CN109746539A - Draw solder bonding machine control method - Google Patents
Draw solder bonding machine control method Download PDFInfo
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- CN109746539A CN109746539A CN201711068506.6A CN201711068506A CN109746539A CN 109746539 A CN109746539 A CN 109746539A CN 201711068506 A CN201711068506 A CN 201711068506A CN 109746539 A CN109746539 A CN 109746539A
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- soldering tip
- displacement
- bonding machine
- control system
- control method
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Abstract
The present invention discloses a kind of drawing solder bonding machine control method, it include: in the soldering tip displacement of drive displacement mechanism driving welding mechanism, the soldering tip is by the displacement mechanism fast speed belt to the first specific position, external control system controls the displacement mechanism and slows down, make the soldering tip with slow speed displacement into second specific position, pass through second specific position in the soldering tip, the control system will control the soldering tip to heat in displacement to soldering tip internal heating element in slower speed displacement to welded article body.The welding of welded article body is finished in the soldering tip, control system control heating element cools down, the control system drives the displacement mechanism to leave the soldering tip slowly, when soldering tip is left with slow speed and reaches the second specific position, the control system drive displacement mechanism, returns the soldering tip quickly and sets original position.
Description
Technical field
The present invention is a kind of related bonding machine, espespecially a kind of control welded in a manner of multistage displacement to welded article body
Method processed.
Background technique
Traditional bonding machine is placed in welding when welding to welded article body, by welded article body, in external control
Pneumatic cylinder on system drive bonding machine makes pneumatic cylinder driving soldering tip carry out welding processing to weldering object.
Since the soldering tip of traditional bonding machine is driven with pneumatic cylinder, it is also easy to produce under the driving of pneumatic cylinder
Bad problem, because pneumatic cylinder is that soldering tip one-time-reach-place can be made to tin cream splash (because oil content is high) when being welded,
It causes welding position thinning, is easily broken off, weld part offset, tin is not completely closely sealed with welded article body, and proof time is longer.And
And when welding finishes, pneumatic cylinder is once to retract soldering tip, can retract together tin cream, cause the welding of welded article body not
Completely.
Summary of the invention
Therefore, the main object of the present invention, is to solve traditional missing, the present invention using motor driving bonding machine weldering
Head, and welded article body is welded with the displacement mode of multistage friction speed driving soldering tip, failure welding will not be generated and asked
Topic.
It is another object of the present invention to the present invention to utilize solder,, should in welding because solder oil content is few
Solder will not splash, not will cause that welding position is thinning and fracture thing, will not more weld part be made to deviate, allow tin and welded article body
It can be completely closely sealed.
Another object of the present invention is soldering tip of the invention when welding finishes, and external control system is to soldering tip
Welding temperature cools down, and when soldering tip is brought back, will not retract together tin, keep welding position more complete.
In order to achieve the above object, the present invention provides a kind of drawing solder bonding machine control method, which includes one
Telephone-moving structure, a welding mechanism, one draw solder mechanism and a load carrier, which there is a soldering tip and the displacement machine to have
One motor, the bonding machine and external control system electrical connection include: to control the step of solder is welded in welded article body
When the bonding machine is controlled by the external control system, to drive the weldering of the motor driven of the displacement mechanism welding mechanism
Head displacement.When the soldering tip is quickly driven by the displacement mechanism and is displaced to first specific position, i.e., the displacement of completion first segment is gone
Journey, the control system controls the displacement mechanism and slows down at this time.When the control system controls the displacement mechanism and slows down, make this
Soldering tip into second specific position, that is, completes the second segment displacement stroke of the soldering tip with slow speed displacement.In the soldering tip
It is carried out in third section displacement stroke by second specific position, which will control the soldering tip to be displaced compared with the second segment
Stroke be slow speed displacement to welded article body on, while the soldering tip displacement in, the control system is to one inside the soldering tip
Heating element is heated, and is welded in scolding tin on the welded article body.The welding of welded article body is finished in the soldering tip, the control
System processed controls the heating element simultaneously and cools down, at this time the control system drive the displacement mechanism make the soldering tip slowly from
It opens.When the soldering tip is left with slow speed and passes through second specific position, which drives the displacement mechanism, makes this
Soldering tip quickly returns and sets original position.
