CN109702937B - Manufacturing method of LED display module - Google Patents
Manufacturing method of LED display module Download PDFInfo
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- CN109702937B CN109702937B CN201811472619.7A CN201811472619A CN109702937B CN 109702937 B CN109702937 B CN 109702937B CN 201811472619 A CN201811472619 A CN 201811472619A CN 109702937 B CN109702937 B CN 109702937B
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Abstract
The invention provides a method for manufacturing an LED display module, which comprises the following steps of S1, S2, S3 and S1: providing an LED display module, glue solution, a forming die, a die assembly device and a vacuumizing box body, wherein the forming die comprises an upper die and a lower die, and the die assembly device can move the upper die to be assembled with the lower die; s2: keeping the vacuum state in the vacuum-pumping box body, injecting glue solution into the lower die in the vacuum-pumping box body, and moving the upper die to be matched with the lower die through a die matching device; s3: and (5) curing. According to the manufacturing method of the LED display module, the glue is poured and the die is assembled in the vacuum environment, so that air is prevented from being mixed into the glue solution to form bubbles after the glue solution is solidified, and the light transmission effect of the glue solution after being solidified and formed into the protective layer is improved.
Description
Technical Field
The invention belongs to the technical field of LED display screens, and particularly relates to a manufacturing method of an LED display module.
Background
The LED display module generally comprises a substrate for realizing a control function and a plurality of LED lamp beads arranged on one side of the substrate, and the LED lamp beads are generally only provided with fewer protection structures or even exposed for ensuring the display effect. The LED display module is subjected to collision caused by transport which cannot be avoided in the using process, and different weather environments (water vapor, acid-base property, high and low temperature and ultraviolet rays) can cause damage to the substrate of the LED display module and the exposed LED lamp beads in different degrees. At present, the service life of the LED display module in a severe service environment is usually only one year or even half a year, which causes high use cost and lack of market competitiveness.
Therefore, how to fully protect the LED display module under the condition of ensuring the display effect of the LED display module to solve the problems of collision avoidance, corrosion prevention, moisture prevention, static electricity prevention and the like, and further prolong the service life of the LED display module, which becomes a hotspot of research in the current LED display field.
At present, for protecting the LED display module, one side of the LED display module, which is provided with the LED lamp beads, is provided with a protective layer, the commonly used protective layer is provided with epoxy resin, and air can be often mixed in the protective layer in the process of attaching the protective layer, so that bubbles appear in the protective layer, the light transmission of the protective layer is influenced, and the display effect of the LED display module is further influenced.
Disclosure of Invention
The invention aims to provide a manufacturing method of an LED display module, which aims to solve the technical problem that bubbles are left in a protective layer in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: the manufacturing method of the LED display module comprises the following steps:
s1: providing an LED display module, glue solution, a forming die, a glue filling assembly, a mold closing device and a vacuumizing box body, wherein the LED display module comprises a substrate and a plurality of LED lamp beads arranged on one side of the substrate, the forming die comprises an upper die and a lower die, the upper die is fixed on one side of the substrate, which is far away from the LED lamp beads, and the mold closing device can move the upper die to be closed with the lower die;
s2: placing the forming mold and the LED display module in the vacuumizing box body, and injecting the glue solution into the lower mold through the glue pouring assembly in a vacuum state; driving the LED display module fixed on the upper die to be immersed into the glue solution through the die assembly device in a vacuum state, so that the upper die and the lower die are assembled;
s3: and curing and forming the glue solution into a protective layer for sealing the LED lamp beads on the substrate.
Further, the method also comprises the following steps:
s4: and demolding, and carrying out finish machining treatment on the cured and molded protective layer.
Further, in the process of closing the upper die and the lower die, the upper die is gradually closed at an initial inclination angle until the upper die and the lower die are completely attached.
