CN109733077A - A kind of substrate positioning method improving print position accuracy - Google Patents
A kind of substrate positioning method improving print position accuracy Download PDFInfo
- Publication number
- CN109733077A CN109733077A CN201910090174.4A CN201910090174A CN109733077A CN 109733077 A CN109733077 A CN 109733077A CN 201910090174 A CN201910090174 A CN 201910090174A CN 109733077 A CN109733077 A CN 109733077A
- Authority
- CN
- China
- Prior art keywords
- substrate
- identification point
- printing
- position accuracy
- positioning method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention relates to a kind of substrate positioning methods for improving print position accuracy, it the described method comprises the following steps: Step 1: the same position in substrate front and back separately designs the duplicate identifiable identification point of quantity, shape, size, identification point and substrate internal wiring simultaneous processing；Step 2: substrate enters printing board, location hole or locating detent chucking substrate are inserted by pilot pin, carry out initial alignment；Step 3: printing board identifies and positions the identification point at substrate front side and the back side, calculate the position deviation value of front and back identification point, the offset that the central value of the deviation is inclined as substrate layer is taken, print head is moved to seal designated position and is printed using the position as absolute standard.For the present invention by finding new printing positioning reference standard in substrate front side and back side design specialized mark, the identification degree that can be effectively improved print position accuracy, promote identification point promotes product appearance quality.
Description
Technical field
The present invention relates to a kind of substrate positioning methods for improving print position accuracy, belong to semiconductor packaging neck
Domain.
Background technique
Traditional seal printing is the Design Orientation hole on substrate, is positioned and is printed in location hole by pilot pin.It beats
Pilot pin is placed in substrate positioning hole when print, but due to following factor, causes seal position deviation larger:
1, substrate aperture can be bigger than normal than pilot pin diameter, and pilot pin is caused easily to be shaken in positioning hole position；
2, location hole and Unit internal wiring are that different phase is processed when substrate is processed, and lead to positioning holes center and base
There is also certain deviations for the relative position at the center plate unit；
3, product cutting according to and the identification point of internal wiring simultaneous processing carry out contraposition cutting, after cutting forming product with
Seal position can also have deviation.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of raising print position accuracy for the above-mentioned prior art
Substrate positioning method, it is by finding new printing positioning reference standard, energy in substrate front side and back side design specialized mark
The identification degree for enough effectively improving print position accuracy, promoting identification point promotes product appearance quality.
The present invention solves the above problems used technical solution are as follows: a kind of substrate positioning for improving print position accuracy
Method the described method comprises the following steps:
Step 1: the same position in substrate front and back separately designs, quantity, shape, size are duplicate to be can recognize
Printing identification point, printing identification point and substrate internal wiring simultaneous processing；
Step 2: substrate enters printing board, location hole or locating detent chucking substrate are inserted by pilot pin, carried out initial
Positioning；
Step 3: printing board identifies and position the printing identification point at substrate front side and the back side, calculates front and back and beat
The position deviation value for printing identification point takes the offset that the central value of the deviation is inclined as substrate layer, and print head is with position work
For absolute standard, it is moved to seal designated position and is printed.
It carries out product cutting after step 4, is carried out pair according to the cutting identification point with internal wiring simultaneous processing when cutting
Position cutting, cutting mark and printing identification point simultaneous processing.
Preferably, the quantity of the identification point in step 1 is at least respectively designed in the horizontal position left edge and right hand edge of substrate
One.
Preferably, the shape of the identification point in step 1 is round, rectangular, T-shaped, cross or ellipse.
Compared with the prior art, the advantages of the present invention are as follows:
A kind of substrate positioning method for improving print position accuracy of the present invention, it passes through in substrate front side and back side design
Specific identity finds new printing positioning reference standard, can effectively improve print position accuracy, promote knowing for identification point
It does not spend, promotes product appearance quality.
Detailed description of the invention
Fig. 1 is the schematic diagram of substrate front side and back side identification point in the present invention.
Fig. 2 is the schematic diagram of edges of boards identification point position in the present invention.
Fig. 3 is the figure opening design diagram of identification point in the present invention.
Fig. 4 is after optimizing by the schematic diagram of the traverse design one of identification point.
Fig. 5 is after optimizing by the schematic diagram of the traverse design two of identification point.
Fig. 6 is the schematic diagram of front and back mark position deviation after molding substrate.
Wherein:
Substrate 1
Front print identification point 2
The back side prints identification point 3
Soldermask layer opening 4
Copper face 5
Electroplated lead 6
Substrate edges 7.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
It is of the present invention it is a kind of improve print position accuracy substrate positioning method, it the following steps are included:
Step 1: as shown in Figure 1, the same position in 1 front and back of substrate separately designs quantity, shape, size complete one
The front print identification point 2 of sample and the back side print identification point 3, and front print identification point 2 and the back side print in identification point 3 and substrate
Portion's route simultaneous processing, purpose lead to substrate front side printing identification point and back side printing mark point in order to compensate for the substrate number of plies more
Set deviation；
As shown in Fig. 2, fringe region of the design of front print identification point 2 in substrate 1, at least in the horizontal position of substrate 1
Left edge and right hand edge respectively design one, and the quantity of identification point is more, and positioning accuracy is higher, and discrimination is higher；
Printing mark dot shape is designed as the figure easy to identify such as round, rectangular, T-shaped, cross, ellipse, and designs
For the opening mode of non-ink covering, the copper face 5 that 4 expose as shown in figure 3, soldermask layer is open forms printing identification point, copper face 5
Shape is recommended as round, rectangular；
When identification point has electroplated lead 6 to pass through, and copper face 5 arrives distance≤0.1mm of substrate edges 7, it is special to design
6 cabling of electroplated lead；As shown in Figure 4, Figure 5, copper face 5 is not to designing electroplated lead 6 between substrate edges 7, and electroplated lead 6 is from copper
Other side cablings of face 5 can prevent substrate scoreboard conducting wire from generating burr, improve the identification degree of identification point；
Step 2: substrate enters printing board, location hole or locating detent chucking substrate are inserted by pilot pin, carried out initial
Positioning, the deviation size of initial alignment do not have any influence to final print position precision；
Step 3: printing board identifies and position the identification point at substrate front side and the back side, front and back printing mark is calculated
Know the position deviation value of point (although devising the identical identification point of quantity, shape, size in front and back same position, often
In one laminar substrate additive process, can all there is that layer is inclined, there is also layers for the front and back printing identification point position after leading to practical forming
Inclined tolerance, as shown in Figure 6), the offset that the central value of the deviation is inclined as substrate layer is taken, print head is using the position as absolutely
To benchmark, it is moved to seal designated position and is printed；
Step 4: single-item cutting is carried out to substrate, according to the cutting mark click-through with internal wiring simultaneous processing when cutting
Row contraposition cutting, cutting identification point and printing identification point simultaneous processing.
Outside above-described embodiment, the invention also includes have other embodiments, all use equivalent transformation or equivalent replacement sides
The technical solution that formula is formed, should all fall within the scope of the hereto appended claims.
Claims (4)
1. a kind of substrate positioning method for improving print position accuracy, it is characterised in that the described method comprises the following steps:
Step 1: the same position in substrate front and back separately designs, quantity, shape, size are duplicate identifiable to be beaten
Print identification point, printing identification point and substrate internal wiring simultaneous processing；
Step 2: substrate enters printing board, location hole or locating detent chucking substrate are inserted by pilot pin, it is initially fixed to carry out
Position；
Step 3: printing board identifies and position the printing identification point at substrate front side and the back side, front and back printing mark is calculated
The position deviation value for knowing point takes the offset that the central value of the deviation is inclined as substrate layer, and print head is using the position as absolutely
To benchmark, it is moved to seal designated position and is printed.
2. a kind of substrate positioning method for improving print position accuracy according to claim 1, it is characterised in that: step
Product cutting is carried out after four, and contraposition cutting is carried out according to the cutting identification point with internal wiring simultaneous processing when product is cut,
Cut identification point and printing identification point simultaneous processing.
3. a kind of substrate positioning method for improving print position accuracy according to claim 1, it is characterised in that: step
The quantity of identification point in one at least respectively designs one in the horizontal position left edge and right hand edge of substrate.
