CN1097220C - Computer chip and heat sink assembly and its making method - Google Patents
Computer chip and heat sink assembly and its making method Download PDFInfo
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- CN1097220C CN1097220C CN98106288A CN98106288A CN1097220C CN 1097220 C CN1097220 C CN 1097220C CN 98106288 A CN98106288 A CN 98106288A CN 98106288 A CN98106288 A CN 98106288A CN 1097220 C CN1097220 C CN 1097220C
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- computer chip
- radiator
- matrix
- membrane module
- heat transfer
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Abstract
The present invention relates to an assembly of a computer chip and a heat sink and a making method thereof. The assembly of a computer chip and a heat sink comprises a computer chip, a heat sink and a heat transfer medium which is positioned between the computer chip and the heat sink, wherein the computer chip has a top surface and is electrically connected with a switching circuit on a mainboard through an electric connector; the heat sink is provided with a basal body and a plurality of heat radiating fins, wherein the bottom surface of the basal body is butted with the top surface of the computer chip; the heat transfer medium is coated between the top surface of the computer chip and the bottom surface of the basal body of the heat sink, and is used for filling a gap between the top surface of the computer chip and the bottom surface of the basal body of the heat sink.
Description
Technical field
The present invention relates to a kind of computer chip and radiator subassembly and constructive method thereof, particularly relate to and a kind ofly reduce manpower and man-hour, heat-transfer effect is good, and obtains easy, the cheap computer chip of its heat transfer medium and radiator subassembly and constructive method thereof.
Background technology
Along with the fast development of computerized information industry, the various electric devices of the inner installing of computer are also increasing, for example: chip, power supply unit, disk drive, CD player etc.Because each electric device in the course of the work, the capital produces certain heat, wherein, especially should be noted that the heat that the central processing unit chip produces can accelerate and corresponding increase along with the computer arithmetic speed, therefore the heat radiation of settlement computer inside how effectively, guaranteeing that central processing unit works under suitable temperature, make the pcs signal transmission stable and ensure the quality of products, is the problem that must solve at present.
In the known technology, the technology that solves the central processing unit chip cooling can be with reference to United States Patent (USP) the 5th, 019,940,5,276,585,5,436,798,5,486,981,5,590,025 and 5,594, No. 624 etc., these patents are all utilized the bottom surface of radiator, directly with the end face butt of central processing unit chip, and heat diffusion and the discharge rapidly that the central processing unit chip is produced.
This mode with radiator bottom surface direct butt central processing unit chip end face, heat-transfer effect between its radiator and the central processing unit chip depends on the flatness of radiator bottom surface and central processing unit chip end face, and two contact pressure between the surface, if the flatness on two surfaces is not good, or the contact pressure deficiency between the interface, can cause existing between two surfaces some slits, and in the slit residual air, very easily increase the heat transfer impedance between two surfaces thus, have a strong impact on the heat-transfer effect between radiator and the central processing unit chip, for addressing the above problem, generally can between two surfaces, increase by a heat transfer medium, Pasting heat transfer adhesive tape (thermal tape) or smear heat transfer fat (thermal grease) etc. between two surfaces for example, to fill up the slit between radiator bottom surface and the central processing unit chip end face, avoid air residual and influence heat-transfer effect.
Though the mode of this utilization heat transfer adhesive tape or heat transfer fat filling chink can be improved heat-transfer effect, but this class heat transfer adhesive tape or heat transfer fat not only cost an arm and a leg, and market supply is few, generally only there is manufacturer of several family to make supply (as 3M, Thermagon, Chomerics, Bergquist etc.), rule of origin is limited, moreover, also there are following shortcoming in these heat transfer adhesive tapes or heat transfer fat:
1. heat transfer tape portion:
The heat transfer adhesive tape roughly is divided into two types of single face gum and two-sided gums, need during use to tear off with the barrier paper that manually will stick on the gum earlier, utilize the viscosity of gum again, with the heat transfer adhesive tape stick on radiator bottom surface or (single face gum pattern)/and the appropriate location of (two-sided gum pattern) central processing unit chip end face on.Clearly, this earlier with manually tearing the mode that barrier paper is pasted again off, need more manpower and man-hour, and its heat-transfer effect is also not really desirable, even in some known technology, or because of the high heat transfer impedance of heat transfer adhesive tape itself, or, reduce the heat-transfer effect between central processing unit chip and the radiator on the contrary because of pasting out-of-flatness.
