make
For non-(methyl) silicon Acrylote ketone, blocked for the trimethyl silicon substrate of the viscosity at 25 DEG C with 100~10,000mPas
(ト リ メ チ Le シ リ Le ending オ イ Le) and silicon rubber.Non- (methyl) silicon Acrylote ketone is for middle use incorporated herein
Adhesive crosslinking purpose, may include the copolymerizable group such as vinyl.
Inorganic filler:
Inorganic filler can also be added in the adhesive.I.e., it is possible to for the silica-based of such as pyrogenic silica,
For untreated state (hydrophily) or it can be handled and hydrophobicity is made.Arbitrary pyrogenic silica is equal
The one kind that can be used alone is applied in combination two or more.
When using inorganic filler, relative to (A) ingredient of 100 mass parts, the inorganic fill of 0.1~20 mass parts is blended
Agent.
In addition, wishing that ultraviolet light is not present in the preparation method of adhesive used in the present invention.Specifically, using dress
The mixing and blending machine for having vacuum degassing apparatus, by deaeration, can obtain ultraviolet hardening after mixing above-mentioned each ingredient
Liquid silicone rubber adhesive.
[process that irradiation ultraviolet light makes adhesive layer semi-solid preparation]
Adhesive bonding method of the invention forms the coating of ultraviolet hardening liquid silicone rubber adhesive on the first substrate
After adhesive layer, irradiation ultraviolet light is to make adhesive layer semi-solid preparation.
As to the ultraviolet source for keeping adhesive layer semi-solid preparation useful, can enumerating to be issued in various ultraviolet wavelength bands
The mode of ultraviolet energy and design common mercury vapor light or metal halide lamp, for example only issue 365nm it is specific
The LED light etc. of single wavelength.
For example, it is desirable that for making useful 220~450nm of ultraviolet range of adhesive layer semi-solid preparation.This
Outside, for semi-solid preparation, accumulated light is adjusted by irradiation time.
[bonding process that the second substrate is laminated via adhesive layer]
In adhesive bonding method of the invention, so that the second substrate is laminated in first substrate via the adhesive layer of semi-solid preparation, pasted
It closes.
It is bonded under vacuum as applying method by using vacuum forming apparatus, to prevent the mixed of bubble
Enter, uniform adhesive layer can be obtained.In addition, vacuum forming apparatus refers to the dress for carrying out the fitting of bubble-free under vacuum
It sets, panel sectional device used in smart phone or tablet computer, touch panel etc. usually can be used.Vacuum forming apparatus
Final vacuum be 1000Pas hereinafter, being if possible 100Pas hereinafter, preferably 20Pas or less.
In addition, the second substrate used in the present invention, can be used identical with the substrate illustrated as first substrate
Substrate.
[process for making adhesive layer formal solidification]
In adhesive bonding method of the invention, the laminated body of the above-mentioned first substrate being bonded and the second substrate is further irradiated
Ultraviolet light makes the adhesive layer formal solidification of semi-cured state.
As to the ultraviolet source for keeping the adhesive layer formal solidification of semi-cured state useful, can enumerating and for making to bond
The identical ultraviolet source of ultraviolet source of layer semi-solid preparation.In this case, for formal solidification, also by irradiation time adjust its with
The accumulated light of semi-solid preparation.
Embodiment
Hereinafter, the present invention is concretely demonstrated using Examples and Comparative Examples, but the present invention is not limited to this.Separately
Outside, the weight average molecular weight of polystyrene conversion is the value measured using gel permeation chromatography, and viscosity is to make at 25 DEG C
The value obtained with rotary viscosity design determining.
In addition, the ultraviolet light irradiation condition in following Examples and Comparative Examples is as described below.
Ultraviolet light irradiation condition
Using Iwasaki Electric Co., Ltd. manufacture EYE UV electronic control unit, material surface it is ultraviolet
Line illumination is 100mW/cm2(365nm) adjusts accumulated light by irradiation time.
The judgement benchmark of solid state
The inviscid test (tack free test) of JIS K6249, will in evaluation method on the basis of by fingers-touch method
When touching the bonding layer surface after ultraviolet light irradiation with finger, adhesive layer is stained with the state on finger as semi-solid preparation.Also, sentence
Whether there is or not mobility for disconnected adhesive layer.
It is uncured: to there is adhesion to feel, also there is mobility.
Semi-solid preparation: having adhesion to feel, but does not have mobility.
Solidification: both without adhesion sense, also without mobility.
