CN109690366B - Optical reflector, fingerprint identification module and mobile terminal - Google Patents

Optical reflector, fingerprint identification module and mobile terminal Download PDF

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Publication number
CN109690366B
CN109690366B CN201880002696.8A CN201880002696A CN109690366B CN 109690366 B CN109690366 B CN 109690366B CN 201880002696 A CN201880002696 A CN 201880002696A CN 109690366 B CN109690366 B CN 109690366B
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China
Prior art keywords
light
layer
base
screen
light reflecting
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CN109690366A (en
Inventor
冷寒剑
吴宝全
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Goodix Technology Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • G02B5/0808Mirrors having a single reflecting layer
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14Protective coatings, e.g. hard coatings
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1324Sensors therefor by using geometrical optics, e.g. using prisms

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)

Abstract

The application provides an optics reflector, fingerprint identification module, mobile terminal. The optical reflector includes: a base and a light reflecting portion; the base is used for being arranged on one side of the screen, the light reflecting part is connected with the base, and the light reflecting part is provided with a light reflecting surface parallel to the screen and used for reflecting a fingerprint image from the surface of the screen; the base is provided with a light-through cavity, the light-through cavity is provided with a first opening towards one side of the light reflecting portion, the first opening is provided with a supporting portion used for supporting the optical lens, one side, opposite to the plane where the light reflecting portion is located, of the light-through cavity is used for arranging a fingerprint detection chip, the light-through cavity is used for enabling a fingerprint image reflected by the light reflecting portion to irradiate to a sensing surface of the fingerprint detection chip through the optical lens, and the inner wall of the light-through cavity is a light absorption surface. The application provides an optical reflector, makes the fingerprint technique can use in the LCD screen under the screen.

Description

Optical reflector, fingerprint identification module and mobile terminal
Technical Field
The embodiment of the application relates to the fingerprint identification technology, especially relates to an optics reflector, fingerprint identification module, mobile terminal.
Background
With the advent of the full screen age of electronic devices such as mobile phones, the application of the fingerprint under the screen (also called light-sensitive screen fingerprint identification) technology is more and more extensive, and the optical fingerprint under the screen is the most popular. The principle of the finger print technology under the screen is as follows: when a finger touches the screen, light emitted by the screen penetrates through the surface of the screen to illuminate the fingerprint texture, and fingerprint reflection light penetrates through the screen to return to the sensor, so that a fingerprint image is finally formed for identification.
In particular, an image sensor is arranged in the OLED screen, and Light passes through the OLED screen by utilizing gaps among OLED sub-pixels, so that fingerprints are identified.
An external light source is needed for light emission in an existing LCD (Liquid Crystal Display) screen, and light of the external light source is reflected to the LCD screen, so that the finger print technology under the screen is difficult to apply to the LCD screen.
Disclosure of Invention
The application provides an optics reflector, fingerprint identification module, mobile terminal to solve among the prior art technical problem that the LCD screen can't use the fingerprint technique under the screen.
In a first aspect, the present application provides an optical reflector comprising: a base and a light reflecting portion;
the base is used for being arranged on one side of the screen, the light reflecting part is connected with the base, and the light reflecting part is provided with a light reflecting surface parallel to the screen and used for reflecting a fingerprint image from the surface of the screen;
the base is provided with a light-through cavity, the light-through cavity is provided with a first opening towards one side of the light reflecting portion, the first opening is provided with a supporting portion used for supporting the optical lens, one side, opposite to the plane where the light reflecting portion is located, of the light-through cavity is used for arranging a fingerprint detection chip, the light-through cavity is used for enabling a fingerprint image reflected by the light reflecting portion to irradiate to a sensing surface of the fingerprint detection chip through the optical lens, and the inner wall of the light-through cavity is a light absorption surface.
As an optional mode, in the optical reflector provided by the present application, a second opening is formed on a side of the light-passing cavity opposite to the plane where the light-reflecting portion is located, and the second opening is used for disposing a fingerprint detection chip.
As an alternative, the present application provides an optical reflector, in which the base is configured to be installed at a side of the screen or disposed adjacent to the side of the screen, and the top end of the base is a plane parallel to the light reflecting surface.
As an optional mode, the application provides an optics reflector, supporting part include the arrangement groove, have two relative settings on the arrangement groove and dodge the breach, dodge the breach and be used for dodging optical lens.
As an optional mode, in the optical reflector provided in the present application, the substrate layer and the reflective layer stacked on the substrate layer are disposed on the reflective portion.
