CN2249920Y - CPU heat radiator - Google Patents

CPU heat radiator Download PDF

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Publication number
CN2249920Y
CN2249920Y CN 96201629 CN96201629U CN2249920Y CN 2249920 Y CN2249920 Y CN 2249920Y CN 96201629 CN96201629 CN 96201629 CN 96201629 U CN96201629 U CN 96201629U CN 2249920 Y CN2249920 Y CN 2249920Y
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Prior art keywords
heating radiator
cpu
heat abstractor
support
lower half
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Expired - Fee Related
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CN 96201629
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Chinese (zh)
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钟豪胜
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Individual
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Individual
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Abstract

The utility model relates to a heat radiating device for a CPU, wherein, a shell cover for CPU is provided with an outer frame whose center is provided with a square hole. A protection ring is vertically and upward extended from the upper edge of the outer frame; the size of the protection ring is slightly bigger than the size of the square hole in the center of the outer frame; a supporting body is positioned below the outer frame. The upper half part of a radiator is fin-shaped; the lower half part of the radiator is square, and is provided with a lateral through hole; the size of the lower half part of the radiator is equal to or slightly smaller than the size of the square hole of the shell cover for a CPU; a supporting rim is positioned between the upper half part and the lower half part of the radiator. The lower half part of the supporting unit of the radiator is circular; the inner surface of the lower half part of the supporting unit of the radiator is provided with threads; the upper half part of the supporting unit of the radiator is provided with at least two corresponding preventing sheets which are protruded inward and horizontally from the inner surface of the upper part. A supporting ring is positioned between the upper half and the lower half parts of the supporting unit of theradiator, and is protruded and extended inward.