2. heat transfer fat part:
Utilize heat transfer fat directly to spread upon mode on radiator bottom surface or the central processing unit chip end face, compare with the heat transfer adhesive tape, though save manpower and man-hour, but these heat transfer fat are thick at normal temperatures, very easily dirty, can't guarantee quality, and be difficult to smear evenly, thus the heat-transfer effect when influence is used.
So, how to utilize a kind of cheap, obtain easily, steady quality, the heat transfer medium that can reduce manpower and man-hour simultaneously, to improve the heat transfer quality between radiator and the central processing unit chip, be the problem that must solve.
Summary of the invention
The object of the present invention is to provide the stable computer chip of a kind of heat-transfer effect and radiator subassembly and constructive method thereof.
Another object of the present invention is to provide a kind of computer chip that can reduce manpower and man-hour and radiator subassembly and constructive method thereof.
Another object of the present invention is to provide a kind of computer chip and radiator subassembly and constructive method thereof, its heat transfer medium cheap and obtaining easily.
The object of the present invention is achieved like this, and a kind of computer chip and radiator subassembly promptly are provided, and it comprises: a computer chip has an end face, and is electrically connected with interlock circuit on the motherboard through an electric connector; One radiator has a matrix and several radiating fins, the end face butt of the bottom surface of this matrix and described computer chip; Wax shape heat transfer medium between described computer chip end face and described radiator matrix bottom surface, and is filled up slit between described computer chip end face and the described radiator matrix bottom surface; This wax shape heat transfer medium has suitable fusing point, and its heat that absorbs described computer chip is by the solid-state liquid state that is melted into.
The present invention also comprises the constructive method of a kind of computer chip and radiator subassembly, and it comprises: a computer chip is provided, and it is electrically connected with interlock circuit on the motherboard through an electric connector, and it has an end face; One radiator is provided, and it has a matrix and several radiating fins, and this matrix has a bottom surface; One wax shape heat transfer medium is spread upon on the appropriate location of described radiator matrix bottom surface equably, and this wax shape heat transfer medium has suitable fusing point, and the heat that described computer chip produced will make it by the solid-state liquid state that is melted into; This radiator is seated on the described computer chip, makes the end face butt of described radiator matrix bottom surface and described computer chip.
The present invention also comprises the constructive method of a kind of computer chip membrane module and radiator subassembly, and it comprises: a computer chip membrane module is provided, and its inside is provided with sub-circuit board, computer chip and some electrical equipments, and it forms a plate body in a side; One radiator is provided, and it has a matrix and several radiating fins, and this matrix has a bottom surface; One wax shape heat transfer medium is spread upon on the appropriate location of described radiator matrix bottom surface equably, and this wax shape heat transfer medium has suitable fusing point, and the heat that computer chip produced will make it by the solid-state liquid state that is melted into; With the bottom surface of radiator matrix and the plate body butt of computer chip membrane module.
The present invention also comprises a kind of computer chip membrane module and radiator subassembly, and it comprises: a computer chip membrane module, its inside are provided with sub-circuit board, computer chip and some electric devices, and form a plate body in the one side; One radiator has a matrix and several radiating fins, the plate body butt of the bottom surface of this matrix and described computer chip membrane module; Wax shape heat transfer medium is between described computer chip membrane module plate body and described radiator matrix bottom surface, in order to fill up the slit between described computer chip membrane module plate body and the described radiator matrix bottom surface; This wax shape heat transfer medium has suitable fusing point, and the heat that described computer chip work produces will make it by the solid-state liquid state that is melted into.
The advantage of apparatus of the present invention and method is, owing to scribble cured shape medium between its computer chip and the radiator matrix, its heat-transfer effect is fine, minimizing manpower and expending man-hour, and medium obtains easily, and cheap.