Further, the step S1 further provides a first conveying device and a material carrying plate capable of being conveyed with the first conveying device, and the vacuum box body provided in the step S1 includes a glue pouring box, a mold closing box and a transition box;
the material carrying plate is used for carrying the LED display module, the upper die and the lower die; the glue filling assembly is arranged in the glue filling box, the mold closing box is arranged between the glue filling box and the transition box, and the mold closing device is arranged in the mold closing box;
the feeding side of the glue pouring box is hermetically connected with a first sealing door, the glue pouring box is hermetically connected with the mould assembling box through a second sealing door, the mould assembling box is hermetically connected with the transition box through a third sealing door, and the discharging side of the transition box is hermetically connected with a fourth sealing door;
vacuumizing devices are arranged in the glue pouring box, the mold closing box and the transition box, and the first sealing door, the second sealing door, the third sealing door and the fourth sealing door can be switched between an opening state and a closing state;
the first conveying device carries the material carrying plate and is used for conveying the upper die, the lower die and the LED display module from the glue pouring box to the die assembling box through the material carrying plate and conveying the matched upper die, the matched lower die and the LED display module enclosed between the upper die and the lower die from the die assembling box to the transition box;
the step S2 includes the following steps:
step S21: pouring glue into the glue pouring box;
step S22: vacuumizing the mould assembling box;
step S23: closing the mold in the mold closing box;
step S24: vacuumizing the transition box;
step S25: blanking is carried out, wherein the blanking is carried out,
wherein the step S21 includes the following steps performed in sequence:
s211: placing the LED display module, the upper die and the lower die in the glue pouring box;
s212: closing the first sealing door and the second sealing door;
s213: vacuumizing the glue pouring box;
s214: injecting the glue solution into the lower die in the glue filling box;
the step S22 includes the following steps performed in sequence:
s221: closing the third sealing door;
s222: vacuumizing the mould assembling box;
the step S221 is performed after the step S212;
the step S23 includes the following steps performed in sequence:
s231: opening the second sealing door;
s232: after the LED display module, the upper die and the lower die are conveyed into the die assembling box by the first conveying device, closing the second sealing door;
s233: closing the upper die and the lower die in the die closing box;
the step S231 is performed after the steps S214 and S222;
the step S24 includes the following steps performed in sequence:
s241: closing the fourth sealing door;
s242: vacuumizing the transition box;
the step S241 is performed after the step S221;
the step S25 includes the following steps performed in sequence:
s251: opening the third sealing door;
s252: the first conveying device conveys the matched lower die and the LED display module into the transition box, and then the third sealing door is closed;
s253: opening the fourth sealing door;
s254: blanking;
step S251 is performed after step S233 and step S242.
Further, during continuous production, after the nth group of LED display modules, the upper mold and the lower mold complete the step S232;
firstly opening the first sealing door, placing the (N + 1) th group of LED display modules, the upper die and the lower die in the glue pouring box, then closing the first sealing door, and then performing the steps S213 and S214, the steps S23, the step S24 and the step S25,
wherein N is not less than 1 and N is an integer.
Further, the step S1 further provides a glue solution control device and a glue solution detection device, and the following steps are further included between the step S1 and the step S2:
s5: the glue solution detection device monitors and displays the physical property of the glue solution;
s6: and adjusting the physical property, the proportion of each component or the glue yield of the glue solution by adjusting the glue solution control device according to production requirements.
Furthermore, the mold closing device comprises a fixed seat, a gripper, a first driving mechanism and a second driving mechanism, one end of the fixed seat is connected with the first driving mechanism, the gripper is arranged on the fixed seat, the first driving mechanism can drive the fixed seat to move from the upper mold position to the lower mold position, and the second driving mechanism is arranged on the fixed seat and can control the gripper to be closed to grip the upper mold or be opened to release the upper mold.
Furthermore, the mold closing device further comprises a connecting plate and an elastic piece, the connecting plate is fixedly connected with the first driving mechanism, one end of the connecting plate is hinged with the fixed seat, and the other end of the connecting plate is elastically connected with the fixed seat through the elastic piece.
Furthermore, a plurality of containing positions are arranged on the material carrying plate, one part of the containing positions are used for placing the lower die, and the other part of the containing positions are used for placing the upper die and the LED display module.
Further, the containing position comprises a lower die containing cavity and a module containing cavity, the lower die is placed in the lower die containing cavity, and the upper die and the LED display module are placed in the module containing cavity.