Description

The CPU heat abstractor
The utility model relates to a kind of CPU heat abstractor.
At present, improving the modal method of component heat performance is that device is contacted with a sheet of sheet metal, and increases the surface area of device, for example with heat sink arrangement in assembly.And this heating radiator normally becomes with aluminium or copper, and is to select from the aspect of its price and thermal behavior ratio.
Known a fin shape heating radiator is installed contact in the electronic device assembly of CPU (central processing unit) (CPU), microprocessor etc. the time, heat can be conducted from CPU by it, and this heating radiator has several fins, can enlarge its surface area, make heat dissipation promptly around in the environment, so it is efficient especially for dissipation of heat; The heat dissipation that the thermal coupling technology of heating radiator and CPU, different heating radiator fit all can produce CPU, and cpu temperature is reduced to the dead line.
More existing uses assembling of linking closely is buckled in heating radiator among the CPU, and this type of control structure is because of uneven strangulation strength, causes it and fastens heating radiator in CPU and wish that direct heat transfer contact is quite because of difficulty; In fact, heating radiator and CPU easily between produce the gap, thereby thermal coupling is lower.
A kind of heat sink arrangement is that it comprises a breakout box and a heating radiator with the transfer of the heat in the electronic device assembly; Breakout box wherein has a roof and two corresponding from limit wall that roof hangs from above downwards; Each limit wall has a groove and runs parallel to roof and electronic device assembly is slipped in the breakout box; Breakout box also has first and second plane, lies low respectively on groove and bottom thereby form a space; In addition, groove can chimericly hold the corresponding marginal portion of electronic device assembly, and there is a hole at breakout box roof center, the cylindric base part of heating radiator planar bottom surface and being sleeved in the hole of breakout box roof.Hole has screw thread, and the base part of heating radiator also has screw thread, heating radiator can be reversed to be tightened in the screw thread hole and firmly to be close proximity to electronic device assembly near electronic device assembly up to the flat bottom surface of heating radiator substrate downwards to form thermal coupling.
According to above-mentioned, reversing between base part and the hole screws engaging structure, can simplify the attended operation of heat sink arrangement, but it produces some unpredictable minus effects; Because the screw thread hole is formed on the roof of breakout box, and the electronic device assembly device is between first and second plane, and its bottom surface area of reversing the base part that is tightened in the screw thread hole must be less than the surf zone above the electronic device assembly; Surf zone above the common electronic device assembly, for example the surf zone of a Pentium Pentium processor is 25 square centimeters, and the main in the above core (being the integrated circuit part) that produces heat is 12.25 squares of branch branches.Yet because the space constraint around the electronic device assembly, the size of breakout box outside is 5.3 centimeters and takes advantage of 5.3 centimeters that it is 2.7 centimeters that the heating radiator base part can be accepted diameter; So the bottom surface area area of heating radiator base part is 75.72 square centimeters (that is 1.35 centimeters * 1.35 centimeters); Thereby, have only a fraction of central area to contact above the electronic device assembly with heating radiator base part direct heat; In fact, 22.89% the contacting of 46.69% or this Pentium processor entire upper surface of having only the main upper surface core that produces heat with radiator heat.
Known another kind of substrate rim construction, it has following shortcoming: if the thickness of its base part less than the thickness of hole, then its compressing strength that imposes on electronic device assembly will be not enough, thereby may reduce thermal coupling widely and cause resistance to heat to increase; But if the thickness of its base part is greater than the thickness of hole, then its compressing strength that imposes on electronic device assembly is damaged electronic device assembly easily with excessive.
The temperature that can make the abutment that flows of known increase heat rises, that is reduces from heating radiator to airborne resistance to heat by the air-flow that increases surf zone and increase by surf zone; Therefore, bigger thermocontact area can produce better heat conduction; Thereby, the heat conduction situation of heating radiator the best be need at least with this processor on the main core that produces heat do thermo-contact completely; Opposite, structure commonly used is via a breakout box heating radiator to be reversed to be tightened on the CPU, it has limited the thermocontact area of heating radiator and CPU, thereby has reduced the radiating effect of heating radiator.
