CN109702937A - LED display module manufacturing method - Google Patents
LED display module manufacturing method Download PDFInfo
- Publication number
- CN109702937A CN109702937A CN201811472619.7A CN201811472619A CN109702937A CN 109702937 A CN109702937 A CN 109702937A CN 201811472619 A CN201811472619 A CN 201811472619A CN 109702937 A CN109702937 A CN 109702937A
- Authority
- CN
- China
- Prior art keywords
- display module
- led display
- case
- lower die
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The present invention provides a kind of LED display module manufacturing methods, including step S1, step S2 and step S3, S1: providing LED display module, glue, molding die, mold closing mechanism and vacuumize cabinet, and molding die includes upper die and lower die, and upper mold can be moved to by mold closing mechanism to be molded with lower die；S2: holding vacuumizes in cabinet as vacuum state, injects glue in lower die vacuumizing in cabinet, then be moved to upper mold by mold closing mechanism and mold with lower die；S3: solidification.LED display module manufacturing method provided by the invention, encapsulating, molding, avoid air and are mixed into glue and form bubble after glue solidification, improving glue curing molding is the translucent effect after protective layer under vacuum conditions.
Description
Technical field
The invention belongs to LED display technical fields, are to be related to a kind of LED display module manufacturing method more specifically.
Background technique
LED display module generally includes the substrate for realizing control function and several LED for being arranged in substrate side
Lamp bead, to guarantee that display effect, the usually only less protection structure of LED lamp bead are even exposed.LED display module is using
It collides with caused by the unavoidable carrying of process and different climatic environment (steam, acid-base property, high/low temperature, ultraviolet light) is equal
Different degrees of injury can be brought to the substrate of LED display module and exposed LED lamp bead.Currently, LED display module is comparing
The even half a year of service life usually only 1 year in severe use environment, cause that use cost is high, lacks market competition
Power.
Therefore, how LED display module sufficiently to be protected in the case where guaranteeing the display effect of LED display module
Shield the problems such as to solve anticollision, anti-corrosion, moisture-proof, antistatic, and then extends LED display module service life, becomes current LED
The hot spot studied in display field.
It is at present protection LED display module, protective layer can be set in the side that LED display module is equipped with LED lamp bead, commonly use
Protective layer have epoxy resin, however during adhering to protective layer, be often mixed into air in protective layer, cause protective layer
In there is bubble, influence the translucency of protective layer, and then affect the display effect of LED display module.
Summary of the invention
The purpose of the present invention is to provide a kind of LED display module manufacturing methods, to solve guarantor existing in the prior art
The technical issues of there are bubbles in sheath.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of LED display module manufacturing method is provided, wrap
Include following steps:
S1: providing LED display module, glue, molding die, encapsulating component, mold closing mechanism and vacuumize cabinet, described
LED display module includes substrate and several LED lamp beads set on the substrate side, and the molding die includes upper mold under
Mould, the upper mold are fixed on the side away from the LED lamp bead of the substrate, and the mold closing mechanism can be mobile by the upper mold
It is molded to the lower die；
S2: by the molding die, the LED display module be placed in it is described vacuumize in cabinet, under vacuum conditions will
The glue is injected in the lower die by the encapsulating component；It is driven and is fixed by the mold closing mechanism under vacuum conditions again
The LED display module in the upper mold immerses in the glue, molds the upper mold and the lower die；
S3: being the protective layer being sealed in the LED lamp bead on the substrate by the glue curing molding.
Further, further include following steps:
S4: demoulding carries out finishing processing to the protective layer after curing molding.
Further, during the upper mold and the lower die mold, gradually with initial inclination angle by the upper mold
Molding is bonded to the upper mold with the lower die completely.