The manufacturing method of the LED display module provided by the invention has the beneficial effects that: compared with the prior art, the manufacturing method of the LED display module injects the glue solution into the lower die in the vacuum environment, avoids the phenomenon that the flowing glue solution is directly contacted with air and mixed with the air, closes the upper die and the lower die in the vacuum environment, enables the LED display module to be immersed into the glue solution, avoids the phenomenon that the glue solution is mixed with the air to form bubbles and influence the light transmission effect of the protective layer, and then enables the glue solution to be solidified to form the protective layer.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flowchart of a method for manufacturing an LED display module according to an embodiment of the present invention;
FIG. 2 is a flowchart illustrating a method for manufacturing an LED display module according to another embodiment of the present invention;
FIG. 3 is a flowchart of one embodiment provided in step S2 of the method for manufacturing the LED display module of FIG. 1 or FIG. 2;
fig. 4 is a flowchart of step S21 in fig. 3;
fig. 5 is a flowchart of step S22 in fig. 3;
fig. 6 is a flowchart of step S23 in fig. 3;
fig. 7 is a flowchart of step S24 in fig. 3;
fig. 8 is a flowchart of step S25 in fig. 3;
FIG. 9 is a top view of an apparatus for manufacturing an LED display module according to an embodiment of the present invention;
FIG. 10 is a front view of FIG. 9;
fig. 11 is a three-dimensional structure diagram of the LED display module according to the embodiment of the present invention with a protective layer attached thereon;
fig. 12 is a perspective view of a lower mold according to an embodiment of the present invention;
fig. 13 is a perspective view of a module clamping device according to an embodiment of the present invention;
FIG. 14 is a front view of the module holder shown in FIG. 13 with the LED display module placed in the glue receiving cavity;
fig. 15 is a perspective structural view of a material carrying plate according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
10. an LED display module; 11. a substrate; 12. LED lamp beads;
20. a protective layer; 30. a lower die; 31. a glue solution accommodating cavity; 40. an upper die;
50. a mold clamping device; 51. a connecting plate; 52. a fixed seat; 521. a chute; 53. a gripper; 531. a finger; 54. an elastic member;
60. a material carrying plate; 61. a capacity bit; 611. a lower die accommodating cavity; 612. a module accommodating cavity;
70. vacuumizing the box body; 71. filling a glue box; 711. a first sealing door; 72. a mould assembling box; 721. a second sealing door; 73. a transition box; 731. a third sealing door; 732. a fourth sealing door;
80. a glue pouring assembly; 90. a baking device; 100. a demolding device; 110. a first conveying device; 120. a second conveying device.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, fig. 9, fig. 11 and fig. 12, a method for manufacturing an LED display module according to the present invention will now be described. The manufacturing method of the LED display module comprises the following steps:
s1: providing an LED display module 10, glue solution, a forming die, a glue filling assembly 80, a die closing device 50 and a vacuumizing box body 70, wherein the LED display module 10 comprises a substrate 11 and a plurality of LED lamp beads 12 arranged on one side of the substrate 11, the forming die comprises an upper die 40 and a lower die 30, the upper die 40 is fixed on one side of the substrate 11, which is far away from the LED lamp beads 12, and the die closing device 50 can move the upper die 40 to be closed with the lower die 30;
s2: placing the forming mold and the LED display module in a vacuum box 70, and injecting the glue solution into the lower mold 30 through a glue pouring assembly 80 in a vacuum state; driving the LED display module fixed on the upper die 40 to be immersed into the glue solution through the die closing device 50 in a vacuum state, so that the upper die 40 and the lower die 30 are closed;
s3: and curing and molding the glue solution to form a protective layer 20 for sealing the LED lamp beads 12 on the substrate 11.
Compared with the prior art, the manufacturing method of the LED display module provided by the invention has the advantages that the glue solution is injected into the lower die 30 in the vacuum environment, the flowing glue solution is prevented from directly contacting with air to mix with the air, the upper die 40 and the lower die 30 are assembled in the vacuum environment, the LED display module 10 is immersed in the glue solution, the air mixed in the glue solution is prevented from forming bubbles to influence the light transmission effect of the protective layer 20, and then the glue solution is solidified to form the protective layer 20.
Specifically, referring to fig. 12, a glue solution containing cavity 31 for containing glue solution is arranged on the lower die 30.
Specifically, the vacuum-pumping operation of the vacuum-pumping chamber 70 is performed between step S1 and step S2; the vacuum releasing operation of the vacuum box 70 is performed between step S2 and step S3.
Further, referring to fig. 2, as a specific embodiment of the method for manufacturing an LED display module according to the present invention, the method further includes the following steps:
s4: and demolding, and carrying out finish machining treatment on the cured and molded protective layer.
