CN109748267A - A kind of graphene thermal component preparation method based on multiple tracks cleaning - Google Patents

A kind of graphene thermal component preparation method based on multiple tracks cleaning Download PDF

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Publication number
CN109748267A
CN109748267A CN201910135059.4A CN201910135059A CN109748267A CN 109748267 A CN109748267 A CN 109748267A CN 201910135059 A CN201910135059 A CN 201910135059A CN 109748267 A CN109748267 A CN 109748267A
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graphene
former material
thermal component
activator
multiple tracks
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CN109748267B (en
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庞美兴
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Shenzhen Ruiren New Material Technology Co ltd
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ONTAP PLATING PRECISION ELECTRONICS CO Ltd
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Abstract

The present invention provides a kind of graphene thermal component preparation methods based on multiple tracks cleaning comprising following procedure of processing: 1) ultrasonic cleaning graphene former material;2) continue to clean graphene former material by activator, activator includes the sulfuric acid of 10-20% and the surfactant of 0.05-1%, and the surplus of activator is water;3) continue to clean graphene former material by deionized water;4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;6) continue the dry graphene former material that layers of copper has been electroplated.The present invention can make activator obtain higher flatness compared to the prior art, and the roughness after reducing the cleaning of graphene former material can simultaneously be effectively improves the performance of the acid and alkali-resistance of last thermal component.

