CN109696999A

CN109696999A - Film metal foil with metal base covers metallic transparent substrate material, Clairvoyant type electrode plywood, electrode former material and device

Info

Publication number: CN109696999A
Application number: CN201811218544.XA
Authority: CN
Inventors: 桑原真
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2017-10-23
Filing date: 2018-10-18
Publication date: 2019-04-30

Abstract

The present invention provides a kind of film metal foil with metal base that the few ultra micro thin wires of transmission loss can be efficiently formed by photo-engraving process.Film metal foil 10 with metal base has film metal foil 11, peeling layer 12 and metal base 13.Film metal foil 11 has the first interarea T11 and the second interarea B11.Peeling layer 12 is arranged on the first interarea T11, has conduction.Metal base 13 is arranged on peeling layer 12.It is 2.5 μm of micro concavo-convexes below that first interarea T11 of film metal foil 11, which has 10 mean roughness (Rz), and the ratio of width to height (Str) of the surface texture of the first interarea T11 is 0.5 or more and 1.0 or less.

Description

Film metal foil with metal base covers metallic transparent substrate material, Clairvoyant type electrode With plywood, electrode former material and device

Technical field

The present invention relates to the film metal foil with metal base, cover metallic transparent substrate material, the stacking of Clairvoyant type electrode Plate, Clairvoyant type electrode former material and device.

Background technique

In the past, smart phone, tablet computer, vehicle-mounted navigation equipment, PC, game machine, automatic cash deposit and withdrawal It is mechanical, electrical depending on etc., be widely used in the electronic equipment of the former configuration touch panel module of image display device.Image display dress It sets with the image display function for showing image in display area.The image display devices such as touch panel module and liquid crystal display It is applied in combination, the input unit of the position touched as the display area detection in output image functions.

Touch panel module has contact panel sensor and controls its control unit.Contact panel sensor is for body The now two-dimensional coordinate based on X-axis and Y-axis, has detecting electrode.Detecting electrode includes multiple X electrodes and orthogonal with the X electrode Multiple Y electrodes.Such contact panel sensor is to make the contact panel sensor component for having X electrode and have Y electrode Contact panel sensor with component be overlapped and constitute.Hereinafter, X electrode or Y electrode are known as perspectivity electrode sometimes.

In recent years, have detection sensitivity is high, can be combined with the image display device of high resolution miniaturize (with Be also referred to as fine patterning down) the exploitation of contact panel sensor component of perspectivity electrode be in progress.If using thickness Material of the metal layer as the perspectivity electrode for making such fine patterning, the then etching period for reaching substrate surface become It grows, the up rightness avalanche of the side wall of perspectivity electrode, is likely to occur in the case where the line width of the perspectivity electrode of formation disconnected Line.It is therefore desirable to the metal layer of fine pattern purposes with a thickness of 9 μm or less.

The material of metal layer as such fine pattern purposes discloses in patent document 1: in the electrolysis for having thickness Successively has the band of middle layer and ultrathin copper foil on the glassy surface (on the surface that electrolysis roller side is formed when manufacture) of foil carriers The copper foil of carrier.Middle layer is constituted in the way of it can remove very thin layers of copper from carrier.Moreover, in patent document 1, as band The manufacturing method of the copper foil of carrier, discloses following method: the electrolysis roller being ground to surface is configured in a cell, And interpolar distance configuration electrode as defined in being separated around electrolysis roller, it is precipitated by the surface for the electrolysis roller that will be rotated Copper peels off, so that 18 μm of thickness of electrolytic copper foil carrier is continuously obtained, in the electrolysis roller of obtained electrolytic copper foil carrier The surface (glassy surface) of side forms middle layer, then, forms very thin layers of copper by plating in the middle layer.

Existing technical literature

Patent document

Patent document 1: Japanese Unexamined Patent Publication 2017-88961 bulletin

Summary of the invention

However, if it is desired to such ultrathin copper foil is recorded using patent document 1, and line width is made less than 5 by photo-engraving process μm ultra micro thin wires, then have wiring break risk.In addition, in general, if flowing through alternating current in wiring, due to Skin effect and current convergence flows through wiring surface, if therefore using as ultrathin copper foil described in Patent Document 1, height It is poor to flow through the high alternating current of frequency greatly and in the wiring of the long longer copper foil in section, then the risk for thering is transmission loss to become larger.

Here, difference of height refers to, and as shown in figure 13, when copper foil sample 100 is cut off with vertical plane, what notch occurred The sum of the maximum peak heights Hp and maximum valley depth Hv of the average height L3 relative to protrusion at the bumps of cross section curve 101 (difference of height=Hp+Hv).As shown in figure 13, cross-sectional length refers to the length of cross section curve 101, as the above-mentioned difference of height of expression One of index, can also the ratio between the length L2 with the length L1 of cross section curve 101 relative to reference line 102 indicate.

Therefore, the object of the present invention is to provide the few ultra micro of transmission loss can be efficiently formed by photo-engraving process The film metal foil with metal base of thin wires covers metallic transparent substrate material, Clairvoyant type electrode plywood, their system Make method, Clairvoyant type electrode former material and device.

The film metal foil with metal base that first invention is related to has the film with the first interarea and the second interarea Metal foil, the peeling layer with conduction being arranged on above-mentioned first interarea and the Metal Substrate being arranged on above-mentioned peeling layer Material, it is 2.5 μm of micro concavo-convexes below that the first interarea of above-mentioned film metal foil, which has 10 mean roughness (Rz), and above-mentioned The ratio of width to height (Str) of the surface texture of first interarea is 0.5 or more and 1.0 or less.

What the second invention was related to, which cover metallic transparent substrate material, has transparent substrate, in the single side of above-mentioned transparent substrate or two The above-mentioned film metal foil with metal base and transparent between above-mentioned transparent substrate and above-mentioned film metal foil of face setting Adhesive layer.

The Clairvoyant type electrode that third invention is related to is to remove above-mentioned gold from the above-mentioned metallic transparent substrate material that covers with plywood Belong to made of substrate and peeling layer.

The Clairvoyant type electrode former material that 4th invention is related to has wiring diagram pattern layer, and the wiring diagram pattern layer is above-mentioned Clairvoyant type The above-mentioned film metal foil of electrode plywood has the wiring diagram pattern layer of opening portion.

The control that the device that 5th invention is related to has above-mentioned Clairvoyant type electrode former material and is electrically connected with above-mentioned wiring diagram pattern layer Circuit processed.

The Clairvoyant type electrode former material that 6th invention is related to has transparent substrate and the one or two sides in above-mentioned transparent substrate 0.1 μm of thickness or more and 5.0 μm of wiring diagram pattern layer below of formation, above-mentioned wiring diagram pattern layer is existed to via clear adhesive The film metal foil engaged in above-mentioned transparent substrate is patterned and is formed, and 10 points of the surface of above-mentioned wiring diagram pattern layer are flat Equal roughness (Rz) be 2.5 μm hereinafter, and the ratio of width to height (Str) of the surface texture on the above-mentioned surface of above-mentioned wiring diagram pattern layer be 0.5 or more and 1.0 or less.

Invention effect

In accordance with the invention it is possible to which the few ultra micro thin wires of transmission loss are efficiently formed by photo-engraving process.

Detailed description of the invention

Figure 1A of Fig. 1 is showing on the thickness direction for the film copper foil with metal base that embodiments of the present invention are related to Meaning sectional view.Figure 1B is the schematic cross-section on the thickness direction for covering metallic transparent substrate material that embodiments of the present invention are related to Figure.

Fig. 2A of Fig. 2 is the signal on the thickness direction for the Clairvoyant type electrode plywood that embodiments of the present invention are related to Sectional view.Fig. 2 B is the schematic section on the thickness direction for the Clairvoyant type electrode former material that embodiments of the present invention are related to.Figure 2C is the schematic section on the thickness direction for the device that embodiments of the present invention are related to.

Fig. 3 A~Fig. 3 D of Fig. 3 is the manufacture for the film copper foil with metal base for indicating that embodiments of the present invention are related to The schematic illustration of each process of method.

Fig. 4 A of Fig. 4 is the gold for illustrating the electrolysis method based on the electrolysis roller for using embodiments of the present invention to be related to Belong to the schematic section of the manufacturing method of substrate.Fig. 4 B is the amplification sectional view of the metal base in the portion D in Fig. 4 A.Fig. 4 C is to use In the schematic illustration for the manufacturing method for illustrating the second plywood.Fig. 4 D is that the amplification of second plywood in the portion E in Fig. 4 C is cut Face figure.

Fig. 5 A~Fig. 5 D of Fig. 5 is the manufacturer for the Clairvoyant type electrode plywood for indicating that embodiments of the present invention are related to The schematic illustration of each process of method.

Fig. 6 is the top view for indicating the continuity test pattern of continuity test single sided perspective type electrode former material.

Fig. 7 A of Fig. 7 is from after the film metal foil stripping metal substrate with metal base of embodiment 1, film metal Scanning electron microscope (the SEM:Scanning Electron of the first interarea of the release surface of foil side, that is, film metal foil Microscope) image (observation multiplying power: 1000 times).Fig. 7 B is the film metal foil removing with metal base from comparative example 1 Second interarea of after metal base, film metal foil side release surface, that is, film metal foil SEM image (observation multiplying power: 1000 times).

Fig. 8 A~Fig. 8 D of Fig. 8 is each work for indicating the manufacturing method of single sided perspective type electrode plywood of embodiment 1 The schematic illustration of sequence.

Fig. 9 A of Fig. 9 be embodiment 1 single sided perspective type electrode former material wiring diagram pattern layer SEM image (observation multiplying power: 2000 times).Fig. 9 B is SEM image (the observation multiplying power: 2000 of the wiring diagram pattern layer of the single sided perspective type electrode former material of comparative example 1 Times).

Figure 10 A~Figure 10 H of Figure 10 is each of the manufacturing method of the single sided perspective type electrode plywood of expression comparative example 1 The schematic illustration of process.

Figure 11 is the schematic section on the thickness direction of the printed wiring board with strip line of reference example.

Figure 12 is the coordinate diagram for indicating the measurement result of the transmission loss of each sample of reference example.

Figure 13 is the sectional view for illustrating the wiring of difference of height and cross-sectional length.

Specific embodiment

Hereinafter, embodiments of the present invention will be described.It should be noted that assigning identical symbol to identical constituent element Number, it omits the description sometimes.

(1) the film metal foil with metal base

Film metal foil 10 of the present embodiment with metal base is to have film metal foil as shown in Figure 1A 11, peeling layer 12, metal base 13 and reflection reduce the plywood of layer 14.Film metal foil 11 has the first interarea T11 and the Two interarea B11.Peeling layer 12 and metal base 13 are successively arranged on the first interarea T11.Reflection reduces layer 14 in the second interarea It is arranged on B11.

In present embodiment, the ratio of width to height (Str) of the surface texture of the first interarea T11 of film metal foil 11 be 0.5 with It is upper and 1.0 hereinafter, and 10 mean roughness (Rz) of the first interarea T11 of film metal foil 11 are 2.5 μm or less.Here, Str, which refers to, joins the three-dimensional surface character of the isotropism on surface or anisotropic quantification of intensities as defined in ISO25178 Number, takes 0 or more and 1 the following value.For Str close in the case where 1, surface shows stronger isotropism.Feelings of the Str close to 0 Under condition, surface shows stronger anisotropy.Here, isotropism refers to, the bumps on surface can't see the directionality of rule, I.e. surface does not have texture etc..Anisotropy refers to, the bumps on surface can see the directionality of rule, i.e. surface is textured etc.. Rz refers to 10 mean roughness as defined in JIS B0601 (1994).

