CN109698285A - Bonding method, mechanism and the display panel of thin-film packing structure and the film that blocks water - Google Patents
Bonding method, mechanism and the display panel of thin-film packing structure and the film that blocks water Download PDFInfo
- Publication number
- CN109698285A CN109698285A CN201710992603.8A CN201710992603A CN109698285A CN 109698285 A CN109698285 A CN 109698285A CN 201710992603 A CN201710992603 A CN 201710992603A CN 109698285 A CN109698285 A CN 109698285A
- Authority
- CN
- China
- Prior art keywords
- film
- thin
- blocks water
- packing structure
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
Abstract
The embodiment of the invention provides bonding method, mechanism and the display panels of a kind of thin-film packing structure and the film that blocks water, method includes: to carry out surface cleaning and hydrophilic activation processing to thin-film packing structure and the film that blocks water respectively, thin-film packing structure is set to form the first activating surface with the film that blocks water one side to be bonded, and make film one side formation second activating surface to be bonded with thin-film packing structure that block water；First activating surface and the second activating surface are directly fitted, to thin-film packing structure and the film that blocks water carry out it is pre- be bonded processing, obtain thin-film packing structure and the pre- bonding structure of film of blocking water；Pre- bonding structure is made annealing treatment, makes thin-film packing structure and blocks water film in the form of covalent bond and be bonded together.The technical solution of the embodiment of the present invention can be improved the bond strength of thin-film packing structure with the film that blocks water, and improve process repeatability, and the thermal stability and chemical stability that improve thin-film packing structure between the film that blocks water.
Description
Technical field
The present embodiments relate to encapsulation technology field more particularly to the sides of bonding of a kind of thin-film packing structure and the film that blocks water
Method, mechanism and display panel.
Background technique
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display panel, due to having width
It the advantages that visual angle, good contrast, quick response speed and low-power consumption, is gradually concerned by people and favors.
Phenomena such as in order to prevent OLED element from being oxidized, usually utilizes thin-film package (Thin Film in the prior art
Encapsulation, TFE) structure gets up oled layer cladding, and the film that blocks water is arranged away from the side of oled layer in TFE structure
(Barrier Film, BF) generallys use the attached method of gluing, BF is pasted onto the prior art between TFE structure and BF
In TFE structure.
But in the prior art, the keying features of the TFE structure and BF that are obtained using the attached method of gluing, glue intensity
It is lower, peeling resistance is poor, bonding thermoplasticity and thermosetting property it is poor.
Summary of the invention
The embodiment of the present invention provides bonding method, mechanism and the display panel of a kind of thin-film packing structure and the film that blocks water, energy
The bond strength for enough improving TFE structure and BF improves process repeatability, and the heat improved between TFE structure and the film that blocks water is steady
Qualitative and chemical stability.
The embodiment of the present invention provides the bonding method of a kind of thin-film packing structure and the film that blocks water, comprising:
Respectively to the thin-film packing structure and the film that blocks water one side to be bonded and film and the film of blocking water
Encapsulating structure one side to be bonded carries out surface cleaning and hydrophilic activation processing, makes the thin-film packing structure and the film that blocks water
One side to be bonded forms the first activating surface, and, make film and the thin-film packing structure one side to be bonded of blocking water
Form the second activating surface；
First activating surface and second activating surface are directly fitted, to the thin-film packing structure with it is described
The film that blocks water carries out pre- bonding processing, obtains the pre- bonding structure of thin-film packing structure with the film that blocks water；
The pre- bonding structure is made annealing treatment, makes the thin-film packing structure and the film that blocks water with covalent bond
Form is bonded together, and thin-film packing structure described in the mechanism after making bonding reaches predetermined with the degree that is bonded of the film that blocks water
Condition.
Further, in method described above, the thin-film packing structure is carried out pre- being bonded place with the film that blocks water
Reason obtains the pre- bonding structure of thin-film packing structure with the film that blocks water, comprising:
According to preset pre- bonding temperature and pre- bonding handling duration, to the thin-film packing structure and it is described block water film into
The pre- bonding processing of row, makes first activating surface generate the first hydrogen bond, and, so that second activating surface is generated the second hydrogen
Key；
First hydrogen bond is bonded with second hydrogen occurs polymerization reaction, obtains hydrone and to covalent atom, is formed
The pre- bonding structure of the thin-film packing structure and the film that blocks water；
Described to covalent atom is formed according to the material of the thin-film packing structure and the material of the film that blocks water.