Description

A kind of graphene thermal component preparation method based on multiple tracks cleaning
Technical field
The graphene thermal component preparation process based on plating that the present invention relates to a kind of, is based in particular to one kind The graphene thermal component preparation method of multiple tracks cleaning.
Background technique
Graphene be one kind by carbon atom with sp2Hybridized orbit forms the Two-dimensional Carbon nanometer material that hexangle type is in honeycomb lattice Material.Graphene has extraordinary heat-conductive characteristic, and the thermal coefficient of pure flawless single-layer graphene is up to 5300W/mK, It is the highest carbon material of thermal coefficient so far, is higher than single-walled carbon nanotube (3500W/mK) and multi-walled carbon nanotube (3000W/mK).When it is as carrier, thermal coefficient is also up to 600W/mK.In addition, the trajectory thermal conductivity of graphene can make The lower limit of the trajectory thermal conductivity of the carbon nanotube of unit circumference and length moves down.
In current electronic product, various electronic components require to radiate, and traditional graphene is being applied to electricity When the heat dissipation of subcomponent, one layer of metal layer is mainly fixed to the surface of graphene, particular by what is be bonded or be electroplated Metal layer is fixed on graphene by mode, and plating is better than the mode of bonding in heat conduction efficiency.
In current electroplating process, the graphene former material for plating, acid are mainly needed by acid wash liquid cleaning Property washing lotion is the greasy dirt and oxide in order to draw graphene former material surface.But in the process of cleaning, it has been found that acid Cleaning is easy to improve the roughness of graphene surface in the process of cleaning, is unfavorable for the jail after being electroplated between graphene and metal layer Soundness, and there is also weakness in the performance of acid and alkali-resistance for the thermal component after subsequent plating.
Summary of the invention
In consideration of it, the present invention provides a kind of graphene thermal component preparation methods based on multiple tracks cleaning, it is intended to solve The problem of low, thermal component the acid-proof alkaline difference of firmness after being electroplated between graphene and metal layer in the prior art.
For this purpose, the present invention provides a kind of graphene thermal component preparation methods based on multiple tracks cleaning comprising following Procedure of processing:
1) ultrasonic cleaning graphene former material;
2) continue to clean graphene former material by activator, activator includes the sulfuric acid of 10-20% and the table of 0.05-1% Face activating agent, the surplus of activator are water;
3) continue to clean graphene former material by deionized water;
4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
Further, above-mentioned steps 1) in, graphene former material is cleaned using 1011 cleaning agents.
Further, above-mentioned steps 1) in, activator includes the sulfuric acid of 13-18% and the surface-active of 0.05-0.5% Agent, the surplus of activator are water.
Further, above-mentioned steps 1) in, activator includes 15% sulfuric acid and 0.1% surfactant, activator Surplus be water.
Further, above-mentioned surfactant is OP-10 surfactant.
Further, above-mentioned steps 4) in include twice galvanizing process: first by electroplating liquid medicine to graphene former material into The primary plating of row;Second time electroplating is carried out to graphene former material secondly by electroplating liquid medicine.
Further, above-mentioned electroplating liquid medicine includes the ingredient of following weight percent:
Further, above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 3-8%;Sulfuric acid 12- 18%;Brightener 0.5-1.1%;Adjuvant 0.04-0.0.08%;Fill and lead up agent 0.04-0.0.08%;Surplus is water.
Further, above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 4-7%;Sulfuric acid 13- 16%;Brightener 0.6-1%;Adjuvant 0.05-0.0.07%;Fill and lead up agent 0.05-0.0.07%;Surplus is water.
Further, above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 5%;Sulfuric acid 14%;It is bright Agent 0.8%;Adjuvant 0.06%;Fill and lead up agent 0.06%;Surplus is water.
A kind of graphene thermal component preparation method based on multiple tracks cleaning provided by the present invention, compared to existing skill Art has the advantage that, by just there is activator to clean graphene former material after ultrasonic cleaning, sulfuric acid therein can be washed Surfactant (preferably OP-10 surfactant, i.e. the OP-10 emulsification removing the greasy dirt of graphene former material, while including Agent) when cleaning graphene former material, activator can be made to obtain higher flatness using the characteristic of surfactant, Roughness after reducing the cleaning of graphene former material, while the characteristic of the acid and alkali-resistance using surfactant, can effectively improve The performance of the acid and alkali-resistance of last thermal component.
Specific embodiment
The exemplary embodiment of the disclosure is described in more detail below.Although showing the exemplary implementation of the disclosure Example, it being understood, however, that may be realized in various forms the disclosure and should not be limited by the embodiments set forth herein.On the contrary, It provides these to implement on the contrary in order to thoroughly understand the disclosure, and the scope of the present disclosure can be communicated completely to Those skilled in the art.
Embodiment one:
It is provided in an embodiment of the present invention it is a kind of based on multiple tracks cleaning graphene thermal component preparation method, mainly include Following procedure of processing:
1) 1011 cleaning agent ultrasonic cleaning graphene former materials are used;
2) continue to clean graphene former material by activator, activator includes 15% sulfuric acid and 0.1% surface OP-10 Activating agent (OP-10 emulsifier), the surplus of activator are water;
3) continue to clean graphene former material by deionized water;
4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
Wherein, include twice galvanizing process in step 4): primary electricity being carried out to graphene former material by electroplating liquid medicine first Plating;Second time electroplating is carried out to graphene former material secondly by electroplating liquid medicine.
Above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 5%;Sulfuric acid 14%;Brightener 0.8%;Adjuvant 0.06%;Fill and lead up agent 0.06%;Surplus is water.
Using above-mentioned electroplating liquid medicine electro graphite alkene former material, the more smooth and light on the surface of thermal component may be implemented It is sliding, and can synchronize carry out pickling again in the plating process, so that subsequent thermal component meets cleaning and smooth simultaneously The characteristic of property.
Each technological parameter of embodiment one is as shown in the table:
Embodiment two:
It is provided in an embodiment of the present invention it is a kind of based on multiple tracks cleaning graphene thermal component preparation method, mainly include Following procedure of processing:
1) 1011 cleaning agent ultrasonic cleaning graphene former materials are used;
2) continue to clean graphene former material by activator, activator includes 13% sulfuric acid and 0.5% surface OP-10 Activating agent (OP-10 emulsifier), the surplus of activator are water;
3) continue to clean graphene former material by deionized water;
4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
Wherein, include twice galvanizing process in step 4): primary electricity being carried out to graphene former material by electroplating liquid medicine first Plating;Second time electroplating is carried out to graphene former material secondly by electroplating liquid medicine.
Above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 4%;Sulfuric acid 16%;Brightener 0.6%;Adjuvant 0.05%;Fill and lead up agent 0.07%;Surplus is water.
Embodiment three:
It is provided in an embodiment of the present invention it is a kind of based on multiple tracks cleaning graphene thermal component preparation method, mainly include Following procedure of processing:
1) 1011 cleaning agent ultrasonic cleaning graphene former materials are used;
2) continue to clean graphene former material by activator, activator includes 18% sulfuric acid and 0.15% OP-10 table Face activating agent (OP-10 emulsifier), the surplus of activator are water;
3) continue to clean graphene former material by deionized water;
4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
Wherein, include twice galvanizing process in step 4): primary electricity being carried out to graphene former material by electroplating liquid medicine first Plating;Second time electroplating is carried out to graphene former material secondly by electroplating liquid medicine.
Above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 8%;Sulfuric acid 12%;Brightener 0.3%;Adjuvant 0.1%;Fill and lead up agent 0.02%;Surplus is water.
Example IV:
It is provided in an embodiment of the present invention it is a kind of based on multiple tracks cleaning graphene thermal component preparation method, mainly include Following procedure of processing:
1) 1011 cleaning agent ultrasonic cleaning graphene former materials are used;
2) continue to clean graphene former material by activator, activator includes 16% sulfuric acid and 0.05% OP-10 table Face activating agent (OP-10 emulsifier), the surplus of activator are water;
3) continue to clean graphene former material by deionized water;
4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
Wherein, include twice galvanizing process in step 4): primary electricity being carried out to graphene former material by electroplating liquid medicine first Plating;Second time electroplating is carried out to graphene former material secondly by electroplating liquid medicine.
Above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 10%;Sulfuric acid 16%;Brightener 1.1%;Adjuvant 0.08%;Fill and lead up agent 0.06%;Surplus is water.
Embodiment five:
It is provided in an embodiment of the present invention it is a kind of based on multiple tracks cleaning graphene thermal component preparation method, mainly include Following procedure of processing:
1) 1011 cleaning agent ultrasonic cleaning graphene former materials are used;
2) continue to clean graphene former material by activator, activator includes 17% sulfuric acid and 0.25% OP-10 table Face activating agent (OP-10 emulsifier), the surplus of activator are water;
3) continue to clean graphene former material by deionized water;
4) electro graphite alkene former material forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
Wherein, include twice galvanizing process in step 4): primary electricity being carried out to graphene former material by electroplating liquid medicine first Plating;Second time electroplating is carried out to graphene former material secondly by electroplating liquid medicine.
Above-mentioned electroplating liquid medicine includes the ingredient of following weight percent: copper ion 2%;Sulfuric acid 20%;Brightener 1.3%;Adjuvant 0.02%;Fill and lead up agent 0.05%;Surplus is water.
To sum up, a kind of graphene thermal component preparation method based on multiple tracks cleaning, phase provided by above-described embodiment It has the advantage that compared with the prior art by just there is activator to clean graphene former material after ultrasonic cleaning, it is therein Sulfuric acid can wash away the greasy dirt of graphene former material, at the same include surfactant (preferably OP-10 surfactant, i.e., OP-10 emulsifier) when cleaning graphene former material, activator can be made to obtain using the characteristic of surfactant higher Flatness, reduce graphene former material cleaning after roughness, while using surfactant acid and alkali-resistance characteristic, Ke Yiyou Improve the performance of the acid and alkali-resistance of last thermal component in effect ground.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies Within, then the present invention is also intended to include these modifications and variations.