That is, in present embodiment, the first interarea T11 of film metal foil 11 be equally, it is protrusion outstanding (peak) or recessed Portion (paddy) less, smooth face (below be also referred to as high even surface).Being routed and using in the past using such film metal foil 11 The wiring of ultrathin copper foil is compared, transmission loss is small, particularly wiring in the frequency of alternating current that flows through it is high in the case where its imitate Fruit is significant.Speculate this is because, being cut compared with previous ultrathin copper foil using the first interarea T11 of the wiring of film metal foil 11 Face length is short, even if alternating current is flowed through along the surface shape of wiring due to skin effect, alternating current compared with the past The distance flowed through is also short, therefore the transmission loss of signal becomes smaller.In addition, even if handling by photoetch to Gao Ping In the case that the film metal foil 11 of the first sliding interarea T11 forms wiring, the generation compared with the past that broken string can also be inhibited, Therefore ultra micro thin wires can be efficiently formed.Speculate the main reason is that: the shape on the first interarea T11 of film metal foil 11 When exposing at photoresist into defined wiring pattern shape, compared with the case where using previous ultrathin copper foil, transmission is photic The exposure light of resist layer is difficult to be capable of forming the photoresist with desired opening shape in the first interarea T11 diffusing reflection Layer；When implementing photoetch processing to film metal foil 11, it is not easy to it is directive along the tool of copper foil surface that etching solution occur Bumps spread such situation, therefore etching reaction is easy to carry out along the thickness direction of film metal foil 11.Here, ultra micro fine cloth Line refers to that wiring of the line width less than 10 μm, preferably 0.1 μm or more and 10 μm hereinafter, more preferably 0.5 μm or more and 4.0 μm Hereinafter, further preferably 1.0 μm or more and 3.0 μm or less.In present embodiment, with the of Str regulation film metal foil 11 The surface texture of one interarea T11 is due to putting down compared with using the Rz, the arithmetic that use as the evaluation index of surface texture all the time The case where regulations such as equal roughness (Ra), can more correctly hold: whether transmission loss is few；Whether photo-engraving process can be passed through Ultra micro thin wires are efficiently formed.Here, Ra refers to arithmetic average roughness as defined in JIS B0601 (1994).

In present embodiment, the film metal foil 10 with metal base, which has, reflects reduction layer 14, but the present invention is not limited to This, the film metal foil 10 with metal base, which can not have reflection, reduces layer 14.

(1.1) film metal foil

Film metal foil 11 is preferably used as such as contact panel sensor, electro-magnetic wave absorption piece or vehicle-mounted antenna, printing The electrode materials such as wiring plate.

The Str of first interarea T11 of film metal foil 11 is 0.5 or more and 1.0 hereinafter, preferably 0.55 or more and 1.0 Hereinafter, more preferably 0.6 or more and 1.0 or less.The Rz of first interarea T11 of film metal foil 11 is 2.5 μm hereinafter, preferably 0.01 μm or more and 2.0 μm hereinafter, more preferably 0.01 μm or more and 1.8 μm or less.It is main using the first of film metal foil 11 The Str of face T11 less than 0.5 and Rz be more than 2.5 μm film metal foil 11 formed ultra micro thin wires in the case where, due to above-mentioned Reason, ultra micro thin wires are easy broken string, and the transmission loss of the ultra micro thin wires of formation has the risk to become larger.

The thickness of film metal foil 11 is preferably 0.1 μm or more and 5.0 μm hereinafter, more preferably 0.5 μm or more and 3.0 μm Below.If film metal foil 11 with a thickness of in above range, ultra micro thin wires are more readily formed by photo-engraving process.

First interarea T11 of film metal foil 11 is high even surface but is 2.5 μm below fine there are Rz as previously described It is concave-convex.The difference of height of the micro concavo-convex be preferably 2.3 μm hereinafter, more preferably 1.9 μm hereinafter, further preferably 1.7 μm with Under.The cross-sectional length of first interarea T11 of film metal 11 is preferably 1.10 times or less relative to the length of reference line.Use this There is the ultra micro thin wires that the film metal foil 11 of sample is formed transmission loss when especially flowing through the alternating current of high frequency to become smaller The advantages of.

As the material for constituting film metal foil 11, for example, it is preferable to comprising at least one kind of in copper, nickel, aluminium and silver. Wherein, the preferred copper of material of film metal foil 11 is constituted for principal component, in film metal foil 11, relative to film metal foil 11 Gross mass preferably comprises 80 mass % of copper or more, more preferably comprising 85 mass % of copper or more, further preferably comprising 90 matter of copper Measure % or more.The size of film metal foil 11 is according to appropriate adjustments such as the purposes of film metal foil 10 with metal base.

In present embodiment, peeling layer 12 is directly formed on the first interarea T11 of film metal foil 11, in the second interarea B11 is upper, which directly to form reflection, reduces layer 14, such as between the first interarea T11 and peeling layer 12 and the second interarea B11 and anti- Penetrating reduces between layer 14, can form antirust treatment layer, silane coupled process layer etc..If forming antirust treatment layer, can prevent The only discoloration (corrosion) of film metal foil 11.If forming silane coupled process layer, metallic transparent substrate material is covered aftermentioned In 20, the adhesive strength of film metal foil and clear adhesive can be improved.As the material for constituting antirust treatment layer, such as can To use zinc-plated, galvanized alloy, tin plating, plating tin alloy, nickel plating, chromate etc..The thickness of antirust treatment layer is preferably 0.001 μm Above and 0.50 μm or less.As the silane coupling agent for constituting silane coupled process layer, 3- (2- amino second can be used for example Base) TSL 8330,3- glycidoxypropyltrimewasxysilane, 3- aminopropyl triethoxysilicane Alkane, 3-mercaptopropyi trimethoxy silane or 3- phenyl amino propyl trimethoxy silane etc..The thickness of silane coupled process layer Preferably 0.001 μm or more and 0.50 μm or less.

(1.2) peeling layer

Peeling layer 12 mainly has the effect being easy from the 10 stripping metal substrate 13 of film metal foil with metal base.Removing Layer 12 has the first interarea T12 and the second interarea B12, covers the whole face of the first interarea T11 of film metal foil 11.Peeling layer 12 The first interarea T12 and the Str of the second interarea B12 be 0.5 or more and 1.0 hereinafter, preferably 0.55 or more and 1.0 hereinafter, more Preferably 0.6 or more and 1.0 or less.The Rz of the first interarea T12 and the second interarea B12 of peeling layer 12 be 2.5 μm hereinafter, it is preferred that For 0.01 μm or more and 2.0 μm hereinafter, more preferably 0.01 μm or more and 1.8 μm or less.Constitute the thickness of the metal of peeling layer 12 Preferably 0.001 μm or more and 0.50 μm or less of degree.If peeling layer 12 with a thickness of in above range, the first of peeling layer 12 The surface texture of interarea T12 and the second interarea B12 comply with the surface texture of the second interarea B13 of metal base 13, therefore remove The surface texture of the first interarea T12 and the second interarea B12 of layer 12 can be evaluated as with the second interarea B13's of metal base 13 Surface texture is identical.The thickness of peeling layer 12 can be found out by gravimetric method.As the material for constituting peeling layer 12, such as can be with It enumerates comprising nickel, molybdenum, chromium, iron, titanium, tungsten, the one or more alloy or oxide of phosphorus etc..Thus peeling layer 12 has conducting Property, film metal foil 11 is capable of forming using electrolytic coating on peeling layer 12.It is preferred that the first interarea T12 side master of peeling layer 12 It to include alloy, the second side interarea B12 is the main peeling layer comprising oxide.Metal base 13 can be with peeling layer as a result, 12 remove from the film metal foil 10 with metal base together, and peeling layer 12 can be removed from film metal foil 11.

(1.3) metal base

The reinforcing material (carrier) for the film metal foil 11 that metal base 13 is thin as thickness, mechanical strength is low functions. Metal base 13 has the first interarea T13 and the second interarea B13, covers the whole face of the first interarea T12 of peeling layer 12.Metal Substrate The thickness of material 13 does not limit especially then if the thickness for the mechanical strength that there is the carrier as film metal foil 11 to function It is fixed, preferably 7 μm or more and 40 μm hereinafter, more preferably 7 μm or more and 36 μm hereinafter, further preferably 10 μm or more and 20 μm or less.The thickness of metal base 13 can be found out by gravimetric method.

As the material for constituting metal base 13, preferably comprise for example selected from copper, nickel, aluminium, magnesium, tungsten, molybdenum, platinum, gold and palladium In a kind (hereinafter referred to as ingredient A).And then preferably, the content of ingredient A is preferred relative to the gross mass of metal base 13 Comprising 80 mass % or more, preferably comprise 85 mass % or more, more preferably comprising 90 mass % or more.Go out from the viewpoint of cost Hair is, it is preferable to use copper.As the metal base 13 for using copper, electrolytic copper foil, electrolysis copper alloy foil, calendering copper can be used for example Foil, calendering copper alloy foil etc..Shown in the manufacturing method of film metal foil with metal base as be described hereinafter, film metal foil 11 Surface texture of the surface texture of first interarea T11 via peeling layer 12 by the second interarea B13 of metal base 13 is influenced, Therefore the Str of the second interarea B13 of metal base 13 is for 0.5 or more and 1.0 hereinafter, preferably 0.55 or more and 1.0 hereinafter, more Preferably 0.6 or more and 1.0 or less.The Rz of second interarea B13 of metal base 13 be 2.5 μm hereinafter, preferably 0.01 μm with Above and 2.0 μm hereinafter, more preferably 0.01 μm or more and 1.8 μm or less.

(1.4) reflection reduces layer

Reflection reduces layer 14 in the Clairvoyant type electrode former material 40 shown in Fig. 2 B, be the first reflection reduce pattern layer 41A and Second reflection reduces the material of pattern layer 41B (hereinafter, sometimes referred to as reflection reduces pattern layer 41A, 41B).

Reflection, which reduces layer 14, has the first interarea T14 and the second interarea B14.Reflection reduces the scheme shown in Fig. 2A of layer 14 In, the whole face of the second interarea B14 of clear adhesive 22A is covered, but in the scheme shown in Fig. 2 B, is equivalent to reflection reduction figure Pattern layer 41 is not covered with the whole face of the second interarea B14 of clear adhesive 22A.The thickness that reflection reduces layer 14 is preferably 0.001 μm or more and 0.50 μm hereinafter, more preferably 0.01 μm or more and 0.30 μm or less.If reflection reduce layer 14 with a thickness of above-mentioned In range, then reflecting, which reduces the surface texture of the first interarea T14 and the second interarea B14 of layer 14, complies with the of film metal foil 11 The surface texture of two interarea B11, therefore it is capable of forming the surface that reflection reduces the first interarea T14 and the second interarea B14 of layer 14 The reflection that the surface texture of second interarea B11 of character and film metal foil 11 is roughly the same reduces layer.Reflection reduces layer 14 Thickness can be found out by gravimetric method.