Further, in method described above, the pre- bonding structure is made annealing treatment, comprising:
According to preset annealing temperature and annealing duration, the pre- bonding structure is made annealing treatment, is made adjacent
Two form the covalent bond to react to each other between covalent atom, and, by the hydrone from it is described first activation table
It is discharged between face and second activating surface.
Further, in method described above, the pre- bonding temperature and/or the annealing temperature are according to described thin
The material of the material of film encapsulating structure and the film that blocks water, is set.
Further, in method described above, the material phase of the material of the thin-film packing structure and the film that blocks water
It is same or different.
Further, in method described above, the thin-film packing structure includes the first silicon layer and the first silicon oxide layer；
The first silicon oxide layer one side is arranged on first silicon layer, and first silicon oxide layer is not disposed on institute
State the first silicon layer for the thin-film packing structure and the film that blocks water it is to be bonded while.
Further, in method described above, the film that blocks water includes the second silicon layer and the second silicon oxide layer；
The second silicon oxide layer one side is arranged on second silicon layer, and second silicon oxide layer is not disposed on institute
State the second silicon layer block water for described in film and the thin-film packing structure it is to be bonded while.
Further, in method described above, first hydrogen bond and/or second hydrogen bond are hydroxyl.
The embodiment of the present invention also provides the keying features of a kind of thin-film packing structure and the film that blocks water, the thin-film packing structure
Keying features with the film that blocks water are prepared according to the bonding method of as above any thin-film packing structure and the film that blocks water.
The embodiment of the present invention also provides a kind of display panel, including flexible substrate, Organic Light Emitting Diode layer and institute as above
The keying features of the thin-film packing structure stated and the film that blocks water；
The Organic Light Emitting Diode layer is located at the side of the flexible substrate；
The keying features of the thin-film packing structure and the film that blocks water are located in the Organic Light Emitting Diode layer away from described
The side of flexible substrate, and coat the Organic Light Emitting Diode layer.
Bonding method, mechanism and the display panel of the thin-film packing structure of the embodiment of the present invention and the film that blocks water, pass through difference
It is to be bonded to TFE structure and BF and BF and TFE structure while carry out surface cleaning and hydrophilic activation processing to be bonded,
TFE structure is set to form the first activating surface with one side BF to be bonded, and, the one side for keeping BF and TFE structure to be bonded is formed
After second activating surface, the first activating surface and the second activating surface are directly fitted, TFE structure and BF are carried out pre- to be bonded place
Reason, obtains TFE structure and the pre- bonding structure of BF, and make annealing treatment to pre- bonding structure, makes TFE structure and BF with covalent
The form of key is bonded together, and avoids and TFE structure is bonded together with BF using gluing attached method.The embodiment of the present invention
Technical solution, can be improved TFE structure and the bond strength of BF, improve process repeatability, and improve TFE structure and block water
Thermal stability and chemical stability between film.
Detailed description of the invention
Attached drawing described herein is used to provide to further understand the embodiment of the present invention, constitutes the embodiment of the present invention
A part, the illustrative embodiments and their description of the embodiment of the present invention are used to explain the present invention embodiment, do not constitute to this hair
The improper restriction of bright embodiment.In the accompanying drawings:
Fig. 1 is the flow chart of the TFE structure of the embodiment of the present invention and the bonding method embodiment one of BF；
Fig. 2 is the flow chart of the TFE structure of the embodiment of the present invention and the bonding method embodiment two of BF；
Fig. 3 is that the embodiment of the present invention obtains TFE structure and the pre- bonding structure of BF after the processing of bonding in advance；
Fig. 4 be by annealing after obtain in the form of covalent bond existing for TFE structure and BF keying features；
Fig. 5 is the structural schematic diagram of the display panel of the embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Technical solution of the embodiment of the present invention is clearly and completely described in specific embodiment and corresponding attached drawing.Obviously, described
Embodiment is only a part of the embodiment of the embodiment of the present invention, instead of all the embodiments.Based on the reality in the embodiment of the present invention
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the range of protection of the embodiment of the present invention.