After demolding, after the glue solution is cured and formed into the protective layer 20, the protective layer 20 needs to be subjected to finish machining, wherein the finish machining comprises working procedures of polishing, cutting and the like on the protective layer 20.
Further, as a specific implementation manner of the method for manufacturing the LED display module provided by the present invention, in the process of closing the upper mold 40 and the lower mold 30, the upper mold 40 is gradually closed at an initial inclination angle until the upper mold 40 and the lower mold 30 are completely attached, so that the phenomenon that the upper mold 40 presses residual air into the glue solution in the process of closing the mold is avoided, and the glue solution in the lower mold 30 is prevented from being splashed due to the flat pressing of the upper mold 40.
Further, referring to fig. 1 and fig. 3 to fig. 8, as a specific embodiment of the method for manufacturing an LED display module according to the present invention, step S1 further provides a first conveying device 110 and a material loading plate 60 capable of being conveyed along with the first conveying device 110, and the vacuum box 70 provided in step S1 includes a glue filling box 71, a mold clamping box 72, and a transition box 73;
the material carrying plate 60 is used for carrying the LED display module 10, the upper die 40 and the lower die 30; the glue filling assembly 80 is arranged in the glue filling box 71, the mold closing box 72 is arranged between the glue filling box 71 and the transition box 73, and the mold closing device 50 is arranged in the mold closing box 72;
the feeding side of the glue pouring box 71 is hermetically connected with a first sealing door 711, the glue pouring box 71 is hermetically connected with the mold closing box 72 through a second sealing door 721, the mold closing box 72 is hermetically connected with the transition box 73 through a third sealing door 731, and the discharging side of the transition box 73 is hermetically connected with a fourth sealing door 732;
vacuumizing devices are arranged in the glue pouring box 71, the mold closing box 72 and the transition box 73, and the first sealing door 711, the second sealing door 721, the third sealing door 731 and the fourth sealing door 732 can be switched between an opening state and a closing state;
the first conveying device 110 carries a material carrying plate 60, and is used for conveying the upper die 40, the lower die 30 and the LED display module 10 from the glue pouring box 71 to the mold closing box 72 through the material carrying plate 60, and conveying the closed upper die 40, the closed lower die 30 and the LED display module 10 enclosed between the upper die 40 and the lower die 30 from the mold closing box 72 to the transition box 73;
step S2 includes the following steps:
step S21: pouring glue in a glue pouring box;
step S22: vacuumizing the mould box;
step S23: closing the mold in the mold closing box;
step S24: vacuumizing the transition box;
step S25: blanking is carried out, wherein the blanking is carried out,
wherein, step S21 includes the following steps performed in sequence:
s211: placing the LED display module 10, the upper die 40 and the lower die 30 in a glue pouring box 71;
s212: closing the first sealing door 711 and the second sealing door 721;
s213: vacuumizing the glue pouring box 71;
s214: injecting glue into the lower die 30 in the glue filling box 71;
step S22 includes the following steps performed in sequence:
s221: the third sealing door 731 is closed;
s222: vacuumizing the mold box 72;
step S221 is performed after step S212;
step S23 includes the following steps performed in sequence:
s231: opening the second sealing door 721;
s232: after the first conveying device 110 conveys the LED display module 10, the upper die 40 and the lower die 30 into the mold closing box 72, the second sealing door 721 is closed;
s233: closing the upper mold 40 and the lower mold 30 in the mold closing box 72;
step S231 is performed after step S214 and step S222;
step S24 includes the following steps performed in sequence:
s241: closing the fourth sealing door 732;
s242: vacuumizing the transition box 73;
step S241 is performed after step S221;
step S25 includes the following steps performed in sequence:
s251: the third sealing door 731 is opened;
s252: the first conveying device 110 sends the matched lower die 30 and the LED display module 10 into the transition box 73, and then closes the third sealing door 731;
s253: opening the fourth sealing door 732;
s254: blanking;
step S251 is performed after step S233 and step S242;
the glue pouring process, the mold closing process and the blanking process are respectively carried out in different boxes, so that the space in the glue pouring box 71, the space in the mold closing box 72 and the space in the transition box 73 can be saved; the glue pouring process, the die assembly process and the blanking process can be carried out simultaneously, so that the production efficiency is improved; in the production process, the vacuum state in the mold closing box 72 can be kept all the time only by vacuumizing the mold closing box 72 once, so that the time for vacuumizing the mold closing box 72 again is saved, the mold closing process can be continuously carried out, and the production efficiency is improved.