As an optional mode, in the optical reflector provided in the present application, the light reflecting portion further includes a transparent protective layer, and the protective layer is located outside the light reflecting layer.
As an alternative, the present application provides an optical reflector, wherein the light reflecting portion extends below the bottom of the base and is connected to the bottom of the base.
In an alternative embodiment, the light reflector further includes a light absorbing layer at the bottom of the base.
As an alternative, in the optical reflector provided by the present application, the reflective layer and the base are located on the same side of the substrate layer.
As an alternative, in the optical reflector provided by the present application, an edge of the light reflecting layer is flush with an edge of one side of the base facing the light reflecting portion; alternatively, the light reflecting layer extends to below the bottom of the base.
As an optional mode, the optical reflector provided by the present application, the light reflecting layer extends to below the bottom of the base, and the light reflecting layer and the light absorbing layer are located on different layers, and the protective layer is located between the light reflecting layer and the light absorbing layer.
As an alternative, in the optical reflector provided by the present application, the reflective layer and the base are respectively located on two opposite sides of the substrate layer.
In an alternative embodiment, the present application provides an optical reflector, wherein the light absorbing layer is located between the substrate layer and the base.
In an alternative embodiment, the protective layer of the optical reflector provided by the present application is made of silicon dioxide, silicon nitride, or an organic paint.
In an alternative embodiment, the light absorbing layer of the optical reflector provided in the present application is made of an organic glue or an inorganic paint.
The second aspect, the application provides a fingerprint identification module, including fingerprint identification chip, optical lens and foretell optics reflector, fingerprint identification chip and optical lens all are located the logical light intracavity of optics reflector.
As an optional mode, the fingerprint identification module that this application provided still includes the light source, and the light source setting is in the side of screen for the fingerprint of the fingerprint identification area on the screen illuminates.
In a third aspect, the present application provides a mobile terminal, including the fingerprint identification module described above.
According to the optical reflector, the fingerprint identification module and the mobile terminal, the optical reflector is provided with the reflecting part, the reflecting part is provided with the reflecting surface parallel to the screen, and the fingerprint image from the surface of the screen is reflected through the reflecting surface; the setting is seted up the base that leads to the light chamber, leads to the light chamber and has first opening towards one side of reflection of light portion, sets up the supporting part that is used for supporting optical lens on the first opening, and the fingerprint image of reflection shines to leading to the light intracavity through first opening and optical lens to shine to leading to on the sensing face of the fingerprint detection chip on the light chamber, finally form fingerprint image and discern, make the screen finger print technique down can use in the LCD screen.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of an optical reflector according to an embodiment of the present disclosure;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic view illustrating an application state of an optical reflector according to an embodiment of the present disclosure;
FIG. 4 is a first schematic view illustrating positions of a base and a light-reflecting portion of an optical reflector according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram illustrating a second position of the base and the light reflecting portion in the optical reflector according to an embodiment of the present disclosure;
FIG. 6 is a third schematic view illustrating the positions of the base and the light-reflecting portion of the optical reflector according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;
fig. 9 is a flowchart of a method for packaging a reflector according to an embodiment of the present disclosure.
Description of reference numerals:
100-a base; 101-a light-transmitting cavity; 102 — a first opening; 103-a support; 1031-avoiding the notch; 104-light absorption surface; 105 — a second opening; 200-a light-reflecting portion; 201-a light reflecting surface; 202-a substrate layer; 203-a light reflecting layer; 204-protective layer; 205-light absorbing layer; 300-screen; 400-an optical lens; 500-fingerprint detection chip; 600-fingerprint identification module; 700 — an optical reflector; 800-a light source; 900 — mobile terminal.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," "third," and "fourth," if any, in the description and claims of this application and the above-described figures are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The light emitting principle of the LCD screen is as follows: the liquid crystal material is filled between two parallel plates, the arrangement state of internal molecules of the liquid crystal material is changed by means of voltage so as to attain the goal of shading light and transmitting light, and can display the image with different depth and uniform arrangement, and between two flat plates a filter layer with three-component colour is added, so that it can implement display of colour image.
The LCD screen needs an external light source, and the back of the LCD screen needs to have a reflector to reflect the light of the external light source to the surface of the screen. The principle of the finger print technology under the screen is as follows: when a finger touches the screen, light emitted by the screen penetrates through the surface of the screen to illuminate the fingerprint texture, and fingerprint reflection light penetrates through the screen to return to the sensor, so that a fingerprint image is finally formed for identification. Therefore, the underscreen fingerprint technique is difficult to apply in LCD screens.
Therefore, the present application provides an optical reflector, which aims to solve the above technical problems in the prior art.
