CN109730108B - Wafer shell inlayer spraying device - Google Patents
Wafer shell inlayer spraying device Download PDFInfo
- Publication number
- CN109730108B CN109730108B CN201910197943.0A CN201910197943A CN109730108B CN 109730108 B CN109730108 B CN 109730108B CN 201910197943 A CN201910197943 A CN 201910197943A CN 109730108 B CN109730108 B CN 109730108B
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- assembly
- cylinder
- spraying
- belt conveying
- mounting plate
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- 238000005507 spraying Methods 0.000 title claims abstract description 64
- 239000000463 material Substances 0.000 claims abstract description 60
- 230000004888 barrier function Effects 0.000 claims abstract description 40
- 238000013519 translation Methods 0.000 claims abstract description 21
- 239000002002 slurry Substances 0.000 claims abstract description 15
- 235000012773 waffles Nutrition 0.000 claims abstract 2
- 210000000078 claw Anatomy 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 3
- 235000019219 chocolate Nutrition 0.000 abstract description 31
- 235000013305 food Nutrition 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 230000005484 gravity Effects 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000015243 ice cream Nutrition 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Confectionery (AREA)
Abstract
The invention discloses a waffle shell inner layer spraying device which comprises a frame, a belt conveying assembly, a barrier strip assembly, a material separating assembly, a grabbing assembly, a spraying assembly and a net belt conveying assembly, wherein the belt conveying assembly is positioned at one end of the frame, the barrier strip assembly is erected above the belt conveying assembly and is parallel to the conveying direction of the belt conveying assembly, the material separating assembly is arranged below a discharge end of the belt conveying assembly, the other side of the material separating assembly is connected with the spraying assembly, the net belt conveying assembly is positioned at the other end of the frame and is connected with the spraying assembly, the grabbing assembly is erected above the material separating assembly, the spraying assembly and the net belt conveying assembly through a translation assembly, a hollow part coating without demoulding is arranged, so that a hollow part of food is downwards sprayed by using a chocolate fountain, redundant chocolate slurry naturally drops due to the action of gravity, a chocolate layer is directly formed in an inner cavity of food, the operation is simple, demoulding is not needed, and the yield is high.
Description
Technical Field
The invention relates to the technical field of food processing, in particular to a wafer shell inner layer spraying device.
Background
In the prior art, a chocolate coating is coated on the inner surface of a concave food such as a egg roll, molten chocolate is poured into a cavity which is used as a mold and is pressed by aluminum foil, the temperature is reduced by cooling, the chocolate is contacted with the cold surface of the mold to be solidified, and then the central part of the chocolate which is still liquid is sucked by a tubular pipe orifice connected with a vacuum storage tank, so that a thin-wall hollow chocolate shell is formed. The pumped chocolate is returned to the tank of the machine by a pump and a pipe heated to bring the chocolate mass to a liquid state. Or in the field of frozen confectionery products there are also methods using cold moulds for producing ice cream in rolls, for example by casting a chocolate layer inside a wafer in rolls. The process involves pouring a liquid chocolate mass into the interior of a wafer of the egg roll and then inserting a cold, conical countermold into the egg roll to disperse the chocolate mass into a thin layer on the interior surface of the wafer of the egg roll.
In any method, chocolate is finally required to be demolded, and in the demolding process, the chocolate shell is thin and fragile and is easy to damage during demolding, and the chocolate shell is easy to be demolded from a mold, so that the yield is low, the processing efficiency is low and the cost for coating the hollow part of the food is high.
Disclosure of Invention
The technical problem to be solved by the invention is to provide the coating of the hollow part without demolding, so that the hollow part of the food is downward, the hollow part is sprayed by using a chocolate fountain, the superfluous chocolate slurry naturally drops under the action of gravity, a chocolate layer is directly formed in the inner cavity of the food, the operation is simple, the demolding is not needed, and the yield is high.
In order to solve the technical problems, the invention provides a wafer shell inner layer spraying device which comprises a frame, a belt conveying component, a barrier strip component, a material distributing component, a material grabbing component, a spraying component and a net belt conveying component, wherein the belt conveying component is positioned at one end of the frame, the barrier strip component is arranged above the belt conveying component and is parallel to the conveying direction of the belt conveying component, the material distributing component is arranged below the discharging end of the belt conveying component, the other side of the material distributing component is connected with the spraying component, the net belt conveying component is positioned at the other end of the frame and is connected with the spraying component, and the material grabbing component is arranged above the material distributing component, the spraying component and the net belt conveying component through a translation component.