Further, the step S1 also provides the first conveying device and can be transmitted with first input unit
Loading plate, the cabinet that vacuumizes that the step S1 is provided includes encapsulating case, molding case and transition case；
The loading plate is for carrying the LED display module, the upper mold and the lower die；The encapsulating component is placed in
In the encapsulating case, the molding case is set between the encapsulating case and the transition case, and the mold closing mechanism is set to the conjunction
In moulding box；
The feed side of the encapsulating case is sealedly connected with the first closure door, by the between the encapsulating case and the molding case
Two closure doors are tightly connected, and are sealed up a door and are tightly connected by third between the molding case and the transition case, under the transition case
Material side seal is connected with the 4th closure door；
Vacuum evacuation device is equipped in the encapsulating case, the molding case and the transition case, described first seals up a door, is described
Second closure door, third closure door and the 4th closure door can switch under opening state and closed state；
First conveying device carries the loading plate, for by the loading plate by the upper mold, the lower die
The molding case is delivered to from the encapsulating case with the LED display module, and by the upper mold and the lower die after molding
And the LED display module being closed between the upper mold and the lower die is delivered to the transition case from the molding case；
The step S2 includes the following steps:
Step S21: the encapsulating in the encapsulating case；
Step S22: the molding case is vacuumized；
Step S23: it is molded in the molding case；
Step S24: the transition case is vacuumized；
Step S25: blanking,
Wherein, the step S21 includes the following steps that sequence carries out:
S211: the LED display module, the upper mold and the lower die are placed in the encapsulating case；
S212: first closure door and second closure door are closed；
S213: the encapsulating case is vacuumized；
S214: the glue is injected in the lower die in the encapsulating case；
The step S22 includes the following steps that sequence carries out:
S221: the third closure door is closed；
S222: the molding case is vacuumized；
The step S221 is carried out after the step S212；
The step S23 includes the following steps that sequence carries out:
S231: second closure door is opened；
S232: the LED display module, the upper mold and the lower die are delivered to the conjunction by first conveying device
After in moulding box, second closure door is closed；
S233: the upper mold and the lower die are molded in the molding case；
The step S231 is carried out after the step S214 and step S222；
The step S24 includes the following steps that sequence carries out:
S241: the 4th closure door is closed；
S242: the transition case is vacuumized；
The step S241 is carried out after the step S221；
The step S25 includes the following steps that sequence carries out:
S251: the third closure door is opened；
S252: first conveying device by after molding the lower die and the LED display module be sent into the transition
After case, the third closure door is closed；
S253: the 4th closure door is opened；
S254: blanking；
The step S251 is carried out after the step S233 and the step S242.
Further, when continuous production, institute has been carried out in the N group LED display module, the upper mold and the lower die
After stating step S232；
First closure door is first opened, the N+1 group LED display module, the upper mold and the lower die are placed in institute
State in encapsulating case, turn off first closure door, then carry out the step S213 and the step S214 and the step S23,
The step S24 and step S25,
Wherein N >=1, and N is integer.
Further, the step S1 also provides resin-control device and glue detection device, in the step S1 and institute
Stating between step S2 further includes following steps:
S5: the physical property of the glue detection arrangement monitors to the glue is simultaneously shown；
S6: the physical property of the glue, each component are adjusted by adjusting the resin-control device according to production requirement
Ratio or gel quantity.
Further, the mold closing mechanism includes fixing seat, handgrip, the first driving mechanism and the second driving mechanism, described
One end of fixing seat is connect with first driving mechanism, and the handgrip is set in the fixing seat, first driving mechanism
The fixing seat can be driven to be moved at the lower die position from the upper mold position, second driving mechanism is set to described
In fixing seat and can control the handgrip close up with grab the upper mold or open to unclamp the upper mold.
Further, the mold closing mechanism further includes connecting plate and elastic component, the connecting plate and first driving machine
Structure is fixedly connected, and one end of the connecting plate and the fixing seat are hinged, and the other end passes through the elastic component and the fixing seat
Elastic connection.
Further, the loading plate is equipped with multiple accommodating positions, and a part of accommodating position is used to place the lower die,
Accommodating position is for placing the upper mold and the LED display module described in another part.
Further, the accommodating position includes lower die accommodating cavity and mould group accommodating cavity, places institute in the lower die accommodating cavity
Lower die is stated, places the upper mold and the LED display module in the mould group accommodating cavity.
The beneficial effect of LED display module manufacturing method provided by the invention is: compared with prior art, the present invention
LED display module manufacturing method under vacuum conditions injects glue in lower die, and the glue for avoiding flowing directly connects with air
It touches and is mixed into air, then under vacuum conditions mold upper mold and lower die, so that LED display module immerses in glue, avoid
Air is mixed in glue and forms bubble, is influenced the translucent effect of protective layer, is then allowed glue to be formed by curing protective layer again.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is a kind of flow chart of LED display module manufacturing method provided in an embodiment of the present invention；
Fig. 2 is the flow chart of another LED display module manufacturing method provided in an embodiment of the present invention；
Fig. 3 is a kind of flow chart for embodiment that the step S2 of LED display module manufacturing method in Fig. 1 or Fig. 2 is provided；
Fig. 4 is the flow chart of step S21 in Fig. 3；
Fig. 5 is the flow chart of step S22 in Fig. 3；
Fig. 6 is the flow chart of step S23 in Fig. 3；
Fig. 7 is the flow chart of step S24 in Fig. 3；
Fig. 8 is the flow chart of step S25 in Fig. 3；
Fig. 9 is the top view of LED display module manufacturing device provided in an embodiment of the present invention；
Figure 10 is the front view of Fig. 9；
Figure 11 is three-dimensional structure diagram when having protective layer in LED display module provided in an embodiment of the present invention；
Figure 12 is the three-dimensional structure diagram of lower die provided in an embodiment of the present invention；
Figure 13 is the three-dimensional structure diagram of mould group clamping device provided in an embodiment of the present invention；
Figure 14 is front view when LED display module is put into glue accommodating chamber by mould group clamping device shown in Figure 13；
Figure 15 is the three-dimensional structure diagram of loading plate provided in an embodiment of the present invention.