The optical reflector provided by the embodiments of the present application will be described in detail with reference to several examples.
FIG. 1 is a schematic structural diagram of an optical reflector according to an embodiment of the present disclosure; FIG. 2 is a top view of FIG. 1; fig. 3 is a schematic view illustrating a usage state of an optical reflector according to an embodiment of the present disclosure. As shown in fig. 1 to 3, the present embodiment provides an optical reflector 700, including: a base 100 and a light reflecting portion 200;
the base 100 is for being placed at one side of the screen 300, the reflection part 200 is connected with the base 100, and the reflection part 200 has a reflection surface 201 parallel to the screen 300 for reflecting a fingerprint image from the surface of the screen 300;
it should be understood that fig. 3 is only a schematic illustration, and in a specific embodiment, the base 100 related to the present application is installed on one side of the screen 300, and actually may mean that the base 100 is specifically located at a side or below the screen 300, or is disposed adjacent to the side of the screen 300. For example, the thickness of the screen 300 is generally larger than that of the base, and the base 100 is installed at a position where one side of the screen 300 is biased toward the bottom, i.e., a position laterally below. In other alternative embodiments, the base 100 may also be mounted below the screen 300, such as at an edge location below the screen 300.
The base 100 is provided with a light-transmitting cavity 101, one side of the light-transmitting cavity 101 facing the light-reflecting portion 200 is provided with a first opening 102, the first opening 102 is provided with a supporting portion 103 for supporting the optical lens 400, one side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting portion 200 is located is used for arranging the fingerprint detection chip 500, the light-transmitting cavity 101 is used for enabling a fingerprint image reflected by the light-reflecting portion 200 to irradiate to a sensing surface of the fingerprint detection chip 500 through the optical lens 400, and the inner wall of the light-transmitting cavity 101 is a light-absorbing surface 104.
Specifically, the reflector 200 and the base 100 are mounted on the side of the screen 300 of the LCD panel, the reflective surface 201 of the reflector 200 connected to the base 100 is parallel to the screen 300, the reflector 200 abuts against the side of the screen 300, and the reflector 200 is positioned between the base 100 and the side of the screen 300. The light reflection part 200 may be installed above a light source for illuminating a fingerprint recognition area on the screen 300. A first opening 102 is formed in one side, facing the light reflecting portion 200, of the light transmitting cavity 101, a supporting portion 103 for supporting the optical lens 400 is arranged on the first opening 102, the optical lens 400 is supported through the supporting portion 103, and the fingerprint detection chip 500 is mounted on one side, opposite to the plane where the light reflecting portion 200 is located, of the light transmitting cavity 101.
Specifically, the first opening 102 may be rectangular, circular, oval or irregular in shape, as long as the first opening 102 can transmit light, and the embodiment is not limited herein. The supporting portion 103 is used for supporting the optical lens 400, and a supporting surface of the supporting portion 103 can be matched with an outer side of the optical lens 400, so that the optical lens 400 can be stably supported on the supporting portion 103. The side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting part 200 is located is used for arranging the fingerprint detection chip 500, and the fingerprint detection chip 500 can be arranged on the inner side wall of the light-transmitting cavity 101, so that a fingerprint image entering the light-transmitting cavity 101 can be timely irradiated onto the sensing surface of the fingerprint detection chip 500 on the light-transmitting cavity 101; the side of the light-transmitting cavity 101 opposite to the plane of the light-reflecting portion 200 may be a light-transmitting surface, and the fingerprint detection chip 500 may be disposed outside the light-transmitting surface, so that the fingerprint detection chip 500 may be conveniently mounted.
When a finger touches the screen 300, light of an external light source of the LCD screen is reflected to the surface of the screen 300 and penetrates through the surface of the screen 300 to illuminate the fingerprint texture of the fingerprint identification area, or an independent light source is arranged on the side of the LCD screen, light of the independent light source is reflected to the surface of the screen 300, a fingerprint image from the surface of the screen 300 is reflected to the first opening 102 through the light reflecting surface 201 of the light reflecting part 200, and is irradiated into the light passing cavity 101 through the optical lens 400 supported by the supporting part 103 at the first opening 102 and is irradiated onto the sensing surface of the fingerprint detection chip 500 on the light passing cavity 101, and finally a fingerprint image is formed for identification, so that the finger print technology under the screen can be applied to the LCD screen.