Further, the feed distribution assembly comprises a feed distribution mounting seat, a moving cylinder, a first linear sliding rail, a moving plate, a first upper cylinder, a first lower cylinder, a positioning mounting plate and a positioning head, wherein the moving cylinder is mounted on one end of the feed distribution mounting seat, which is close to the belt conveying assembly, in the transmission direction, the first linear sliding rail is fixed on the feed distribution mounting seat on two sides of the moving cylinder, the moving cylinder pushes the moving plate to move along the first linear sliding rail, the first upper cylinder and the second cylinder are mounted on the moving plate upwards, the positioning mounting plate is connected with the first upper cylinder and the second cylinder, and the positioning head is mounted on the positioning mounting plate.
Further, a guide post is arranged on the moving plate, and a guide seat opposite to the guide post is arranged on the positioning mounting plate.
Further, the grabbing component comprises an upper cylinder mounting plate, a lower cylinder mounting plate, a second upper cylinder, a second lower cylinder, a material claw mounting plate and a material claw, wherein the upper cylinder mounting plate and the lower cylinder mounting plate are connected with the translation component, the second upper cylinder and the lower cylinder are downwards mounted on the upper cylinder mounting plate and the lower cylinder mounting plate, the material claw mounting plate is connected with the second upper cylinder and the lower cylinder, and the material claw is mounted below the material claw mounting plate.
Further, the blend stop subassembly includes blend stop support and blend stop, the blend stop support erect in the frame both sides, the blend stop support is provided with two at least along transmission direction, the blend stop sets up along transmission direction, just the blend stop is fixed in the double-screw bolt below, be provided with in the frame double-screw bolt complex swivel nut.
Further, the position of the barrier strip at the feeding end is set to be a sharp angle structure.
Further, the spraying subassembly includes spraying mount pad, spraying motor, feed screw and thick liquids container, the spraying motor install in spraying mount pad lower surface, the feed screw is located spraying mount pad top and connect the spraying motor, the feed screw lower extreme is located inside the thick liquids container, the feed screw upper end stretches out the frame upper surface.
Further, a material cylinder is arranged below the mesh belt transmission assembly, and guide plates connected with the material cylinder are further arranged at two ends of the mesh belt transmission assembly.
Further, the translation subassembly includes translation support, multiposition cylinder and second linear slide rail, the translation support includes triangle-shaped cylinder mount and rectangle slide rail mount, multiposition cylinder one end is fixed in triangle-shaped summit, the other end with the slide rail mount meets, the second linear slide rail is fixed in the slide rail mount just is located multiposition cylinder both sides.
Further, the upper surface of the frame is provided with a material hole corresponding to the material distributing assembly and the spraying assembly.
Compared with the prior art, the wafer shell inner layer spraying device has the beneficial effects that the hollow part coating is not required to be demoulded, so that the hollow part of food is downwards sprayed, the hollow part is sprayed by using a chocolate fountain, redundant chocolate slurry naturally drops due to the action of gravity, a chocolate layer is directly formed in the inner cavity of the food, the operation is simple, the demoulding is not required, and the yield is high.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a front view of the dispensing assembly of the present invention.
Fig. 3 is a side view of a dispensing assembly of the present invention.
Fig. 4 is a side view of the present invention of a gripper assembly.
Fig. 5 is a front view of the present invention.
FIG. 6 is a front view of the barrier strip assembly of the present invention.
FIG. 7 is a top view of the barrier rib assembly of the present invention.
Fig. 8 is a top view of the translation assembly of the present invention.
Fig. 9 is a top view of the frame structure of the present invention.