Specification and claims and the (if present)s such as term " first " in above-mentioned attached drawing, " second " are for area
Not similar part, without being used to describe a particular order or precedence order.It should be understood that the data used in this way are appropriate
In the case of can be interchanged, so that embodiments herein described herein can be real with the sequence other than illustrating herein
It applies.
Below in conjunction with attached drawing, the technical solution of each embodiment offer of embodiment that the present invention will be described in detail.
Since OLED is more sensitive to steam, if there is steam enters OLED thin-film packing structure, the service life of OLED can be reduced,
Therefore, the thin-film packing structure of OLED it is usual in the film that blocks water can be set.The laminating type to block water between film and thin-film packing structure
The common attached realization of gluing, but glue adherency in flexible display screen and there is very big drawback, because flexible display screen needs to guarantee tool
The operation such as have certain flexibility, can be bent or bend.If attached by gluing, the film that blocks water is multiple with thin-film packing structure
May be such that glue is ineffective after bending or bending, the film that causes to block water falls off so that OLED thin-film packing structure be oxidized and
Service life reduction, therefore, present applicant proposes use will block water in a manner of covalent bonding between atom film and thin-film package knot
Structure fitting, in this way, whole film thickness (not needing between the two in addition glue) can not only be reduced, and since it is adopted
It is bonded with the mode of chemical bonding, the fitting of the two can be made stronger.Concrete processing procedure may refer to down
State content:
Fig. 1 is the flow chart of the TFE structure of the embodiment of the present invention and the bonding method embodiment one of BF, as shown in Figure 1, this
The TFE structure of inventive embodiments and the bonding method of BF can specifically include following steps:
100, respectively it is to be bonded to TFE structure and BF and BF and TFE structure it is to be bonded while carry out surface it is clear
Clean and hydrophilic activation processing makes TFE structure form the first activating surface with one side BF to be bonded, and, make BF and TFE structure
One side to be bonded forms the second activating surface.
During a specific implementation, to realize being bonded for TFE structure and BF, need to wait for key to TFE structure and BF
Conjunction and BF and TFE structure while carry out surface cleaning and hydrophilic activation processing to be bonded.
For example, can but be not limited to carry out surface cleaning and hydrophilic activation processing under alcoholic environment, specifically, can be with
TFE structure and one side BF to be bonded are ultrasonically treated after a certain period of time using deionized water, boiling is boiled certain in dehydrated alcohol
Time, and rinsed repeatedly with deionized water, it is put into ethyl alcohol and is ultrasonically treated certain time, obtain the first activation table of TFE structure
Face.
Similarly, surface cleaning and hydrophilic work can be carried out using the same method one side to be bonded to BF and TFE structure
Change processing, obtains the second activating surface of BF.
101, the first activating surface and the second activating surface are directly fitted, to TFE structure and BF carry out it is pre- be bonded processing,
Obtain TFE structure and the pre- bonding structure of BF.
After obtaining the first activating surface and the second activating surface, can but be not limited to the environment of dehydrated alcohol steam
Under, the first activating surface and the second activating surface are fit together, and to TFE structure and BF carry out it is pre- be bonded processing, in turn
Obtain TFE structure and the pre- bonding structure of BF.
102, the pre- bonding structure of TFE structure and BF are made annealing treatment, makes TFE structure and BF in the form of covalent bond
It is bonded together, thin-film packing structure reaches predetermined condition with the degree that is bonded for the film that blocks water in the mechanism after making bonding.
In order to discharge stress, increase the ductility and toughness between the material of TFE structure and the material of BF, and generate
Special construction, in the embodiment of the present invention, after obtaining the pre- bonding structure of TFE structure and BF, need to the pre- bonding structure into
Row annealing, so that TFE structure and BF be made to be bonded together in the form of covalent bond, the TFE structure that obtains in this way and BF's
Keying features, in this way, TFE structure be bonded in the form of covalent bond between BF, the fitting gap very little of the two, so as to reduce
Steam in TFE structure stops, and especially remains in contact surface (i.e. the first activating surface and second between TFE structure and BF
Activating surface) on steam.Meanwhile the mechanism after bonding prevents steam from entering TFE structure by BF.