Wherein, each appended drawing reference in figure:
10, LED display module；11, substrate；12, LED lamp bead；
20, protective layer；30, lower die；31, glue accommodating chamber；40, upper mold；
50, mold closing mechanism；51, connecting plate；52, fixing seat；521, sliding slot；53, handgrip；531, finger；54, elastic component；
60, loading plate；61, position is accommodated；611, lower die accommodating cavity；612, mould group accommodating cavity；
70, cabinet is vacuumized；71, encapsulating case；711, the first closure door；72, case is molded；721, the second closure door；73, transition
Case；731, third is sealed up a door；732, the 4th closure door；
80, encapsulating component；90, apparatus for baking；100, stripper apparatus；110, the first conveying device；120, the second conveying dress
It sets.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
Specific orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
Fig. 1, Fig. 9, Figure 11 and Figure 12 are please referred to, now LED display module manufacturing method provided by the invention is illustrated.
The LED display module manufacturing method, includes the following steps:
S1: LED display module 10, glue, molding die, encapsulating component 80, mold closing mechanism 50 are provided and vacuumize cabinet
70, LED display modules 10 include substrate 11 and several LED lamp beads 12 set on 11 side of substrate, molding die include upper mold 40
With lower die 30, upper mold 40 is fixed on the side away from LED lamp bead 12 of substrate 11, and upper mold 40 can be moved to by mold closing mechanism 50
It is molded with lower die 30；
S2: molding die, LED display module are placed in and vacuumized in cabinet 70, glue is passed through into filling under vacuum conditions
Glue component 80 injects in lower die 30；The LED being fixed in upper mold 40 is driven to show by mold closing mechanism 50 under vacuum conditions again
Mould group immerses in glue, molds upper mold 40 and lower die 30；
S3: being the protective layer 20 being sealed in LED lamp bead 12 on substrate 11 by glue curing molding.
LED display module manufacturing method provided by the invention compared with prior art under vacuum conditions injects glue
In lower die 30, the glue for avoiding flowing directly contacts with air and is mixed into air, then under vacuum conditions by upper mold 40 under
Mould 30 molds, so that LED display module 10 immerses in glue, avoids and is mixed with air in glue and forms bubble, influence to protect
The translucent effect of layer 20, then allows glue to be formed by curing protective layer 20 again.
Specifically, Figure 12 is please referred to, lower die 30 is equipped with the glue accommodating chamber 31 for accommodating glue.
Specifically, it is carried out between step S1 and step S2 to vacuumizing 70 vacuum pumping of cabinet；In step S2 and step
It carries out discharging vacuumizing to vacuumizing cabinet 70 between rapid S3.
Further, referring to Fig. 2, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode further includes following steps:
S4: demoulding carries out finishing processing to the protective layer after curing molding.
It is demoulding, after glue curing molding is protective layer 20, it is also necessary to protective layer 20 be finished, finishing includes pair
The processes such as the polishing of protective layer 20, cutting.
Further, a kind of specific embodiment as LED display module manufacturing method provided by the invention, upper mold 40
During being molded with lower die 30, upper mold 40 is gradually molded with initial inclination angle to upper mold 40 and is bonded completely with lower die 30,
It avoids upper mold 40 in clamping process remaining air is pressed into glue, the glue also avoided in lower die 30 is flat by upper mold 40
It presses and splashes.