Claims (10)

1. a kind of graphene thermal component preparation method based on multiple tracks cleaning, which is characterized in that including following procedure of processing:
1) ultrasonic cleaning graphene former material;
2) continue to clean graphene former material by activator, the activator includes the sulfuric acid of 10-20% and the table of 0.05-1% Face activating agent, the surplus of the activator are water;
3) continue to clean graphene former material by deionized water;
4) the graphene former material is electroplated, forms layers of copper on the surface of graphene former material;
5) the graphene former material that layers of copper has been electroplated in cleaning is continued by deionized water;
6) continue the dry graphene former material that layers of copper has been electroplated.
2. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 1, which is characterized in that In the step 1), graphene former material is cleaned using 1011 cleaning agents.
3. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 1, which is characterized in that In the step 1), the activator includes the sulfuric acid of 13-18% and the surfactant of 0.05-0.5%, the activator Surplus is water.
4. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 1, which is characterized in that In the step 1), the activator includes 15% sulfuric acid and 0.1% surfactant, and the surplus of the activator is Water.
5. according to claim 1, a kind of graphene thermal component preparation method based on multiple tracks cleaning, feature described in 3 or 4 It is, the surfactant is OP-10 surfactant.
6. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 1, which is characterized in that Include twice galvanizing process in the step 4): graphene former material being once electroplated by electroplating liquid medicine first;Secondly logical It crosses electroplating liquid medicine and second time electroplating is carried out to graphene former material.
7. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 6, which is characterized in that The electroplating liquid medicine includes the ingredient of following weight percent:
8. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 7, which is characterized in that The electroplating liquid medicine includes the ingredient of following weight percent: copper ion 3-8%;Sulfuric acid 12-18%;Brightener 0.5-1.1%; Adjuvant 0.04-0.0.08%;Fill and lead up agent 0.04-0.0.08%;Surplus is water.
9. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 7, which is characterized in that The electroplating liquid medicine includes the ingredient of following weight percent: copper ion 4-7%;Sulfuric acid 13-16%;Brightener 0.6-1%;It is auxiliary Auxiliary agent 0.05-0.0.07%;Fill and lead up agent 0.05-0.0.07%;Surplus is water.
10. a kind of graphene thermal component preparation method based on multiple tracks cleaning according to claim 7, feature exist In the electroplating liquid medicine includes the ingredient of following weight percent: copper ion 5%;Sulfuric acid 14%;Brightener 0.8%;Adjuvant 0.06%;Fill and lead up agent 0.06%;Surplus is water.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113622007A (en) * 2021-09-08 2021-11-09 苏州市安派精密电子有限公司 Preparation method of high-flexibility graphite or graphene heat dissipation component