Description of drawings
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Fig. 1 is the three-dimensional exploded view of computer chip of the present invention and radiator subassembly and constructive method thereof;
Fig. 2 is the three-dimensional combination figure of computer chip of the present invention and radiator subassembly and constructive method thereof;
Fig. 3 is the cut-open view along III-III line among Fig. 2;
Fig. 4 is the three-dimensional exploded view of another embodiment of the present invention.
Concrete implementation content
Please consult Fig. 1, Fig. 2 and Fig. 3 simultaneously, computer chip of the present invention and radiator subassembly comprise: a central processing unit chip 10, a radiator 20 and the heat transfer medium 30 between central processing unit chip 10 and radiator 20.This central processing unit chip 10 is plugged on the electric connector (figure does not show), and is electrically connected with the last interlock circuit of motherboard (figure does not show); Radiator 20 has the tabular matrix 22 that slightly is square, and several and matrix 22 are one-body molded and towards leaving the radiating fin 24 that central processing unit chip 10 directions are extended, these several radiating fins 24 slightly are column, with the array way deploying, the end face butt of the bottom surface of this matrix 22 and central processing unit chip 10; Heat transfer valency matter 30 directly spreads upon on the appropriate location of radiator 20 bottom surfaces (also can spread upon central processing unit chip 10 end faces) (generally spreading upon middle body), smear certain area (the central processing unit chip that is generally 5cm * 5cm is smeared the square area of 2.5cm * 2.5cm approximately) simultaneously, this heat transfer medium 30 is a wax, therefore can spread upon on the bottom surface of radiator 20 equably, and steady quality dirty its thing that can't flow, this wax shape heat transfer medium 30 is very common on the market, as in order to smear the light wax of apple surface, or other suitable wax or gypsum etc., cheap and obtain easily.When 10 work of central processing unit chip produce heat and make environment temperature rise to a certain degree, this wax shape heat transfer medium 30 will be by the solid-state liquid state that is melted into, thereby has a good flowability, to fill up the slit (see figure 3) between radiator 20 bottom surfaces and central processing unit chip 10 end faces, avoid air to residue in the slit and influence heat-transfer effect, and the experiment proved that this wax shape heat transfer medium 30 can be selected the material of fusing point about about 65 ℃.
The constructive method of this computer chip and radiator subassembly is as follows:
1. central processing unit chip 10 is plugged on the electric connector (figure do not show), is electrically connected with interlock circuit on the motherboard (scheming not show) by this electric connector, this central processing unit chip 10 has an end face.
2. this radiator 20 is provided, and it has a matrix 22 and several radiating fins 24, and this matrix 22 has a bottom surface.
3. wax shape heat transfer medium 30 is spread upon equably on the appropriate location of radiator 20 matrixes 22 bottom surfaces.
4. radiator 20 is seated on the central processing unit chip 10, makes the bottom surface of radiator 20 matrixes 22 and the end face butt of central processing unit chip 10.
See also Fig. 4, it is the three-dimensional exploded view of another embodiment of the present invention, and it comprises a central processing unit membrane module 40, a radiator 50 and the heat transfer medium 60 between central processing unit membrane module 40 and radiator 50.This central processing unit membrane module 40 comprises a rectangle box-shaped shell 42, be positioned at the plate body 44 of shell 42 sides and radiator 50 butts and be located at shell 42 and the sub-circuit board of plate body 44 inside, central processing unit chip and other electric device etc. (figure does not show), consider the good heat transfer effect, between central processing unit chip and plate body 44, also can increase heat transfer medium (figure does not show) again, offer plurality of holes on this plate body 44; Radiator 50 comprises a long flat plate shape matrix 52, and several and matrix 52 are one-body molded and extend and radiating fin 54 in the form of sheets towards leaving in central processing unit membrane module 40 directions, plate body 44 butts of the bottom surface of this matrix 52 and central processing unit membrane module 40, these several radiating fins 54 extend along the longitudinally of matrix 52 in parallel with each other, and all form a pair of groove 56 on each radiating fin 54; Wax shape heat transfer medium 60 is spread upon equably on the appropriate location of radiator 50 bottom surfaces (or plate body 44 end faces of central processing unit membrane module 40), and smear suitable area, to fill up the slit between radiator 50 bottom surfaces and central processing unit membrane module 40 plate bodys 44 end faces, avoid air to remain in the slit and influence heat-transfer effect.