In the present embodiment, a light reflecting portion 200 is provided, the light reflecting portion 200 having a light reflecting surface 201 parallel to the screen 300, and the fingerprint image from the surface of the screen 300 is reflected by the light reflecting surface 201; the setting is seted up and is passed through base 100 of optical cavity 101, it has first opening 102 to pass through optical cavity 101 towards one side of reflective portion 200, set up the supporting part 103 that is used for supporting optical lens 400 on the first opening 102, the fingerprint image of reflection shines to passing through in the optical cavity 101 through first opening 102 and optical lens 400, and shine to passing through on the sensing face of fingerprint detection chip 500 on the optical cavity 101, finally form fingerprint image and discern, make the fingerprint technique under the screen can use in the LCD screen. The light absorbing surface 104 reduces the interference of light noise by providing the light absorbing surface 104 on the inner wall surface of the light passing cavity 101.
In a specific implementation mode, the side of the light-transmitting cavity 101 opposite to the plane of the light reflecting portion 200 is provided with a second opening 105, and the second opening 105 is used for arranging the fingerprint detection chip 500. By providing the second opening 105 in the light passing cavity 101, the fingerprint detection chip 500 is easy to install. In a specific implementation, the fingerprint detection chip 500 can be directly covered and fixed on the second opening 105 so as to mount the fingerprint detection chip 500; the second opening 105 may also be a step-shaped opening, the grain detection chip 500 is embedded and fixed on the step surface of the second opening 105, and the upper surface of the grain detection chip 500 is flush with the upper surface of the second opening 105, so that the grain detection chip 500 is not easy to fall off. The fixing manner of the streak detection chip 500 and the second opening 105 may be bonding, or other types of connection manners, which is not described herein again.
Optionally, the base 100 is configured to be mounted on a side of the screen 300 or disposed adjacent to the side of the screen 300, and a top end of the base 100 is a plane parallel to the light reflecting surface 201. In a specific implementation, the top end of the base 100 may be used to mount the fingerprint detection chip 500, that is, the fingerprint detection chip 500 is parallel to the light-reflecting surface 201, so that the fingerprint image reflected by the light-reflecting surface 201 is irradiated into the light-passing cavity 101 through the first opening 102 and the optical lens 400, and can be irradiated onto the sensing surface of the fingerprint detection chip 500 on the light-passing cavity 101. In a specific implementation, the top end of the base 100 may be flush with the light reflecting surface 201, and the top end of the base 100 may be higher or lower than the light reflecting surface 201, which is not limited herein.
The supporting portion 103 is used to support the optical lens 400, so that the supporting portion 103 can stably support the optical lens 400. In a specific implementation manner, the supporting portion 103 includes a placement groove, and the placement groove has two avoidance notches 1031 oppositely arranged, and the avoidance notches 1031 are used for avoiding the optical lens 400. Specifically, the shape of the avoiding notch 1031 may be set according to the outer side surface of the optical lens 400, for example, the avoiding notch 1031 may be matched with the outer side surface of the optical lens 400, so that the optical lens 400 is embedded into the supporting portion 103, so that the supporting portion 103 can stably support the optical lens 400.
FIG. 4 is a first schematic view illustrating positions of a base and a light-reflecting portion of an optical reflector according to an embodiment of the present disclosure; fig. 5 is a schematic diagram illustrating a second position of the base and the light reflecting portion in the optical reflector according to an embodiment of the present disclosure; fig. 6 is a third schematic view illustrating positions of the base and the light reflecting portion in an optical reflector according to an embodiment of the present disclosure. As shown in fig. 4 to 6, in the optical reflector 700 according to the present embodiment, the substrate layer 202 and the reflective layer 203 laminated on the substrate layer 202 are disposed on the reflective portion 200. That is, the light reflecting portion 200 is divided into two layers, the first layer is a substrate layer 202, a light reflecting layer 203 is laminated on the substrate layer 202 to form the light reflecting portion 200, the substrate layer 202 is used for supporting the light reflecting layer 203, and the light reflecting layer 203 is used for reflecting light. The light-reflecting surface 201 may serve as the light-reflecting layer 203.
Specifically, the substrate layer 202 may be opaque or transparent. The material of the substrate layer 202 may be a silicon wafer, glass, a metal plate, ceramic, or an organic material, the shape of the substrate layer 202 is not limited, the thickness of the substrate layer 202 is hundreds of microns, for example, the thickness of the substrate layer 202 is 200 microns. The reflective layer 203 may be formed on the substrate layer 202 by sputtering, evaporation, printing, silver plating, or other processes. The material of the reflective layer 203 may be a mirror reflective material such as aluminum, silver, etc., and the embodiment is not limited thereto. The thickness of the light-reflecting layer 203 is typically in the order of a few microns, for example the thickness of the light-reflecting layer 203 is 0.2 um.