4. a kind of substrate positioning method for improving print position accuracy according to claim 1, it is characterised in that: step
The shape of identification point in one is round, rectangular, T-shaped, cross or ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910090174.4A CN109733077A (en) | 2019-01-30 | 2019-01-30 | A kind of substrate positioning method improving print position accuracy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910090174.4A CN109733077A (en) | 2019-01-30 | 2019-01-30 | A kind of substrate positioning method improving print position accuracy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109733077A true CN109733077A (en) | 2019-05-10 |
Family
ID=66366834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910090174.4A Pending CN109733077A (en) | 2019-01-30 | 2019-01-30 | A kind of substrate positioning method improving print position accuracy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109733077A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005014012A (en) * | 2003-06-24 | 2005-01-20 | Pentax Corp | Drawing aparatus and drawing method |
| US20110032557A1 (en) * | 2008-04-30 | 2011-02-10 | Moisey Bernstein | Printing |
| CN102403307A (en) * | 2010-09-15 | 2012-04-04 | 深圳市九洲光电子有限公司 | LED substrate structure |
| CN102501615A (en) * | 2011-10-12 | 2012-06-20 | 江苏锐毕利实业有限公司 | Rigid printed circuit board spray printing positioning method |
| CN103824904A (en) * | 2014-01-28 | 2014-05-28 | 深圳市九洲光电科技有限公司 | Manufacturing method of LED package substrate |
| CN104638093A (en) * | 2015-02-09 | 2015-05-20 | 深圳市晶台股份有限公司 | Novel LED (Light Emitting Diode) structure encapsulation method |
| CN108845480A (en) * | 2018-08-08 | 2018-11-20 | 中山新诺科技股份有限公司 | A kind of position alignment of inner layer plates accuracy measurement method |
| CN108943094A (en) * | 2018-05-23 | 2018-12-07 | 麦格纳电子（张家港）有限公司 | Circuit board separating and cutting process |
-
2019
- 2019-01-30 CN CN201910090174.4A patent/CN109733077A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005014012A (en) * | 2003-06-24 | 2005-01-20 | Pentax Corp | Drawing aparatus and drawing method |
| US20110032557A1 (en) * | 2008-04-30 | 2011-02-10 | Moisey Bernstein | Printing |
| CN102403307A (en) * | 2010-09-15 | 2012-04-04 | 深圳市九洲光电子有限公司 | LED substrate structure |
| CN102501615A (en) * | 2011-10-12 | 2012-06-20 | 江苏锐毕利实业有限公司 | Rigid printed circuit board spray printing positioning method |
| CN103824904A (en) * | 2014-01-28 | 2014-05-28 | 深圳市九洲光电科技有限公司 | Manufacturing method of LED package substrate |
| CN104638093A (en) * | 2015-02-09 | 2015-05-20 | 深圳市晶台股份有限公司 | Novel LED (Light Emitting Diode) structure encapsulation method |
| CN108943094A (en) * | 2018-05-23 | 2018-12-07 | 麦格纳电子（张家港）有限公司 | Circuit board separating and cutting process |
| CN108845480A (en) * | 2018-08-08 | 2018-11-20 | 中山新诺科技股份有限公司 | A kind of position alignment of inner layer plates accuracy measurement method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103752882B (en) | The boring method of wiring board | |
| CN205071431U (en) | PCB board is with preventing partially to bit architecture | |
| CN205029958U (en) | V -CUT prevents slow -witted graphic structure | |
| CN105430913B (en) | A kind of boring method of printed circuit board | |
| DE3937988C2 (en) | Precision positioning using electrical measurements | |
| CN104023486A (en) | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof | |
| CN110545616A (en) | PCB facilitating layer deviation monitoring and manufacturing method thereof | |
| CN109089381A (en) | A kind of contour processing method of microsize pcb board | |
| CN106961795B (en) | A kind of PCB forming method | |
| CN110418505A (en) | A kind of precision PCB blank plate and its processing molding method | |
| CN109733077A (en) | A kind of substrate positioning method improving print position accuracy | |
| CN104797095B (en) | A kind of rivet machine table top and the printed circuit board (PCB) lamination method using it | |
| CN105043828B (en) | A kind of method of accurate grinding and polishing of PCB microsections in place | |
| CN112867266B (en) | PCB grooving process method | |
| CN107148170B (en) | A kind of partially undesirable method of core material riveting in reduction PCB multilayer board | |
| CN203912365U (en) | Soft and hard multilayer circuit board | |
| CN103025069A (en) | Method for improving outer pattern layer contraposition precision by virtue of exposure PIN pins | |
| CN110740591B (en) | Blind hole processing method of multilayer printed board | |
| CN212519541U (en) | Can improve COB printed wiring board of going technology limit precision | |
| CN107971700A (en) | Simulator locating formula coaming plate high accuracy processing technology | |
| CN114938570A (en) | High-precision PCB processing method | |
| CN104972736B (en) | Engraving method for gravure plate | |
| JPS61125715A (en) | Method for detecting hole mark position on multi-layer printing wiring board | |
| CN207534005U (en) | For the perforating device of circuit board | |
| CN113129368B (en) | PCB direction identification method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190510 |