The constructive method of this embodiment is as follows:
1. this central processing unit membrane module 40 is provided, it comprises a rectangle box-shaped shell 42, is positioned at the plate body 44 of shell 42 sides and is located at shell 42 and the sub-circuit board of plate body 44 inside, central processing unit chip and other electric device etc. (figure does not show) offer plurality of holes on this plate body 44.
2. radiator 50 is provided, and it has a matrix 52 and several radiating fins 54, and this matrix 52 has a bottom surface.
3. wax shape heat transfer medium 60 is spread upon equably on the appropriate location of radiator 50 matrixes 52 bottom surfaces.
4. with the bottom surface of radiator 50 matrixes 22 and plate body 44 butts of central processing unit membrane module 40.
Below only embodiments of the invention are described, but can not be limited the present invention, various variations or modification according to spirit of the present invention is done all are included in the claim of the present invention.
Claims (22)
1. computer chip and radiator subassembly is characterized in that it comprises:
One computer chip has an end face, and is electrically connected with interlock circuit on the motherboard through an electric connector;
One radiator has a matrix and several radiating fins, the end face butt of the bottom surface of described matrix and described computer chip;
Wax shape heat transfer medium between described computer chip end face and described radiator matrix bottom surface, and is filled up slit between described computer chip end face and the described radiator matrix bottom surface;
Described wax shape heat transfer medium has suitable fusing point, and its heat that absorbs described computer chip is by the solid-state liquid state that is melted into.
2. computer chip as claimed in claim 1 and radiator subassembly is characterized in that, the fusing point of described wax shape heat transfer medium is about 65 ℃.
3. computer chip as claimed in claim 1 or 2 and radiator subassembly is characterized in that, described wax shape heat transfer medium is applied in radiator matrix bottom surface and computer chip end face among both on any appropriate location at least.
4. computer chip as claimed in claim 1 or 2 and radiator subassembly is characterized in that described computer chip directly is inserted on the described electric connector.
5. computer chip as claimed in claim 1 or 2 and radiator subassembly is characterized in that, the matrix of the described radiator tabular body that is square, described several radiating fins and matrix is one-body molded and extend towards leaving in described computer chip direction.
6. computer chip as claimed in claim 5 and radiator subassembly is characterized in that, described several radiating fins slightly are column, and with the array way deploying.
7. computer chip as claimed in claim 1 or 2 and radiator subassembly is characterized in that, described computer chip is the central processing unit chip.
8. the constructive method of computer chip and radiator subassembly is characterized in that it comprises:
A kind of computer chip is provided, and it is electrically connected with interlock circuit on the motherboard through an electric connector, and it has an end face;
One radiator is provided, and it has a matrix and several radiating fins, and described matrix has a bottom surface;
One wax shape heat transfer medium is spread upon on the appropriate location of described radiator matrix bottom surface equably, and described wax shape heat transfer medium has suitable fusing point, and the heat that described computer chip produced will make it by the solid-state liquid state that is melted into;
Described radiator is seated on the described computer chip, makes the end face butt of described radiator matrix bottom surface and described computer chip.
9. the constructive method of computer chip as claimed in claim 8 and radiator subassembly is characterized in that, the fusing point of described wax shape heat transfer medium is about 65 ℃.
10. the constructive method of computer chip and radiator subassembly as claimed in claim 8 or 9, it is characterized in that, after the coated on bottom side of described radiator matrix is spread wax shape heat transfer medium, earlier on the end face of described computer chip, smear the shape heat transfer medium of waxing, more described radiator is seated on the described computer chip.
11. the constructive method of computer chip and radiator subassembly is characterized in that as claimed in claim 8 or 9, described computer chip is the central processing unit chip.