In addition, in different application areas, it may not to the minimum requirements of the firmness between TFE structure and BF
Together, by the way that TFE structure can satisfy to the requirements of different firmness with the mechanism that BF is bonded in a manner of being bonded.By upper
The mode of stating be bonded after mechanism when, can be surveyed with the bond strength in the mechanism after para-linkage between TFE structure and BF
Examination (for example, can be by carrying out multiple bending or bend test, determining whether there is in by pre-determined number or duration
A possibility that TFE structure is separated with BF or BF falls off, so that it is determined that its bond strength), if test result instruction TFE structure with
The corresponding firmness of bond strength between BF is greater than the minimum requirements of specified firmness, it may be considered that after bonding
Mechanism can come into operation.If the corresponding firmness of bond strength between test result instruction TFE structure and BF is less than
The minimum requirements of specified firmness, i.e. bond strength between TFE structure and BF be not up to standard, at this point it is possible to by TFE structure
It is opened with BF points, then, removes other impurity on the first activating surface and the second activating surface, above-mentioned treatment process can be passed through
Bonding is re-started, after the completion of bonding, the mechanism after para-linkage bond strength test can be carried out again, if being unsatisfactory for making a reservation for
Condition then re-starts bonding, until bond strength meets predetermined condition.Therefore, processed by way of bonding
Journey, bond strength is higher, and process repeatability is higher, the covalent bond of formation thermal stability with higher and chemical stabilization
Property.
The TFE structure of the embodiment of the present invention and the bonding method of BF, by respectively to TFE structure and one side BF to be bonded
Surface cleaning and hydrophilic activation processing are carried out with one side BF and TFE structure to be bonded, makes TFE structure and one side BF to be bonded
The first activating surface is formed, and, after so that BF is formed the second activating surface with TFE structure one side to be bonded, by the first activation
Surface is directly fitted with the second activating surface, to TFE structure and BF carry out it is pre- be bonded processing, obtain TFE structure and the pre- key of BF
Structure is closed, and pre- bonding structure is made annealing treatment, so that TFE structure and BF is bonded together in the form of covalent bond, avoids
It is using gluing attached method that TFE structure and BF is viscous and together.The technical solution of the embodiment of the present invention, can be improved TFE
The bond strength of structure and BF improves process repeatability, and improves the thermal stability and chemical stabilization between TFE structure and BF
Property.
Fig. 2 is the flow chart of the TFE structure of the embodiment of the present invention and the bonding method embodiment two of BF, as shown in Fig. 2, this
On the basis of the bonding method embodiment shown in Fig. 1 of the TFE structure and BF of inventive embodiments, further in further detail to this
The technical solution of inventive embodiments is described.
As shown in Fig. 2, the TFE structure of the embodiment of the present invention and the bonding method of BF can specifically include following steps:
200, respectively it is to be bonded to TFE structure and BF and BF and TFE structure it is to be bonded while carry out surface it is clear
Clean and hydrophilic activation processing makes TFE structure form the first activating surface with one side BF to be bonded, and, make BF and TFE structure
One side to be bonded forms the second activating surface.
The step please refers to the step 100 in above-mentioned embodiment illustrated in fig. 1 in detail, and details are not described herein.
201, the first activating surface and the second activating surface are directly fitted, according to preset pre- bonding temperature and pre- bonding
Handling duration, to TFE structure and BF carry out it is pre- be bonded processing, so that the first activating surface is generated the first hydrogen bond, and, make second living
Change surface area contact and generates the bonding of the second hydrogen.
For example, after directly fitting the first activating surface and the second activating surface, it can be according to preset pre- bonding temperature
Degree and pre- bonding handling duration, TFE structure is heated with BF, with to TFE structure with BF progress is pre- is bonded processing.
Specifically, TFE structure and BF are being carried out to can be generated first at the first activating surface in pre- bonding process
Hydrogen bond generates the second hydrogen bond at the second activating surface.For example, the first activating surface of TFE structure can adsorb but be not limited to-
OH group generates the first hydrogen bond, and similarly, the second activating surface of BF can adsorb but be not limited to-OH group, generates the second hydrogen bond.
Wherein, pre- bonding temperature is the material of the material and BF according to TFE structure, is set.