Further, Fig. 1 and Fig. 3 are please referred to Fig. 8, one as LED display module manufacturing method provided by the invention
Kind of specific embodiment, it conveying device 110 and the material containing that can be transmitted with the first conveying device 110 that step S1, which also provides first,
Plate 60, it includes encapsulating case 71, molding case 72 and transition case 73 that step S1 was provided, which vacuumizes cabinet 70,；
Loading plate 60 is for carrying LED display module 10, upper mold 40 and lower die 30；Encapsulating component 80 is placed in encapsulating case 71
Interior, molding case 72 is set between encapsulating case 71 and transition case 73, and mold closing mechanism 50 is set in molding case 72；
The feed side of encapsulating case 71 is sealedly connected with the first closure door 711, passes through second between encapsulating case 71 and molding case 72
Closure door 721 is tightly connected, and is molded and is tightly connected between case 72 and transition case 73 by third closure door 731, the blanking of transition case 73
Side seal is connected with the 4th closure door 732；
Vacuum evacuation device, first the 711, second closure door of closure door are equipped in encapsulating case 71, molding case 72 and transition case 73
721, third closure door 731 and the 4th closure door 732 can switch under opening state and closed state；
First conveying device 110 carries loading plate 60, for being shown upper mold 40, lower die 30 and LED by loading plate 60
Mould group 10 is delivered to molding case 72 from encapsulating case 71, and by the upper mold 40 and lower die 30 after molding and is closed in upper mold 40 and lower die
LED display module 10 between 30 is delivered to transition case 73 from molding case 72；
Step S2 includes the following steps:
Step S21: the encapsulating in encapsulating case；
Step S22: pairing moulding box vacuumizes；
Step S23: it is molded in molding case；
Step S24: transition case is vacuumized；
Step S25: blanking,
Wherein, step S21 includes the following steps that sequence carries out:
S211: LED display module 10, upper mold 40 and lower die 30 are placed in encapsulating case 71；
S212: the first closure door 711 and the second closure door 721 are closed；
S213: encapsulating case 71 is vacuumized；
S214: glue is injected in lower die 30 in encapsulating case 71；
Step S22 includes the following steps that sequence carries out:
S221: third closure door 731 is closed；
S222: pairing moulding box 72 vacuumizes；
Step S221 is carried out after step s 212；
Step S23 includes the following steps that sequence carries out:
S231: the second closure door 721 is opened；
After LED display module 10, upper mold 40 and lower die 30 are delivered in molding case 72 by the S232: the first conveying device 110,
Close the second closure door 721；
S233: upper mold 40 and lower die 30 are molded in molding case 72；
Step S231 is carried out after step S214 and step S222；
Step S24 includes the following steps that sequence carries out:
S241: the 4th closure door 732 is closed；
S242: transition case 73 is vacuumized；
Step S241 is carried out after step S221；
Step S25 includes the following steps that sequence carries out:
S251: third closure door 731 is opened；
S252: the first conveying device 110 by after molding lower die 30 and LED display module 10 be sent into transition case 73 after, close
Close third closure door 731；
S253: the 4th closure door 732 is opened；
S254: blanking；
Step S251 is carried out after step S233 and step S242；
It allows encapsulating process, clamping process and blanking process to carry out in different cabinets respectively, encapsulating case 71 can be saved, closed
Space in moulding box 72 and transition case 73；And encapsulating process, clamping process and blanking process can carry out simultaneously, improve production
Efficiency；Pairing moulding box 72 is only needed to vacuumize the vacuum state that can be once always maintained in molding case 72 in process of production,
The time vacuumized in pairing moulding box 72 again is saved, enables clamping process to continue to carry out, improves production efficiency.
Specifically, Fig. 9 and Figure 10 is please referred to, when being vacuum state in encapsulating case 71 and molding case 72, i.e., first seals up a door
711, when the second closure door 721 and third closure door 731 are in closed state, the second closure door 721, encapsulating case 71 and molding case are opened
Also it is vacuum state in 72, lower die 30 and LED display module 10 is sent into after molding case 72 from encapsulating case 71 and close the second closure door
721, molding at this time is also vacuum state in case 72；When being vacuum state in molding case 72 and transition case 73, i.e., second seals up a door
721, third closure door 731 and the 4th closure door 732 are in off state, and are opened third closure door 731, are molded case 72 and transition case 73
Inside also be vacuum state, by the upper mold 40 after molding, the LED display module 10 between lower die 30 and upper mold 40 and lower die 30 from
After molding case 72 is sent to transition case 73, third closure door 731 is closed, molding in case 72 is also vacuum state, therefore in pairing moulding box
After 72 vacuumize, in subsequent production, molding in case 72 is always vacuum state.
Specifically, the time vacuumized is about 60 seconds, and the time of encapsulating is 20-50 seconds, and the time of molding is 30-180
Second, therefore the savable time is at least 80 seconds, improves production efficiency.
Further, a kind of specific embodiment as LED display module manufacturing method provided by the invention, it is continuous raw
When production, after N group LED display module 10, upper mold 40 and lower die 30 have carried out step S232, the first closure door 711 is first opened,
N+1 group LED display module 10, upper mold 40 and lower die 30 are placed in encapsulating case 71, turn off the first closure door 711, then carry out
Step S213 and step S214 and step S23, step S24 and step S25, wherein N >=1, and N are integer；
When N group LED display module 10, upper mold 40 and lower die 30 are molded in molding case 72, N+1 group LED is aobvious
Show that mould group 10, upper mold 40 and lower die 30 can carry out encapsulating in encapsulating case 71, so that two groups of LED display modules 10, upper mold 40
It can be carried out simultaneously with the clamping process and encapsulating process of lower die 30, save the production time, improve production efficiency；And N+1 group
LED display module 10, upper mold 40 and lower die 30 do not need pairing moulding box 72 again and vacuumize, and save pairing moulding box 72 and vacuumize
Time.