Description of the embodiments
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Referring to fig. 1, an embodiment of a spraying device for inner layers of wafer shells 100 according to the present invention includes a frame 10, a belt conveying component 20, a barrier strip component 30, a material distributing component 40, a material grabbing component 50, a spraying component 60 and a mesh belt conveying component 70, where the belt conveying component 20 is located at one end of the frame 10 and is connected with a production device of the previous step, in this embodiment, the wafer shells 100 produced in the previous step are conveyed to the belt conveying component 20 in a hollow downward reverse buckling posture, the barrier strip component 30 is erected above the belt conveying component 20 and is parallel to the conveying direction of the belt conveying component 20, the wafer shells 100 entering the belt conveying component 20 are orderly arranged along the conveying direction of the belt conveying component 20 under the barrier of the barrier strip component 30, the material distributing component 40 is disposed below the discharge end of the belt conveying component 20 for convenience of subsequent operations, when the wafer shells 100 are output from the belt conveying assembly 20, the separating assembly 40 jacks up the wafer shells 100 from the lower side to separate the wafer shells from other wafer shells 100, so as to be convenient for the grabbing assembly 50 to grab, the other side of the separating assembly 40 is connected with the spraying assembly 60, the net belt conveying assembly 70 is positioned at the other end of the frame 10 and is connected with the spraying assembly 60, the grabbing assembly 50 is erected above the separating assembly 40, the spraying assembly 60 and the net belt conveying assembly 70 through the translation assembly 90, after the separating assembly 40 separates part of the wafer shells 100 from other wafer shells 100 on the belt conveying assembly 20, the grabbing assembly 50 grabs the wafer shells 100 on the separating assembly 40, moves to the upper side of the spraying assembly 60, the spraying assembly 60 upwards sprays chocolate paste, the hollow part of the wafer shells 100 is coated with a layer of chocolate paste, the material grabbing component 50 grabs the wafer shell 100 and moves to the upper portion of the mesh belt conveying component 70 along the translation component 90, chocolate slurry attached to the surface of the wafer shell 100 is quickly solidified on the surface of the wafer shell 100 to form a chocolate shell, and excessive chocolate slurry falls on the mesh belt conveying component 70 due to the action of gravity and drops downwards through a mesh belt, in this embodiment, in order to collect excessive chocolate slurry falling from the wafer shell 100, a material cylinder 80 is arranged below the mesh belt conveying component 70, and guide plates 71 connected with the material cylinder 80 are further arranged at two ends of the mesh belt conveying component 70, so that the chocolate slurry dropped from the wafer shell 100 can be collected.
Referring to fig. 2 and 3, a schematic structural diagram of a distributing assembly 40 according to the present invention is shown, the distributing assembly 40 includes a distributing mounting seat 401, a moving cylinder 402, a first linear slide rail 403, a moving plate 404, a first up-down cylinder 405, a positioning mounting plate 406, and a positioning head 407, the moving cylinder 402 is mounted on one end of the distributing mounting seat 401 near the belt conveying assembly 20 along the transmission direction, so that the moving cylinder 402 can push the positioning head 407 to be near or far away from the belt conveying assembly 20, the first linear slide rail 403 is fixed on the distributing mounting seat 401 on two sides of the moving cylinder 402, a pair of slide rails are symmetrically arranged, so that the moving plate 404 mounted on the moving cylinder 403 can be guaranteed to move along the first linear slide rail 403, the first up-down cylinder 405 is mounted on the moving plate 404, the positioning mounting plate 406 is connected with the first up-down cylinder 405, the first up-down cylinder 405 pushes the positioning mounting plate 406 to jack up the wafer shells 100, the positioning head 406 is mounted on the positioning mounting plate 40, and the positioning head is arranged on the same number of the wafer shells 100, and the positioning head is capable of completing the positioning of the wafer shells 100 being completely separated from the belt conveying assembly 40 by one time, and the number of the wafer carrier assembly is completely separated from the carrier assembly 100. In this embodiment, since the area of the positioning mounting plate 406 is larger, in order to ensure the stability of the positioning mounting plate 406, the moving plate 404 is provided with a guide post 408, and the positioning mounting plate 406 is provided with a guide seat 409 opposite to the guide post 408, so that when the first up-down cylinder 405 pushes the positioning mounting plate 406 up-down, the positioning mounting plate 406 will not shake or deviate.