202, the first hydrogen bond is bonded with the second hydrogen occurs polymerization reaction, obtains hydrone and to covalent atom, forms TFE knot
The pre- bonding structure of structure and BF.
In a specific implementation process, after obtaining the first hydrogen bond and the second hydrogen bond, the first hydrogen bond and the second hydrogen bonding energy
Polymerization reaction enough occurs, and obtains hydrone, and, it is generated respectively according to the material of TFE structure and the material of BF corresponding to altogether
Valence atom, and then form the pre- bonding structure of TFE structure and BF.
For example, the material of TFE structure and the material of BF are same or different, made in the embodiment of the present invention with silicon or silica
For TFE structure, and, using silicon or silica as the material of BF for the technical solution of the embodiment of the present invention is described.
But the embodiment of the present invention is not restricted to both materials.
For example, TFE structure includes the first silicon layer and the first silicon oxide layer, the first silicon oxide layer one side is arranged in the first silicon layer
On, and the first silicon oxide layer be not disposed on the first silicon layer for TFE structure and BF it is to be bonded while.Similarly, BF includes
Second silicon layer and the second silicon oxide layer, the second silicon oxide layer one side is arranged on the second silicon layer, and the second silicon oxide layer is not set
The second silicon layer for BF and TFE structure it is to be bonded while.
During a specific implementation item, the first hydrogen bond and/or the second hydrogen bond can be but be not limited to hydroxyl, this
Sample, after polymerization reaction occurs for the first hydrogen bond and the second hydrogen bond, available hydrone and comprising silicon oxygen to covalent atom.
203, according to preset annealing temperature and annealing duration, pre- bonding structure is made annealing treatment, is made adjacent
Two to react to each other between covalent atom, formed covalent bond, and, by hydrone from the first activating surface with second activation
It is discharged between surface, TFE structure and BF is made to be bonded together in the form of covalent bond.
For example, hydrone is being obtained and after covalent atom, under the cavity of bonded interface and the hydrone high temperature of gap location
The first activating surface and the second activating surface are diffused into, so that parital vacuum is generated, at this point it is possible to according to preset annealing temperature
Degree and annealing duration, make annealing treatment pre- bonding structure, and such TFE structure and BF can occur plastic deformation and make sky
It eliminates in hole.Meanwhile TFE structure and the reduction of BF viscosity at a temperature of this, it may occur that viscous flow, so that microgap is eliminated, it will
Hydrone is discharged between the first activating surface and the second activating surface.Meanwhile adjacent two are to mutual between covalent atom
Reaction is generated covalent bond, TFE structure and BF is made to be bonded together in the form of covalent bond, since TFE structure and BF are with covalent bond
Form exist, be equivalent to and set an overall structure for TFE structure and BF, improve TFE structure and being bonded for BF is strong
Degree, and improve thermal stability and chemical stability between TFE structure and the film that blocks water.
Wherein, annealing temperature is the material of the material and BF according to TFE structure, is set.
Fig. 3 is that the embodiment of the present invention obtains TFE structure and the pre- bonding structure of BF after the processing of bonding in advance, and Fig. 4 is warp
Cross annealing after obtain in the form of covalent bond existing for TFE structure and BF keying features.
As shown in Figure 3 and Figure 4, using the TFE structure of the embodiment of the present invention and the bonding method of BF, make the hydrogen bond in Fig. 3
After polymerization reaction occurs, by annealing, obtain it is shown in Fig. 4 in the form of covalent bond existing for TFE structure and BF be bonded
Mechanism, which raises the bond strengths of TFE structure and BF, and improve the thermal stability between TFE structure and the film that blocks water and change
Learn stability.And due to no longer needing to be bonded using the attached mode of gluing between TFE structure and BF, between TFE structure and BF
One layer of gelatin substance is lacked, the bonding structure of TFE structure and BF obtained from can be thinner.
The embodiment of the present invention also provides the keying features of a kind of TFE structure and BF, specifically can be according to Fig. 1 or Fig. 2 institute
Prepared by the bonding method of the TFE structure and BF shown, concrete structure schematic diagram can refer to Fig. 4, is please referred in detail above-mentioned
Correlation is recorded, and details are not described herein.