It wherein, can be in step after N group LED display module 10, upper mold 40 and lower die 30 have carried out step S232
Either step in S233, step S241, step S242, step S251, step S252, step S253 and step S254 is completed
Afterwards, then the first closure door 711 is opened, and N+1 group LED display module 10, upper mold 40 and lower die 30 is placed in encapsulating case 71.
Specifically, can in no particular order when being vacuumized to encapsulating case 71, molding case 72 and transition case 73, the first closure door 711, the
Two closure doors 721, third closure door 731 and the 4th closure door 732 are opened and closed according to sequence is vacuumized.
Further, Figure 13 is please referred to, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode, step S1 also provide resin-control device and glue detection device, further include walking between step S1 and step S2 as follows
It is rapid:
S5: the physical property of glue detection arrangement monitors to glue is simultaneously shown；
S6: according to production requirement by adjust resin-control device adjust the physical property of glue, the ratio of each component and
Gel quantity；
The physical property of glue, such as the temperature of glue can be adjusted by resin-control device according to needs of production
And viscosity；Adjust the ratio of each components such as glue Zhong Shui, glue；Adjust glue gel quantity number, improve the matter of the glue of output
Amount, so that improving glue curing molding is the translucency after protective layer.
Specifically, glue detection device can select according to the actual situation, such as temperature sensing can be arranged on encapsulating component
Device.
Further, Figure 13 is please referred to, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode, mold closing mechanism 50 include fixing seat 52, handgrip 53, the first driving mechanism and the second driving mechanism, one end of fixing seat 52
It is connect with the first driving mechanism, handgrip 53 is set in fixing seat 52, and the first driving mechanism can drive fixing seat 52 from upper mold 40
The place of setting is moved at 30 position of lower die, and the second driving mechanism, which is set in fixing seat 52 and can control handgrip 53, closes up on to grab
Mould 40 is opened to unclamp upper mold 40；
First driving mechanism and the second driving mechanism improve the degree of automation of mold closing mechanism 50, improve production effect
Rate.
Specifically, the first driving mechanism and the second driving mechanism are cylinder.
Further, Figure 13 is please referred to, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode, fixing seat 52 are equipped with sliding slot 521, and handgrip 53 is slidably connected on sliding slot 521, through handgrip 53 on sliding slot 521
The crawl to upper mold 40 is realized in sliding, simple and convenient, easy to accomplish, high-efficient.
Specifically, Figure 13 is please referred to, handgrip 53 includes two fingers 531, and two fingers 531 are driven by the second driving mechanism
It is dynamic, it is moved on sliding slot 521, and grab upper mold 40.
Specifically, the second driving mechanism can only piece finger 531 of driving be slided, will be another fixed with finger 531, real
Now to the crawl of upper mold 40.
Further, Figure 13 and Figure 14 is please referred to, a kind of tool as LED display module manufacturing method provided by the invention
Body embodiment, mold closing mechanism 50 further include connecting plate 51 and elastic component 54, and connecting plate 51 and the first driving mechanism, which are fixed, to be connected
It connects, one end of connecting plate 51 and fixing seat 52 are hinged, and the other end passes through elastic component 54 and 52 elastic connection of fixing seat, the company of being adjustable
Fishplate bar 51 is at a distance from the elastic connection end between fixing seat 52, so that the articulated connection end between connecting plate 51 and fixing seat 52
With it is inconsistent at a distance from elastic connection end, thus allow it is at an acute angle between connecting plate 51 and fixing seat 52, therefore handgrip 53 grab
During upper mold 40 and lower die 30 mold, upper mold 40 relative to lower die 30 be also it is inclined, by upper mold 40 to lower die 30
During slowly mobile, one end of upper mold 40 is inherently first contacted with one end of lower die 30, is being continued upper mold 40 to lower die
30 during, and the residual air between LED display module 10 and glue can be extruded, and avoid air being pressed into glue
In, while the splashing of glue is also avoided, until molding is completed, upper mold 40 stops to the movement of lower die 30, and due to connecting plate 51
With the elastic connection between fixing seat 52, upper mold 40 is first touched with lower die 30 in one end of upper mold 40 and the molding of lower die 30 is completed
During, have certain buffer function, therefore clamping process is very smooth, and elastic component 54 then connecting plate easy to accomplish 51 with
Elastic connection between fixing seat 52, it is simple and convenient.