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080156653A1 (en) * 2006-12-28 2008-07-03 Chang Gung University Cyanide-free pre-treating solution for electroplating copper coating layer on magnesium alloy surface and a pre-treating method thereof
CN102719866A (en) * 2012-06-12 2012-10-10 河南科技学院 Cleaning and activating complex agent before plating of stainless steel parts and production process of cleaning and activating complex agent
CN103943281A (en) * 2014-05-09 2014-07-23 浙江大学 Preparation method of electric wire and cable with copper-graphene complex phase conductive wire core
CN105624747A (en) * 2015-12-29 2016-06-01 东莞市青麦田数码科技有限公司 Copper/graphene composite multi-layer heat dissipation film
CN105713434A (en) * 2016-02-05 2016-06-29 浙江大学 Graphene-doping-modified protective coating and preparing method and application thereof
US20180340267A1 (en) * 2013-06-20 2018-11-29 Baker Hughes, A Ge Company, Llc Method to produce metal matrix nanocomposite

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080156653A1 (en) * 2006-12-28 2008-07-03 Chang Gung University Cyanide-free pre-treating solution for electroplating copper coating layer on magnesium alloy surface and a pre-treating method thereof
CN102719866A (en) * 2012-06-12 2012-10-10 河南科技学院 Cleaning and activating complex agent before plating of stainless steel parts and production process of cleaning and activating complex agent
US20180340267A1 (en) * 2013-06-20 2018-11-29 Baker Hughes, A Ge Company, Llc Method to produce metal matrix nanocomposite
CN103943281A (en) * 2014-05-09 2014-07-23 浙江大学 Preparation method of electric wire and cable with copper-graphene complex phase conductive wire core
CN105624747A (en) * 2015-12-29 2016-06-01 东莞市青麦田数码科技有限公司 Copper/graphene composite multi-layer heat dissipation film
CN105713434A (en) * 2016-02-05 2016-06-29 浙江大学 Graphene-doping-modified protective coating and preparing method and application thereof

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
GANG HUANG ET AL: "Preparation and characterization of the graphene-Cu composite film by electrodeposition process", 《MICROELECTRONIC ENGINEERING》 *
方景礼: "《电镀添加剂理论与应用》", 30 April 2006 *
李文虎: "高导热石墨膜/铜复合材料的制备及应用", 《中国优秀硕士学位论文全文数据库•工程科技I辑》 *
梅自强等: "《纺织工业中的表面活性剂》", 30 April 2001 *
王中华等: "《油田化学品使用手册》", 31 July 2004 *
胡明辉: "《电镀企业现场管理与技术》", 30 September 2012 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113622007A (en) * 2021-09-08 2021-11-09 苏州市安派精密电子有限公司 Preparation method of high-flexibility graphite or graphene heat dissipation component
JP7187069B1 (en) * 2021-09-08 2022-12-12 蘇州市安派精密電子有限公司 A method for manufacturing a flexible graphite or graphene material heat-dissipating component
US20230070481A1 (en) * 2021-09-08 2023-03-09 Suzhou Ontap Precision Electronic Co., Ltd. Method for preparing heat dissipation component with high flexibility made of graphite or graphene material

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