In addition, TFE structure, which can be used for any need from the bonding method of BF33, is fitted in one for two different materials
In the application risen, especially in the application such as flexible display screen, if TFE structure and BF33 pasted by way of covalent bonding
It closes, the film thickness of OLED film in flexible display screen can not only be reduced, it is also possible that the fitting of the two is stronger, with
TFE structure after bonding is arbitrarily bent with BF, the film that blocks water is difficult to fall off, to effectively reduce in TFE structure
Steam stop, and prevent steam from entering TFE structure by BF, the service life of raising OLED and flexible display screen.For this purpose,
The embodiment of the present invention also provides a kind of display panel, can specifically include the following contents:
Fig. 5 is the structural schematic diagram of the display panel of the embodiment of the present invention, as shown in figure 5, the display of the embodiment of the present invention
Panel may include flexible substrate 1, oled layer 2 and according to Fig. 1 or the side of bonding of the TFE structure and BF33 of embodiment illustrated in fig. 2
The keying features 3 of TFE structure and BF33 prepared by method.
As shown in figure 5, oled layer 2 is located at the side of flexible substrate 1, the keying features 3 of TFE structure and BF33 are located at
Oled layer 2 deviates from the side of flexible substrate 1, and coats oled layer 2.
For example, as shown in figure 5, TFE structure may include but be not limited to inorganic in the display panel of the embodiment of the present invention
Nitride layer 31 and organic matter layer 32, wherein inorganic layer 31, which is located at, deviates from the side of flexible substrate 1 in oled layer 2, and coats OLED
Layer 2, organic matter layer 32 are arranged on inorganic layer 31, and form keying features with BF33.Due to the thinner thickness of BF33, no
It is fixed easily, so, as shown in figure 5, can also include high transparent polyester film (Polyethylene in the embodiment of the present invention
Terephthalate Polyester-film, PET) 4, and BF33 is arranged on PET4.
It should be noted that the embodiment of the present invention with one layer of inorganic layer 31 of TFE structure and one layer of organic matter layer 32 in order to
The technical solution of the embodiment of the present invention is described, in actual application, TFE structure may include multiple inorganic layers
31 and multiple organic matter layers 32, and inorganic layer 31 and organic matter layer 32 are arranged alternately, and are no longer illustrated one by one herein.
The display panel of the embodiment of the present invention, by respectively to TFE structure and one side BF33 to be bonded and BF33 and TFE
Structure one side to be bonded carries out surface cleaning and hydrophilic activation processing, and TFE structure and BF33 one side to be bonded is made to form the
One activating surface, and, after so that BF33 is formed the second activating surface with TFE structure one side to be bonded, by the first activating surface
Directly fitted with the second activating surface, to TFE structure and BF33 carry out it is pre- be bonded processing, obtain TFE structure and the pre- key of BF33
Structure is closed, and pre- bonding structure is made annealing treatment, so that TFE structure and BF33 is bonded together in the form of covalent bond, keeps away
Exempt from using gluing attached method that TFE structure and BF33 is viscous and together.The technical solution of the embodiment of the present invention, can be improved
The bond strength of TFE structure and BF improves process repeatability, and improve thermal stability between TFE structure and the film that blocks water and
Chemical stability.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. the bonding method of a kind of thin-film packing structure and the film that blocks water characterized by comprising
Respectively to the thin-film packing structure and the film that blocks water one side to be bonded and film and the thin-film package of blocking water
Structure one side to be bonded carries out surface cleaning and hydrophilic activation processing, and the thin-film packing structure and the film that blocks water is made to wait for key
The one side of conjunction forms the first activating surface, and, form the film one side to be bonded with the thin-film packing structure that block water
Second activating surface；
First activating surface and second activating surface are directly fitted, blocked water to the thin-film packing structure with described
Film carries out pre- bonding processing, obtains the pre- bonding structure of thin-film packing structure with the film that blocks water；
The pre- bonding structure is made annealing treatment, makes the thin-film packing structure and the film that blocks water in the form of covalent bond
It is bonded together, thin-film packing structure described in the mechanism after making bonding reaches predetermined item with the degree that is bonded of the film that blocks water
Part.