Further, Figure 14 is please referred to, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode, elastic component 54 include spring and pin shaft, and pin shaft is set in spring, and one end of spring is fixedly connected with connecting plate 51, separately
One end is fixedly connected with fixing seat 52, pin shaft energy support spring, is avoided wrong between elastic skew or connecting plate 51 and fixing seat 52
Position, spring can make the contraction or elongation that have certain between connecting plate 51 or fixing seat 52.
Further, Figure 15 is please referred to, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode, loading plate 60 are equipped with multiple accommodating positions 61, and a part accommodating position 61 accommodates position 61 for placing lower die 30, another part
For placing upper mold 40 and LED display module 10, lower die 30 and upper mold 40 and LED display module 10 are placed on accommodating position 61
On, it ensure that lower die 30, the stability of upper mold 40 and LED display module 10 during transportation, it is simple and convenient.
Further, Figure 15 is please referred to, a kind of specific implementation as LED display module manufacturing method provided by the invention
Mode, accommodating position 61 include lower die accommodating cavity 611 and mould group accommodating cavity 612, place lower die 30, mould group in lower die accommodating cavity 611
Upper mold 40 and LED display module 10 are placed in accommodating cavity 612, it, can be directly by under when conveying lower die 30 and LED display module 10
Mould 30 is placed in lower die accommodating cavity 611, upper mold 40 and LED display module 10 is placed in mould group accommodating cavity 612, nothing
It needs to fix, it is simple and convenient.
Specifically, before molding die is placed in encapsulating case 71, LED display module 10 is fixed in upper mold 40,
The LED display module 10 fixed and upper mold 40 are placed on together in mould group accommodating cavity 612 again.
Further, Fig. 9 and Figure 10 is please referred to, a kind of tool as LED display module manufacturing method provided by the invention
Body embodiment, further includes apparatus for baking 90, stripper apparatus 100 and the second conveying device 120, and apparatus for baking 90 is set to transition
Between case 73 and stripper apparatus 100, the second conveying device 120 can be by lower die 30, upper mold 40 and LED display module 10 from transition case
73 are delivered to apparatus for baking 90, then are delivered to stripper apparatus 100 from apparatus for baking 90, and apparatus for baking 90 can be to defeated from transition case 73
The LED display module 10 brought is toasted, and accelerates the curing molding of glue, and stripper apparatus 100 can be to from apparatus for baking
The LED display module 10 that 90 conveyings come is demoulded, and production efficiency is improved.
Specifically, the second conveying device 120 can be conveyer belt.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1.LED display module manufacturing method, which comprises the steps of:
S1: LED display module, glue, molding die, encapsulating component, mold closing mechanism are provided and vacuumize cabinet, the LED is aobvious
Show that mould group includes substrate and several LED lamp beads set on the substrate side, the molding die includes upper die and lower die, described
Upper mold is fixed on the side away from the LED lamp bead of the substrate, and the mold closing mechanism can be moved to the upper mold and institute
State lower die molding；
S2: by the molding die, the LED display module be placed in it is described vacuumize in cabinet, under vacuum conditions will be described
Glue is injected in the lower die by the encapsulating component；Institute is fixed on by mold closing mechanism drive under vacuum conditions again
The LED display module stated in upper mold immerses in the glue, molds the upper mold and the lower die；
S3: being the protective layer being sealed in the LED lamp bead on the substrate by the glue curing molding.
2. LED display module manufacturing method according to claim 1, it is characterised in that: further include following steps:
S4: demoulding carries out finishing processing to the protective layer after curing molding.
3. LED display module manufacturing method according to claim 1, it is characterised in that: the upper mold and the lower die are closed
During mould, the upper mold is gradually molded with initial inclination angle to the upper mold and is bonded completely with the lower die.