In order to protect the reflective layer 203, the reflective portion 200 further includes a transparent protective layer 204, and the protective layer 204 is located outside the reflective layer 203. The protective layer 204 is used to protect the reflective layer 203 from damage.
Optionally, the material of the protection layer 204 is silicon dioxide, silicon nitride or organic paint.
Specifically, the protective layer 204 may be formed on the outer side of the reflective layer 203 by chemical vapor deposition, glue coating, printing, or the like. The thickness of the protective layer 204 is typically in the order of microns, such as 1um for the protective layer 204.
Optionally, the light reflecting part 200 extends to below the bottom of the base 100 and is connected with the bottom of the base 100. That is, the connection position of the light reflecting portion 200 and the base 100 is the bottom of the base 100. Specifically, the light reflecting portion 200 has three layers, which are a substrate layer 202, a light reflecting layer 203 stacked on the substrate layer 202, and a protective layer 204 outside the light reflecting layer 203, and the base 100 may be connected to the substrate layer 202, the light reflecting layer 203, or the protective layer 204.
In particular implementations, the light reflecting portion 200 also has a light absorbing layer 205, the light absorbing layer 205 being located at the bottom of the base 100. When the light-reflecting portion 200 is connected to the bottom of the base 100, if the light-passing cavity 101 of the base 100 is connected to the bottom of the base 100, the light-absorbing layer 205 is formed on the light-reflecting portion 200, and the light-absorbing layer 205 is located at the bottom of the base 100, so that light can be absorbed in the region of the light-passing cavity 101, and interference of light noise in the light-passing cavity 101 can be reduced.
Optionally, the light absorbing layer 205 is made of organic glue or inorganic paint. The light absorbing layer 205 is manufactured by processing methods such as gluing, silk printing, chrome plating, anode and the like.
Since the light reflecting portion 200 has the substrate layer 202, the light reflecting layer 203, the protective layer 204, and the light absorbing layer 205, the relative position between the light reflecting portion 200 and the base 100 may have various forms, and the various relative positions between the light reflecting portion 200 and the base 100 will be described in detail below.
As shown in fig. 4, the first relative position between the light reflecting portion 200 and the base 100 is specifically:
the light reflecting layer 203 and the base 100 are located on the same side of the base layer 202, the light reflecting layer 203 extends to the bottom lower portion of the base 100, specifically, the base layer 202, the light reflecting layer 203 and the protective layer 204 are sequentially stacked, the light absorbing layer 205 is arranged above the protective layer 204, the light absorbing layer 205 is located at the bottom of the base 100, that is, the light absorbing layer 205 is located between the bottom of the base 100 and the protective layer 204, the light absorbing layer 205 and the light reflecting layer 203 are arranged in different layers, and the protective layer 204 is located between the light reflecting layer 203 and the light absorbing layer 205. Thus, the base layer 202, the light reflecting layer 203, the protective layer 204, the light absorbing layer 205, and the base 100 are formed in this order. The manufacturing process is simple and the manufacturing precision is high.
As shown in fig. 5, the second relative position between the light reflecting portion 200 and the base 100 is specifically as follows:
the light reflecting layer 203 and the base 100 are located on the same side of the substrate layer 202, the edge of the light reflecting layer 203 is flush with the edge of one side of the base 100 facing the light reflecting portion 200, specifically, the light absorbing layer 205 and the light reflecting layer 203 are arranged between the substrate layer 202 and the protective layer 204, and the light absorbing layer 205 and the light reflecting layer 203 are arranged on the same layer. In the manufacturing, the light absorbing layer 205 and the light reflecting layer 203 are formed on the same layer on the base material layer 202, the protective layer 204 is formed on the light absorbing layer 205 and the light reflecting layer 203, and the base 100 is formed on the protective layer 204 at a portion opposite to the light absorbing layer 205. Thus, the light absorbing layer 205 and the light reflecting layer 203 are provided in the same layer, which reduces the cost.
As shown in fig. 6, the third relative position between the light reflecting portion 200 and the base 100 is specifically as follows:
the light reflecting layer 203 and the base 100 are respectively positioned at two opposite sides of the substrate layer 202, the light absorbing layer 205 is positioned between the substrate layer 202 and the base 100, and the light reflecting layer 203 is positioned between the base 100 and the protective layer 204. In the production, the light reflecting layer 203 and the protective layer 204 are sequentially stacked on one side surface of the base material layer 202, and the light absorbing layer 205 and the base 100 are sequentially stacked on the opposite side surface of the base material layer 202.