Planar stretch adhesion test
As shown in Figure 1, using the glass plate 1,2 (first substrate and the second substrate) of size 25mm × 100m, thickness 2mm,
It is viscous with about 500 μm of Thickness Mode coating and in such a way that bond area is 25mm × 20mm on glass plate 1 (first substrate)
The ultraviolet hardening liquid silicone rubber adhesive of the area of area or more is closed, forms adhesive layer 3, and irradiate the purple of stipulated time
Outside line.Further, the surface of the adhesive layer 3 by another glass plate 2 (the second substrate) mounting after irradiation keeps it formally solid
Change.As the measuring method of bonding force, the glass plate for fitting into crosswise is removed in measurement in the mode vertical with adhesive surface up and down
Intensity.
(embodiment 1,2 and Comparative Examples 1 and 2)
By the viscosity shown in following structural formula (4), at 25 DEG C be 3,000mPas organopolysiloxane 100g, 2,
2- diethoxy acetophenone (" DEAP ") 2g, by following MA unit (SiO1/2) and M unit (SiO1/2) and Q unit (SiO4/2)
Constitute and these units molar ratio be MA:M:Q=1:4:5 and polystyrene conversion weight average molecular weight be 5,000 it is organic
Polysiloxanes 10g, 3- methacryloxypropyl trimethoxy silane 1g is uniformly mixed, and prepares ultraviolet hardening liquid silicon
Rubber adhesive (sample A).
[chemical formula 14]
In formula, the arrangement of each siloxane unit with parantheses can be random, or block.
MA unit:
[chemical formula 15]
M unit:
[chemical formula 16]
Q unit:
[chemical formula 17]
Sample A is coated on glass plate 1 with about 500 μm of thickness, forms adhesive layer 3, irradiation provides the ultraviolet of accumulated light
Line.Then, another glass plate 2 is fitted on adhesive layer 3, irradiation accumulated light is 24,000mJ/cm2Ultraviolet light.
Measure planar stretch adhesive strength.Show the result in table 1.
[table 1]
According to the result of table 1, in embodiment 1 and embodiment 2, planar stretch adhesive strength is good.In addition, each other by substrate
When fitting, since adhesive layer is semi-solid preparation, it can adjust or repair bonding position, additionally it is possible to control the thickness of adhesive layer
Degree.On the other hand, in the comparative example 1 being bonded substrate each other with the uncured state of adhesive layer, although planar stretch intensity is good
It is good, but the thickness of adhesive layer is widely varied because of fitting, is unable to control the thickness of adhesive layer, in addition, can not also adjust fitting
Position.Also, so that the cured state of adhesive layer, i.e. in the state comparative example 2 that is bonded substrate each other of no adhesion sense,
Substrate can be removed each other.
According to that can confirm above, if adhesive bonding method of the invention, then the thickness of adhesive layer can be controlled, and can adjust
Whole bonding position.
In addition, the present invention is not limited to above embodiment.Above embodiment is to illustrate, and is had and power of the invention
The substantially identical composition of the technical concept recorded in the sharp claim and technical solution for playing same function and effect is all contained in
In technical scope of the invention.
Claims (3)
1. a kind of adhesive bonding method, for using ultraviolet hardening liquid silicone rubber adhesive by opposite a pair of of first substrate with
The method of the second substrate bonding characterized by comprising described adhesive coating is formed and bonded on the first substrate
The process of layer irradiates ultraviolet light to the adhesive layer to make the process of the adhesive layer semi-solid preparation, via the institute after semi-solid preparation
Stating adhesive layer makes bonding process and irradiation ultraviolet light that the second substrate is laminated the work of the adhesive layer formal solidification
Sequence.
2. adhesive bonding method according to claim 1, which is characterized in that use following (A) ingredients relative to 100 mass parts
Ultraviolet hardening liquid organopolysiloxane composition made of following (B) ingredients containing 0.01~10 mass parts, as
The ultraviolet hardening liquid silicone rubber adhesive,
(A) ingredient: there is the structure of at least two general formulas (1) expression and relative to whole siloxane units, You Jiju in molecule
Siloxane unit does not have SiO4/2And SiO3/2Unit and only by SiO2/2、SiO1/2The organic poly- silicon oxygen for the straight-chain that unit is constituted
Alkane,
(B) ingredient: Photoepolymerizationinitiater initiater,
[chemical formula 1]
In formula, m 0, an integer of 1 or 2, R1For hydrogen atom, phenyl or halogenophenyl, R2For hydrogen atom or methyl, R3For monovalence
The substituted or non-substituted alkyl that the carbon atom number that may be the same or different is 1~10, Z1For-R4-、-R4O- or-R4(CH3)2The bivalent group that SiO- is indicated, wherein R4The carbon atom number that may be the same or different for divalent be 1~10 it is substituted or non-substituted
Alkyl, Z2For oxygen atom or divalent can same or different carbon atom number be 1~10 substituted or non-substituted alkyl.
3. adhesive bonding method according to claim 2, which is characterized in that using relative to (A) ingredient described in 100 mass parts
Further ultraviolet hardening liquid organopolysiloxane composition made of following (C) ingredients containing 1~100 mass parts,
As the ultraviolet hardening liquid silicone rubber adhesive,
(C) ingredient: there is the structure of at least one general formula (2) expression in molecule and averagely have relative to whole siloxane units
The SiO of 1~50mol%4/2And/or SiO3/2The organopolysiloxane of the branched of unit,
[chemical formula 2]
In formula, m ' is 0, an integer of 1 or 2, R1’For hydrogen atom, phenyl or halogenophenyl, R2’For hydrogen atom or methyl, R3’It is one
The substituted or non-substituted alkyl that the carbon atom number that may be the same or different of valence is 1~10, Z1’For-R4’-、-R4’O- or-R4’
(CH3)2The bivalent group that SiO- is indicated, wherein R4’Substitution that the carbon atom number that may be the same or different for divalent is 1~10 or
Non-substituted alkyl, Z2’For oxygen atom or divalent can same or different carbon atom number be 1~10 it is substituted or non-substituted
Alkyl.
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| JP2017-214679 | 2017-11-07 | ||
| JP2017214679A JP2019085488A (en) | 2017-11-07 | 2017-11-07 | Method of bonding substrates |
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| CN109749700A true CN109749700A (en) | 2019-05-14 |
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| JP (1) | JP2019085488A (en) |
| KR (1) | KR20190051829A (en) |
| CN (1) | CN109749700A (en) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111876127A (en) * | 2020-08-05 | 2020-11-03 | 深圳市新纶科技股份有限公司 | Dam adhesive and preparation method thereof, and fumed silica and preparation method thereof |
| CN112930106A (en) * | 2021-01-22 | 2021-06-08 | 杭州唯灵医疗科技有限公司 | Flexible electronic equipment and assembling method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6962290B2 (en) * | 2018-08-02 | 2021-11-05 | 信越化学工業株式会社 | UV curable silicone composition for stereolithography and its cured product |
| WO2023042745A1 (en) * | 2021-09-14 | 2023-03-23 | ダウ・東レ株式会社 | Curable organopolysiloxane composition, slightly-adhesive organopolysiloxane adhesive agent layer obtained by curing same, and laminate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014005354A (en) * | 2012-06-22 | 2014-01-16 | Momentive Performance Materials Inc | Two-agent type curable polyorganosiloxane composition and use thereof |
| JP2014169412A (en) * | 2013-03-05 | 2014-09-18 | Shin Etsu Chem Co Ltd | Method for curing curable silicone composition |
| CN104210218A (en) * | 2013-05-31 | 2014-12-17 | 盟立自动化股份有限公司 | Substrate adhesion method |
| CN104559825A (en) * | 2013-10-15 | 2015-04-29 | 信越化学工业株式会社 | Thermosetting conductive silicone composition, conductive adhesive, conductive die bonding material, and photosemiconductor apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6496900B2 (en) * | 2015-01-20 | 2019-04-10 | 協立化学産業株式会社 | Method for bonding optical members |
| JP6262684B2 (en) * | 2015-03-31 | 2018-01-17 | 信越化学工業株式会社 | Ultraviolet curable liquid organopolysiloxane composition for image display device, adhesive for image display device containing the composition, image display device using the adhesive, and bonding method using the adhesive |
-
2017
- 2017-11-07 JP JP2017214679A patent/JP2019085488A/en active Pending
-
2018
- 2018-11-02 KR KR1020180133224A patent/KR20190051829A/en unknown
- 2018-11-06 TW TW107139244A patent/TW201925391A/en unknown
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014005354A (en) * | 2012-06-22 | 2014-01-16 | Momentive Performance Materials Inc | Two-agent type curable polyorganosiloxane composition and use thereof |
| JP2014169412A (en) * | 2013-03-05 | 2014-09-18 | Shin Etsu Chem Co Ltd | Method for curing curable silicone composition |
| CN104210218A (en) * | 2013-05-31 | 2014-12-17 | 盟立自动化股份有限公司 | Substrate adhesion method |
| CN104559825A (en) * | 2013-10-15 | 2015-04-29 | 信越化学工业株式会社 | Thermosetting conductive silicone composition, conductive adhesive, conductive die bonding material, and photosemiconductor apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111876127A (en) * | 2020-08-05 | 2020-11-03 | 深圳市新纶科技股份有限公司 | Dam adhesive and preparation method thereof, and fumed silica and preparation method thereof |
| CN112930106A (en) * | 2021-01-22 | 2021-06-08 | 杭州唯灵医疗科技有限公司 | Flexible electronic equipment and assembling method thereof |
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| JP2019085488A (en) | 2019-06-06 |
| TW201925391A (en) | 2019-07-01 |
| KR20190051829A (en) | 2019-05-15 |
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