In addition, when reversing the base part of common heat sink, the operator is tightened in the screw thread hole, and downwards towards electronic device assembly when the flat bottom of heating radiator substrate firmly abuts against on the electronic device assembly, then there is a downward compressing strength to act on the electronic device assembly central area, because the clamshell outer edge part of electronic device assembly is to be controlled between the protrusion sheet and roof of breakout box, thereby the clamshell outer edge part of electronic device assembly will act on the roof of a reacting force at breakout box; Thereby there is a flexion torsion strength to act on electronic device assembly and may causes bad operating effect and damage electronic package.
Electronic device assembly is that edge support chip by breakout box supports its marginal portion in addition; Though the lower surface of heating radiator substrate is level contact electronic device assembly, yet the operator also need continue crooked electronic device assembly heating radiator reversed downwards and to screw, thereby may produce minus effect for electronic device assembly; In addition, so reverse the heating radiator that screws on the electronic device assembly excessively, may cause the lower surface scratch electronic device assembly surface of heating radiator substrate, and produce the minus effect that to expect.
Fundamental purpose of the present utility model provides the CPU heat abstractor, and heating radiator can contact the main central area that produces heat on the CPU surface, and increases thermocontact area and enlarge the most direct heat conduction.
Another purpose of the utility model is in a kind of CPU heat abstractor is provided, the downward compressing strength of heating radiator be by the mean effort of heating radiator support unit on CPU.
Another purpose of the present utility model is to provide a kind of CPU heat abstractor, in case thermo-contact is done in the heating radiator horizontal setting on CPU, act on CPU and go up and may cause CPU bending and pressure too to concentrate on the CPU for fear of any strength of reversing, heating radiator can not move down again.
Another purpose of the present utility model is to provide a kind of CPU heat abstractor, the downward drive actions of heating radiator is only provided to lower compression by a heating radiator support unit of the present utility model, do not tighten action and there is any rotation, therefore the lower surface of heating radiator and CPU thermo-contact, surface that can't scratch CPU.
Another purpose of the present utility model is in a kind of CPU heat abstractor is provided, and its fitting operation is very easy to, fast and firm.
The purpose of this utility model is achieved in that a kind of CPU heat abstractor, it comprises that the first half is the heating radiator of fin shape, comprise that also a CPU clamshell has a housing, a protection ring and a supporter, housing center wherein has a square hole, the edge-perpendicular of protection ring above housing extends upward, and its surface has screw thread, and the size of its inside is more bigger than the square hole at housing center again; In addition, supporter is positioned at the housing below; Described heating radiator also includes a Lower Half and and supports wheel rim, wherein Lower Half is square-shaped and have a cross through hole, the size of Lower Half is equal to or slightly less than the square hole of CPU clamshell, support wheel rim between the first half and Lower Half of heating radiator, and its periphery is greater than the square hole of CPU clamshell; In addition, this heating radiator have at least a shape pore from it half one vertically protrude out to the cross through hole of Lower Half; One heating radiator support unit is an annulus, and it includes a Lower Half, a first half and a support ring; Wherein Lower Half is a toroidal, and its inner face has screw thread; The first half wherein has at least two correspondingly to protrude protective sheet from the inside level of its inner face; Support ring is at the heating radiator support unit up and down between the halves and inwardly protrude out, thereby forms a supported chamber between protective sheet and support ring, and its internal diameter is less than the support wheel rim of heating radiator.
Described heating radiator support unit is an annulus, and it has four corresponding protective sheet that protrude out from the inside level of its inner face.
Described each protective sheet all has an inclined end face.
Described support ring is for being a toroidal and inwardly protruding out from support unit inner face center section, and the support wheel rim of described heating radiator is a circular rim, and its external diameter is greater than the support ring internal diameter in the support unit.
The described heating radiator first half can be right cylinder, and its external diameter is greater than square Lower Half, and the support wheel rim of described heating radiator protrudes out the joint of halves about heating radiator.
The diameter of the described heating radiator first half is bigger than the external diameter of described support wheel rim, forms a circular recessed channel and adjacent on the bracing ring wheel.
The height that the height of the square Lower Half of described heating radiator is higher than protection ring adds the thickness of CPU clamshell housing.
The protection ring of described CPU clamshell is an annulus, and has screw thread with its outside.
Has indenture on the described heating radiator support unit.