2. the method according to claim 1, wherein being carried out to the thin-film packing structure and the film that blocks water pre-
Bonding processing, obtains the pre- bonding structure of thin-film packing structure with the film that blocks water, comprising:
According to preset pre- bonding temperature and pre- bonding handling duration, the thin-film packing structure and the film that blocks water are carried out pre-
Bonding processing makes first activating surface generate the first hydrogen bond, and, so that second activating surface is generated the second hydrogen bond；
First hydrogen bond is bonded with second hydrogen occurs polymerization reaction, obtains hydrone and to covalent atom, described in formation
The pre- bonding structure of thin-film packing structure and the film that blocks water；
Described to covalent atom is formed according to the material of the thin-film packing structure and the material of the film that blocks water.
3. according to the method described in claim 2, it is characterized in that, being made annealing treatment to the pre- bonding structure, comprising:
According to preset annealing temperature and annealing duration, the pre- bonding structure is made annealing treatment, adjacent two are made
It is a to form the covalent bond to react to each other between covalent atom, and, by the hydrone from first activating surface with
It is discharged between second activating surface.
4. according to the method described in claim 3, it is characterized in that, the pre- bonding temperature and/or the annealing temperature are roots
According to the material of the thin-film packing structure and the material of the film that blocks water, set.
5. according to the method described in claim 4, it is characterized in that, the material of the thin-film packing structure and the film that blocks water
Material is same or different.
6. according to the method described in claim 5, it is characterized in that, the thin-film packing structure includes the first silicon layer and the first oxygen
SiClx layer；
First silicon oxide layer one side is arranged on first silicon layer, and first silicon oxide layer is not disposed on described the
One silicon layer for the thin-film packing structure and the film that blocks water it is to be bonded while.
7. according to the method described in claim 5, it is characterized in that, the film that blocks water includes the second silicon layer and the second silica
Layer；
Second silicon oxide layer one side is arranged on second silicon layer, and second silicon oxide layer is not disposed on described the
Two silicon layers block water for described in film and the thin-film packing structure it is to be bonded while.
8. according to any method of claim 2-7, which is characterized in that first hydrogen bond and/or second hydrogen bond
For hydroxyl.
9. the keying features of a kind of thin-film packing structure and the film that blocks water, which is characterized in that the thin-film packing structure and the film that blocks water
Keying features be prepared by the bonding methods of -8 any thin-film packing structures and the film that blocks water according to claim 1.
10. a kind of display panel, which is characterized in that including flexible substrate, Organic Light Emitting Diode layer and as claimed in claim 9
The keying features of thin-film packing structure and the film that blocks water；
The Organic Light Emitting Diode layer is located at the side of the flexible substrate；
The keying features of the thin-film packing structure and the film that blocks water are located in the Organic Light Emitting Diode layer away from the flexibility
The side of substrate, and coat the Organic Light Emitting Diode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710992603.8A CN109698285A (en) | 2017-10-23 | 2017-10-23 | Bonding method, mechanism and the display panel of thin-film packing structure and the film that blocks water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710992603.8A CN109698285A (en) | 2017-10-23 | 2017-10-23 | Bonding method, mechanism and the display panel of thin-film packing structure and the film that blocks water |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109698285A true CN109698285A (en) | 2019-04-30 |
Family
ID=66226660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710992603.8A Pending CN109698285A (en) | 2017-10-23 | 2017-10-23 | Bonding method, mechanism and the display panel of thin-film packing structure and the film that blocks water |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109698285A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364427A (en) * | 2019-07-17 | 2019-10-22 | 德淮半导体有限公司 | Wafer bonding method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101391497A (en) * | 2007-09-21 | 2009-03-25 | 精工爱普生株式会社 | Bonding sheet, bonding method and bonded body |