In one embodiment of this invention, the first segment displacement stroke then refer to the soldering tip from home position be moved to this
The distance of one specific position.
In one embodiment of this invention, when carrying out soldering tip displacement, which can be to being somebody's turn to do inside the soldering tip
The control that heating element is heated or cooled down.
In one embodiment of this invention, which is to pass through second specific position to the welded article with soldering tip
The speed of body is identical.
In one embodiment of this invention, this quickly returns that set speed in situ identical as the speed of first segment displacement stroke.
In one embodiment of this invention, one driving section of motor driven of the displacement mechanism, pivot joint should on the driving section
Welding mechanism, to drive the welding mechanism upper and lower displacement.
In one embodiment of this invention, there is an adjustment section on the welding mechanism, which is configured in the adjustment section,
The disposition of heating component is inside the soldering tip.
In one embodiment of this invention, which is located at below the welding mechanism, the drawing solder mechanism be with
The solder reduction is pulled to below the soldering tip.
In one embodiment of this invention, one is located at displacement mechanism front and holding below the welding mechanism
Mounted mechanism has a plummer on the load carrier, and the plummer is to carry the welded article body.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 is bonding machine stereoscopic schematic diagram of the invention;
Fig. 2 is the schematic side view of Fig. 1;
Fig. 3 is bonding machine control method flow diagram of the invention;
Fig. 4 is the mobile schematic diagram one of welding mechanism of bonding machine of the invention;
Fig. 5 is the mobile schematic diagram two of welding mechanism of bonding machine of the invention;
Fig. 6 is the mobile schematic diagram three of welding mechanism of bonding machine of the invention.
Wherein, appended drawing reference
S100-S114 step
10 bonding machines
1 pedestal
2 displacement mechanisms
21 motors
22 driving sections
3 welding mechanisms
31 adjustment sections
32 soldering tips
4 draw solder mechanism
5 load carriers
51 plummers
Specific embodiment
Technical solution of the present invention is described in detail in the following with reference to the drawings and specific embodiments, to be further understood that
The purpose of the present invention, scheme and effect, but it is not intended as the limitation of scope of the appended claims of the present invention.
Fig. 1-6 is please referred to, is bonding machine stereoscopic of the invention, side view, bonding machine control method process and bonding machine
The mobile schematic diagram of welding mechanism.It is as shown in the figure: drawing solder bonding machine control method of the invention, mainly control bonding machine 10
On 3 segmented of welding mechanism be moved on welded article body 20, when being welded in scolding tin on the welded article body 20, will not generate floating
Weld phenomenon.
Firstly, having a bonding machine such as step S100: the bonding machine 10 has a pedestal 1, one displacement of tool on the pedestal 1
Mechanism 2 has a motor 21 and a driving section 22 on the displacement mechanism 2, a welding mechanism 3 is pivotally connected on the driving section 22, with band
Move 3 upper and lower displacement of welding mechanism.There is an adjustment section 31, which has a soldering tip on the welding mechanism 3
32, the soldering tip 32 is interior to have a heating element (not shown).In addition, have one to draw solder mechanism 4 below the welding mechanism 3,
The drawing solder mechanism 4 is being pulled to the solder reduction (not shown) positioned at 32 lower section of the soldering tip.Also, in having one on pedestal 1
In there is a plummer 51 on the front of displacement mechanism 2 and load carrier 5 positioned at 3 lower section of welding mechanism, the load carrier 5,
The plummer 51 is to carry welded article body (not shown).
Step S102 places welded article body: external after welded article body 20 to be placed in the plummer 51 of the load carrier 5
Control system (not shown) control the lower section that the plummer 51 is moved to the welding mechanism 3 by the load carrier 5.
Step S104, soldering tip displacement: when bonding machine 10 is controlled by external control system, with drive displacement mechanism 2
Motor 21 is driven the driving section 22, makes the soldering tip 32 of 22 V belt translation of the driving section welding mechanism 3 toward bottom offset.
The first segment displacement stroke of soldering tip: step S106 is displaced by 2 fast speed belt trend bottom offset of mechanism in welding mechanism 3
When, when the soldering tip 32 is displaced to downwards first specific position B, the control system of the outside will control the displacement mechanism 2
Motor 21 slows down.In this schema, which then refers to the soldering tip 32 under the A of home position to being moved to
The distance of first specific position B, the distance about 5cm.
Step S108, the second segment displacement stroke of soldering tip: in the soldering tip 32 by first specific position B (such as Fig. 4 institute
Show) while the outside control system control the displacement mechanism 2 motor 21 slow down, make the soldering tip 32 with slow speed to
Bottom moves in second specific position C (as shown in Figure 5), that is, completes the second segment displacement stroke of soldering tip 32.In this schema,
When the soldering tip 32 is displaced to second specific position C, the soldering tip 32 and the welded article body 20 are apart from about 0.2cm.
Step S110, the third section displacement stroke of soldering tip: passing through second specific position C in the soldering tip 32, the outside
Control system will control the soldering tip 32 to be in slow speed displacement to welded article body 20 and scolding tin compared with the second segment displacement stroke
It is welded, is welded in the scolding tin on the welded article body 20 (as shown in Figure 6).In the weldering of abovementioned steps S108, S110
During first 32 liang of sections move, external control system can be heated or be cooled down to the heating element inside the soldering tip 32
Control.
The first segment displacement of step S112, soldering tip are left: welding the same a period of time finished to welded article body 20 in the soldering tip 32
Between external control system control the heating element cooling soldering tip 32 inside simultaneously, the control system is in the driving displacement at this time
The motor 21 of mechanism 2 leaves the soldering tip 32 slowly, be pulled scolding tin will not, is occurred with reducing the thing of failure welding.?
In this schema, the slow speed is identical by the speed of the second specific position C to the welded article body as soldering tip.
The second segment displacement of step S114, soldering tip are left: leaving in soldering tip 32 in the slow speed of upper step and pass through this
When the second specific position C, which drives the motor 21 of the displacement mechanism 2 to return the soldering tip 32 quickly and sets original position.At this
In schema, this is quickly returned, and to set speed in situ identical as the speed of first segment displacement stroke.
Further, it is that the present invention drives the soldering tip of bonding machine using motor, and with the displacement side of multistage friction speed
Formula driving soldering tip welds welded article body, will not lead to the problem of failure welding.
Further, it is the present invention using solder, because solder oil content is few, in welding, which will not
Splash, not will cause welding position it is thinning and fracture thing, will not more weld part be made to deviate, make tin and welded article physical efficiency completely close
It closes.
Again further, be soldering tip of the invention when welding finishes, welding temperature of the external control system to soldering tip
Degree cools down, and when soldering tip is brought back, will not retract together tin, keep welding position more complete.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (9)
1. a kind of drawing solder bonding machine control method, which is characterized in that the bonding machine includes a displacement mechanism, a bonding machine
Structure, one draw solder mechanism and a load carrier, which has a motor, the bonding machine with a soldering tip and the displacement machine
With external control system electrical connection, include: by the step that solder is welded on welded article body with control
A), when the bonding machine is controlled by the external control system, to drive the motor driven of the displacement mechanism bonding machine
The soldering tip of structure is displaced;
B), when the soldering tip is quickly driven by the displacement mechanism and is displaced to first specific position, i.e., the displacement of completion first segment is gone
Journey, the control system controls the displacement mechanism and slows down at this time;
C), when the control system controls the displacement mechanism and slows down, make the soldering tip with slow speed displacement to one second specific
In position, that is, complete the second segment displacement stroke of the soldering tip;
D), carried out in third section displacement stroke in the soldering tip by second specific position, which will control the soldering tip
With compared with the second segment displacement stroke be slow speed displacement to welded article body on, while the soldering tip displacement in, the control system
A heating element inside the soldering tip is heated, is welded in scolding tin on the welded article body;
E), the welding of welded article body is finished in the soldering tip, which controls the heating element simultaneously and cool down, and at this time should
Control system drives the displacement mechanism to leave the soldering tip slowly;
F), when the soldering tip is left with slow speed and passes through second specific position, which drives the displacement mechanism,
It returns the soldering tip quickly and sets original position.
2. drawing solder bonding machine control method as described in claim 1, which is characterized in that the first segment displacement stroke of step a
Then refer to that the soldering tip is moved to the distance of first specific position from home position.
3. drawing solder bonding machine control method as described in claim 1, which is characterized in that in the soldering tip position for carrying out step c or d
When shifting, control which can be heated or be cooled down to the heating element inside the soldering tip.
4. drawing solder bonding machine control method as described in claim 1, which is characterized in that the slow speed in step e
It is identical by the speed of the second specific position to the welded article body as the soldering tip.
5. drawing solder bonding machine control method as described in claim 1, which is characterized in that this quickly returns and sets original in step f
The speed of position is identical as the speed of the first segment displacement stroke.
6. drawing solder bonding machine control method as described in claim 1, which is characterized in that the motor of the displacement mechanism interlocks
One driving section, the driving section are pivotally connected the welding mechanism, to drive the welding mechanism upper and lower displacement.
7. drawing solder bonding machine control method as described in claim 1, which is characterized in that have an adjustment on the welding mechanism
Portion, the soldering tip are configured in the adjustment section, and the disposition of heating component is inside the soldering tip.
8. drawing solder bonding machine control method as described in claim 1, which is characterized in that be somebody's turn to do in addition, the drawing solder mechanism is located at
Below welding mechanism, which is being pulled to a solder reduction below the soldering tip.
9. drawing solder bonding machine control method as described in claim 1, which is characterized in that have one to be located in front of displacement mechanism
And the load carrier below the welding mechanism, there is a plummer, which is welded to carry this on the load carrier
Object.
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CN201711068506.6A CN109746539A (en) | 2017-11-03 | 2017-11-03 | Draw solder bonding machine control method |
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CN201711068506.6A CN109746539A (en) | 2017-11-03 | 2017-11-03 | Draw solder bonding machine control method |
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CN109746539A true CN109746539A (en) | 2019-05-14 |
Family
ID=66398016
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CN201711068506.6A Pending CN109746539A (en) | 2017-11-03 | 2017-11-03 | Draw solder bonding machine control method |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112828440A (en) * | 2021-03-29 | 2021-05-25 | 上海骄成机电设备有限公司 | Welding method of ultrasonic welding machine |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3163765B2 (en) * | 1991-07-02 | 2001-05-08 | 住友電気工業株式会社 | Bonding tool and its manufacturing and handling method |
CN201524857U (en) * | 2009-07-16 | 2010-07-14 | 中山火炬开发区优凯自动化设备厂 | thermocompression bonder |
CN103084694A (en) * | 2011-10-21 | 2013-05-08 | 株式会社工房Pda | Hot pressure welding head, bonding apparatus, bonding method and junction structure of thin line and terminal |
CN103551695A (en) * | 2013-11-04 | 2014-02-05 | 昆山美连德电子科技有限公司 | Wire harness welding machine |
CN204673109U (en) * | 2015-05-12 | 2015-09-30 | 李维良 | Accurate bonding machine |
CN106392295A (en) * | 2016-10-24 | 2017-02-15 | 歌尔股份有限公司 | Thermal compression welding method |
-
2017
- 2017-11-03 CN CN201711068506.6A patent/CN109746539A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3163765B2 (en) * | 1991-07-02 | 2001-05-08 | 住友電気工業株式会社 | Bonding tool and its manufacturing and handling method |
CN201524857U (en) * | 2009-07-16 | 2010-07-14 | 中山火炬开发区优凯自动化设备厂 | thermocompression bonder |
CN103084694A (en) * | 2011-10-21 | 2013-05-08 | 株式会社工房Pda | Hot pressure welding head, bonding apparatus, bonding method and junction structure of thin line and terminal |
CN103551695A (en) * | 2013-11-04 | 2014-02-05 | 昆山美连德电子科技有限公司 | Wire harness welding machine |
CN204673109U (en) * | 2015-05-12 | 2015-09-30 | 李维良 | Accurate bonding machine |
CN106392295A (en) * | 2016-10-24 | 2017-02-15 | 歌尔股份有限公司 | Thermal compression welding method |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112828440A (en) * | 2021-03-29 | 2021-05-25 | 上海骄成机电设备有限公司 | Welding method of ultrasonic welding machine |
CN112828440B (en) * | 2021-03-29 | 2022-06-28 | 上海骄成超声波技术股份有限公司 | Welding method of ultrasonic welding machine |
WO2022206355A1 (en) * | 2021-03-29 | 2022-10-06 | 上海骄成超声波技术股份有限公司 | Ultrasonic welding machine and welding method |
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