Specifically, referring to fig. 9 and 10, when the interior of the glue pouring box 71 and the mold closing box 72 are in a vacuum state, that is, the first sealing door 711, the second sealing door 721 and the third sealing door 731 are all in a closed state, the second sealing door 721 is opened, the interior of the glue pouring box 71 and the interior of the mold closing box 72 are still in a vacuum state, the lower mold 30 and the LED display module 10 are sent into the mold closing box 72 from the glue pouring box 71, and then the second sealing door 721 is closed, and the interior of the mold closing box 72 is still in a vacuum state; when the mold clamping box 72 and the transition box 73 are in a vacuum state, namely the second sealing door 721, the third sealing door 731 and the fourth sealing door 732 are in a closed state, the third sealing door 731 is opened, the mold clamping box 72 and the transition box 73 are in a vacuum state, the clamped upper mold 40, the clamped lower mold 30 and the LED display module 10 between the upper mold 40 and the lower mold 30 are conveyed from the mold clamping box 72 to the transition box 73, the third sealing door 731 is closed, and the mold clamping box 72 is in a vacuum state, so that after the mold clamping box 72 is vacuumized, the mold clamping box 72 is always in a vacuum state in subsequent production.
Specifically, the vacuumizing time is about 60 seconds, the glue filling time is 20-50 seconds, and the mold closing time is 30-180 seconds, so that the time can be saved by at least 80 seconds, and the production efficiency is improved.
Further, as a specific embodiment of the method for manufacturing the LED display module provided by the present invention, during continuous production, after the nth group of LED display modules 10, the upper mold 40, and the lower mold 30 have been performed in step S232, the first sealing door 711 is opened, the (N + 1) th group of LED display modules 10, the upper mold 40, and the lower mold 30 are placed in the glue filling box 71, the first sealing door 711 is closed, and then steps S213 and S214, and steps S23, S24, and S25 are performed, where N is greater than or equal to 1, and N is an integer;
when the nth group of LED display modules 10, the upper die 40 and the lower die 30 are assembled in the assembling box 72, the (N + 1) th group of LED display modules 10, the upper die 40 and the lower die 30 can be filled with glue in the glue filling box 71, so that the assembling process and the glue filling process of the two groups of LED display modules 10, the upper die 40 and the lower die 30 can be simultaneously carried out, the production time is saved, and the production efficiency is improved; and the (N + 1) th group of LED display modules 10, the upper die 40 and the lower die 30 do not need to vacuumize the mold box 72, so that the time for vacuumizing the mold box 72 is saved.
After the nth group of LED display modules 10, the upper mold 40, and the lower mold 30 complete step S232, the first sealing door 711 may be opened after any one of step S233, step S241, step S242, step S251, step S252, step S253, and step S254 is completed, and the (N + 1) th group of LED display modules 10, the upper mold 40, and the lower mold 30 are placed in the potting box 71.
Specifically, the first sealing door 711, the second sealing door 721, the third sealing door 731 and the fourth sealing door 732 are opened and closed according to a vacuum-pumping sequence when the glue-pouring box 71, the mold-closing box 72 and the transition box 73 are vacuumized.
Further, referring to fig. 13, as a specific implementation manner of the LED display module manufacturing method provided by the present invention, step S1 further provides a glue solution control device and a glue solution detection device, and the following steps are further included between step S1 and step S2:
s5: the glue solution detection device monitors and displays the physical property of the glue solution;
s6: adjusting the physical property, the proportion of each component and the glue yield of the glue solution by adjusting a glue solution control device according to production requirements;
the physical properties of the glue solution, such as the temperature and the viscosity of the glue solution, can be adjusted by the glue solution control device according to the actual production requirements; adjusting the proportion of water, glue and other components in the glue solution; the glue yield of the glue solution is adjusted, and the quality of the output glue solution is improved, so that the light transmittance of the glue solution after being cured and formed into a protective layer is improved.
Specifically, the glue solution detection device can be selected according to actual conditions, and for example, a temperature sensor can be arranged on the glue filling assembly.
Further, referring to fig. 13, as a specific embodiment of the method for manufacturing the LED display module according to the present invention, the mold clamping device 50 includes a fixed seat 52, a gripper 53, a first driving mechanism and a second driving mechanism, wherein one end of the fixed seat 52 is connected to the first driving mechanism, the gripper 53 is disposed on the fixed seat 52, the first driving mechanism can drive the fixed seat 52 to move from the position of the upper mold 40 to the position of the lower mold 30, and the second driving mechanism is disposed on the fixed seat 52 and can control the gripper 53 to close to grip the upper mold 40 or open to release the upper mold 40;
the first and second driving mechanisms improve the degree of automation of the mold clamping device 50 and improve the production efficiency.
Specifically, the first driving mechanism and the second driving mechanism are both air cylinders.
Further, referring to fig. 13, as a specific embodiment of the method for manufacturing the LED display module according to the present invention, the fixing base 52 is provided with a sliding slot 521, the grip 53 is slidably connected to the sliding slot 521, and the grip 53 slides on the sliding slot 521 to grip the upper mold 40, which is simple and convenient, easy to implement, and high in efficiency.
Specifically, referring to fig. 13, the hand grip 53 includes two fingers 531, and the two fingers 531 are driven by the second driving mechanism to move on the chute 521 and grip the upper mold 40.
Specifically, the second driving mechanism may drive only one finger 531 to slide, and fix the other finger 531, so as to capture the upper mold 40.
Further, referring to fig. 13 and 14, as a specific embodiment of the method for manufacturing an LED display module according to the present invention, the mold clamping device 50 further includes a connecting plate 51 and an elastic member 54, the connecting plate 51 is fixedly connected to the first driving mechanism, one end of the connecting plate 51 is hinged to the fixing base 52, and the other end of the connecting plate 51 is elastically connected to the fixing base 52 through the elastic member 54, so that the distance between the elastic connecting end between the connecting plate 51 and the fixing base 52 can be adjusted, the distance between the hinged connecting end between the connecting plate 51 and the fixing base 52 and the elastic connecting end are not the same, and the connecting plate 51 and the fixing base 52 form an acute angle, so that the upper mold 40 is tilted with respect to the lower mold 30 during the process of clamping the upper mold 40 and the lower mold 30 by the gripper 53, and during the process of slowly moving the upper mold 40 to the lower mold 30, one end of the upper, in the process of continuously approaching the upper die 40 to the lower die 30, residual air between the LED display module 10 and the glue solution can be extruded, air is prevented from being pressed into the glue solution, splashing of the glue solution is also avoided at the same time, the upper die 40 stops moving towards the lower die 30 until die assembly is completed, and due to elastic connection between the connecting plate 51 and the fixing seat 52, one end of the upper die 40 firstly contacts with the lower die 30 to complete die assembly of the upper die 40 and the lower die 30, a certain buffering effect can be achieved, therefore, the die assembly process is very smooth, and the elastic part 54 can easily achieve elastic connection between the connecting plate 51 and the fixing seat 52, and the LED display module is simple and convenient.
Further, referring to fig. 14, as a specific embodiment of the LED display module manufacturing method provided by the present invention, the elastic element 54 includes a spring and a pin, the pin is sleeved in the spring, one end of the spring is fixedly connected to the connecting plate 51, the other end of the spring is fixedly connected to the fixing base 52, the pin can support the spring to avoid elastic deflection or dislocation between the connecting plate 51 and the fixing base 52, and the spring can enable a certain amount of contraction or elongation between the connecting plate 51 and the fixing base 52.
Further, referring to fig. 15, as a specific embodiment of the LED display module manufacturing method provided by the present invention, a plurality of accommodating locations 61 are disposed on the material carrying plate 60, one part of the accommodating locations 61 is used for placing the lower mold 30, the other part of the accommodating locations 61 is used for placing the upper mold 40 and the LED display module 10, and the lower mold 30, the upper mold 40 and the LED display module 10 are placed on the accommodating locations 61, so that stability of the lower mold 30, the upper mold 40 and the LED display module 10 in a conveying process is ensured, and the method is simple and convenient.
Further, referring to fig. 15, as a specific embodiment of the LED display module manufacturing method provided by the present invention, the accommodating position 61 includes a lower mold accommodating cavity 611 and a module accommodating cavity 612, the lower mold 30 is disposed in the lower mold accommodating cavity 611, and the upper mold 40 and the LED display module 10 are disposed in the module accommodating cavity 612, when the lower mold 30 and the LED display module 10 are conveyed, the lower mold 30 can be directly disposed in the lower mold accommodating cavity 611, and the upper mold 40 and the LED display module 10 can be disposed in the module accommodating cavity 612, which is simple and convenient without fixing.
Specifically, before the molding die is placed in the glue filling box 71, the LED display module 10 is fixed on the upper die 40, and then the fixed LED display module 10 and the upper die 40 are placed together in the module accommodating cavity 612.
Further, referring to fig. 9 and 10, as a specific embodiment of the method for manufacturing the LED display module according to the present invention, the method further includes a baking device 90, a demolding device 100, and a second conveying device 120, where the baking device 90 is disposed between the transition box 73 and the demolding device 100, the second conveying device 120 can convey the lower mold 30, the upper mold 40, and the LED display module 10 from the transition box 73 to the baking device 90, and then from the baking device 90 to the demolding device 100, the baking device 90 can bake the LED display module 10 conveyed from the transition box 73, so as to accelerate the curing and forming of the glue solution, and the demolding device 100 can demold the LED display module 10 conveyed from the baking device 90, so as to improve the production efficiency.
In particular, the second conveyor 120 may be a conveyor belt.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
- The manufacturing method of the LED display module is characterized by comprising the following steps:s1: providing an LED display module, glue solution, a forming die, a glue filling assembly, a mold closing device and a vacuumizing box body, wherein the LED display module comprises a substrate and a plurality of LED lamp beads arranged on one side of the substrate, the forming die comprises an upper die and a lower die, the upper die is fixed on one side of the substrate, which is far away from the LED lamp beads, and the mold closing device can move the upper die to be closed with the lower die;s2: placing the forming mold and the LED display module in the vacuumizing box body, and injecting the glue solution into the lower mold through the glue pouring assembly in a vacuum state; driving the LED display module fixed on the upper die to be immersed into the glue solution through the die assembly device in a vacuum state, so that the upper die and the lower die are assembled;s3: curing and molding the glue solution into a protective layer for sealing the LED lamp beads on the substrate;the step S1 further provides a first conveying device and a material carrying plate capable of being conveyed with the first conveying device, and the vacuum box body provided in the step S1 includes a glue pouring box, a mold closing box and a transition box;the material carrying plate is used for carrying the LED display module, the upper die and the lower die; the glue filling assembly is arranged in the glue filling box, the mold closing box is arranged between the glue filling box and the transition box, and the mold closing device is arranged in the mold closing box;the feeding side of the glue pouring box is hermetically connected with a first sealing door, the glue pouring box is hermetically connected with the mould assembling box through a second sealing door, the mould assembling box is hermetically connected with the transition box through a third sealing door, and the discharging side of the transition box is hermetically connected with a fourth sealing door;vacuumizing devices are arranged in the glue pouring box, the mold closing box and the transition box, and the first sealing door, the second sealing door, the third sealing door and the fourth sealing door can be switched between an opening state and a closing state;the first conveying device carries the material carrying plate and is used for conveying the upper die, the lower die and the LED display module from the glue pouring box to the die assembling box through the material carrying plate and conveying the matched upper die, the matched lower die and the LED display module enclosed between the upper die and the lower die from the die assembling box to the transition box;the step S2 includes the following steps:step S21: pouring glue into the glue pouring box;step S22: vacuumizing the mould assembling box;step S23: closing the mold in the mold closing box;step S24: vacuumizing the transition box;step S25: blanking is carried out, wherein the blanking is carried out,wherein the step S21 includes the following steps performed in sequence:s211: placing the LED display module, the upper die and the lower die in the glue pouring box;s212: closing the first sealing door and the second sealing door;s213: vacuumizing the glue pouring box;s214: injecting the glue solution into the lower die in the glue filling box;the step S22 includes the following steps performed in sequence:s221: closing the third sealing door;s222: vacuumizing the mould assembling box;the step S221 is performed after the step S212;the step S23 includes the following steps performed in sequence:s231: opening the second sealing door;s232: after the LED display module, the upper die and the lower die are conveyed into the die assembling box by the first conveying device, closing the second sealing door;s233: closing the upper die and the lower die in the die closing box;the step S231 is performed after the steps S214 and S222;the step S24 includes the following steps performed in sequence:s241: closing the fourth sealing door;s242: vacuumizing the transition box;the step S241 is performed after the step S221;the step S25 includes the following steps performed in sequence:s251: opening the third sealing door;s252: the first conveying device conveys the matched lower die and the LED display module into the transition box, and then the third sealing door is closed;s253: opening the fourth sealing door;s254: blanking;step S251 is performed after step S233 and step S242.