Fig. 7 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present application. As shown in fig. 7, on the basis of the foregoing embodiments, the present embodiment further provides a fingerprint identification module 600, which includes a fingerprint identification chip 500, an optical lens 400, and the optical reflector 700 provided in the foregoing embodiments, where the fingerprint identification chip 500 and the optical lens 400 are both located in the light-passing cavity 101 of the optical reflector 700.
The structure and the operation principle of the optical reflector 700 are described in detail in the above embodiments, and are not described herein again.
Optionally, the fingerprint identification module 600 that this embodiment provided still includes light source 800, and light source 800 sets up the side at screen 300 for illuminate the regional fingerprint of fingerprint identification on the screen 300. Specifically, the light source 800 is located below the light reflecting portion 200.
Specifically, the light reflecting portion 200 of the optical reflector 700 and the base 100 are mounted on the side of the screen 300 of the LCD panel, the light reflecting surface 201 of the light reflecting portion 200 connected to the base 100 is parallel to the screen 300, the light reflecting portion 200 abuts against the side of the screen 300, and the light reflecting portion 200 is located between the base 100 and the side of the screen 300. A first opening 102 is formed in one side, facing the light reflecting portion 200, of the light transmitting cavity 101, a supporting portion 103 for supporting the optical lens 400 is arranged on the first opening 102, the optical lens 400 is supported through the supporting portion 103, and the fingerprint detection chip 500 is mounted on one side, opposite to the plane where the light reflecting portion 200 is located, of the light transmitting cavity 101.
The direction of the arrow in fig. 7 shows the direction of the light path, specifically, the light source 800 illuminates the fingerprint of the fingerprint identification area on the screen 300, the fingerprint image from the surface of the screen 300 is reflected to the first opening 102 by the light reflecting surface 201 of the light reflecting portion 200, and is irradiated into the light passing cavity 101 through the optical lens 400 supported by the supporting portion 103 at the first opening 102, and is irradiated onto the sensing surface of the fingerprint detection chip 500 on the light passing cavity 101, and finally the fingerprint image is formed for identification.
The light path in fig. 7 is more precisely oriented by providing a separate light source 800 to illuminate the fingerprint of the fingerprint identification area on the screen 300.
Fig. 8 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application. As shown in fig. 8, on the basis of the foregoing embodiments, the present embodiment provides a mobile terminal 900, which includes the fingerprint identification module 600.
The structure and the working principle of the fingerprint identification module 600 are described in detail in the above embodiments, and are not described herein again.
In this embodiment, the mobile terminal 900 may be any product or component having a display function, such as a liquid crystal panel, electronic paper, an Organic Light-Emitting Diode (OLED) panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a wearable device, or a home appliance device.
Fig. 9 is a flowchart of a method for packaging a reflector according to an embodiment of the present disclosure. As shown in fig. 9. On the basis of the above embodiments, the present embodiment provides an optical reflector packaging method.
Specifically, the method comprises the following steps:
and S101, respectively arranging a light reflecting layer 203 and a light absorbing layer 205 on a substrate layer 202, wherein at least part of the light reflecting layer 203 forms a light reflecting surface 201 for reflecting a fingerprint image from the surface of the screen 300.
Specifically, the light reflecting layer 203 and the light absorbing layer 205 may be located on the same side of the substrate layer 202, and further, the light reflecting layer 203 and the light absorbing layer 205 may be disposed on the same layer or different layers. The light reflecting layer 203 and the light absorbing layer 205 may be disposed on opposite sides of the substrate layer 202, as long as at least a portion of the light reflecting layer 203 forms the light reflecting surface 201 for reflecting a fingerprint image from the surface of the screen 300, and the embodiment is not limited thereto.
S102, a base 100 is arranged at the position, provided with the light absorption layer 202, of the base layer 202, a light passing cavity 101 is formed in the base 100, the light passing cavity 101 is used for enabling a fingerprint image to irradiate the sensing surface of the fingerprint detection chip 500, and the inner wall of the light passing cavity 101 is a light absorption surface 104.
In a specific implementation, a support layer is disposed on the substrate layer 202, and the base 100 is formed in the support layer.
Specifically, the base 100 is formed in a support layer, and specifically includes:
the support layer is processed to form the base 100, the processing including any one or more of the following: pasting, bonding, injection molding and stamping.
Optionally, in the optical reflector packaging method provided in this embodiment, after the light reflecting layer 203 is formed on the substrate layer 202, the method further includes:
a protective layer 204 is provided on the light-reflecting layer 203. By providing the protective layer 204, the protective layer 204 is used to protect the reflective layer 203 and prevent the reflective layer 203 from being damaged.