4. LED display module manufacturing method according to claim 1, it is characterised in that: the step S1 also provides first
Conveying device and the loading plate that can be transmitted with first input unit, the described of step S1 offer vacuumize cabinet
Including encapsulating case, molding case and transition case；
The loading plate is for carrying the LED display module, the upper mold and the lower die；The encapsulating component is placed in described
In encapsulating case, the molding case is set between the encapsulating case and the transition case, and the mold closing mechanism is set to the molding case
It is interior；
The feed side of the encapsulating case is sealedly connected with the first closure door, passes through the second envelope between the encapsulating case and the molding case
Door sealing connection, is sealed up a door by third between the molding case and the transition case and is tightly connected, the blanking side of the transition case
It is sealedly connected with the 4th closure door；
Vacuum evacuation device, first closure door, described second are equipped in the encapsulating case, the molding case and the transition case
Closure door, third closure door and the 4th closure door can switch under opening state and closed state；
First conveying device carries the loading plate, for by the loading plate by the upper mold, the lower die and institute
It states LED display module and is delivered to the molding case from the encapsulating case, and by the upper mold and the lower die and envelope after molding
The LED display module closed between the upper mold and the lower die is delivered to the transition case from the molding case；
The step S2 includes the following steps:
Step S21: the encapsulating in the encapsulating case；
Step S22: the molding case is vacuumized；
Step S23: it is molded in the molding case；
Step S24: the transition case is vacuumized；
Step S25: blanking,
Wherein, the step S21 includes the following steps that sequence carries out:
S211: the LED display module, the upper mold and the lower die are placed in the encapsulating case；
S212: first closure door and second closure door are closed；
S213: the encapsulating case is vacuumized；
S214: the glue is injected in the lower die in the encapsulating case；
The step S22 includes the following steps that sequence carries out:
S221: the third closure door is closed；
S222: the molding case is vacuumized；
The step S221 is carried out after the step S212；
The step S23 includes the following steps that sequence carries out:
S231: second closure door is opened；
S232: the LED display module, the upper mold and the lower die are delivered to the molding case by first conveying device
After interior, second closure door is closed；
S233: the upper mold and the lower die are molded in the molding case；
The step S231 is carried out after the step S214 and step S222；
The step S24 includes the following steps that sequence carries out:
S241: the 4th closure door is closed；
S242: the transition case is vacuumized；
The step S241 is carried out after the step S221；
The step S25 includes the following steps that sequence carries out:
S251: the third closure door is opened；
S252: first conveying device by the lower die after molding and after the LED display module is sent into the transition case,
Close the third closure door；
S253: the 4th closure door is opened；
S254: blanking；
The step S251 is carried out after the step S233 and the step S242.
5. LED display module manufacturing method according to claim 4, it is characterised in that: when continuous production, in N group institute
It states after LED display module, the upper mold and the lower die carried out the step S232,
First closure door is first opened, the N+1 group LED display module, the upper mold and the lower die are placed in the filling
In glue case, first closure door is turned off, then carries out the step S213 and the step S214 and the step S23, described
The step S24 and step S25,
Wherein N >=1, and N is integer.
6. LED display module manufacturing method according to claim 1, it is characterised in that: the step S1 also provides glue
Control device and glue detection device further include following steps between the step S1 and the step S2:
S5: the physical property of the glue detection arrangement monitors to the glue is simultaneously shown；
S6: the ratio of the physical property of the glue, each component is adjusted by adjusting the resin-control device according to production requirement
Example or gel quantity.
7. LED display module manufacturing method according to claim 1, it is characterised in that: the mold closing mechanism includes fixing
Seat, handgrip, the first driving mechanism and the second driving mechanism, one end of the fixing seat are connect with first driving mechanism, institute
Handgrip is stated in the fixing seat, first driving mechanism can drive the fixing seat to be moved to from the upper mold position
At the lower die position, second driving mechanism, which is set in the fixing seat and can control the handgrip, closes up to grab
It states upper mold or opens to unclamp the upper mold.
8. LED display module manufacturing method according to claim 7, it is characterised in that: the mold closing mechanism further includes connecting
Fishplate bar and elastic component, the connecting plate are fixedly connected with first driving mechanism, one end of the connecting plate and the fixation
Seat is hinged, and the other end passes through the elastic component and the fixing seat elastic connection.
9. LED display module manufacturing method according to claim 1, it is characterised in that: the loading plate is equipped with multiple
Accommodate position, a part of accommodating position for placing the lower die, accommodating position described in another part for place the upper mold with
The LED display module.