Referring to fig. 4 and 5, a schematic structural diagram of a material grabbing assembly 50 according to the present invention is shown, the material grabbing assembly 50 includes an upper and lower cylinder mounting plate 501, a second upper and lower cylinder 502, a material claw mounting plate 503 and a material clamping claw 504, the upper and lower cylinder mounting plate 501 is connected to the translation assembly 90, the translation assembly 90 drives the translation, the second upper and lower cylinder 502 is mounted downward on the upper and lower cylinder mounting plate 501, the material claw mounting plate 503 is connected to the second upper and lower cylinder 502, the second upper and lower cylinder 502 pushes the material claw mounting plate 503 to grab the wafer shells 100 on the positioning head 407 downward, the material clamping claw 504 is mounted under the material claw mounting plate 503, the material clamping claw 504 corresponds to the positioning head 407 one by one, and when the wafer shells 100 are transported on the belt conveying assembly 20, the front and rear wafer shells 100 are connected, and a certain distance exists between the three positioning heads 407, in order to enable the 3-row positioning heads 407 to lift the corresponding wafer shells 100, when the first-row wafer shells 100 are moved out of the belt conveying assembly 20, the first-row positioning head 407 closest to the belt conveying assembly 20 lifts the wafer shells 100, then the moving cylinder 402 pushes the positioning head 407 away from the belt conveying assembly 20 so as to move the positioning head to the position below the corresponding first-row clamping claw 504, the first-row clamping claw 504 picks up the wafer shells 100 on the first-row positioning head 407, then the moving cylinder 402 withdraws the positioning head 407, the second-row wafer shells 100 move out of the belt conveying assembly 20, the first-row positioning head 407 which has been empty lifts the wafer shells 100, and at the same time the first-row clamping claw 504 corresponds to the second-row wafer shells 100, at the position, the gripper assembly 50 moves down, places the wafer shells 100 on the first-row clamping claw 504 on the second-row positioning head 407, and so on, until the wafer shells 100 are positioned on the three-row positioning heads 407, at this time, the positioning heads 407 are pushed out by the moving cylinders 402, the three-row positioning heads 407 correspond to the three rows of clamping claws 504, the material grabbing assembly 50 moves downwards, the clamping claws 504 simultaneously grab the three rows of positioned wafer shells 100, and the three rows of clamping claws move to the position above the spraying assembly 60 to spray the lower surfaces of the wafer shells 100 in the state.
Referring to fig. 6 and 7, the barrier rib assembly 30 includes a barrier rib bracket 302 and a barrier rib 301, the barrier rib bracket 302 is disposed on two sides of the frame 10, at least two barrier rib brackets 302 are disposed along the transmission direction, the barrier rib 301 is disposed along the transmission direction, and the barrier rib 301 is fixed below the stud 303, the frame 10 is provided with a rotating nut 304 matched with the stud 303, because the barrier rib 301 is longer, when only one position of the barrier rib 301 is fixed, two ends of the barrier rib 301 are easy to shake and change positions, resulting in irregular alignment of the wafer shells 100, and the barrier rib 301 is fixed below the stud 303, the height of the barrier rib 301 is adjustable, when the height of the wafer shells 100 is lower, the barrier rib 301 is disposed close to the upper surface of the frame 10, and when the height of the wafer shells 100 is higher, the barrier rib 301 is disposed far from the upper surface of the frame 10, because the wafer shells 100 are not standard cylinders, the wafer shells 100 on the belt conveying assembly 20 are in a structure with small top and the large bottom, and the barrier rib assemblies 20 are not beneficial to the transmission of the wafer shells 100. Further, in order to enable the wafer shells 100 to smoothly move along the separation of the barrier strips 301 within the range of entering the barrier strips 301, the position of the barrier strips 301 at the feeding end is set to be in a sharp angle structure, so that the wafer shells 100 can conveniently enter between adjacent barrier strips 301.
Referring to fig. 1, the spraying assembly 60 includes a spraying mounting seat 601, a spraying motor 602, a feeding screw 603, and a slurry container 604, the spraying motor 602 is mounted on the lower surface of the spraying mounting seat 601, which saves space, the feeding screw 603 is located above the spraying mounting seat 601 and is connected with the spraying motor 602, the spraying motor 602 drives the feeding screw 603 to rotate, the lower end of the feeding screw 603 is located inside the slurry container 604, i.e. the lower end of the feeding screw 603 is located in slurry, along with the rotation of the feeding screw 603, the slurry located at the lower end of the feeding screw 603 moves upwards under the driving of the feeding screw 603 until being transferred to the top end of the feeding screw 603 and then drops, the upper end of the feeding screw 603 extends out of the upper surface of the frame 10, the slurry transferred by the feeding screw 603 is also exposed out of the upper surface of the frame 10, after the gripper assembly 50 drives the gripped wafer shell 100 to move above the spraying assembly 60, the gripper jaw 504 moves down, the wafer shell 100 contacts with the top end of the feeding screw 603, the chocolate slurry is sprayed onto the lower surface of the wafer shell 100, and the gripper jaw 504 is moved one by one time, and the number of grippers 504 are aligned with the number of the gripper jaw 504. The wafer shells 100 after spraying are driven by the clamping claws 504 to move above the mesh belt conveying assembly 70, the wafer shells 100 are placed on the mesh belt conveying assembly 70, the clamping claws 504 move to the initial positions, and the next round of wafer shells 100 spraying is started. The wafer shells 100 located on the web transfer assembly 70 drain the excess chocolate mass itself during the transfer process and after complete draining the wafer shells 100 are sent to the next station.
Referring to fig. 8, a schematic structural diagram of a translation assembly 90 according to the present invention is shown, where the translation assembly 90 includes a translation bracket 901, a multi-position cylinder 902, and a second linear slide 903, and because the material grabbing assembly 50 needs to stay at multiple positions, in this embodiment, the multi-position cylinder 902 is used to push the material grabbing assembly 50 to move, and in other embodiments, the translation bracket 901 includes a triangular cylinder fixing frame 901a and a rectangular slide fixing frame 901b, one end of the multi-position cylinder 902 is fixed at a vertex of the triangle, and the other end of the multi-position cylinder 902 is connected with the slide fixing frame 901b, so as to ensure the fixation stability of the multi-position cylinder 902, and the second linear slide 903 is fixed on the slide fixing frame 901b and is located on two sides of the multi-position cylinder 902. Providing two slide rails can ensure the stability of the grabbing assembly 50 mounted thereon.
Referring to fig. 9, which is a top view of the structure of the frame 10 according to the present invention, the upper surface of the frame 10 is provided with material holes 101 corresponding to the material distributing assembly 40 and the spraying assembly 60, so as to facilitate the operation of the material distributing assembly 40 and the spraying assembly 60.
The above-described embodiments are merely preferred embodiments for fully explaining the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutions and modifications will occur to those skilled in the art based on the present invention, and are intended to be within the scope of the present invention. The protection scope of the invention is subject to the claims.
Claims (9)
1. The waffle shell inner layer spraying device is characterized by comprising a frame, a belt conveying assembly, a barrier strip assembly, a material distributing assembly, a material grabbing assembly, a spraying assembly and a mesh belt conveying assembly,
the belt conveying assembly is positioned at one end of the frame, the barrier strip assembly is erected above the belt conveying assembly and is parallel to the conveying direction of the belt conveying assembly, the material distributing assembly is arranged below the discharging end of the belt conveying assembly, the other side of the material distributing assembly is connected with the spraying assembly, the mesh belt conveying assembly is positioned at the other end of the frame and is connected with the spraying assembly, a material cylinder is arranged below the mesh belt conveying assembly, and the material grabbing assembly is erected above the material distributing assembly, the spraying assembly and the mesh belt conveying assembly through the translation assembly;
the spraying assembly comprises a spraying installation seat, a spraying motor, a feed screw and a slurry container, wherein the spraying motor is installed on the lower surface of the spraying installation seat, the feed screw is located above the spraying installation seat and connected with the spraying motor, the lower end of the feed screw is located inside the slurry container, and the upper end of the feed screw extends out of the upper surface of the frame.
2. The wafer shell inner layer spraying device according to claim 1, wherein the material distributing assembly comprises a material distributing mounting seat, a movable air cylinder, a first linear sliding rail, a movable plate, a first upper air cylinder, a first lower air cylinder, a positioning mounting plate and a positioning head, the movable air cylinder is mounted on one end, close to the belt conveying assembly, of the material distributing mounting seat in the conveying direction, the first linear sliding rail is fixed on the material distributing mounting seat on two sides of the movable air cylinder, the movable air cylinder pushes the movable plate to move along the first linear sliding rail, the first upper air cylinder and the lower air cylinder are mounted on the movable plate upwards, the positioning mounting plate is connected with the first upper air cylinder and the first lower air cylinder, and the positioning head is mounted on the positioning mounting plate.
3. The wafer shell inner layer spraying device according to claim 2, wherein a guide post is arranged on the moving plate, and a guide seat opposite to the guide post is arranged on the positioning mounting plate.
4. The wafer shell inner layer spraying device according to claim 1, wherein the material grabbing component comprises an upper cylinder mounting plate, a lower cylinder mounting plate, a second upper cylinder, a lower cylinder, a material claw mounting plate and a material clamping claw, the upper cylinder mounting plate and the lower cylinder mounting plate are connected with the translation component, the second upper cylinder and the lower cylinder are downwards mounted on the upper cylinder mounting plate and the lower cylinder mounting plate, the material claw mounting plate is connected with the second upper cylinder and the lower cylinder, and the material clamping claw is mounted below the material claw mounting plate.
5. The wafer shell inner layer spraying device according to claim 1, wherein the barrier strip assembly comprises barrier strip brackets and barrier strips, the barrier strip brackets are arranged on two sides of the frame, the barrier strip brackets are at least two in the transmission direction, the barrier strips are arranged in the transmission direction, the barrier strips are fixed below the studs, and the frame is provided with rotating nuts matched with the studs.
6. The wafer shell inner layer spraying apparatus of claim 5 wherein the barrier strip is disposed in a pointed configuration at the feed end.
7. The wafer shell inner layer spraying device according to claim 1, wherein two ends of the mesh belt transmission assembly are further provided with guide plates connected with the material cylinder.
8. The wafer shell inner layer spraying device according to claim 1, wherein the translation assembly comprises a translation bracket, a multi-position cylinder and a second linear slide rail, the translation bracket comprises a triangular cylinder fixing frame and a rectangular slide rail fixing frame, one end of the multi-position cylinder is fixed at a triangular vertex, the other end of the multi-position cylinder is connected with the slide rail fixing frame, and the second linear slide rail is fixed on the slide rail fixing frame and is positioned on two sides of the multi-position cylinder.
9. The wafer shell inner layer spraying device according to claim 1, wherein the upper surface of the frame is provided with a material hole corresponding to the material distributing component and the spraying component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910197943.0A CN109730108B (en) | 2019-03-15 | 2019-03-15 | Wafer shell inlayer spraying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910197943.0A CN109730108B (en) | 2019-03-15 | 2019-03-15 | Wafer shell inlayer spraying device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109730108A CN109730108A (en) | 2019-05-10 |
| CN109730108B true CN109730108B (en) | 2024-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910197943.0A Active CN109730108B (en) | 2019-03-15 | 2019-03-15 | Wafer shell inlayer spraying device |
Country Status (1)
| Country | Link |
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| CN (1) | CN109730108B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111567658B (en) * | 2020-05-28 | 2023-04-11 | 安徽省好朋友食品有限公司 | A coating equipment for chocolate production |
| CN112450247A (en) * | 2020-11-30 | 2021-03-09 | 丽水市莲都区汇聚机械设计工作室 | Filling material absorbing and recycling device of biscuit production equipment |
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| CN209965107U (en) * | 2019-03-15 | 2020-01-21 | 苏州永德胜模具科技有限公司 | Wafer shell inner layer spraying device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7322310B2 (en) * | 2003-10-28 | 2008-01-29 | Norse Dairy Systems, Inc. | Conical shell grasping and retaining apparatus, method for coating inverted conical shells, and modular and reconfigurable frozen cone confection manufacturing system and method |
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|---|---|---|---|---|
| JP2004290947A (en) * | 2003-03-25 | 2004-10-21 | Nordson Kk | Method for coating inner surface of hollow cubic object to be coated with liquid or molten material |
| CA2486018A1 (en) * | 2004-10-28 | 2006-04-28 | Nestec S.A. | Method, apparatus, and system for coating food items |
| JP2007097540A (en) * | 2005-10-07 | 2007-04-19 | Kanebo Foods Ltd | Corn cup, method for producing the same, corn-cup frozen sweet by using the same, method for preventing moisture absorption into corn cup, method for producing corn cup frozen sweet, device for producing corn cup frozen sweet and gripping tool |
| CN103892029A (en) * | 2012-12-25 | 2014-07-02 | 内蒙古伊利实业集团股份有限公司 | Brittle cream cone drinking chocolate inward-spraying apparatus and method for spraying chocolate by applying brittle cream cone drinking chocolate inward-spraying apparatus |
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| Publication number | Publication date |
|---|---|
| CN109730108A (en) | 2019-05-10 |
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