Optionally, the method for encapsulating an optical reflector provided in this embodiment further includes, after forming the base 100 in the supporting layer,
a light absorbing layer 205 is provided on the inner wall of the light passing cavity 101.
The optical reflector packaging method provided by the present embodiment will be described in detail with reference to three relative positions between the light reflecting portion 200 and the base 100 in fig. 4-6.
The method of packaging the optical reflector 700 in the first relative position between the reflector 200 and the base 100 of FIG. 4 may include:
and S201, arranging a light reflecting layer 203 on the base material layer 202.
Specifically, the material of the substrate layer 202 may be a silicon wafer, glass, a metal plate, ceramic, or an organic material, and the shape of the substrate layer 202 is not limited. The substrate layer 202 is processed to a desired thickness, the thickness of the substrate layer 202 is in the order of hundreds of microns, for example, the thickness of the substrate layer 202 is 200 microns.
The reflective layer 203 is fabricated on the surface of the substrate layer 202 by sputtering, evaporation, printing, silver deposition, high-doping aluminum sputtering, or other processing methods. The specific processing parameters of the processing modes such as sputtering, evaporation, printing, deposition silver plating, etc. may be the same as those of the existing processing modes, and the embodiment is not limited herein.
The reflective layer 203 may be made of a specular reflective material such as aluminum or silver, which is not limited herein. The thickness of the light-reflecting layer 203 is typically in the order of a few microns, for example the thickness of the light-reflecting layer 203 is 0.2 um.
And S202, arranging a protective layer 204 on the light reflecting layer 203.
Specifically, the material of the protection layer 204 is silicon dioxide, silicon nitride, or organic paint. The protective layer 204 is manufactured on the surface of the reflective layer 203 by processing methods such as chemical vapor deposition, glue coating, printing, and the like, wherein specific processing parameters of the processing methods such as chemical vapor deposition, glue coating, printing, and the like are the same as those of the existing methods, and the embodiment is not limited herein. The thickness of the protective layer 204 is typically in the order of microns, such as 1um for the protective layer 204. The protective layer 204 is used to protect the reflective layer 203 from damage. The protection layer 204 is not required to be disposed, and the protection layer 204 can be eliminated when the reflective layer 203 is formed by silver deposition or high-dopant aluminum sputtering.
S203, a light absorbing layer 205 is provided on the protective layer 204.
Specifically, the light absorbing layer 205 may be made of a light absorbing material such as an organic glue or an inorganic paint. The light absorbing layer 205 is manufactured on the surface of the protective layer 204 by processes of gluing, silk-screen printing, chrome plating, anodic deposition, etc., wherein specific process parameters of the processes of gluing, silk-screen printing, chrome plating, anodic deposition, etc. may be the same as those of the prior art, and the embodiment is not limited herein. The area of the light absorbing layer 205 is larger than that of the protective layer 204, i.e., the area of the protective layer 204 (the area of the light reflecting layer 203) is larger than that of the light absorbing layer 205, so that at least part of the light reflecting layer 203 forms the light reflecting surface 201 for reflecting the fingerprint image from the surface of the screen 300. The light absorbing layer 205 can be formed by exposure and development or dry and wet etching, and the specific processing method, position, shape and size of the light absorbing layer 205 can be set according to actual needs, and the embodiment is not limited herein.
S204, the base 100 is disposed on the light absorbing layer 205.
Specifically, the base 100 is fabricated on the surface of the light absorbing layer 205 by processing methods such as bonding, injection molding, and stamping. The structure of the base 100 of the present embodiment may be: the base 100 is provided with a light-transmitting cavity 101, one side of the light-transmitting cavity 101 facing the light-reflecting portion 200 is provided with a first opening 102, the first opening 102 is provided with a supporting portion 103 for supporting the optical lens 400, one side of the light-transmitting cavity 101 opposite to the plane where the light-reflecting portion 200 is located is used for arranging the fingerprint detection chip 500, the light-transmitting cavity 101 is used for enabling a fingerprint image reflected by the light-reflecting portion 200 to irradiate to a sensing surface of the fingerprint detection chip 500 through the optical lens 400, and the inner wall of the light-transmitting cavity 101 is a light-absorbing surface 104. The absorption coefficient of the light absorbing surface 104 is not limited, and the thickness of the light absorbing surface 104 is typically in the order of micrometers, such as 20 um.
The material of the base 100 may be any solid material such as organic glue, plastic particles, metal, etc., and the embodiment is not limited thereto. The position and shape of the base 100 are designed according to the design requirement of the optical path in fig. 7, and the embodiment is not limited herein.
The method of packaging the optical reflector 700 in the second relative position between the reflector 200 and the base 100 of FIG. 5 may include:
and S301, arranging a light reflecting layer 203 and a light absorbing layer 205 on the base material layer 202.
S302, the protective layer 204 is provided on the light absorbing layer 205.
S304, the base 100 is disposed on the protective layer 204.
Specifically, in the present embodiment, the light reflecting layer 203 and the light absorbing layer 205 are disposed on the same layer, and the remaining packaging method is the same as the embodiment of the packaging method of the optical reflector 700 in the first relative position between the light reflecting portion 200 and the base 100, which is not repeated herein.
The method of packaging the optical reflector 700 in the third relative position between the reflector 200 and the base 100 of FIG. 6 may include:
s401, arranging a light reflecting layer 203 on one side of the base material layer 202;
s402, arranging a protective layer 204 on the reflective layer 203;
s403, arranging a light absorbing layer 205 on the opposite side of the substrate layer 202, which is provided with the light reflecting layer 203;
s404, the base 100 is disposed on the light absorbing layer 205.
Specifically, in the present embodiment, the light reflecting layer 203 and the light absorbing layer 205 are respectively located on two opposite sides of the substrate layer 202, and the remaining packaging method is the same as the above-mentioned embodiment of the packaging method of the optical reflector 700 at the first opposite position between the light reflecting portion 200 and the base 100, which is not repeated herein.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (15)

1. An optical reflector, comprising: a base and a light reflecting portion;
the base is used for being arranged on one side of the screen, the light reflecting part is connected with the base, the light reflecting part is provided with a light reflecting surface parallel to the screen and used for reflecting a fingerprint image from the surface of the screen, the light reflecting part is provided with a base material layer and a light reflecting layer which is laminated with the base material layer, the outer side of the light reflecting layer is provided with a transparent protective layer, the light reflecting part is also provided with a light absorbing layer, and the light absorbing layer is positioned at the bottom of the base;
the utility model discloses a fingerprint detection device, including reflection portion, light cavity, light transmission portion, optical lens, sensing face, light cavity.
2. The optical reflector according to claim 1, wherein a side of the light-passing cavity opposite to the plane of the light-reflecting portion has a second opening for disposing the fingerprint detection chip.
3. The optical reflector of claim 2, wherein the base is adapted to be mounted on or adjacent to a side of the screen, and the top of the base is a plane parallel to the reflective surface.
4. The optical reflector according to claim 1, wherein the supporting portion comprises a placement groove, the placement groove has two avoidance gaps oppositely disposed thereon, and the avoidance gaps are used for avoiding the optical lens.
5. The optical reflector of claim 1, wherein the light reflecting portion extends below and connects to the bottom of the base.
6. The optical reflector of claim 5, wherein the light-reflecting layer and the base are on the same side of the substrate layer.
7. The optical reflector of claim 6 wherein the edge of the light-reflecting layer is flush with a side edge of the base facing the light-reflecting portion; alternatively, the light reflecting layer extends to below the bottom of the base.
8. The optical reflector of claim 6, wherein the light reflecting layer extends below the bottom of the base, and the light reflecting layer and the light absorbing layer are on different layers, the protective layer being between the light reflecting layer and the light absorbing layer.
9. The optical reflector of claim 5, wherein the light-reflecting layer and the base are on opposite sides of the substrate layer.
10. The optical reflector of claim 9, wherein the light absorbing layer is positioned between the substrate layer and the base.
11. The optical reflector according to any one of claims 1-10, wherein the material of the protective layer is silicon dioxide, silicon nitride or an organic paint.
12. The optical reflector of any one of claims 1-10, wherein the light absorbing layer is made of an organic glue or an inorganic paint.
13. A fingerprint identification module comprising a fingerprint identification chip, an optical lens and the optical reflector of any one of claims 1-12, wherein the fingerprint identification chip and the optical lens are both located in a light-passing cavity of the optical reflector.
14. The fingerprint identification module of claim 13, further comprising a light source disposed on a side of the screen for illuminating a fingerprint of the fingerprint identification area on the screen.
15. A mobile terminal characterized by comprising the fingerprint recognition module of claim 13 or 14.
CN201880002696.8A 2018-12-04 2018-12-04 Optical reflector, fingerprint identification module and mobile terminal Active CN109690366B (en)

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CN209543373U (en) * 2018-12-04 2019-10-25 深圳市汇顶科技股份有限公司 Optic reflector, fingerprint recognition mould group and mobile terminal

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