One fan is installed above the described heating radiator.
Described supporter comprises two corresponding feets, extends and be parallel to respectively the two-phase corresponding sides of square hole downwards from CPU clamshell housing edge.
Have a vertical plane in the described feet, and bottom it inside horizontal-extending of support chip is arranged, between two vertical planes of feet one hole is arranged, between below two support chips and the housing.
Described CPU clamshell also comprises at least two corresponding projections, and protuberance is respectively from two corresponding sides, that is protrudes downwards from two feets and housing lower surface.
Described CPU clamshell also comprises a counter stop pin, and it one vertical plane is arranged in this feet, and a support chip is arranged at the bottom from the extension downwards of housing lower edge and perpendicular to two feets.
The utility model can contact the main central area that produces heat on the CPU surface, can increase thermocontact area and enlarge the most direct heat conduction, downward compressing strength acts on above the CPU fifty-fifty, do not tighten action and there is any rotation, so lower surface of heating radiator and CPU thermo-contact, surface that can't scratch CPU, and fitting operation is very easy to, fast and firm.
Below in conjunction with accompanying drawing and concrete technical scheme the utility model is described in further detail.
Fig. 1 is the concrete part section schematic exploded perspective view of the utility model CPU heat abstractor;
Fig. 2 is the concrete part section front view of the utility model CPU heat abstractor;
Fig. 3 is the concrete section front view of the utility model CPU heat abstractor aggregate erection CPU.
Referring to Fig. 1,2,3, heat sink arrangement comprises a CPU clamshell 30 and a heating radiator support unit 40, and it can make heating radiator 10 firmly be placed in and do heat dissipation on the CPU20; CPU clamshell 30 is made by the electronic isolation material, it comprises a circular housing 31, there is a square hole 311 at circular housing center, CPU clamshell 30 also comprises a protection ring 32, extend vertically upward from circular housing 31 upper edge, the protection ring external diameter is slightly less than the external diameter of circular housing 31, but than the diagonal angle line length of the square hole 311 at circular housing center, and form a circular shoulder 312 at the peripheral edge portion of circular housing; The peripheral surface of protection ring 32 has screw thread again; In addition, CPU clamshell 30 also includes a supporter below housing 31, and supporter comprises two corresponding feets 33,34, extend downwards from the edge of housing 31, with control CPU clamshell 30 on CPU; Two feets 33,34 are parallel to the two-phase corresponding sides of square hole 311 respectively, and each feet has an interior vertical surface 331,341 and a bottom support sheet 332,342, the respectively extension of inside level, and the distance of 331,341 of two vertical surface is the size that equals or be slightly larger than CPU20; Therefore, CPU clamshell 30 supports to form between pin 33,34 and housing 31 lower surface a hole 300 to hold CPU20 two; As shown in Figure 3, the two-phase corresponding edge part of CPU20 is respectively by 332,342 supports of support chip.
In order to provide a compressing strength firmly fastening CPU20 on its position, and one compressing instrument is arranged in housing 31 bottom surfaces; As shown in Figure 2, the compressing instrument includes two corresponding overhang 35,36, and two feet places from housing 31 bottom surfaces protrude out downwards so that the less thick of hole 300 respectively; The distance that two overhang, 35,36 tail ends and two support chips are 332,342 is equal to or slightly less than the thickness of CPU20; Therefore, CPU clamshell 30 can firmly be buckled on the CPU20.
One counter stop pin 37 has a vertical plane 371 and a bottom support sheet 372 in one, it is from the housing 31 bottom margins extension downwards of CPU clamshell 30 and perpendicular to two feets 33,34, CPU20 moves in inside in order to restriction, makes CPU20 to combine with square hole 311.The heating radiator of use of the present utility model is by metal or made with the similar material of metal, and it comprises a latter half 12 and a circular support wheel rim 13 that a fin cylinder the first half 11, is square, support wheel rim heating radiator up and down 2 half partly between; Cylinder the first half 11 has the fin of several sheets, can enlarge heating radiator 10 surface areas, and increases dissipation of heat; The size of heating radiator 10 square the latter halfs is the sizes that are equal to or slightly less than the square hole 311 of CPU clamshell 30, thereby CPU clamshell 30 can be inserted in the square hole, to oppress on CPU20; The aspect ratio protection ring 32 of the plinth 12 of heating radiator adds the height height of the housing 31 of CPU clamshell 30, and it has a cross through hole 121, while cross through hole 121 is other from extending to of plinth 12; Heating radiator 10 also has several central shaft airflow holes 14, and vertically protruding out the first half 11 that passes through cylinder fin shape is had better air-flow circulation to the cross through hole of plinth 12; The square Lower Half 12 of the diameter ratio of the cylinder fin shape first half 11 big, and circular support wheel rim 13 protrudes at the joint of the first half 11 with Lower Half 12, in order to increase the radiating effect of heating radiator 10, the diameter of the heating radiator first half 11 is greater than supporting wheel rim 13; In addition, there is a circular recessed channel to be positioned at and supports on the wheel rim 13, heat-sink unit 40 is meshed with heating radiator.
Heating radiator support unit 40 is an annulus, and has indenture 41 so that the operator is easy and rotary manipulation with its outside; The thickness of the circular edges wall of heating radiator support unit 40 equals the thickness of the circle shoulder 312 of CPU clamshell; And heating radiator support unit 40 has a circular support ring 42 inwardly to protrude out from its inner face center, and the internal diameter of support ring 42 should be less than the external diameter of the support wheel rim 13 of heating radiator 10; Again, the upper half part of support unit 40 has four corresponding protective sheet 43, and the beveled end surface 44 of protective sheet is that the inside level of circular surface protrudes out in it, and in protective sheet 43 with support and form a supported chamber 45 between the wheel rim 13; The support wheel rim 13 of heating radiator can down push supported chamber 45; That is be placed in protective sheet 43 and support ring 42 between, and guidance surface can be regarded in the beveled end surface of protective sheet 43; The thickness that supports wheel rim 13 equals or above the smaller support ring 42 and the distance between protective sheet 43 bottom surfaces, can firmly be placed between support ring and the protective sheet with the support wheel rim 13 that causes heating radiator 10; Heating radiator support unit 40 the latter halfs (that is between support ring 42 and support unit 40 bottoms) inner face has screw thread 46.
For improving the efficient of heating radiator 10, then must increase the chlorine flow that flows through CPU or heat abstractor surface; A fan can be added and CPU airshed on every side can be increased; Thereby fan 50 can install at the first half 11 of heating radiator 10 to increase the heat dissipation of heating radiator.Pass the cross through hole of the first half 11 because of having a plurality of central gas stream hole 145 longitudinal extensions, can make the air-flow of fan 50 arrive Lower Half 12, thereby can form preferable air-flow circulation, strengthen the heat dissipation of CPU to Lower Half 12.
According to the above, the support unit 40 of heating radiator and the installation of heating radiator 10 are that the square Lower Half 12 with heating radiator 10 is inserted in the square hole 311 of clamshell 30, and heating radiator support unit 40 reversed are tightened on the protection ring 32 and are connected with CPU clamshell 30; As shown in Figure 2, heating radiator 10 still remaines on overhang 35,36 bottoms of CPU clamshell 30 up to the heating radiator lower surface by protective sheet 43 driving downwards of heating radiator support unit 40.
As shown in Figure 3, the operator can utilize feet 33,34 and CPU20 is slided in the heat abstractor, and CPU20 firmly is fixed in its position; When the internal motion of CPU20 divides in by the edge of 37 stop of counter stop pin and CPU20 when being controlled in support chip 332,342 and the overhang 35,36, then CPU20 can combine with square hole 311.
Can do direct thermal coupling for making between heating radiator 10 and the CPU20, the operator turns heating radiator support unit 40 and continues to be rotated down and tightens, so that it is downward to drive heating radiator by average downward four protective sheet 43 of compressing strength compressing; When the bottom of heating radiator 10 is driven to when doing thermo-contact above the CPU20, the operator can feel a reacting force that pins thereby the support unit that stops operating; Rotation heat sink support unit 40 compressing is on the CPU20 or when CPU20 shifts out heating radiator again, because of square the latter half 12 of heating radiator is pinned by the square hole 311 of clamshell 30, so heating radiator 10 can and then not rotate, and avoids scratch CPU20.
Because CPU20 is a square body style such as Pentium Pentium processor.Therefore utilize the plinth surface of heating radiator and do not use other shape (for example circular) can reach the expansion contact area; Therefore, the latter half of the utility model heating radiator 10 provides the thermocontact area of heating radiator and CPU20 maximum, and thermal coupling and heat conduction usefulness can reach maximum then; According to device of the present utility model, the big I of square the latter half 12 of heating radiator 10 increases to maximum effective dimensions, therefore the area of its latter half can expand 11.56 square centimeters to, it is near CPU20 (for example Pentium processor), 12.25 square centimeters of the central areas of main generation heat, thereby can produce preferable direct heat conduction; As mentioned above, the main center that produces heat of CPU20 partly has 94% to be that contact is on heating radiator; In addition, because of downward compressing strength be mean effort at heating radiator 10 to protective sheet 43, so compressing is that mean allocation is on CPU20 in the strength on the CPU20.

Claims (14)

1, a kind of CPU heat abstractor, it comprises that the first half is the heating radiator of fin shape, it is characterized in that: comprise that also a CPU clamshell has a housing, a protection ring and a supporter, housing center wherein has a square hole, the edge-perpendicular of protection ring above housing extends upward, and its surface has screw thread, and the size of its inside is more bigger than the square hole at housing center again, in addition, supporter is positioned at the housing below; Described heating radiator also includes a Lower Half and and supports wheel rim, wherein Lower Half is square-shaped and have a cross through hole, the size of Lower Half is equal to or slightly less than the square hole of CPU clamshell, support wheel rim between the first half and Lower Half of heating radiator, and its periphery is greater than the square hole of CPU clamshell, in addition, this heating radiator have at least a shape pore from it half one vertically protrude out to the cross through hole of Lower Half; One heating radiator support unit is an annulus, and it includes a Lower Half, a first half and a support ring; Wherein Lower Half is a toroidal, and its inner face has screw thread, the first half wherein has at least two correspondingly to protrude protective sheet from the inside level of its inner face, support ring is at the heating radiator support unit up and down between the halves and inwardly protrude out, between protective sheet and support ring, form a supported chamber, and its internal diameter is less than the support wheel rim of heating radiator.
2, a kind of CPU heat abstractor according to claim 1 is characterized in that: described heating radiator support unit is an annulus, and it has four corresponding protective sheet that protrude out from the inside level of its inner face.
3, a kind of CPU heat abstractor according to claim 2, it is characterized in that: described each protective sheet all has an inclined end face.
4, a kind of CPU heat abstractor according to claim 2, it is characterized in that: described support ring is for being a toroidal and inwardly protruding out from support unit inner face center section, the support wheel rim of described heating radiator is a circular rim, and its external diameter is greater than the support ring internal diameter in the support unit.
5, a kind of CPU heat abstractor according to claim 1, it is characterized in that: the described heating radiator first half can be right cylinder, and its external diameter is greater than square Lower Half, and the support wheel rim of described heating radiator protrudes out the joint of halves about heating radiator.
6, a kind of CPU heat abstractor according to claim 1, it is characterized in that: the diameter of the described heating radiator first half is bigger than the external diameter of described support wheel rim, forms a circular recessed channel and adjacent on the bracing ring wheel.
7, a kind of CPU heat abstractor according to claim 6 is characterized in that: the height that the height of the square Lower Half of described heating radiator is higher than protection ring adds the thickness of CPU clamshell housing.
8, a kind of CPU heat abstractor according to claim 7, it is characterized in that: the protection ring of described CPU clamshell is an annulus, and has screw thread with its outside.
9, a kind of CPU heat abstractor according to claim 8 is characterized in that: have indenture on the described heating radiator support unit.
10, a kind of CPU heat abstractor according to claim 1 is characterized in that: a fan is installed above the described heating radiator.
11, a kind of CPU heat abstractor according to claim 9, it is characterized in that: described supporter comprises two corresponding feets, extends and be parallel to respectively the two-phase corresponding sides of square hole downwards from CPU clamshell housing edge.
12, a kind of CPU heat abstractor according to claim 11, it is characterized in that: have a vertical plane in the described feet, and the inside horizontal-extending of a support chip is arranged at its bottom, between two vertical planes of feet one hole is arranged, between below two support chips and the housing.
13, a kind of CPU heat abstractor according to claim 12, it is characterized in that: described CPU clamshell also comprises at least two corresponding projections, protuberance is respectively from two corresponding sides, that is protrudes downwards from two feets and housing lower surface.
14, a kind of CPU heat abstractor according to claim 13, it is characterized in that: described CPU clamshell also comprises a counter stop pin, it one vertical plane is arranged in this feet, and a support chip is arranged at the bottom from the extension downwards of housing lower edge and perpendicular to two feets.
CN 96201629 1996-01-29 1996-01-29 CPU heat radiator Expired - Fee Related CN2249920Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 96201629 CN2249920Y (en) 1996-01-29 1996-01-29 CPU heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 96201629 CN2249920Y (en) 1996-01-29 1996-01-29 CPU heat radiator

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Publication Number Publication Date
CN2249920Y true CN2249920Y (en) 1997-03-19

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CN 96201629 Expired - Fee Related CN2249920Y (en) 1996-01-29 1996-01-29 CPU heat radiator

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1097220C (en) * 1998-04-10 2002-12-25 鸿海精密工业股份有限公司 Computer chip and heat sink assembly and its making method
CN1299553C (en) * 1999-08-30 2007-02-07 莫列斯公司 Radiator unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1097220C (en) * 1998-04-10 2002-12-25 鸿海精密工业股份有限公司 Computer chip and heat sink assembly and its making method
CN1299553C (en) * 1999-08-30 2007-02-07 莫列斯公司 Radiator unit

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