CN109742059B - 一种应用于大功率半导体模块“何氏”散热结构 - Google Patents
一种应用于大功率半导体模块“何氏”散热结构 Download PDFInfo
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- CN109742059B CN109742059B CN201910011315.9A CN201910011315A CN109742059B CN 109742059 B CN109742059 B CN 109742059B CN 201910011315 A CN201910011315 A CN 201910011315A CN 109742059 B CN109742059 B CN 109742059B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 101
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 239000000110 cooling liquid Substances 0.000 claims abstract description 66
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000007789 sealing Methods 0.000 claims description 23
- 238000003466 welding Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000012809 cooling fluid Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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CN201910011315.9A CN109742059B (zh) | 2019-01-07 | 2019-01-07 | 一种应用于大功率半导体模块“何氏”散热结构 |
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CN109742059A CN109742059A (zh) | 2019-05-10 |
CN109742059B true CN109742059B (zh) | 2020-09-15 |
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CN111182767B (zh) * | 2019-12-31 | 2022-03-04 | 季华实验室 | 散热器 |
CN115241140B (zh) * | 2022-08-08 | 2023-01-31 | 温州欧乐彩科技有限公司 | 一种具有高效散热结构的耐压型半导体器件 |
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CN103413794A (zh) * | 2013-08-16 | 2013-11-27 | 中国科学院深圳先进技术研究院 | 一种半导体功率器件的散热封装结构 |
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CN107851625A (zh) * | 2015-09-03 | 2018-03-27 | 大陆汽车有限公司 | 冷却装置、用于生产冷却装置的方法及电源电路 |
CN108389841A (zh) * | 2018-04-04 | 2018-08-10 | 肇庆市创业帮信息技术有限公司 | 一种拼接式均温板散热装置 |
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- 2019-01-07 CN CN201910011315.9A patent/CN109742059B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007258624A (ja) * | 2006-03-27 | 2007-10-04 | Toyota Motor Corp | 半導体冷却装置 |
CN200956703Y (zh) * | 2006-08-23 | 2007-10-03 | 李建明 | 翅片式水冷散热器 |
CN101707192A (zh) * | 2009-11-05 | 2010-05-12 | 中国北车股份有限公司大连电力牵引研发中心 | 散热封装结构及其大功率器件管芯的封装方法 |
CN103575140A (zh) * | 2012-07-19 | 2014-02-12 | 格伦格斯有限公司 | 用于电力电子设备和电池冷却的具有焊接管的紧凑型铝换热器 |
CN203628307U (zh) * | 2013-04-18 | 2014-06-04 | 叶雪瑶 | 一种大功率紫外led灯 |
CN103413794A (zh) * | 2013-08-16 | 2013-11-27 | 中国科学院深圳先进技术研究院 | 一种半导体功率器件的散热封装结构 |
CN107851625A (zh) * | 2015-09-03 | 2018-03-27 | 大陆汽车有限公司 | 冷却装置、用于生产冷却装置的方法及电源电路 |
CN105957850A (zh) * | 2016-05-26 | 2016-09-21 | 扬州国扬电子有限公司 | 一种集成散热器的功率模块 |
CN205900530U (zh) * | 2016-08-15 | 2017-01-18 | 华南理工大学 | 一种电液动力微泵驱动的小型液冷系统 |
CN206860280U (zh) * | 2017-06-07 | 2018-01-09 | 东风贝洱热系统有限公司 | 一种波浪形的中冷器内置紊流片 |
CN108389841A (zh) * | 2018-04-04 | 2018-08-10 | 肇庆市创业帮信息技术有限公司 | 一种拼接式均温板散热装置 |
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Address after: No.668 Zhongwu Avenue, Tianning District, Changzhou City, Jiangsu Province Patentee after: Tiger Technology Co.,Ltd. Address before: 213004 No. 38 Fenghuang Road, Tianning District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU TIGER ELECTRONIC MATERIALS TECHNOLOGY Co.,Ltd. |
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