The material for reducing layer 14 is reflected as constituting, metal such as copper, nickel, cobalt, tungsten or aluminium etc. can be used, it can be also Include sulphur etc..If constituting reflection and reducing the material of layer 14 is metal, can in the Clairvoyant type electrode former material 40 shown in Fig. 2 B Reduce the cloth of the first wiring diagram pattern layer 42A and the second wiring diagram pattern layer 42B (hereinafter, sometimes referred to as wiring diagram pattern layer 42A, 42B) Line resistance.Wherein, reflection reduction layer 14, which is preferably contained with the content below of per unit area 0.1% or more and 10.0%, is selected from At least one or more in sulphur, nickel, cobalt, tungsten and aluminium.Thereby, it is possible to inhibit the wave of the feature on the surface as film metal foil 11 Long 550nm or more and 780nm high reflectance below, can be in 380nm or more and 780nm or less is as flat reflectivity. Therefore, in Clairvoyant type electrode former material 40, inhibit the flashing on the surface of wiring diagram pattern layer 42A, 42B, by Clairvoyant type electrode former material In the case that 40 for liquid crystal display etc., the contrast ratio for being able to suppress picture becomes smaller.In this case, the content of sulphur is preferably Within 10%.If the content of sulphur is that the resistance value of wiring diagram pattern layer 42A, 42B itself can be made to be difficult to become in above range It is high.It should be noted that the containing ratio of per unit area is by being attached to commercially available energy dispersion-type X-ray optical splitter (EDS) or the resolver (transformation results based on PC) of commercially available wavelength-dispersion type X-ray optical splitter (WDS) parses Value (weight %).

Reflection reduces layer 14, light in visible light region (380nm or more and 780nm or less) reflectivity 20% hereinafter, more preferably 15% hereinafter, further preferably 10% hereinafter, particularly preferably 5% or less.In visible light region The reflectivity of light be by the side according to " plastics-total light transmittance of JIS K 7375 and total light reflectance seek method " The value of method measurement.

(2) metallic transparent substrate material is covered

It is of the present embodiment to cover metallic transparent substrate material 20 as shown in Figure 1B, it is saturating to have transparent substrate 21, first Bright adhesive layer 22A, the film metal foil 10A of first band metal base, the band metal base of the second clear adhesive 22B and second Film metal foil 10B.Transparent substrate 21 has the first interarea T21 and the second interarea B21.In the first interarea of transparent substrate 21 On T21, the film metal foil 10A of the first clear adhesive 22A and first band metal base is stacked gradually.In transparent substrate 21 On second interarea B21, film metal foil 10B of the second clear adhesive 22B and second with metal base is stacked gradually.First band Film metal foil 10B of the film metal foil 10A and second of metal base with metal base with the film metal of metal base Foil 10 is identical composition.Hereinafter, the first clear adhesive 22A and the second clear adhesive 22B are known as clear adhesive sometimes Layer 22A, 22B.In present embodiment, the film metal foil 10A that metallic transparent substrate material 20 has first band metal base is covered With the second film metal foil 10B with metal base, however, the present invention is not limited thereto, covering metallic transparent substrate material 20 can only have The film metal foil 10A of standby first band metal base.

(2.1) transparent substrate

Transparent substrate 21 is sheet.The thickness of transparent substrate 21 is appropriate according to purposes for covering metallic transparent substrate material 20 etc. Selection, preferably 24 μm or more and 300 μm hereinafter, more preferably 35 μm or more and 260 μm or less.If transparent substrate 21 It is easy to operate with a thickness of in above range, being then difficult to generate fold, and the transparency is excellent.As the material for constituting transparent substrate 21 Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate can be used for example in matter (PC) or the transparent resins such as polymethyl methacrylate (PMMA).Transparent substrate 21 can containing the addition types such as tetrabromobisphenol A, The fire retardant of response type.

In addition, can also use as material other than the above and improve knot comprising stretching when cycloolefin, film by strength Crystalline substance is to improve the transparent resin of the polyester of birefringence.It is such as 100nm or less especially with having comprising length of delay Cycloolefin film, the transparent substrate for the polyester film that length of delay is such as 3000nm or more cover what metallic transparent substrate material obtained Clairvoyant type electrode former material is as described later, has the advantages that can reduce rainbow hot spot and black aobvious phenomenon.

(2.2) clear adhesive

The film metal foil 10A of first band metal base is fixed on the of transparent substrate 21 by the first clear adhesive 22A On one interarea T21.The second film metal foil 10B with metal base is fixed on transparent substrate 21 by the second clear adhesive 22B The second interarea B21 on.First clear adhesive 22A can be identical composition with the second clear adhesive 22B, or phase Mutually different composition.

Clear adhesive 22A, 22B is the solidfied material of transparent adhesive.It is such as excellent as the material for constituting transparent adhesive Choosing includes acrylic resin, epoxy resin, carbamate resins or their hybrid resin.Especially acrylic acid series tree The transparency of rouge, carbamate resins or their hybrid resin is excellent, optically also beneficial.

The hardness of clear adhesive 22A, 22B is preferably 1.0N/mm²Above and 200N/mm²Hereinafter, more preferably 4.0N/ mm²Above and 175N/mm²Below.If the hardness of clear adhesive 22A, 22B is in above range, being able to suppress becomes broken string The reason of one of bonding material stretching, extension.Here, the hardness of clear adhesive 22A, 22B is measured by nano impress device Value.The thickness of clear adhesive 22A, 22B be preferably 0.5 μm or more and 10.00 μm hereinafter, more preferably 1.0 μm or more and 8.00 μm or less.

(3) Clairvoyant type electrode plywood

Clairvoyant type electrode plywood 30 of the present embodiment be from cover metallic transparent substrate material 20 removing first Made of metal base 13A, the first peeling layer 12A, the second metal base 13B and the second peeling layer 12B.That is, Clairvoyant type electrode As shown in Figure 2 A with plywood 30, have transparent substrate 21, the first clear adhesive 22A, the first reflection reduction layer 14A, first Film metal foil 11A, the second clear adhesive 22B, the second reflection reduce layer 14B and the second film metal foil 11B.In transparent base On first interarea T21 of material 21, the first clear adhesive 22A, first reflection reduce layer 14A and the first film metal foil 11A according to Secondary stacking.On the second interarea B21 of transparent substrate 21, the second clear adhesive 22B, the second reflection reduce layer 14B and second Film metal foil 11B is stacked gradually.

(4) Clairvoyant type electrode former material

Clairvoyant type electrode former material 40 of the present embodiment has: the first film gold of Clairvoyant type electrode plywood 30 Belonging to first wiring diagram pattern layer 42A and second film metal foil 11B of the foil 11A with the first opening portion A40A has the second opening The second wiring diagram pattern layer 42B of portion A40B.That is, Clairvoyant type electrode former material 40, has transparent substrate 21, first as shown in Figure 2 B thoroughly Bright adhesive layer 22A, the first reflection reduce pattern layer 41A, the first wiring diagram pattern layer 42A, the second clear adhesive 22B, second instead Penetrating reduces pattern layer 41B and the second wiring diagram pattern layer 42B.On the first interarea T21 of transparent substrate 21, the first clear adhesive 22A, the first reflection reduce pattern layer 41A and the first wiring diagram pattern layer 42A and stack gradually.In the second interarea of transparent substrate 21 On B21, the second clear adhesive 22B, the second reflection reduce pattern layer 41B and the second wiring diagram pattern layer 42B and stack gradually.

The reflection having in Clairvoyant type electrode former material 40 reduces pattern layer 41A and can be greatly reduced from the second outer exterior portion A22B (hereinafter, sometimes referred to as A22B) incident light is by clear adhesive and transparent substrate the of the first wiring diagram pattern layer 42A Two interarea B42 are nearby scattered.For reflection reduce pattern layer 41B can similarly be greatly reduced from the first outer exterior portion A22A (with Under, sometimes referred to as A22A) incident light scatters near the second interarea B42 of the second wiring diagram pattern layer 42B.

The sheet resistance of Clairvoyant type electrode former material 40 is preferably 0.01 Ω/sq. or more and 50 Ω/sq. hereinafter, more preferably 0.05 Ω/sq. or more and 10 Ω/sq. are hereinafter, further preferably 0.1 Ω/sq. or more and 5 Ω/sq. or less.

The total light transmittance of Clairvoyant type electrode former material 40 is preferably 60% or more, and more preferably 65% or more, further Preferably 70% or more.If the total light transmittance of Clairvoyant type electrode former material 40 be above range in, can by Clairvoyant type electricity Pole former material 40 is suitably used for contact panel sensor etc..

(4.1) wiring diagram pattern layer

First wiring diagram pattern layer 42A is a part that the first film metal foil 11A is removed by photo-engraving process, thin first A part of film metal foil 11A forms the circuit in the gap as the first opening portion A40A.Second wiring diagram pattern layer 42B also with First wiring diagram pattern layer 42A is again it is a part in the second film metal foil 11B is formd as the second opening portion A40B's The circuit in gap.The pattern form of wiring diagram pattern layer 42A, 42B is according to appropriate adjustments such as the purposes of Clairvoyant type electrode former material 40 Can, for example, grid (lattice) shape, parallel thread pattern shape, chasing tool shape etc. can be enumerated.It should be noted that scheming In scheme shown in 2B, the first opening portion A40A is the position that the first reflection reduces that a part of layer 14A is also removed, and second opens Oral area A40B is the position that the second reflection reduces that a part of layer 14B is also removed.

The line width W of wiring diagram pattern layer 42A, 42B is according to the purposes appropriate adjustment of Clairvoyant type electrode former material 40.It will perspective Type electrode former material 40 be used for contact panel sensor component in the case where, line width W be preferably 0.5 μm or more and 10 μm hereinafter, More preferably 1.0 μm or more and 8.0 μm or less.If line width W is that can expand the first opening portion A40A and the in above range Two opening portion A40B can further increase the permeability of Clairvoyant type electrode former material 40.These the first opening portion A40A and second The opening width W1 of opening portion A40B be preferably 50 μm or more and 10000 μm hereinafter, more preferably 200 μm or more and 5000 μm with Under.In addition, aperture opening ratio, in the region for requiring visible transparent, preferably 69.44% more than and less than 100%, more preferably 92.45% or more and 99.96% or less.It should be noted that above-mentioned aperture opening ratio is the face for forming wiring pattern on substrate In other words the ratio of opening portion in certain area is the ratio for the area not covered by above-mentioned wiring pattern.

The Str of outer exterior portion A22A, A22B be preferably 0.5 or more and 1.0 hereinafter, more preferably 0.55 or more and 1.0 hereinafter, Further preferably 0.6 or more and 1.0 or less.The Rz of outer exterior portion A22A, A22B is preferably 2.5 μm hereinafter, more preferably 0.01 μ M or more and 2.0 μm hereinafter, further preferably 0.01 μm or more and 1.8 μm or less.If the Str and Rz of outer exterior portion A22A, A22B For in above range, then can make the turbidity (mist degree) of clear adhesive 22A, 22B of outer exterior portion A22A, A22B be 20% with Under, the perspectivity of Clairvoyant type electrode former material 40 is more excellent.Turbidity (mist degree) is the value measured by haze meter.