12. the constructive method of computer chip membrane module and radiator subassembly is characterized in that it comprises:
One computer chip membrane module is provided, and its inside is provided with sub-circuit board, computer chip and some electrical equipments, and it forms a plate body in a side;
One radiator is provided, and it has a matrix and several radiating fins, and described matrix has a bottom surface;
One wax shape heat transfer medium is spread upon on the appropriate location of described radiator matrix bottom surface equably, and described wax shape heat transfer medium has suitable fusing point, and the heat that computer chip produced will make it by the solid-state liquid state that is melted into;
With the bottom surface of radiator matrix and the plate body butt of computer chip membrane module.
13. the constructive method of computer chip membrane module as claimed in claim 12 and radiator subassembly is characterized in that, the fusing point of described wax shape heat transfer medium is about 65 ℃.
14. constructive method as claim 12 or 13 described computer chip membrane modules and radiator subassembly, it is characterized in that, after described wax shape heat transfer medium is smeared in the bottom surface of described hot body matrix, earlier on the plate body of described computer chip membrane module, also smear the above wax shape heat transfer medium, make the bottom surface of described radiator matrix and the plate body butt of described computer chip membrane module again.
15. the constructive method as claim 12 or 13 described computer chip membrane modules and radiator subassembly is characterized in that described computer chip membrane module is the central processing unit membrane module, described computer chip is the central processing unit chip.
16. computer chip membrane module and radiator subassembly is characterized in that it comprises:
One computer chip membrane module, its inside are provided with sub-circuit board, computer chip and some electric devices, and form a plate body in the one side;
One radiator has a matrix and several radiating fins, the plate body butt of the bottom surface of described matrix and described computer chip membrane module;
Wax shape heat transfer medium is between described computer chip membrane module plate body and described radiator matrix bottom surface, in order to fill up the slit between described computer chip membrane module plate body and the described radiator matrix bottom surface;
Described wax shape heat transfer medium has suitable fusing point, and the heat that described computer chip work produces will make it by the solid-state liquid state that is melted into.
17. computer chip membrane module as claimed in claim 16 and radiator subassembly is characterized in that, the fusing point of described wax shape heat transfer medium is about 65 ℃.
18. as claim 16 or 17 described computer chip membrane module and radiator subassemblies, it is characterized in that, described wax shape heat transfer medium is applied in described radiator matrix bottom surface and described computer chip membrane module plate body among both on any appropriate location at least.
19. as claim 16 or 17 described computer chip membrane module and radiator subassemblies, it is characterized in that, the matrix of described radiator is the long flat plate shape, and described several radiating fins and described matrix are one-body molded and extend towards leaving in the direction of computer chip membrane module.
20. computer chip membrane module as claimed in claim 19 and radiator subassembly is characterized in that, described several radiating fins in the form of sheets, and in parallel with each other along the longitudinal extension of described matrix.
21. computer chip membrane module as claimed in claim 20 and radiator subassembly is characterized in that, each radiating fin is in position gone up and is all formed a pair of groove.
22. as claim 16 or 17 described computer chip membrane module and radiator subassemblies, it is characterized in that described computer chip membrane module is the central processing unit membrane module, described computer chip is the central processing unit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98106288A CN1097220C (en) | 1998-04-10 | 1998-04-10 | Computer chip and heat sink assembly and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98106288A CN1097220C (en) | 1998-04-10 | 1998-04-10 | Computer chip and heat sink assembly and its making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1232199A CN1232199A (en) | 1999-10-20 |
| CN1097220C true CN1097220C (en) | 2002-12-25 |
Family
ID=5218912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98106288A Expired - Fee Related CN1097220C (en) | 1998-04-10 | 1998-04-10 | Computer chip and heat sink assembly and its making method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1097220C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100426493C (en) * | 2004-12-04 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Boiling cavity type radiator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2208246Y (en) * | 1994-09-22 | 1995-09-20 | 沈参荣 | Heat radiating device for CPU |
| CN2249920Y (en) * | 1996-01-29 | 1997-03-19 | 钟豪胜 | CPU heat radiator |
-
1998
- 1998-04-10 CN CN98106288A patent/CN1097220C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2208246Y (en) * | 1994-09-22 | 1995-09-20 | 沈参荣 | Heat radiating device for CPU |
| CN2249920Y (en) * | 1996-01-29 | 1997-03-19 | 钟豪胜 | CPU heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1232199A (en) | 1999-10-20 |
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