| CN101527257A (en) * | 2008-03-06 | 2009-09-09 | 精工爱普生株式会社 | Method of manufacturing bonded body and bonded body |
| CN101688083A (en) * | 2007-06-18 | 2010-03-31 | 精工爱普生株式会社 | Bonding method, bonded body, droplet ejection head, and droplet ejection device |
| CN103915573A (en) * | 2014-03-05 | 2014-07-09 | 厦门天马微电子有限公司 | Packaging cover plate, manufacturing method and display device |
| CN103956363A (en) * | 2014-03-03 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | Composite substrate and manufacturing method thereof, and flexible display device and manufacturing method thereof |
| CN106298617A (en) * | 2015-05-25 | 2017-01-04 | 中华映管股份有限公司 | Delamination method for laminated structure |
-
2017
- 2017-10-23 CN CN201710992603.8A patent/CN109698285A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101688083A (en) * | 2007-06-18 | 2010-03-31 | 精工爱普生株式会社 | Bonding method, bonded body, droplet ejection head, and droplet ejection device |
| CN101391497A (en) * | 2007-09-21 | 2009-03-25 | 精工爱普生株式会社 | Bonding sheet, bonding method and bonded body |
| CN101527257A (en) * | 2008-03-06 | 2009-09-09 | 精工爱普生株式会社 | Method of manufacturing bonded body and bonded body |
| CN103956363A (en) * | 2014-03-03 | 2014-07-30 | 上海天马有机发光显示技术有限公司 | Composite substrate and manufacturing method thereof, and flexible display device and manufacturing method thereof |
| CN103915573A (en) * | 2014-03-05 | 2014-07-09 | 厦门天马微电子有限公司 | Packaging cover plate, manufacturing method and display device |
| CN106298617A (en) * | 2015-05-25 | 2017-01-04 | 中华映管股份有限公司 | Delamination method for laminated structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364427A (en) * | 2019-07-17 | 2019-10-22 | 德淮半导体有限公司 | Wafer bonding method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6576351B2 (en) | Barrier region for optoelectronic devices | |
| JP4649382B2 (en) | Method for manufacturing organic electroluminescent display device | |
| CN106338852A (en) | Flexible type substrate, display panel and manufacturing method of flexible type substrate | |
| US20170346038A1 (en) | Organic Electroluminescent Display Panel, Fabrication Method Thereof and Display Device | |
| ATE479637T1 (en) | OBTAINING CURVED, COOLED OR TEMPERED GLASS SUBSTRATES COATED WITH A THIN FILM STRUCTURE WITH REFLECTIVE PROPERTIES FOR INFRARED AND/OR SOLAR RADIATION | |
| CN107482096B (en) | A kind of light emitting device and its manufacturing method | |
| TWI609504B (en) | Quantum dots encapsulation structure and method for making the same | |
| JP2015156371A (en) | Layer substrate, light-emitting device and manufacturing method of light-emitting device | |
| CN109192766A (en) | The production method of display panel and display panel | |
| KR102656045B1 (en) | Electrically controllable device with variable diffusion by liquid crystal and method therefor | |
| CN104269427A (en) | Organic light-emitting diode display panel, manufacturing method thereof and display device | |
| JP2003154596A (en) | Transparent gas-barrier film, transparent conductive electrode base material, display element, solar cell, or face-shaped emitter using the film | |
| US10411171B2 (en) | Method of manufacturing a light emitting device | |
| CN102593311A (en) | Light source packaging structure and manufacturing method thereof as well as liquid crystal display | |
| CN107369781A (en) | Encapsulating structure and organic light-emitting display device | |
| CN106887530A (en) | The thin-film packing structure and preparation method of a kind of organic electroluminescence device | |
| CN109698285A (en) | Bonding method, mechanism and the display panel of thin-film packing structure and the film that blocks water | |
| WO2020258536A1 (en) | Encapsulation structure and preparation method for encapsulation structure | |
| CN109817817A (en) | A kind of flexible OLED devices and preparation method thereof | |
| JP2005527076A (en) | Hermetic sealing of organic electro-optic elements | |
| CN108447988A (en) | A kind of flexible substrate and preparation method thereof, display device | |
| CN101162314B (en) | Display device and method for manufacturing mask plate and display device | |
| CN107331790A (en) | A kind of OLED display panel and its method for packing, OLED display | |
| CN108321304A (en) | Display panel and preparation method thereof and display device | |
| WO2017033823A1 (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No. 188, CHENFENG Road, high tech Zone, Suzhou City, Jiangsu Province Applicant after: Suzhou Qingyue Photoelectric Technology Co., Ltd Address before: 215300 No. 188 Feng Feng Road, Kunshan hi tech Zone, Jiangsu, Kunshan Applicant before: Kunshan Visionox Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190430 |
|
| RJ01 | Rejection of invention patent application after publication |