(5) device

Device 50 of the present embodiment is the touch-control of a kind of the mutual capacitance mode as projection type electrostatic capacitance method Panel sensors.Device 50 as shown in Figure 2 C, has Clairvoyant type electrode former material 40, control wiring 51 and cover 52.Control circuit 51 It is electrically connected with wiring diagram pattern layer 42A, 42B.Cover 52 is installed on the face of the first side wiring diagram pattern layer 42A of Clairvoyant type electrode former material 40 On.It should be noted that omitting clear adhesive 22A, 22B in Fig. 2 C, reflection reduces pattern layer 41A, 41B.

Device 50 becomes figure as shown in Figure 2 C, according to the face of the second side wiring diagram pattern layer 42B of Clairvoyant type electrode former material 40 As the mode of 53 side of display device, configures and use in the front side of the display surface T53 of image display device 53.It is shown as image Such as liquid crystal display panel, Plasma picture display panel, electroluminescent (Electro can be used in device 53 Luminescence) panel, electronic paper or cathode-ray tube etc..

In device 50, the first wiring diagram pattern layer 42A is functioned as receiving electrode, the second wiring diagram pattern layer 42B conduct Sender electrode functions.That is, for device 50, if by indicant close to the surface of cover 52, with receiving electrode and The electrostatic capacitance for the capacitor that the point of intersection of sender electrode is formed changes, and control circuit 51 detects the change of the electrostatic capacitance Change, so as to determine close to the position of indicant.As indicant, for example, the finger tip of user, stylus or instruction The electric conductors such as bar.

In addition, passing through polarized sunglasses in the case where image display device 53 shown in fig. 2 C is liquid crystal display panel In the case where seeing picture, in the case where for example using general PET to transparent substrate 21 used in device 50, confirm sometimes To rainbow hot spot, by (being also referred to as low latency below using the material with the length of delay lower than general PET to transparent substrate 21 Material) or material (below also referred to as high latency material) with high length of delay, having can reduce the excellent of above-mentioned rainbow hot spot Point.And it is not limited to liquid crystal display, using the display of polarizing film, picture is seen by polarized sunglasses In the case of, in the case where using general PET to transparent substrate 21 used in device 50, black show (according to the observation occurs sometimes Angle and picture becomes completely black and can't see display) phenomenon, high latency material also has the advantages that reduce black aobvious phenomenon.It needs Illustrate, above-mentioned low latency material is that its length of delay is such as 100nm material below, and it is (representative can to enumerate cycloolefin film JSR system, ProductName Arton, Japan's Zeon system, ProductName ZF-140 or ZF-160) etc..In addition, above-mentioned high latency material is Its length of delay be such as 3000nm or more material, can enumerate polyester film (representative Japan's spinning, super birefringent polyester film, ProductName: SRF) etc..

In present embodiment, the detection mode of device 50 is mutual capacitance mode, and however, the present invention is not limited thereto can be electricity certainly The detection mode of capacitance type, or the detection mode for combining self-capacitance mode with mutual capacitance mode.

(6) manufacturing method of the film metal foil with metal base

The manufacturing method of film metal foil 10 of the present embodiment with metal base successively passes through first step, Two processes, the third step, each process of blackened process, obtain the film metal foil 10 with metal base.In present embodiment, Manufacturing method including blackened process, however, the present invention is not limited thereto, the film metal foil 10 with metal base can not include Blackened process.

(6.1) first step

In first step, as shown in Figure 4 A, it is impregnated in electrolysis roller 110 in first electrolyte 121, the metal that will be obtained Substrate 13 is removed from electrolysis roller 110.Metal base 13 shown in Fig. 3 A and Fig. 4 B is obtained as a result,.

Specifically, as shown in Figure 4 A, electrolysis roller 110 is regard as cathode, by the section circle opposed with electrolysis roller 110 The pallet of arcuation is (not shown) to be used as anode, dipping electrolysis roller 110 in the first electrolyte 121 in electrolytic bath 120.It connects , electric current is flowed through by betweening the anode and the cathode while making and being electrolysed the rotation of roller 110, to keep the electricity of metal base 13 heavy Product is on the surface of electrolysis roller 110.Then, by removing obtained metal base 13 from electrolysis roller 110, thus continuously Ground obtains metal base 13.At this point, the face of metal base 13 contacted with electrolysis roller 110 is the first interarea T13, metal base 13 face not contacted with electrolysis roller 110 is the second interarea B13.

The surface of roller 110 is electrolysed by grinding.That is, (being ground in the bump that the surface of electrolysis roller 110 is formed with strip Polishing scratch).Thereby, it is possible to make to be easy to peel off from electrolysis roller 110 in the metal base 13 of the surface electro-deposition of electrolysis roller 110. As the material for constituting electrolysis roller 110, can be used such as titanium or stainless steel.Size of roller 110 etc. is electrolysed according to band The appropriate adjustments such as the purposes of film metal foil 10 of metal base.

The composition of first electrolyte 121 is according to appropriate adjustments such as the materials of metal base 13, in metal base 13 In the case that material is copper, the first electrolyte 121 preferably comprises the simple substance of copper compound, acids and halogen, more preferably further Contain water soluble polymer.As above-mentioned copper compound, can enumerate copper sulphate, copper nitrate, copper as copper chloride inorganic salts, The organic salts of copper such as copper acetate, cupric oxalate, the alkoxide of copper, copper acetylacetonate and their hydrate.As above-mentioned acid Class can enumerate sulfuric acid, nitric acid, inorganic acid as hydrochloric acid, acetic acid, oxalic acid, organic acid as dodecyl benzene sulfonic acid.Make For the simple substance of above-mentioned halogen, each simple substance of fluorine, chlorine, bromine, iodine can be enumerated, character when simple substance for using these halogens (solid, liquid, gas), is not particularly limited.For the simple substance of these copper compounds, acids and halogen, can select respectively More than one contain in the first electrolyte 121.

By containing water soluble polymer in the first electrolyte 121, can make the second interarea B13 of metal base 13 at For high even surface.That is, the Str 0.5 or more and 1.0 of the second interarea B13 of metal base 13 can be made hereinafter, and making second The Rz of interarea B13 is 2.5 μm or less.Its result is as described later, is easy to make the first interarea T11 of film metal foil 11 to become Gao Ping Sliding surface.If the first electrolyte 121 contains water soluble polymer, the second interarea B13 of metal base 13 can be made to become Gao Ping The main reason for sliding surface, is presumed to, due to water soluble polymer presence and the movement of the copper ion in the first electrolyte 121 It is restricted.Specifically, electric current is easy to concentrate on the top of the protrusion of the bump on the surface of electrolysis roller 110 in electrolysis method Portion, therefore in the case where the first electrolyte 121 is free of water soluble polymer, the copper ion in the first electrolyte 121 be easy to The protrusion for being electrolysed the surface of roller 110 is mobile.Therefore, metal, which is concentrated, is precipitated in protrusion, obtained metal base not with electrolysis Face (glassy surface) surface texture of the face (rough surface) for the side that roller 110 contacts compared with the side contacted with electrolysis roller 110 It is thicker.In contrast, in the case where the first electrolyte 121 contains water soluble polymer, copper ion is difficult to be moved to electrolysis roller The protrusion on the surface of cylinder 110, therefore compared with the case where the first electrolyte 121 is free of water soluble polymer, metal is easy recessed Portion is precipitated.Thus, thus it is speculated that the second interarea B13 of metal base 13 becomes high even surface.As above-mentioned water soluble polymer, such as It is 500 or more and 5000000 polyethylene glycol below, average molecular weight 5000 that average molecular weight (weight average), which can be enumerated, The water-soluble celluloses and Arabic gum etc. such as gelatin below, hydroxymethyl cellulose, hydroxypropyl cellulose.

In addition, the first electrolyte 121 can contain the additives such as 3- sulfydryl -1- propane sulfonic acid.By making the first electrolyte 121 Containing additive, more smooth and excellent gloss, not abnormal protrusion the second interarea B13 can be become.

In first electrolyte 121, preferably above-mentioned copper compound contains 100g/L or more and 300g/L hereinafter, above-mentioned acids contains There is 50g/L or more and 150g/L hereinafter, the simple substance of above-mentioned halogen contains 1 mass ppm or more and 20 mass ppm or less.On in addition, It states in electrolyte 121, preferably water soluble polymer contains 15ppm or more and 50ppm or less.

In the case where containing additive in the first electrolyte 121, above-mentioned additive preferably comprises 1ppm or more and 50ppm Below.

The manufacturing condition of metal base 13 is according to appropriate adjustments such as the materials of metal base 13.For example, current density Preferably 1.0A/dm²Above and 10.0A/dm²Hereinafter, the temperature of the first electrolyte 121 be preferably 10 DEG C or more and 80 DEG C hereinafter, PH is preferably 5.0 or more and 9.0 or less.

The method of the Str and Rz of the second interarea B13 as adjustment metal base 13, for example, to the water of addition The method etc. that the molecular weight and/or additive amount of soluble macromolecular are adjusted.The method of thickness as adjustment metal base 13, For example, adjusting current density can be enumerated and/or impregnate the side that roller 110 flows through the time of electric current in the first electrolyte 121 Method etc..

The surface texture of the obtained metal base 13 is that the first interarea T13 becomes rougher than the second interarea B13. Speculate the main reason is that, by making the first electrolyte 121 contain water soluble polymer, thus the second interarea of metal base 13 B13 becomes high even surface；Due to metal base 13 electrolysis roller 110 the direct electro-deposition in surface, metal base 13 First interarea T13 has transferred the surface texture etc. for being formed with the electrolysis roller 110 of grinding marks.

(6.2) the second step

In the second step, peeling layer 12 is formed on the second interarea B13 of metal base 13.Fig. 3 B and figure are obtained as a result, First layer lamination 15 shown in 4C.

Since peeling layer 12 is directly formed on the second interarea B13 of metal base 13, the second of metal base 13 The surface texture of interarea B13 is transferred to the first interarea T12 of peeling layer 12.Further, since the thickness of peeling layer 12 is very thin (0.001 μm or more and 0.50 μm or less), therefore it is capable of forming the Str and Rz and the second master of the first interarea T12 of peeling layer 12 The Str and Rz of face B12, the peeling layer 12 roughly the same with the Str and Rz of the second interarea B13 of metal base 13.

As the method for forming peeling layer 12, for example, electrolytic plating method etc..Electrolysis for electrolytic plating method The composition of liquid preferably comprises the salt of metal, metal acid compound and organic according to appropriate adjustments such as the materials of peeling layer 12 Acid.As the salt of above-mentioned metal, the sulfate, nitrate, chloride of nickel, molybdenum, chromium, iron, titanium, tungsten, phosphorus etc. can be enumerated in this way Organic salts and their hydrate such as inorganic salts, acetate, oxalates, alkoxide, acetylacetonate.As above-mentioned metal Acid compound can enumerate the salt of the metals such as sodium molybdate, sodium tungstate acid.As above-mentioned organic acid, can enumerate acetic acid, oxalic acid, Citric acid and their hydrate.For the salt, metal acid compound and organic acid of these metals, one kind can be selected respectively Contain in the electrolyte for forming peeling layer 12 above.

It is formed in the electrolyte of peeling layer 12, the salt of preferably above-mentioned metal contains 0.6g/L or more and 60g/L or less (metal Conversion), above-mentioned metal acid compound contains 0.1g/L or more and 10g/L or less (metal conversion), and above-mentioned organic acid contains 0.1g/ L or more and 300g/L or less.

The manufacturing condition of electrolytic plating method is according to appropriate adjustments such as the materials of peeling layer 12.For example, forming peeling layer The temperature of 12 electrolyte is preferably 20 DEG C or more and 60 DEG C hereinafter, pH is preferably 5.0 or more and 9.0 hereinafter, current density is excellent It is selected as 0.5A/dm²Above and 8A/dm²Hereinafter, the processing time is preferably within 5 seconds or more and 40 seconds.

If the manufacturing condition of electrolytic plating method be above range in, be capable of forming peeling layer 12 the first interarea T12 and The Str and Rz of second interarea B12, the peeling layer 12 roughly the same with the Str and Rz of the second interarea B13 of metal base 13.Separately Outside, it mainly include that oxidiferous stripping is mainly wrapped in alloy, the second side interarea B12 that peeling layer 12, which can become the first side interarea T12, Absciss layer, therefore there is conduction.As a result, in the third step, film can be formed on peeling layer 12 using electrolytic plating method Metal 11.

(6.3) the third step

In the third step, as shown in Figure 4 C, film metal foil 11 is formed on peeling layer 12 by electrolytic plating method.By This, the second plywood 16 shown in available Fig. 3 C and Fig. 4 D.

Since film metal foil 11 is directly formed on peeling layer 12, the surface of the second interarea B12 of peeling layer 12 Character is transferred to the first interarea T11 of film metal foil 11.Therefore, it is capable of forming the first interarea T11's of film metal foil 11 Str and Rz, the film metal foil 11 roughly the same with the Str and Rz of the second interarea B12 of peeling layer 12.That is, present embodiment In, the Str and Rz of the second interarea B13 of metal base 13 and the first interarea T11 of film metal foil 11 are capable of forming via stripping The roughly the same film metal foil 11 of absciss layer 12.

As the method for forming film metal foil 11, for example, as shown in Figure 4 C, by metal base 13 as yin Pole impregnates first layer lamination 15 in the second electrolyte 131 in the second electrolytic bath 130, by between the anode and the cathode Electric current is flowed through, thus the electro-deposition on the surface (the second interarea B12 of peeling layer 12) of the second side interarea B13 of metal base 13 The method etc. of film metal foil 11.

Sulfuric acid can be used according to the material appropriate adjustment for constituting film metal foil 11 as the second electrolyte 131 Copper electroplating bath, Copper cyanide plating baths, boron fluorination copper electroplating bath, cupric pyrophosphate electroplating bath or sulfamic acid copper electroplating bath etc..

The composition of second electrolyte 131 is according to appropriate adjustments such as the materials of film metal foil 11, in film metal foil 11 material be copper in the case where, the second electrolyte 131 preferably comprises the simple substance of copper compound, acids and halogen, more preferably into One step contains water soluble polymer.As above-mentioned copper compound, above-mentioned acids, above-mentioned halogen simple substance and above-mentioned water-soluble high score Son can be enumerated and the identical substance that contains in the first electrolyte 121.In second electrolyte 131, preferably above-mentioned copper compound Containing 100g/L or more and 300g/L hereinafter, above-mentioned acids contains 50g/L or more and 150g/L hereinafter, the simple substance of above-mentioned halogen contains There are 1 mass ppm or more and 20 mass ppm or less.In addition, preferably water soluble polymer contains 15ppm in above-mentioned electrolyte 131 Above and 35ppm or less.

The manufacturing condition of film metal foil 11 is according to appropriate adjustments such as the materials of film metal foil 11.For example, electric current Density is preferably 1.0A/dm²Above and 10.0A/dm²Hereinafter, the temperature of the second electrolyte 131 is preferably 10 DEG C or more and 80 DEG C Hereinafter, pH is preferably 5.0 or more and 9.0 or less.

It is adjusted to the method in above range as by the Str and Rz of the first interarea T11 of film metal foil 11, such as can To enumerate: the Str of the second interarea B13 of metal base 13 be adjusted to 0.5 or more and 1.0 or less and first interarea T13 Rz tune In the whole range to 2.5 μm or less, in such a way that peeling layer 12 complies with the surface texture of the second interarea B13 of metal base 13 The method for adjusting the thickness of peeling layer 12；It adjusts current density and/or impregnates the time that roller flows through electric current in electrolyte 131 Method etc..The method of thickness as adjustment film metal foil 11, for example, adjusting current density and/or being electrolysed The method etc. that roller flows through the time of electric current is impregnated in liquid 131.

Furthermore it is possible to form copper on peeling layer 12 by electrolytic plating method and impact plating layer, and then impact plating in copper Film metal foil 11 is formed on layer.Thereby, it is possible to implement plating more evenly on peeling layer 12, film gold can be substantially reduced Belong to the quantity of the pin hole of foil 11.As the electroplating bath for forming copper impact plating layer, cupric pyrophosphate electroplating bath, copper cyanider can be used Electroplating bath.As the electroplating bath for forming film metal foil 11 on copper impact plating layer, it is, for example, possible to use copper sulphate plating Bath, boron are fluorinated copper electroplating bath, cupric pyrophosphate electroplating bath, sulfamic acid copper electroplating bath, Copper cyanide plating baths.Copper impacts plating layer Thickness is preferably 0.001 μm or more and 1 μm or less.The thickness for being also due to copper impact plating layer in this case is thin, therefore removes The surface texture of second interarea B12 of layer 12 is transferred to the first interarea T11 of film metal foil 11, is capable of forming film metal foil Str and Rz, the film metal foil roughly the same with the Str and Rz of the second interarea B12 of peeling layer 12 of 11 the first interarea T11 11.Specifically, the second electrolyte 131 is preferably following compositions.

The alkali metal salt and alkaline matter of cupric pyrophosphate, pyrophosphoric acid are preferably comprised for impacting copper-plated electrolyte.As Above-mentioned alkaline matter can enumerate sodium hydroxide, sodium bicarbonate, ammonia etc..For impacting in copper-plated electrolyte, preferably above-mentioned coke Cupric phosphate contain 60g/L or more and 120g/L hereinafter, the alkali metal salt of above-mentioned pyrophosphoric acid contain 100g/L or more and 400g/L with Under, above-mentioned alkaline matter contains 0.1ml/L or more and 10ml/L or less.

The manufacturing condition of electrolytic plating method is according to appropriate adjustments such as the purposes of film metal foil 11.For example, the second electricity The temperature for solving liquid 131 is preferably 20 DEG C or more and 80 DEG C hereinafter, pH is preferably 6.0 or more and 9.0 hereinafter, current density is preferably 0.5A/dm²Above and 10A/dm²Hereinafter, the processing time is preferably within 1 second or more and 60 seconds.

(6.4) blackened process

In blackened process, forming reflection on the second interarea B11 of film metal foil 11 reduces layer 14.That is, in film Implement blackened processing on second interarea B11 of metal foil 11.It is obtained shown in Figure 1A and Fig. 3 D as a result, with the thin of metal base Film metal foil 10.

As the method for reflecting and reducing layer 14 is formed, for example, electrolytic plating method etc..It is plated as the electrolysis The electroplating bath for covering method reflects the material appropriate adjustment for reducing layer 14 according to constituting, chromate plating etc. can be used for example.

Specifically, metallic compound and acids are preferably comprised for the plating bath of electrolytic plating method.As above-mentioned metal Compound, can enumerate inorganic salts as the sulfate, nitrate, chloride of the metal in copper, nickel, cobalt, tungsten or aluminium, The organic salts such as acetate, oxalates, the alkoxide of metal, acetyl pyruvate and their hydrate.As above-mentioned acids, Sulfuric acid, nitric acid, inorganic acid as hydrochloric acid, acetic acid, oxalic acid, organic acid as dodecyl benzene sulfonic acid can be enumerated.For In the electroplating bath of electrolytic plating method, preferably above-mentioned metallic compound contains 50g/L or more and 300g/L hereinafter, above-mentioned acids contains 10g/L or more and 300g/L or less.

The manufacturing condition of electrolytic plating method is preferably with temperature according to appropriate adjustments such as the purposes of film metal foil 11 10 DEG C or more and 60 DEG C or less, current density 1A/dm²Following 50A/dm²Below, processing the time be 10 seconds or more and 100 seconds with Interior preparation forms the roughened layer of the copper particle comprising convex in the second interarea B11 of film metal foil 11.

Then, preferably in containing sodium dichromate dihydrate 1.0g/L or more and 10g/L electroplating bath below, to formation Surface after roughened layer carries out chromic acid salt treatment.

For the manufacturing condition of electrolytic plating method according to appropriate adjustments such as the purposes of film metal foil 11, pH is preferably 3.0 Above and 5.0 hereinafter, liquid temperature is preferably 10 DEG C or more and 50 DEG C hereinafter, current density is preferably 0.1A/dm²Above and 3.0A/dm²Below.

(7) manufacturing method of metallic transparent substrate material is covered

The manufacturing method of the present embodiment for covering metallic transparent substrate material 20 include first step, the second step, The third step, blackened process, the fourth step and the 5th process.In the fourth step, prepare transparent substrate 21, in transparent substrate 21 Two sides formed clear adhesive oxidant layer, make the transparent substrate 23 with clear adhesive oxidant layer.It, will be with metal base in 5th process Film metal foil 10 11 side of film metal foil face B14, with the clear adhesive of the transparent substrate 23 with clear adhesive oxidant layer The face paste of oxidant layer is closed.Successively pass through first step, the second step, the third step, blackened process, the fourth step, the 5th process Each process, obtain covering metallic transparent substrate material 20.It include blackened process in present embodiment, but the present invention is not limited to This, the manufacturing method for covering metallic transparent substrate material 20 can be free of blackened process.In present embodiment, in transparent substrate 21 Two sides formed clear adhesive oxidant layer, however, the present invention is not limited thereto, can only transparent substrate 21 single side formed clear adhesive Oxidant layer.

(7.1) the fourth step

In the fourth step, prepare transparent substrate 21, forms the first transparent adhesive in the first interarea T21 of transparent substrate 21 Layer 22AU forms the second clear adhesive oxidant layer 22BU in the second interarea B21 of transparent substrate 21.It is obtained shown in Fig. 5 A as a result, Transparent substrate 23 with clear adhesive oxidant layer.The solidfied material of first clear adhesive oxidant layer 22AU is the first clear adhesive 22A.The The solidfied material of two clear adhesive oxidant layer 22BU is the second clear adhesive 22B.

As the method for forming the first clear adhesive oxidant layer 22AU and the second clear adhesive oxidant layer 22BU, for example, Gravure printing method, silk screen print method use reverse roll coating method of intaglio plate etc..

(7.2) the 5th processes

In 5th process, by the face of the side the first film metal foil 11A of the film metal foil 10A of first band metal base B14, it is bonded with the face T23 of the first clear adhesive oxidant layer 22AU of the transparent substrate 23 with clear adhesive oxidant layer.Further, by The face B14 of the second side film metal foil 11B of the two film metal foil 10B with metal base, with the saturating of clear adhesive oxidant layer The face B23 of second clear adhesive oxidant layer 22BU of bright substrate 23 is bonded.It obtains covering metallic transparent shown in Figure 1B and Fig. 5 C as a result, Substrate material 20.

As applying method, for example, following such method etc..That is, as shown in Figure 5 B, making first band metal The face B14 of the side the first film metal foil 11A of the film metal foil 10A of substrate and the transparent substrate 23 with clear adhesive oxidant layer The first clear adhesive oxidant layer 22AU face T23 it is opposed.In turn, make the second of the second film metal foil 10B with metal base The face B14 of the side film metal foil 11B, the face with the second clear adhesive oxidant layer 22BU of the transparent substrate 23 with clear adhesive oxidant layer B23 is opposed.Thereafter, by their integrations, solidify the first clear adhesive oxidant layer 22AU and the second clear adhesive oxidant layer 22BU.By This, the first clear adhesive oxidant layer 22AU solidifies and becomes the first clear adhesive 22A.Second clear adhesive oxidant layer 22BU solidification and As the second clear adhesive 22B.

Keep the first clear adhesive oxidant layer 22AU and the second cured method of clear adhesive oxidant layer 22BU saturating according to constituting first The transparent adhesive appropriate adjustment of bright adhesive layer 22AU and the second clear adhesive oxidant layer 22BU, for example, on one side Apply the defined pressure method heated on one side, the method heated in the environment of normal pressure or low pressure etc. using press machine etc..

(8) manufacturing method of Clairvoyant type electrode plywood

The manufacturing method of Clairvoyant type electrode plywood 30 includes first step, the second step, the third step, black chemical industry Sequence, the fourth step, the 5th process and the 6th process.In 6th process, from covering 20 stripping metal substrate of metallic transparent substrate material And peeling layer.Successively pass through first step, the second step, the third step, blackened process, the fourth step, the 5th process, the 6th The each process of process obtains Clairvoyant type electrode plywood 30.It include blackened process in present embodiment, but the present invention is unlimited In this, the manufacturing method for covering metallic transparent substrate material 20 can be free of blackened process.In present embodiment, in transparent substrate 21 two sides forms clear adhesive oxidant layer, and however, the present invention is not limited thereto can be formed only in the single side of transparent substrate 21 transparent viscous Connect oxidant layer.

(8.1) the 6th processes

In 6th process, the first peeling layer 12A, the first metal base 13A, the are removed from metallic transparent substrate material 20 is covered Two peeling layer 12B and the second metal base 13B.Clairvoyant type electrode plywood 30 shown in Fig. 2A and Fig. 5 D is obtained as a result,.If The first metal base 13A is removed, then the first peeling layer 12A is shelled together with the first metal base 13A from the first film metal foil 11A From.Similarly, if the second metal base 13B, the second peeling layer 12B of removing is thin from second together with the second metal base 13B Film metal foil 11B removing.

Embodiment

Hereinafter, the present invention is specifically described by embodiment.

In embodiment, the measuring method of the thickness of Str, Rz and film metal foil is as described below.

[measurement of Str]

Surface roughness (uses " the laser microscope VK-X150 " of Co., Ltd. KEYENCE, 50 times using measuring appliance Lens), according to ISO25178, it is specified that the Str of film metal foil.Measure the survey of 210.00 μm of 274.70 μ m of film metal foil Determine the height distribution in region, finds out the respective Str by the measurement region segmentation at 4 regions, their average value is made For the ratio of width to height (Str) of the surface texture of film metal foil.Str is 0.5 or more and 1.0 below to be evaluated as "○", less than 0.5 Be evaluated as "×".

[measurement of Rz]

Using surface roughness meter (" SURFCOM1500SD " of Tokyo Seimitsu Co., Ltd), pass through tracer method According to JIS B 0651 (1996) and JIS B 0601 (1994), 2 μm of measurement Rz of contact pilotage are utilized.Measurement range is linear 10mm.Rz be 2.5 μm it is below be evaluated as "○", be evaluated as "×" more than 2.5 μm.

[measurement of the thickness of metal base and film metal foil]

For the thickness of metal base and film metal foil, measurement cuts out the weight of the copper foil of 10cm square, passes through By the density 8.96g/cm of copper³The gravimetric method of conversion calculates thickness.

[measurement of cross-sectional length and difference of height]

For cross-sectional length and difference of height, (" the laser capture microdissection of Co., Ltd. KEYENCE is used using measuring appliance Mirror VK-X100 ", 50 times of lens), measure the difference of height and cross-sectional length L1 of wiring diagram pattern layer.The length L2 of reference line 102 is set as 274.410μm。

Difference of height is as shown in figure 13, and wiring diagram pattern layer 42 is cut off with vertical plane, and the section for calculating the appearance of its notch is bent The sum of the maximum peak heights Hp and maximum valley depth Hv of the average height L3 relative to protrusion at the bumps of line 101 (difference of height =Hp+Hv).Cross-sectional length L1 is as shown in figure 13, measures the length of cross section curve 101.In addition, calculating relative to reference line 102 Length L2 ratio (L1/L2).

[measurement of the broken string quantity of wiring diagram pattern layer]

A part that the film metal foil 11 of single sided perspective type electrode plywood 30S and reflection reduce layer 14 is passed through into light Etching method removes, and obtains the continuity test of the continuity test wiring diagram pattern layer 42C shown in fig. 6 with continuity test pattern With single sided perspective type electrode former material 40C.Count the continuity test of obtained continuity test single sided perspective type electrode former material 40C With the broken string quantity of wiring diagram pattern layer 42C.

[embodiment 1]

(production of the film metal foil 10 with metal base)

(metal base 13)

As electrolysis roller 110, prepare the rotating drum of the ground titanium in surface.As the first electrolyte 121, prepare Electricity containing copper sulfate pentahydrate 170g/L, sulfuric acid 100g/L, 6 mass ppm of chlorine, gelatin (average molecular weight 2000) 30ppm Solve liquid.

As shown in Figure 4 A, electrolysis roller 110 is regard as cathode, by the frame of the section arc-shaped opposed with electrolysis roller 110 Platform is as anode, dipping electrolysis roller 110 in the first electrolyte 121 in electrolytic bath 120.Then, it is in current density 6.0A/dm², the first electrolyte 121 temperature be under 40 DEG C of manufacturing condition on one side making to be electrolysed the anode that exists while roller 110 rotates 20 minutes electric currents are flowed through between cathode, thus make metal electrodeposition on the surface of electrolysis roller 110.

Then, the metal being precipitated on the surface of electrolysis roller 110 is removed from electrolysis roller 110, continuously obtains Fig. 3 A Shown in metal base 13.By obtained metal base 13 in 10% sulfuric acid, temperature be 30 DEG C, current density 5A/ dm², the processing time be to be cleaned 20 seconds with pure water under conditions of 20 seconds by cathode treatment clean surface.

The surface texture and thickness of metal base 13 after measurement cleaning.Metal base 13 with a thickness of 17 μm.Metal Substrate The surface texture of second interarea B13 of the side of material 13 not contacted with electrolysis roller 110 is Str 0.733, Rz 1.383 μm.The surface texture of first interarea T13 (glassy surface) of the side of metal base 13 contacted with electrolysis roller 110 is that Str is 0.261, Rz is 1.637 μm.

(peeling layer 12)

Object 30g/L, Na are being closed containing nickel sulfate hexahydrate₂MoO₄The peeling layer shape of dihydrate 3g/L, sodium citrate 40g/L At with impregnating metal substrate 13 in electrolyte, temperature be 30 DEG C, pH 6, current density 2A/dm², processing the time be 20 seconds Under conditions of be electrolysed, on the second interarea B13 of metal base 13 formed peeling layer 12, cleaned 20 seconds with flowing water.By This, obtains first layer lamination 15 shown in Fig. 3 B.First side interarea T12 of peeling layer 12 mainly includes the alloy of nickel and molybdenum, the Two sides interarea B12 mainly include the oxide of nickel and molybdenum.

(film metal foil 11)

Containing cupric pyrophosphate 80g/L, potassium pyrophosphate 320g/L, ammonium hydroxide 2ml/L cupric pyrophosphate electroplating bath in impregnate One plywood 15, temperature be 40 DEG C, pH 8.5, current density 2.0A/dm², processing the time be 20 seconds under conditions of carry out Cathode treatment is cleaned 20 seconds with pure water.

Then, containing copper sulfate pentahydrate 160g/L, sulfuric acid 100g/L, gelatin (weight average molecular weight 5000) 15ppm, The film metal foil of chloride ion 5ppm is formed with impregnating first layer lamination 15 in electrolyte, temperature be 40 DEG C, pH 7, electric current Density is 3.5A/dm², processing the time be 150 seconds under conditions of be electrolysed, formed on the second interarea B12 of peeling layer 12 Film metal foil 11.The second plywood 16 shown in Fig. 3 C is obtained as a result,.

Then, the second plywood 16 is cleaned 20 seconds with flowing water.The film gold of the second plywood 16 after measurement cleaning Belong to the thickness of foil 11, result is 2 μm.Then, antirust treatment is carried out to the second plywood 16 and silane coupling agent is handled.

(reflection reduces layer 14)

The second plywood 16 is impregnated in the electrolyte containing copper sulfate pentahydrate 30g/L, sulfuric acid 20g/L, in temperature For 80 DEG C, current density 7A/dm², processing the time be 20 seconds under conditions of, be electrolysed, the second of film metal foil 11 The roughened layer of copper is formed on interarea B11.Then, it impregnates and is formed in the chromic acid salt bath containing sodium dichromate dihydrate 3.5g/L Second plywood 16 of the roughened layer of copper, temperature be 30 DEG C, pH 4.0, current density 0.5A/dm², processing the time be Chromic acid salt treatment is carried out under conditions of 2.5 seconds.The film metal foil 10 shown in Fig. 3 D with metal base is obtained as a result,.

Then, from the 10 stripping metal substrate 13 of film metal foil with metal base, the release surface is observed with SEM.If stripping From metal base 13, then peeling layer 12 is removed from film metal foil 11 together with metal base 13.It will be from the thin of metal base First interarea of after 10 stripping metal substrate 13 of film metal foil, 11 side of film metal foil release surface, that is, film metal foil 11 The SEM image (multiplying power: 1000 times) of T11 is shown in Fig. 7 A.

(production that single side covers metallic transparent substrate material 20S)

As transparent substrate 21, preparing transparent PET film, (" the Cosmoshine A4300 " of Co. Ltd. system, thickness spin in Japan Degree: 100 μm).With 3g/m on the first interarea T21 of transparent substrate 21²Coating weight coating with it is following form prepare it is saturating Bright bonding agent (carbamate resins) keeps making it dry for 5 minutes in the environment of 100 DEG C, and the first of 7 μm of thickness of formation is thoroughly Bright adhesive layer 22AU.The transparent substrate 23S of one-side band clear adhesive oxidant layer shown in Fig. 8 A is obtained as a result,.

(composition of transparent adhesive)

Host agent: " the ダイ Na レオ VA-3020 " of Toyo Ink Manufacturing Co., Ltd.

Curing agent: " the ダイ Na レオ HD 1 " of Toyo Ink Manufacturing Co., Ltd.

Mass ratio: host agent/curing agent=100/7

Make the first clear adhesive oxidant layer 22AU of the transparent substrate 23S of one-side band clear adhesive oxidant layer and with metal base Film metal foil 10 reflection reduce layer 14 as shown in Figure 8 B it is opposed, make the transparent substrate 23S of one-side band clear adhesive oxidant layer It is overlapped and is bonded with the film metal foil 10 with metal base.The state of the fitting is kept for 5 days in the environment of 60 DEG C, makes One clear adhesive oxidant layer 22AU solidification is used as the first clear adhesive 22A.Single side shown in Fig. 8 C is obtained as a result, covers metallic transparent Substrate material 20S.

(production of single sided perspective type electrode plywood 30S)

Metallic transparent substrate material 20S stripping metal substrate 13 and peeling layer 12 are covered from single side.It is obtained shown in Fig. 8 D as a result, Single sided perspective type electrode plywood 30S.At this point, if metal base 13 is removed, peeling layer 12 and metal base 13 1 It rises from film metal foil 11 and removes.First master of the obtained single sided perspective type electrode film metal foil 11 of plywood 30S The surface texture of face T11 is that Str 0.781, Rz are 1.630 μm.

(production of single sided perspective type electrode former material)

A part that the film metal foil 11 of single sided perspective type electrode plywood 30S and reflection reduce layer 14 is passed through into light Etching method removes, and obtains having the list of the wiring diagram pattern layer of the mesh pattern of the lattice-like at line/interval (L/S)=5 μm/1000 μm Face Clairvoyant type electrode former material.The cross-sectional length L1 of the wiring diagram pattern layer of obtained single sided perspective type electrode former material is 291.235 μ M, L1/L2 1.06.In addition, difference of height is 1.512 μm.Use the wiring diagram pattern layer of SEM observation single sided perspective type electrode former material. The SEM image (multiplying power: 2000 times) of wiring diagram pattern layer is shown in Fig. 9 A.Confirming continuity test, whether there is or not disconnected with wiring diagram pattern layer 42C Line, result are 0.0/m²。

[modification 1]

For the transparent substrate 21 in embodiment 1, cycloolefin film (Japanese Zeon ZF-160 (100 μm of thickness)) generation is used For high transparency PET film, in addition, carrying out Corona discharge Treatment coating transparent adhesive (carbamate resins) on two sides, this is removed Except, single sided perspective type electrode plywood 30S is obtained similarly to Example 1.And then by obtained single sided perspective type electricity Pole obtains single sided perspective type electrode former material with plywood 30S.The film gold of obtained single sided perspective type electrode plywood 30S The surface texture for belonging to the first interarea T11 of foil 11 is that Str 0.890, Rz are 2.202 μm.Obtained single sided perspective type electrode The cross-sectional length L1 of the wiring diagram pattern layer of former material is 296.500 μm, L1/L2 1.08.In addition, difference of height is 1.797 μm.Confirmation For continuity test with wiring diagram pattern layer 42C whether there is or not broken string, result is 0.0/m².It is filled in addition, being shown for image shown in fig. 2 C It sets 53 and single sided perspective type electrode former material obtained in embodiment 1 is placed, through inclined for device 50 using liquid crystal display panel Light sunglasses confirmation screen, as a result confirms rainbow hot spot, and the single sided perspective type electrode former material of embodiment 1 is changed to change Single sided perspective type electrode former material obtained in example 1 as a result, not confirming rainbow hot spot.

[modification 2]

For the transparent substrate 21 in embodiment 1, super birefringent polyester film (Japan spins SRF (80 μm of thickness)) generation is used For high transparency PET film, in addition to this, single sided perspective type electrode plywood 30S is obtained similarly to Example 1.And then by institute Obtained single sided perspective type electrode obtains single sided perspective type electrode former material with plywood 30S.Obtained single sided perspective type electrode Surface texture with the first interarea T11 of the film metal foil 11 of plywood 30S is that Str 0.844, Rz are 2.111 μm.Institute The cross-sectional length L1 of the wiring diagram pattern layer of obtained single sided perspective type electrode former material is 289.654 μm, L1/L2 1.06.In addition, Difference of height is 1.894 μm.For confirmation continuity test with wiring diagram pattern layer 42C whether there is or not broken string, result is 0.0/m².In addition, for Image display device 53 shown in fig. 2 C uses liquid crystal display panel, for device 50, places the single sided perspective type electricity of embodiment 1 As a result pole former material confirms rainbow hot spot through polarized sunglasses confirmation screen, in addition, the angle confirmation of picture according to the observation Show to black as but the single sided perspective type electrode former material of embodiment 1 being changed to the single sided perspective type electrode former material of modification 2 As a result, rainbow hot spot and black showing as not being identified.

[embodiment 2]

When obtaining metal base 13, the composition of the first electrolyte 121 is set as containing copper sulfate pentahydrate 270g/L, sulphur The composition of sour 90g/L, 20 mass ppm of chlorine, polyethylene glycol (average molecular weight 1000) 10ppm, 3- sulfydryl -1- propane sulfonic acid 5ppm, It is 50A/dm that the condition of plating, which is set as current density,², the first electrolyte 121 temperature be 40 DEG C, Plating times are 2 minutes In addition to this condition obtains single sided perspective type electrode plywood 30S, by obtained single sided perspective similarly to Example 1 Type electrode obtains single sided perspective type electrode former material with plywood 30S.Obtained single sided perspective type electrode is thin with plywood 30S's The surface texture of first interarea T11 of film metal foil 11 is that Str 0.634, Rz are 1.383 μm.Obtained single sided perspective type The cross-sectional length L1 of the wiring diagram pattern layer of electrode former material is 286.818 μm, L1/L2 1.05.In addition, difference of height is 1.397 μm. For confirmation continuity test with wiring diagram pattern layer 42C whether there is or not broken string, result is 3.3/m²。

[embodiment 3]

When obtaining metal base 13, the composition of the first electrolyte 121 is set as containing copper sulfate pentahydrate 280g/L, sulphur Sour 90g/L, 10 mass ppm of chlorine, polyethylene glycol (average molecular weight 1000): 10ppm, 3- sulfydryl -1- propane sulfonic acid: the group of 1ppm At it is 50A/dm that the condition of plating, which is set as current density,², the first electrolyte 121 temperature be 40 DEG C, Plating times are 2 points In addition to this condition of clock obtains single sided perspective type electrode plywood 30S, by obtained single side similarly to Example 1 Clairvoyant type electrode obtains single sided perspective type electrode former material with plywood 30S.Obtained single sided perspective type electrode plywood 30S The surface texture of the first interarea T11 of film metal foil 11 be that Str 0.856, Rz are 2.199 μm.Obtained single side is saturating The cross-sectional length L1 of the wiring diagram pattern layer of type electrode former material is regarded as 293.647 μm, L1/L2 1.07.In addition, difference of height is 1.807μm.For confirmation continuity test with wiring diagram pattern layer 42C whether there is or not broken string, result is 0.0/m²。

[comparative example 1]

(production of the film metal foil 203 with metal base)

(metal base 210)

The composition of first electrolyte 121 is set as containing copper sulfate pentahydrate 160g/L, sulfuric acid 100g/L, chloride ion In addition to this composition of 5ppm similarly to Example 1, continuously obtains metal base 210 shown in Figure 10 A.

By obtained metal base 210 in 10% sulfuric acid, temperature be 30 DEG C, current density 5A/dm², processing when Between by cathode treatment clean surface, to be cleaned 20 seconds with pure water under conditions of 20 seconds.

The surface texture and thickness of metal base 210 after measurement cleaning.Metal base 210 with a thickness of 2.1 μm.Metal The surface texture of first interarea T210 (glassy surface) of the side of substrate 210 contacted with electrolysis roller 110 is that Str is 0.482, Rz is 1.713 μm.

(peeling layer 220)

On the first interarea T210 of metal base 210, peeling layer 220 is formed under the same conditions as example 1, is used Flowing water cleans 20 seconds.Third plywood 201 shown in Figure 10 B is obtained as a result,.

(film metal foil 230)

On the first interarea T220 of peeling layer 220, film metal foil 230 is formed under the same conditions as example 1. The 4th plywood 202 shown in Figure 10 C is obtained as a result,.

Then, the 4th plywood 202 is cleaned 20 seconds with flowing water.The film of the 4th plywood 202 after measurement cleaning The thickness of metal foil 230, result are 2 μm.

(antirust treatment layer and silane coupled process layer)

Antirust treatment and silane coupling agent processing are carried out under the same conditions as example 1.

(reflection reduces layer 240)

On the first interarea T230 of film metal foil 230, formed under the same conditions as example 1 Ni layers thin.By This, obtains the film metal foil 203 shown in Figure 10 D with metal base.

The reflection of the obtained film metal foil 203 with metal base reduces the surface of the first interarea T240 of layer 240 Character is that Str 0.380, Rz are 1.657 μm.

From the 203 stripping metal substrate 210 of film metal foil with metal base, the release surface is observed with SEM.If removing gold Belong to substrate 210, then peeling layer 220 is removed from film metal foil 230 together with metal base 210.It will be from the thin of metal base After 203 stripping metal substrate 210 of film metal foil, 230 side of film metal foil release surface, that is, film metal foil 230 second is main The SEM image (multiplying power: 1000 times) of face B230 is shown in Fig. 7 B.

(single side covers the production of metallic transparent substrate material 204)

The transparent substrate 23S of one-side band clear adhesive oxidant layer shown in Figure 10 E is obtained similarly to Example 1.

Make the first clear adhesive oxidant layer 22AU of the transparent substrate 23S of one-side band clear adhesive oxidant layer and with metal base Film metal foil 203 reflection reduce layer 240 it is opposed as shown in figure 10f, make the transparent substrate of one-side band clear adhesive oxidant layer 23S and film metal foil 203 with metal base are overlapped and are bonded.The state of the fitting is kept for 5 days in the environment of 60 DEG C, Make the first clear adhesive oxidant layer 22AU solidification as the first clear adhesive 22A.Single side shown in Figure 10 G is obtained as a result, covers gold Belong to transparent substrate material 204.

Then, 204 stripping metal substrate 210 of metallic transparent substrate material and peeling layer 220 are covered from single side.It obtains as a result, Single sided perspective type electrode plywood 200 shown in Figure 10 H.At this point, if stripping metal substrate 210, peeling layer 220 and metal Substrate 210 is removed from film metal foil 230 together.The film metal foil of obtained single sided perspective type electrode plywood 200 The surface texture of 230 the second interarea B230 is that Str 0.461, Rz are 2.449 μm.

(production of single sided perspective type electrode former material)

The film metal foil 230 of single sided perspective type electrode plywood 200 and reflection are reduced to a part and reality of layer 240 It applies example 1 to remove likewise by photo-engraving process, obtains having the network diagramming of the lattice-like at line/interval (L/S)=5 μm/1000 μm The single sided perspective type electrode former material of the wiring diagram pattern layer of case.The wiring diagram pattern layer of obtained single sided perspective type electrode former material is cut Face length L1 is 316.280 μm, L1/L2 1.15.In addition, difference of height is 2.409 μm.Use SEM observation single sided perspective type electricity The wiring diagram pattern layer of pole former material.The SEM image (multiplying power: 2000 times) of wiring diagram pattern layer is shown in Fig. 9 B.Confirm that continuity test is used For wiring diagram pattern layer 42C whether there is or not broken string, result is 10.0/m²。

[comparative example 2]

The grinding condition of change electrolysis roller 110, makes the Str of the first interarea T210 (glassy surface) of metal base 210 0.348, Rz is 1.607 μm, in addition to this, single sided perspective type electrode plywood 200 is got similarly with comparative example 1, by institute Obtained single sided perspective type electrode plywood 200 obtains single sided perspective type electrode former material.Obtained single sided perspective type electrode Surface texture with the second interarea B230 of the film metal foil 230 of plywood 200 is that Str 0.380, Rz are 1.657 μm. The cross-sectional length L1 of the wiring diagram pattern layer of obtained single sided perspective type electrode former material is 313.110 μm, L1/L2 1.14.Separately Outside, difference of height is 2.672 μm.For confirmation continuity test with wiring diagram pattern layer 42C whether there is or not broken string, result is 6.6/m²。

[comparative example 3]

The grinding condition of change electrolysis roller 110, makes the Str of the first interarea T210 (glassy surface) of metal base 210 0.220, Rz is 2.351 μm, in addition to this, single sided perspective type electrode plywood 200 is got similarly with comparative example 1, by institute Obtained single sided perspective type electrode plywood 200 obtains single sided perspective type electrode former material.Obtained single sided perspective type electrode Surface texture with the second interarea B230 of the film metal foil 230 of plywood 200 is that Str 0.237, Rz are 1.632 μm. The cross-sectional length L1 of the wiring diagram pattern layer of obtained single sided perspective type electrode former material is 309.559 μm, L1/L2 1.013.Separately Outside, difference of height is 3.826 μm.Wiring diagram pattern layer is confirmed whether there is or not broken string, and result is 6.6/m²。

[comparative example 4]

It is same with embodiment 1 other than the Plating times of<plating conditions>are set as 40 minutes when obtaining metal base 13 Obtain to sample single sided perspective type electrode plywood 200.By the film gold of obtained single sided perspective type electrode plywood 200 Belong to foil 230 and reflection reduce a part of layer 240 and removed similarly to Example 1 by photo-engraving process, as a result fail to be formed line/ It is spaced the wiring diagram pattern layer of the mesh pattern of the lattice-like of (L/S)=5 μm/1000 μm.It also fails to form continuity test wiring Pattern layer 42C.The table of second interarea B230 of the film metal foil 230 of obtained single sided perspective type electrode plywood 200 Face character is that Str 0.728, Rz are 3.740 μm.

[comparative example 5]

The grinding condition of change electrolysis roller 110, makes the Str of the first interarea T210 (glassy surface) of metal base 210 0.380, Rz is 3.835 μm, in addition to this, gets similarly single sided perspective type electrode plywood 200 with comparative example 1.By institute The film metal foil 230 of obtained single sided perspective type electrode plywood 200 and reflection reduce a part and embodiment of layer 240 1 removes likewise by photo-engraving process, as a result fails to be formed the network diagramming of the lattice-like at line/interval (L/S)=5 μm/1000 μm The wiring diagram pattern layer of case.It also fails to form continuity test wiring diagram pattern layer 42C.Obtained single sided perspective type electrode stacking The surface texture of second interarea B230 of the film metal foil 230 of plate 200 is that Str 0.325, Rz are 3.890 μm.

By single sided perspective type electrode the first interarea T11 of plywood 30S and single sided perspective type electrode plywood 200 The cross-sectional length of the wiring diagram pattern layer of the Str and Rz and single sided perspective type electrode former material of second interarea B230, difference of height and have Measurement result without broken string is shown in table 1.

[table 1]

[reference example]

The transmission loss of following samples 310 is evaluated in the following way.

As sample 310, prepare high smooth copper foil (35), common copper foil (35), high smooth copper foil (18) and common copper foil (18).By the copper thickness T of each sample 310₃₁₀, Str, Ra, Rz and cross-sectional length L1 be shown in table 2.The two sides of each sample 310 Surface texture can be evaluated as identical.The length L2 of the reference line 102 of cross-sectional length L1 is 274.410 μm.In addition, each sample L1/L2 is that high smooth copper foil (35) is 1.06, common copper foil (35) is 1.13, high smooth copper foil (18) is 1.04, common copper foil It (18) is 1.13.

[table 2]

As shown in figure 11, the sample 310 of the strip of the line width W determined in such a way that impedance becomes 50 Ω is pre- with two panels Leaching material (thickness: 0.06mm) sandwiches, in (the thickness T of surface configuration copper foil 320 of each prepreg₃₂₀: 35 μm), integral heat pressure makes Prepreg solidification.The copper-clad laminated board 300 with strip line is obtained as a result,.In sample 310, insulating layer 330 (thickness T330: The center of thickness direction 0.28mm) is embedded to sample 310.Wire length is 1m.The impedance of the strip line is 50 Ω.To sample 310 do not implement blackened processing.

In the state of outermost copper foil 320,320 ground connection, 2.0GHz, 3.5GHz or 5.0GHz are transmitted to sample 310 Alternating current, use " the 4 port PNA-L network analyser 13.5/ of N5230A of KEYSIGHTTECHNOLOGIES corporation 20GHz " measures transmission loss.It the results are shown in table 3 and Figure 12.

[table 3]

The result as shown in table 3 and Figure 12 is it is found that under each frequency, the transmission loss of high smooth copper foil (35) and high smooth copper The transmission loss of foil (18) is equivalent, and the transmission loss of common copper foil (35) is equal with the transmission loss of common copper foil (18).In addition, As the frequency of alternating current is got higher, as shown in figure 12, the transmission loss of high smooth copper foil (35) or high smooth copper foil (18), with The difference of the transmission loss of common copper foil (35) or common copper foil (18) becomes larger.As knowen from these results, in the high frequency of 2GHz or more Band domain, the copper thickness T of sample 310₃₁₀Big influence will not be generated to transmission loss, the cross-sectional length of sample 310 damages transmission The raw big influence of loss of production.In addition, knowing that the transmission loss of the short sample 310 of the cross-sectional length sample 310 longer than cross-sectional length is few. Thus, thus it is speculated that the first interarea T11 of the film metal foil 11 in present embodiment is high even surface, than previous ultrathin copper foil Cross-sectional length is short, therefore especially in high frequency band domain, transmission loss is smaller.

Symbol description

The 10 film metal foils with metal base

The film metal foil of 10A first band metal base

Film metal foil of the 10B second with metal base

11 film metal foils

11A the first film metal foil

11B the second film metal foil

12 peeling layers

The first peeling layer of 12A

The second peeling layer of 12B

13 metal bases

The first metal base of 13A

The second metal base of 13B

14 reflections reduce layer

The reflection of 14A first reduces layer

The reflection of 14B second reduces layer

15,16 plywood

20 cover metallic transparent substrate material

21 transparent substrates

22A, 22B clear adhesive

23 transparent substrates with clear adhesive oxidant layer

The transparent substrate of 23S one-side band clear adhesive oxidant layer

30 Clairvoyant type electrode plywoods

40 Clairvoyant type electrode former materials

41A, 41B reflection reduce pattern layer

42A, 42B wiring diagram pattern layer

50 devices

110 electrolysis rollers

121 electrolyte

131 second electrolyte

201,202 plywood

The 203 film metal foils with metal base

210 metal bases

220 peeling layers

230 film metal foils

240 reflections reduce layer

Claims

1. a kind of film metal foil with metal base, has:

Film metal foil with the first interarea and the second interarea,

The peeling layer with conduction that is arranged on first interarea and

The metal base being arranged on the peeling layer,

It is 2.5 μm of micro concavo-convexes below that first interarea of the film metal foil, which has 10 mean roughness Rz, and described The ratio of width to height Str of the surface texture of first interarea is 0.5 or more and 1.0 or less.

2. the film metal foil according to claim 1 with metal base, wherein

The difference of height of the micro concavo-convex of first interarea of the film metal foil is 2.3 μm or less.

3. the film metal foil according to claim 1 or 2 with metal base, wherein

The cross-sectional length of first interarea of the film metal foil is 1.10 times or less relative to the length of reference line.

4. the film metal foil according to claim 1 or 2 with metal base, wherein

The film metal foil with a thickness of 0.1 μm or more and 5.0 μm or less.

5. the film metal foil according to claim 1 or 2 with metal base, wherein

The film metal foil includes at least one kind of in copper, nickel, aluminium and silver.

6. the film metal foil according to claim 5 with metal base, wherein

The film metal foil includes the copper for being 80 mass % or more relative to the gross mass of the film metal foil.

7. the film metal foil according to claim 1 or 2 with metal base, wherein

The metal base include relative to the metal base gross mass be 80 mass % or more selected from copper, nickel, aluminium, 1 kind in magnesium, tungsten, molybdenum, platinum, gold and palladium.

8. the film metal foil according to claim 1 or 2 with metal base, wherein

The metal base with a thickness of 7 μm or more and 40 μm or less.

9. the film metal foil according to claim 1 or 2 with metal base, wherein

Having reflection on the second interarea of the film metal foil reduces layer.

10. one kind covers metallic transparent substrate material, have:

Transparent substrate,

The transparent substrate one or two sides be arranged the film metal foil described in claim 1 with metal base and

Clear adhesive between the transparent substrate and the film metal foil.

11. according to claim 10 cover metallic transparent substrate material, wherein

The clear adhesive includes acrylic resin, epoxy resin, carbamate resins or their hybrid resin.

12. metallic transparent substrate material is covered described in 0 or 11 according to claim 1, wherein

The hardness of the clear adhesive is 1.0N/mm²Above and 200N/mm²Below.

13. metallic transparent substrate material is covered described in 0 or 11 according to claim 1, wherein

The transparent substrate includes the polyester film that length of delay is 100nm cycloolefin film below or length of delay is 3000nm or more.

It is from covering the stripping of metallic transparent substrate material described in claim 10 or 11 14. a kind of Clairvoyant type electrode plywood From made of the metal base and peeling layer.

15. a kind of Clairvoyant type electrode former material, has wiring diagram pattern layer, the wiring diagram pattern layer is saturating described in claim 14 There is the wiring diagram pattern layer of opening portion depending on the film metal foil of type electrode plywood.

16. Clairvoyant type electrode former material according to claim 15, wherein

The line width for forming the wiring diagram pattern layer is 0.5 μm or more and 10 μm or less or opening width is 50 μm or more and 10000 μm or less.

17. Clairvoyant type electrode former material according to claim 16, sheet resistance is 0.01 Ω/sq or more and 50 Ω/sq Below.

18. Clairvoyant type electrode former material according to claim 16, total light transmittance is 60% or more.

19. a kind of device has Clairvoyant type electrode former material described in claim 15 and is electrically connected with the wiring diagram pattern layer Control circuit.

20. a kind of Clairvoyant type electrode former material has the thickness of transparent substrate and the one or two sides formation in the transparent substrate 0.1 μm of degree or more and 5.0 μm of wiring diagram pattern layer below,

The wiring diagram pattern layer is to carry out pattern to the film metal foil engaged in the transparent substrate via clear adhesive Change and formed,

10 mean roughness Rz on the surface of the wiring diagram pattern layer be 2.5 μm hereinafter, and the wiring diagram pattern layer it is described The ratio of width to height Str of the surface texture on surface is 0.5 or more and 1.0 or less.