- 2. The method for manufacturing an LED display module according to claim 1, wherein: also comprises the following steps:s4: and demolding, and carrying out finish machining treatment on the cured and molded protective layer.
- 3. The method for manufacturing an LED display module according to claim 1, wherein: and in the process of closing the upper die and the lower die, gradually closing the upper die at an initial inclination angle until the upper die and the lower die are completely attached.
- 4. The method for manufacturing an LED display module according to claim 1, wherein: during continuous production, after the Nth group of LED display modules, the upper die and the lower die finish the step S232,firstly opening the first sealing door, placing the (N + 1) th group of LED display modules, the upper die and the lower die in the glue pouring box, then closing the first sealing door, and then performing the steps S213 and S214, the steps S23, the step S24 and the step S25,wherein N is not less than 1 and N is an integer.
- 5. The method for manufacturing an LED display module according to claim 1, wherein: the step S1 further provides a glue solution control device and a glue solution detection device, and the following steps are further included between the step S1 and the step S2:s5: the glue solution detection device monitors and displays the physical property of the glue solution;s6: and adjusting the physical property, the proportion of each component or the glue yield of the glue solution by adjusting the glue solution control device according to production requirements.
- 6. The method for manufacturing an LED display module according to claim 1, wherein: the mold closing device comprises a fixed seat, a gripper, a first driving mechanism and a second driving mechanism, one end of the fixed seat is connected with the first driving mechanism, the gripper is arranged on the fixed seat, the first driving mechanism can drive the fixed seat to move from the position of the upper mold to the position of the lower mold, and the second driving mechanism is arranged on the fixed seat and can control the gripper to be closed to grip the upper mold or be opened to release the upper mold.
- 7. The method for manufacturing an LED display module according to claim 6, wherein: the mold closing device further comprises a connecting plate and an elastic piece, the connecting plate is fixedly connected with the first driving mechanism, one end of the connecting plate is hinged to the fixed seat, and the other end of the connecting plate is elastically connected with the fixed seat through the elastic piece.
- 8. The method for manufacturing an LED display module according to claim 1, wherein: the material carrying plate is provided with a plurality of containing positions, one part of the containing positions are used for placing the lower die, and the other part of the containing positions are used for placing the upper die and the LED display module.
- 9. The method for manufacturing an LED display module according to claim 8, wherein: the accommodating position comprises a lower die accommodating cavity and a module accommodating cavity, the lower die is placed in the lower die accommodating cavity, and the upper die and the LED display module are placed in the module accommodating cavity.
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| CN110930893A (en) * | 2019-12-09 | 2020-03-27 | 东莞市泽创塑胶科技有限公司 | Glass fitting process for LED display screen mask |
| CN113459362A (en) * | 2021-07-02 | 2021-10-01 | 和利时(苏州)自控技术有限公司 | Vacuum glue injection molding process method |
| CN113927804B (en) * | 2021-09-18 | 2023-11-07 | 东莞阿尔泰显示技术有限公司 | Glue filling die of LED display module |
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| CN102185120B (en) * | 2011-04-02 | 2013-09-11 | 东莞宏威数码机械有限公司 | Glove box device and method for transmitting workpieces |
| CN202415682U (en) * | 2011-12-31 | 2012-09-05 | 肇庆市腾胜真空技术工程有限公司 | Continuous vehicle lamp glass film-coating device |
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| CN207240636U (en) * | 2017-06-30 | 2018-04-17 | 深圳浩翔光电技术有限公司 | Vacuum glue pouring former |
| CN108381835A (en) * | 2018-02-11 | 2018-08-10 | 硬米（厦门）科技有限公司 | A kind of method of LED module and its reflecting surface encapsulating |
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