10. LED display module manufacturing method according to claim 9, it is characterised in that: the accommodating position includes that lower die is held
Set chamber and mould group accommodating cavity, the lower die placed in the lower die accommodating cavity, placed in the mould group accommodating cavity upper mold and
The LED display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811472619.7A CN109702937B (en) | 2018-12-04 | 2018-12-04 | Manufacturing method of LED display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811472619.7A CN109702937B (en) | 2018-12-04 | 2018-12-04 | Manufacturing method of LED display module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109702937A true CN109702937A (en) | 2019-05-03 |
| CN109702937B CN109702937B (en) | 2021-03-30 |
Family
ID=66254681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811472619.7A Active CN109702937B (en) | 2018-12-04 | 2018-12-04 | Manufacturing method of LED display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109702937B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110930893A (en) * | 2019-12-09 | 2020-03-27 | 东莞市泽创塑胶科技有限公司 | Glass fitting process for LED display screen mask |
| CN113459362A (en) * | 2021-07-02 | 2021-10-01 | 和利时(苏州)自控技术有限公司 | Vacuum glue injection molding process method |
| CN113927804A (en) * | 2021-09-18 | 2022-01-14 | 东莞阿尔泰显示技术有限公司 | Glue filling mold of LED display module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090109755A (en) * | 2008-04-16 | 2009-10-21 | 비전하이테크 주식회사 | Apparatus and method for vacuum molding light guide panel |
| CN102185120A (en) * | 2011-04-02 | 2011-09-14 | 东莞宏威数码机械有限公司 | Glove box device and method for transmitting workpieces |
| CN202415682U (en) * | 2011-12-31 | 2012-09-05 | 肇庆市腾胜真空技术工程有限公司 | Continuous vehicle lamp glass film-coating device |
| CN106273094A (en) * | 2016-10-17 | 2017-01-04 | 中国航空动力机械研究所 | Epoxy resin pattern manufacture method for photoelastic test |
| CN207240636U (en) * | 2017-06-30 | 2018-04-17 | 深圳浩翔光电技术有限公司 | Vacuum glue pouring former |
| CN108381835A (en) * | 2018-02-11 | 2018-08-10 | 硬米（厦门）科技有限公司 | A kind of method of LED module and its reflecting surface encapsulating |
-
2018
- 2018-12-04 CN CN201811472619.7A patent/CN109702937B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090109755A (en) * | 2008-04-16 | 2009-10-21 | 비전하이테크 주식회사 | Apparatus and method for vacuum molding light guide panel |
| CN102185120A (en) * | 2011-04-02 | 2011-09-14 | 东莞宏威数码机械有限公司 | Glove box device and method for transmitting workpieces |
| CN202415682U (en) * | 2011-12-31 | 2012-09-05 | 肇庆市腾胜真空技术工程有限公司 | Continuous vehicle lamp glass film-coating device |
| CN106273094A (en) * | 2016-10-17 | 2017-01-04 | 中国航空动力机械研究所 | Epoxy resin pattern manufacture method for photoelastic test |
| CN207240636U (en) * | 2017-06-30 | 2018-04-17 | 深圳浩翔光电技术有限公司 | Vacuum glue pouring former |
| CN108381835A (en) * | 2018-02-11 | 2018-08-10 | 硬米（厦门）科技有限公司 | A kind of method of LED module and its reflecting surface encapsulating |
Non-Patent Citations (1)
| Title |
|---|
| 杨乃恒: "《幕墙玻璃真空镀膜技术》", 30 November 1994, 东北大学出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110930893A (en) * | 2019-12-09 | 2020-03-27 | 东莞市泽创塑胶科技有限公司 | Glass fitting process for LED display screen mask |
| CN113459362A (en) * | 2021-07-02 | 2021-10-01 | 和利时(苏州)自控技术有限公司 | Vacuum glue injection molding process method |
| CN113927804A (en) * | 2021-09-18 | 2022-01-14 | 东莞阿尔泰显示技术有限公司 | Glue filling mold of LED display module |
| CN113927804B (en) * | 2021-09-18 | 2023-11-07 | 东莞阿尔泰显示技术有限公司 | Glue filling die of LED display module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109702937B (en) | 2021-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109702937A (en) | LED display module manufacturing method | |
| US8158046B2 (en) | Mold apparatus and method | |
| AU2004240172A8 (en) | Device for blow moulding, filling and closing plastic containers | |
| CN109109265A (en) | One kind vacuumizing auxiliary double-shot moulding device | |
| CN211566771U (en) | Injection mold with good injection molding quality | |
| CN205167457U (en) | Plastic product endocyst magnet injection mold | |
| CN206085483U (en) | Multiple color plastic jetting -moulding machine | |
| CN209426062U (en) | A kind of good mold of leakproofness | |
| CN210453577U (en) | Quick injection mold | |
| CN207310395U (en) | Fully-automatic intelligent boxing apparatus | |
| CN209440709U (en) | A kind of anti-deformation silica gel mould for the processing of luggage accessory | |
| CN209409170U (en) | A kind of easy-to-mount injection mold | |
| CN213500686U (en) | Hot runner injection molding control system with time sequence control valve | |
| CN218593654U (en) | Device for improving internal adhesion of anisotropic blow-molded product | |
| CN213830214U (en) | Injection molding device for automobile central control panel | |
| CN220720112U (en) | Silica gel mold convenient to demolding | |
| CN219543988U (en) | Container forming device | |
| CN107877770A (en) | Instrument board covering manufacture method and automobile making method | |
| CN209718464U (en) | A kind of glass reinforced heat conduction silica gel molding equipment | |
| CN214353857U (en) | Be favorable to mould structure that PP material was moulded plastics | |
| CN209259642U (en) | The clamping mold of encapsulation all-in-one machine is blown for single-dosed eye-drops | |
| CN213919453U (en) | Injection molding machine for injection molding | |
| CN215472587U (en) | Silica gel tube extrusion molding mould | |
| CN209158774U (en) | A kind of injection molding machine | |
| CN218196496U (en) | Compression molding device for preparation of medical rubber plug |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |