CN109693451A - A kind of thermal printing head heating base plate and its manufacturing method - Google Patents
A kind of thermal printing head heating base plate and its manufacturing method Download PDFInfo
- Publication number
- CN109693451A CN109693451A CN201910080450.9A CN201910080450A CN109693451A CN 109693451 A CN109693451 A CN 109693451A CN 201910080450 A CN201910080450 A CN 201910080450A CN 109693451 A CN109693451 A CN 109693451A
- Authority
- CN
- China
- Prior art keywords
- layer
- printing head
- thermal printing
- base plate
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 56
- 238000007651 thermal printing Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011241 protective layer Substances 0.000 claims abstract description 46
- 239000010410 layer Substances 0.000 claims abstract description 42
- 239000002346 layers by function Substances 0.000 claims abstract description 42
- 230000007704 transition Effects 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 15
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 13
- 239000002131 composite material Substances 0.000 claims abstract description 13
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 4
- 239000011147 inorganic material Substances 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 9
- 229910003564 SiAlON Inorganic materials 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 238000007733 ion plating Methods 0.000 claims description 5
- 238000003854 Surface Print Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 230000002000 scavenging effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 238000009498 subcoating Methods 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 11
- 238000009826 distribution Methods 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
Abstract
The present invention proposes a kind of thermal printing head heating base plate, including insulating substrate, comprehensively or partial ground glaze layer is equipped on the surface of insulating substrate, public electrode and individual electrode are equipped on the surface of insulating substrate and ground glaze layer, heating resistor configures between electrodes along main Print direction, one end of public electrode is connected along secondary Print direction with heating resistor, and the other end is connected with printing power supply；One end of individual electrode is connected along secondary Print direction with heating resistor, and the other end is connected with control IC；Insulating protective layer is covered on the surface of heating resistor, public electrode and part individual electrode; it is equipped with transition zone on the protection layer; the functional layer of hydrophobic oleophobic is equipped on transition zone, functional layer is made of inorganic material, and protective layer, transition zone and functional layer constitute surface composite layer.Above-mentioned thermal printing head is strong with heating base plate hydrophobic oleophobic ability, can improve carbon distribution and sticky paper phenomenon in print procedure, extend the service life of thermal printing head.
Description
Technical field
The present invention relates to thermal printing field more particularly to a kind of thermal printing head heating base plate and its manufacturing methods.
Background technique
It is well known that print head fever makes thermal media be heated color development, thermal media when heated when thermal printing head works
Chromonic layer it is in a molten state, not only containing organic/inorganic substance but also organic matter is contained in the fusant of chromonic layer, thermal media is in cooling
It is contacted always with print head in the process, the fusant meeting adhesion of chromonic layer on the print head, forms carbon distribution, influences gradation of drop-out colour
With product service life；In addition the cooling of thermal media fusant also will cause thermal printing head sticky paper, be embodied in temperature-sensitive
Medium can be with the different degrees of adhesion of print head, cannot be smooth by print head, causes scarce line and noise of lettering etc..Carbon distribution and viscous
Paper problem influences gradation of drop-out colour, lettering quality and the service life of thermal printing head, and more universal.
Related art is as follows:
Publicity forms ditch close to the position of raised line on the surface of print head paper delivery side protective film on special open 2000-246934
The method that slot reduces carbon distribution, but the product mentioned in the patent, the opening breadth of ditch is small, depth as shallow, once the bigger meeting of carbon deposition quantity
So that the segment difference of ditch is disappeared, cannot sufficiently take carbon distribution out of by the crimping of record media.
The utility model patent of Patent No. 201520630708.5 proposes one kind and sets hydrophilic layer, in paper delivery in paper feed side
Side sets the thermal printing head of hydrophobic layer, which can improve the carbon deposition phenomenon of thermal printing head, but not consider in the utility model
The presence of organic matter in carbon distribution, does not provide film layer preparation method yet.
The application for a patent for invention that number of patent application is 201510101328.7 discloses a kind of wear-resisting dewatering nano THIN COMPOSITE
The preparation method of film, but it is conductive metal that the laminated film in the patent application, which prepares matrix, is not mentioned in similar thermal printing
The method that wear-resisting hydrophobic film layer is prepared on the insulating substrate of head, does not mention the oleophobic performance of film layer yet.
Summary of the invention
In order to solve the problems in the existing technology, the invention proposes a kind of thermal printing head heating base plate and its
Manufacturing method extends the service life of thermal printing head to improve the carbon distribution and sticky paper phenomenon in print procedure.
To achieve the goals above, an aspect of of the present present invention proposes a kind of thermal printing head heating base plate, including exhausted
Edge substrate, the surface of the insulating substrate comprehensively or it is partial be equipped with ground glaze layer, in the insulating substrate and ground glaze layer
Surface be equipped with public electrode and individual electrode, heating resistor along main Print direction configure public electrode and individual electrode it
Between, as the heater for generating Joule heat, one end of the public electrode is connected along secondary Print direction with the heating resistor
It connects, the other end is connected with printing power supply；One end of the individual electrode is along secondary Print direction and the heating resistor phase
Connection, the other end are connected with control IC；It is covered on the surface of the heating resistor, public electrode and part individual electrode
There is the protective layer of insulation, transition zone is equipped on the protective layer, the functional layer of hydrophobic oleophobic, institute are equipped on the transition zone
It states functional layer to be made of inorganic material, the protective layer, transition zone and functional layer constitute surface composite layer.
Preferably, the protective layer is SiAlON, SiON or SiO2, the protective layer with a thickness of 1 μm~6 μm.
Preferably, the transition zone be Cr, Ti or combination, the transition zone with a thickness of 0.4 μm~1.4
μm。
Preferably, the functional layer is mixture, simple substance which is made of Ti, Cu, Si, O, N element, chemical combination
Object is composed, the functional layer with a thickness of 0.8 μm~2 μm.
Preferably, hydrophobic angle > 120 ° of the functional layer, oleophobic angle > 100 °.
Preferably, the overlay area of the transition zone and functional layer is no more than the overlay area of protective layer.
Preferably, the adhesive force of the surface composite layer is 37N~50N；The nano hardness of surface composite layer is 25GPa
~35GPa.
Another aspect of the present invention proposes a kind of manufacturing method based on above-mentioned thermal printing head heating base plate, described
Method the following steps are included:
Step 1, on the insulating substrate print comprehensively or partial unleaded amorphous glass ground glaze layer, 1200 DEG C~
The insulating substrate of sintering belt ground glaze layer at a temperature of 1300 DEG C, then conductive paste is sintered in the surface printing of insulating substrate and ground glaze layer
Material, sintering temperature are 800 DEG C -920 DEG C, form public electrode and individual electrode with photoetching technique later, then along thermal printing head
Main Print direction carries out band-like coating, and sintering forms the heating resistor of 4 μm~8 μ m-thicks at a temperature of 780 DEG C -850 DEG C；
Step 2 is plated using magnetron sputtering technique on the surface of the heating resistor, public electrode and part individual electrode
The protective layer of insulation is made, the protective layer is SiAlON, SiON or SiO2；
The thermal printing head for being coated with insulating protective layer after cleaning is put into multi-arc ion coating chamber with heating base plate by step 3
In body, by being evacuated so that pressure reaches 1 × 10 in cavity-3Pa hereinafter, heating make cavity temperature to 120 DEG C~200 DEG C, be passed through
Argon gas makes pressure in cavity reach 1Pa~2Pa, and back bias voltage 700V~1000V is added to generate heat the thermal printing head with protective layer
Substrate carries out bias cleaning, and scavenging period is 5min~15min, is passed through argon gas later, and flow is 100sccm~150sccm, adjusts
For the whole intracorporal pressure of chamber to 0.3Pa~1.0Pa, setting arc ource electric current is 50A~80A, and back bias voltage is 200V~400V, using more
Arc ion plating technique prepares transition zone on the surface of protective layer, and the transition zone is Cr, Ti or combination；
Step 4, in multi-arc ion coating cavity, be passed through the mixture of nitrogen, oxygen or the two, flow be 60sccm~
110sccm, for the adjustment intracorporal pressure of chamber to 0.3Pa~1.0Pa, setting arc ource electric current is 50A~80A, back bias voltage for 150V~
250V, using multi sphere ion plating technology transition zone surface prepare functional layer, the functional layer be mixture, the mixture by
Ti, Cu, Si, O, the simple substance of N element composition, compound combination form.
Preferably, in the step 2, the protective layer with a thickness of 1 μm~6 μm；It is described in the step 3
Transition zone with a thickness of 0.4 μm~1.4 μm；In the step 4, the functional layer with a thickness of 0.8 μm~2 μm.
Preferably, in the step 3, the overlay area of the transition zone is no more than the overlay area of protective layer；?
In the step 4, the overlay area of the functional layer is no more than the overlay area of protective layer.
The beneficial effect of the program of the present invention is that the thermal printing head manufactured by the above method is dredged with heating base plate
Water oleophobic ability is strong, can improve carbon distribution and sticky paper phenomenon in print procedure, extend the service life of thermal printing head.
Detailed description of the invention
Fig. 1 shows the structural schematic diagram of thermal printing head heating base plate according to the present invention.
Appended drawing reference: 1- insulating substrate, 2- ground glaze layer, 3a- public electrode, 3b- individual electrode, 4- heating resistor, 5-
Surface composite layer, 5a- protective layer, 5b- transition zone, 5c- functional layer.
Specific embodiment
A specific embodiment of the invention is further described with reference to the accompanying drawing.
As shown in Figure 1, thermal printing head heating base plate according to the present invention includes insulating substrate 1, in the insulation
The surface of substrate 1 comprehensively or it is partial be equipped with ground glaze layer 2, be equipped on the surface of the insulating substrate 1 and ground glaze layer 2 public
Electrode 3a and individual electrode 3b, heating resistor 4 configure between public electrode 3a and individual electrode 3b along main Print direction, make
For the heater for generating Joule heat, one end of the public electrode 3a is connected along secondary Print direction with the heating resistor 4,
Its other end is connected with printing power supply；One end of the individual electrode 3b is along secondary Print direction and 4 phase of heating resistor
Connection, the other end are connected with control IC；In the heating resistor 4, the table of public electrode 3a and part individual electrode 3b
Face is covered with the protective layer 5a of insulation, and transition zone 5b is equipped on the protective layer 5a, is equipped on the transition zone 5b hydrophobic
The functional layer 5c of oleophobic, the functional layer 5c are made of inorganic material, the protective layer 5a, transition zone 5b and functional layer 5c structure
At surface composite layer 5.
The protective layer 5a and bottom (namely heating resistor 4, public electrode 3a and part individual electrode 3b of the insulation
Surface) binding force is strong, in the present embodiment, the protective layer 5a is SiAlON, SiON or SiO2, preferably SiAlON, institute
State protective layer 5a with a thickness of 1 μm~6 μm.
The transition zone 5b can be combined preferably with protective layer 5a and functional layer 5c, the transition zone 5b be Cr, Ti or
Person's combination, preferably Cr, the transition zone 5b with a thickness of 0.4 μm~1.4 μm.
The functional layer 5c and transition zone 5b binding force are strong, have hydrophobic, fuel shedding quality, hydrophobic angle > 120 °, oleophobic angle >
100 °, by be arranged functional layer 5c make thermal media in print procedure precipitate be difficult thermal printing head surface deposit,
Bonding.The functional layer 5c is mixture, simple substance, compound combination which is made of Ti, Cu, Si, O, N element and
At, the functional layer 5c with a thickness of 0.8 μm~2 μm.
In the present embodiment, the overlay area of the transition zone 5b and functional layer 5c is no more than the covering of protective layer 5a
Region.
Due to hydrophobic angle > 120 ° of the functional layer 5c, oleophobic angle > 100 °, this makes thermal media in print procedure
Precipitate is difficult in thermal printing head surface deposition, bonding；Due to the presence of insulating protective layer 5a and transition zone 5b, functional layer 5c
It is greatly improved with the adhesive force of thermal printing head heating base plate, the adhesive force of the surface composite layer 5 is 37N~50N；Surface
The nano hardness of composite layer 5 is 25GPa~35GPa.
The manufacturing method of specific thermal printing head heating base plate according to the present invention the following steps are included:
Step 1, on the insulating substrate 1 print comprehensively or partial unleaded amorphous glass ground glaze layer 2,1200 DEG C~
The insulating substrate 1 of sintering belt ground glaze layer 2 at a temperature of 1300 DEG C, then led in the sintering of the surface printing of insulating substrate 1 and ground glaze layer 2
Plasma-based material, sintering temperature are 800 DEG C -920 DEG C, form public electrode 3a and individual electrode 3b with photoetching technique later, then pass through
The methods of describe and to carry out band-like coating along the main Print direction of thermal printing head, at a temperature of 780 DEG C -850 DEG C sintering formed 4 μm~
The heating resistor 4 of 8 μ m-thicks.
Step 2, using magnetron sputtering technique in the heating resistor 4, public electrode 3a and part individual electrode 3b
Surface is coated with the protective layer 5a of insulation.The protective layer 5a is SiAlON, SiON or SiO2, preferably SiAlON, the protection
Layer 5a with a thickness of 1 μm~6 μm.
The thermal printing head for being coated with insulating protective layer 5a after cleaning is put into multi-arc ion coating with heating base plate by step 3
In cavity, by being evacuated so that pressure reaches 1 × 10 in cavity-3Pa hereinafter, heating make cavity temperature to 120 DEG C~200 DEG C, lead to
Enter argon gas, pressure in cavity is made to reach 1Pa~2Pa, back bias voltage 700V~1000V is added to use the thermal printing head with protective layer 5a
Heating base plate carries out bias cleaning, and scavenging period is 5min~15min, is passed through argon gas later, flow be 100sccm~
150sccm, for the adjustment intracorporal pressure of chamber to 0.3Pa~1.0Pa, setting arc ource electric current is 50A~80A, back bias voltage for 200V~
400V prepares transition zone 5b on the surface of protective layer 5a using multi sphere ion plating technology.The transition zone 5b is Cr, Ti or two
The combination of person, preferably Cr, the transition zone 5b with a thickness of 0.4 μm~1.4 μm.The overlay area of the transition zone 5b does not surpass
The overlay area of overprotection layer 5a.
Step 4, in multi-arc ion coating cavity, be passed through the mixture of nitrogen, oxygen or the two, flow be 60sccm~
110sccm, for the adjustment intracorporal pressure of chamber to 0.3Pa~1.0Pa, setting arc ource electric current is 50A~80A, back bias voltage for 150V~
250V prepares functional layer 5c on the surface of transition zone 5b using multi sphere ion plating technology.
The functional layer 5c has hydrophobic, fuel shedding quality, and hydrophobic angle > 120 °, oleophobic angle > 100 °, the functional layer 5c is
Mixture, simple substance which is made of Ti, Cu, Si, O, N element, compound combination form, the thickness of the functional layer 5c
It is 0.8 μm~2 μm.The overlay area of the functional layer 5c is no more than the overlay area of protective layer 5a.
The thermal printing head manufactured by the above method strong, surface composite layer hardness with heating base plate hydrophobic oleophobic ability
Height, it is strong with bottom binding force, carbon distribution and sticky paper phenomenon in print procedure can be improved, extend thermal printing head uses the longevity
Life.
Claims (10)
1. a kind of thermal printing head heating base plate, including insulating substrate, the surface of the insulating substrate comprehensively or part
Be equipped with ground glaze layer, the surface of the insulating substrate and ground glaze layer be equipped with public electrode and individual electrode, heating resistor
Along the configuration of main Print direction between public electrode and individual electrode, as the heater for generating Joule heat, the public electrode
One end be connected along secondary Print direction with the heating resistor, the other end with printing power supply be connected；Individual electricity
One end of pole is connected along secondary Print direction with the heating resistor, and the other end is connected with control IC；It is characterized by:
It is covered with the protective layer of insulation on the surface of the heating resistor, public electrode and part individual electrode, in the protective layer
It is equipped with transition zone, the functional layer of hydrophobic oleophobic is equipped on the transition zone, the functional layer is made of inorganic material, described
Protective layer, transition zone and functional layer constitute surface composite layer.
2. thermal printing head heating base plate according to claim 1, it is characterised in that: the protective layer be SiAlON,
SiON or SiO2, the protective layer with a thickness of 1 μm~6 μm.
3. thermal printing head heating base plate according to claim 2, it is characterised in that: the transition zone be Cr, Ti or
Person's combination, the transition zone with a thickness of 0.4 μm~1.4 μm.
4. thermal printing head heating base plate according to claim 3, it is characterised in that: the functional layer is mixture,
Simple substance that the mixture is made of Ti, Cu, Si, O, N element, compound combination form, the functional layer with a thickness of 0.8 μm~
2μm。
5. thermal printing head heating base plate according to claim 4, it is characterised in that: the hydrophobic angle of the functional layer >
120 °, oleophobic angle > 100 °.
6. thermal printing head heating base plate as claimed in any of claims 1 to 5, it is characterised in that: the mistake
The overlay area for crossing layer and functional layer is no more than the overlay area of protective layer.
7. thermal printing head heating base plate according to claim 6, it is characterised in that: the attachment of the surface composite layer
Power is 37N~50N；The nano hardness of surface composite layer is 25GPa~35GPa.
8. a kind of manufacturing method based on thermal printing head heating base plate described in claim 1, it is characterised in that: the side
Method the following steps are included:
Step 1 prints comprehensive or partial unleaded amorphous glass ground glaze layer on the insulating substrate, at 1200 DEG C~1300 DEG C
At a temperature of sintering belt ground glaze layer insulating substrate, then the surface printing of insulating substrate and ground glaze layer be sintered electrocondution slurry, burn
Junction temperature is 800 DEG C -920 DEG C, forms public electrode and individual electrode with photoetching technique later, then along the leading print of thermal printing head
Direction carries out band-like coating, and sintering forms the heating resistor of 4 μm~8 μ m-thicks at a temperature of 780 DEG C -850 DEG C；
Step 2 is coated with absolutely using magnetron sputtering technique on the surface of the heating resistor, public electrode and part individual electrode
The protective layer of edge, the protective layer are SiAlON, SiON or SiO2；
The thermal printing head for being coated with insulating protective layer after cleaning is put into multi-arc ion coating cavity by step 3 with heating base plate,
By being evacuated so that pressure reaches 1 × 10 in cavity-3Pa hereinafter, heating make cavity temperature to 120 DEG C~200 DEG C, be passed through argon gas,
So that pressure in cavity is reached 1Pa~2Pa, adds back bias voltage 700V~1000V to the thermal printing head heating base plate with protective layer
Bias cleaning is carried out, scavenging period is 5min~15min, is passed through argon gas later, and flow is 100sccm~150sccm, adjusts chamber
For intracorporal pressure to 0.3Pa~1.0Pa, setting arc ource electric current is 50A~80A, and back bias voltage is 200V~400V, using multi sphere from
Sub- coating technology prepares transition zone on the surface of protective layer, and the transition zone is Cr, Ti or combination；
Step 4, in multi-arc ion coating cavity, be passed through the mixture of nitrogen, oxygen or the two, flow be 60sccm~
110sccm, for the adjustment intracorporal pressure of chamber to 0.3Pa~1.0Pa, setting arc ource electric current is 50A~80A, back bias voltage for 150V~
250V, using multi sphere ion plating technology transition zone surface prepare functional layer, the functional layer be mixture, the mixture by
Ti, Cu, Si, O, the simple substance of N element composition, compound combination form.
9. the manufacturing method of thermal printing head heating base plate according to claim 8, it is characterised in that: in the step
In 2, the protective layer with a thickness of 1 μm~6 μm；In the step 3, the transition zone with a thickness of 0.4 μm~1.4 μm；
In the step 4, the functional layer with a thickness of 0.8 μm~2 μm.
10. the manufacturing method of thermal printing head heating base plate according to claim 8 or claim 9, it is characterised in that: described
In step 3, the overlay area of the transition zone is no more than the overlay area of protective layer；In the step 4, the functional layer
Overlay area is no more than the overlay area of protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910080450.9A CN109693451A (en) | 2019-01-28 | 2019-01-28 | A kind of thermal printing head heating base plate and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910080450.9A CN109693451A (en) | 2019-01-28 | 2019-01-28 | A kind of thermal printing head heating base plate and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109693451A true CN109693451A (en) | 2019-04-30 |
Family
ID=66234490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910080450.9A Pending CN109693451A (en) | 2019-01-28 | 2019-01-28 | A kind of thermal printing head heating base plate and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109693451A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110091615A (en) * | 2019-05-10 | 2019-08-06 | 武汉晖印半导体有限公司 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
| CN111409376A (en) * | 2020-03-31 | 2020-07-14 | 湖南凯通电子有限公司 | Printing and manufacturing method for base glaze of heating substrate of thermal printing head |
| CN114368223A (en) * | 2021-01-26 | 2022-04-19 | 山东华菱电子股份有限公司 | Heating substrate for high-performance thermal printing head |
| CN114379237A (en) * | 2021-01-26 | 2022-04-22 | 山东华菱电子股份有限公司 | Heating substrate for high-performance thermal printing head |
| CN114434975A (en) * | 2020-10-30 | 2022-05-06 | 深圳市博思得科技发展有限公司 | Thermal print head and method for manufacturing the same |
| WO2023120093A1 (en) * | 2021-12-24 | 2023-06-29 | 京セラ株式会社 | Thermal head and thermal printer |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305720A (en) * | 1992-04-28 | 1993-11-19 | Alps Electric Co Ltd | Slidably contacting part for recording medium |
| JP2000246934A (en) * | 1999-02-26 | 2000-09-12 | Kyocera Corp | Thermal head |
| CN1337316A (en) * | 2000-08-03 | 2002-02-27 | 理想科学工业株式会社 | Heating head, its surface treatment method and surface treatment agent |
| JP2005161823A (en) * | 2003-12-05 | 2005-06-23 | Fuji Photo Film Co Ltd | Thermal head, thermal printer and thermal recording system |
| CN101466549A (en) * | 2006-06-21 | 2009-06-24 | 罗姆股份有限公司 | Thermal printhead |
| CN101652252A (en) * | 2007-03-15 | 2010-02-17 | 罗姆股份有限公司 | Thermal print head |
| CN102179982A (en) * | 2009-12-28 | 2011-09-14 | 施乐公司 | Superoleophobic and superhydrophobic devices and method for preparing same |
| CN204870085U (en) * | 2015-08-20 | 2015-12-16 | 山东华菱电子股份有限公司 | Thermosensitive printing head |
| CN206826188U (en) * | 2017-06-08 | 2018-01-02 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate suitable for wet environment |
| CN206884473U (en) * | 2017-06-20 | 2018-01-16 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate of wear resistant corrosion resistant |
| CN108656757A (en) * | 2017-03-28 | 2018-10-16 | 罗姆股份有限公司 | Thermal printing head |
| CN208035680U (en) * | 2018-02-07 | 2018-11-02 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate of resistance to hard foreign matter scratching |
| CN209616660U (en) * | 2019-01-28 | 2019-11-12 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate |
-
2019
- 2019-01-28 CN CN201910080450.9A patent/CN109693451A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305720A (en) * | 1992-04-28 | 1993-11-19 | Alps Electric Co Ltd | Slidably contacting part for recording medium |
| JP2000246934A (en) * | 1999-02-26 | 2000-09-12 | Kyocera Corp | Thermal head |
| CN1337316A (en) * | 2000-08-03 | 2002-02-27 | 理想科学工业株式会社 | Heating head, its surface treatment method and surface treatment agent |
| US20020036686A1 (en) * | 2000-08-03 | 2002-03-28 | Riso Kagaku Corporation | Thermal head, surface-treating method therefor and surface-treating agent therefor |
| JP2005161823A (en) * | 2003-12-05 | 2005-06-23 | Fuji Photo Film Co Ltd | Thermal head, thermal printer and thermal recording system |
| CN101466549A (en) * | 2006-06-21 | 2009-06-24 | 罗姆股份有限公司 | Thermal printhead |
| CN101652252A (en) * | 2007-03-15 | 2010-02-17 | 罗姆股份有限公司 | Thermal print head |
| CN102179982A (en) * | 2009-12-28 | 2011-09-14 | 施乐公司 | Superoleophobic and superhydrophobic devices and method for preparing same |
| CN204870085U (en) * | 2015-08-20 | 2015-12-16 | 山东华菱电子股份有限公司 | Thermosensitive printing head |
| CN108656757A (en) * | 2017-03-28 | 2018-10-16 | 罗姆股份有限公司 | Thermal printing head |
| CN206826188U (en) * | 2017-06-08 | 2018-01-02 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate suitable for wet environment |
| CN206884473U (en) * | 2017-06-20 | 2018-01-16 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate of wear resistant corrosion resistant |
| CN208035680U (en) * | 2018-02-07 | 2018-11-02 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate of resistance to hard foreign matter scratching |
| CN209616660U (en) * | 2019-01-28 | 2019-11-12 | 山东华菱电子股份有限公司 | A kind of thermal printing head heating base plate |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110091615A (en) * | 2019-05-10 | 2019-08-06 | 武汉晖印半导体有限公司 | A kind of the high-precision heater construction and its manufacturing process of film thermal printing head |
| CN111409376A (en) * | 2020-03-31 | 2020-07-14 | 湖南凯通电子有限公司 | Printing and manufacturing method for base glaze of heating substrate of thermal printing head |
| CN114434975A (en) * | 2020-10-30 | 2022-05-06 | 深圳市博思得科技发展有限公司 | Thermal print head and method for manufacturing the same |
| CN114434975B (en) * | 2020-10-30 | 2024-01-05 | 深圳市博思得科技发展有限公司 | Thermal print head and method for manufacturing the same |
| CN114368223A (en) * | 2021-01-26 | 2022-04-19 | 山东华菱电子股份有限公司 | Heating substrate for high-performance thermal printing head |
| CN114379237A (en) * | 2021-01-26 | 2022-04-22 | 山东华菱电子股份有限公司 | Heating substrate for high-performance thermal printing head |
| CN114379237B (en) * | 2021-01-26 | 2022-11-15 | 山东华菱电子股份有限公司 | Heating substrate for high-performance thermal printing head |
| CN114368223B (en) * | 2021-01-26 | 2022-11-15 | 山东华菱电子股份有限公司 | Heating substrate for high-performance thermal printing head |
| WO2023120093A1 (en) * | 2021-12-24 | 2023-06-29 | 京セラ株式会社 | Thermal head and thermal printer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109693451A (en) | A kind of thermal printing head heating base plate and its manufacturing method | |
| CN104716339B (en) | Fuel battery metal pole plate carbide and metal oxide composite coating and preparation | |
| CN104674153B (en) | Highly electrically conductive surfaces for electrochemical applications | |
| CN104423114B (en) | A kind of full-solid electrochromic multiple device and preparation method thereof | |
| US20070280847A1 (en) | Preparing and Operating a Vaporizer Body for a Pvd-Metallization System | |
| CN105316629A (en) | Super-hard nano-micron multilayer composite coating and preparation method thereof | |
| CN209616660U (en) | A kind of thermal printing head heating base plate | |
| CN108411296A (en) | A kind of preparation method of stratie | |
| CN107779829B (en) | The preparation method of MULTILAYER COMPOSITE high-temperature corrosion resistance coating based on high-temperature nickel-base alloy | |
| CN103966615A (en) | Pt Ni Al bonding layer doped with binary trace active elements and capable of being completely oxidation resisting at 1200 DEG C and preparation method thereof | |
| JP4178516B2 (en) | Cooker top plate | |
| CN110527962A (en) | A kind of compound heat controlled thin film of low stress wet-heat resisting and preparation method thereof | |
| JP2008132635A (en) | Thermal head | |
| JP2971167B2 (en) | Ceramic heater | |
| CN111954320B (en) | Method for manufacturing metal heating body | |
| CN219096312U (en) | Heating substrate for thermal print head | |
| CN111409376A (en) | Printing and manufacturing method for base glaze of heating substrate of thermal printing head | |
| CN106365637A (en) | C/h-BN composite evaporation boat used for film coating and manufacturing method thereof | |
| CN207619516U (en) | A kind of special microthin coating structure of the milling cutter of high-hardness antioxidation | |
| CN206433210U (en) | A kind of high-cooling property water heating ceramic heating element | |
| CN206851054U (en) | A kind of ceramic heating element with heat dissipating layer | |
| CN109207939A (en) | A kind of NiCrAlSi/CeO on gamma-TiAl alloy surface2Adulterate YSZ coating and preparation method thereof | |
| CN114368223B (en) | Heating substrate for high-performance thermal printing head | |
| CN205133727U (en) | Superhard micron multilayer composite biocoating that receives | |
| TWI683034B (en) | Thermal spray powder, thermal spray coating, coating, and roll in molten metal bath |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |