CN109690366A - Optic reflector, fingerprint recognition mould group, mobile terminal and reflector packaging method - Google Patents

Optic reflector, fingerprint recognition mould group, mobile terminal and reflector packaging method Download PDF

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Publication number
CN109690366A
CN109690366A CN201880002696.8A CN201880002696A CN109690366A CN 109690366 A CN109690366 A CN 109690366A CN 201880002696 A CN201880002696 A CN 201880002696A CN 109690366 A CN109690366 A CN 109690366A
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CN
China
Prior art keywords
light
pedestal
layer
reflecting portion
characterized
Prior art date
Application number
CN201880002696.8A
Other languages
Chinese (zh)
Inventor
冷寒剑
吴宝全
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN2018119033 priority Critical
Publication of CN109690366A publication Critical patent/CN109690366A/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/08Mirrors
    • G02B5/0808Mirrors having a single reflecting layer
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14Protective coatings, e.g. hard coatings
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/00006Acquiring or recognising fingerprints or palmprints
    • G06K9/00013Image acquisition
    • G06K9/00046Image acquisition by using geometrical optics, e.g. using prisms

Abstract

The application provides a kind of optic reflector, fingerprint recognition mould group, mobile terminal and reflector packaging method.Optic reflector includes: pedestal and light-reflecting portion;Pedestal is used to be placed in the side of screen, and light-reflecting portion is connected with pedestal, and light-reflecting portion has the reflective surface parallel with screen, with the fingerprint image for reflecting the surface from screen;Light passing chamber is offered on pedestal, light passing chamber has the first opening towards the side of light-reflecting portion, and first opening on be provided with the support portion for being used to support optical lens, the side opposite with plane where light-reflecting portion of light passing chamber is for being arranged fingerprint detection chip, the fingerprint image that light passing chamber is used to that light-reflecting portion to be made to reflect exposes to the sensing face of fingerprint detection chip via optical lens, and the inner wall of light passing chamber is extinction face.Optic reflector provided by the present application enables to shield lower fingerprint technique and apply in LCD screen.

Description

Optic reflector, fingerprint recognition mould group, mobile terminal and reflector packaging method

Technical field

The invention relates to fingerprint identification technology more particularly to a kind of optic reflectors, fingerprint recognition mould group, movement Terminal and reflector packaging method.

Background technique

As the electronic devices such as mobile phone shield the arrival in epoch comprehensively, shield lower fingerprint (also referred to as light sensation screen fingerprint recognition) technology Using more and more extensive, wherein the most universal with fingerprint under optical profile type screen.Shield the principle of lower fingerprint technique are as follows: when finger contacts When screen, the light that screen issues penetrates screen surface and illuminates fingerprint texture, and fingerprint reflection light penetrates screen and returns to sensing Device ultimately forms fingerprint image to be identified.

((Organic Light Emitting Display, organic light emitting display) shields interior self-luminous to OLED, and screen is thick Spend thin, and full screen structure is translucent material.Therefore, shield lower fingerprint technique in the prior art and be mainly used in OLED screen. Specifically, imaging sensor is arranged in OLED screen, light is allowed to be perforated through OLED screen curtain using gap between OLED subpixel, into And identify fingerprint.

Shining in existing LCD (Liquid Crystal Display, liquid crystal display) screen needs external light source, will be external The light of light source is reflected towards LCD screen, therefore, shields lower fingerprint technique and is difficult to apply in LCD screen.

Summary of the invention

The application provides a kind of optic reflector, fingerprint recognition mould group, mobile terminal and reflector packaging method, to solve The technical issues of LCD screen can not be using lower fingerprint technique be shielded in the prior art.

In a first aspect, the application provides a kind of optic reflector, comprising: pedestal and light-reflecting portion;

Pedestal is used to be placed in the side of screen, and light-reflecting portion connect with pedestal, and light-reflecting portion is with parallel with screen anti- Smooth surface, with the fingerprint image for reflecting the surface from screen;

Light passing chamber is offered on pedestal, light passing chamber has the first opening towards the side of light-reflecting portion, and sets in the first opening It is equipped with the support portion for being used to support optical lens, the side opposite with plane where light-reflecting portion of light passing chamber is for being arranged fingerprint inspection Chip is surveyed, the fingerprint image that light passing chamber is used to that light-reflecting portion to be made to reflect exposes to the sensing face of fingerprint detection chip via optical lens On, the inner wall of light passing chamber is extinction face.

As a kind of optional mode, optic reflector provided by the present application, light passing chamber with plane phase where light-reflecting portion Pair side have second opening, second opening for fingerprint detection chip to be arranged.

As a kind of optional mode, optic reflector provided by the present application, pedestal be used to be mounted on screen side or The side of person's adjacent screen is arranged, and the top of pedestal is the plane parallel with reflective surface.

As a kind of optional mode, optic reflector provided by the present application, support portion includes resettlement groove, is had on resettlement groove There are two evacuation notches being oppositely arranged, evacuation notch is for avoiding optical lens.

As a kind of optional mode, optic reflector provided by the present application, be provided in light-reflecting portion substrate layer and with The reflective layer that substrate layer is stacked.

As a kind of optional mode, optic reflector provided by the present application, light-reflecting portion further includes transparent protective layer, is protected Sheath is located on the outside of reflective layer.

As a kind of optional mode, optic reflector provided by the present application, light-reflecting portion extends to the bottom part down of pedestal, And it is connect with the bottom of pedestal.

As a kind of optional mode, optic reflector provided by the present application, light-reflecting portion also has light-absorption layer, and light-absorption layer is located at The bottom of pedestal.

As a kind of optional mode, optic reflector provided by the present application, reflective layer and pedestal are located at the same of substrate layer Side.

As a kind of optional mode, optic reflector provided by the present application, the edge of reflective layer and the direction of pedestal are anti- The one side edge in light portion flushes;Alternatively, reflective layer extends to the bottom part down of pedestal.

As a kind of optional mode, optic reflector provided by the present application, reflective layer extends to the bottom part down of pedestal, And reflective layer and light-absorption layer are located at different layers, protective layer is between reflective layer and light-absorption layer.

As a kind of optional mode, optic reflector provided by the present application, reflective layer and pedestal are located at substrate layer Opposite two sides.

As a kind of optional mode, optic reflector provided by the present application, light-absorption layer is between substrate layer and pedestal.

As a kind of optional mode, optic reflector provided by the present application, protective layer is located on the outside of reflective layer.

As a kind of optional mode, optic reflector provided by the present application, the material of protective layer is silica, nitridation Silicon or organic coating.

As a kind of optional mode, optic reflector provided by the present application, the material of light-absorption layer is organic gel or inorganic Coating.

Second aspect, the application provide a kind of fingerprint recognition mould group, including fingerprint recognition chip, optical lens and above-mentioned The light passing that optic reflector, fingerprint recognition chip and optical lens are respectively positioned on optic reflector is intracavitary.

As a kind of optional mode, fingerprint recognition mould group provided by the present application further includes light source, and light source is arranged in screen Side, the fingerprint of the fingerprint identification region on screen illuminating.

The third aspect, the application provide a kind of mobile terminal, including above-mentioned fingerprint recognition mould group.

Fourth aspect, the application provide a kind of optic reflector packaging method, comprising:

Reflective layer and light-absorption layer are respectively set on substrate layer, at least partly reflective layer is formed for reflecting from screen The reflective surface of the fingerprint image on surface;

Pedestal is set at the position for being provided with light-absorption layer of substrate, light passing chamber is offered on pedestal, light passing chamber is for making to refer to Print image exposes in the sensing face of fingerprint detection chip, and the inner wall of light passing chamber is extinction face.

As a kind of optional mode, optic reflector packaging method provided by the present application is provided with extinction in substrate The position setting pedestal of layer specifically includes:

Supporting layer is set on substrate layer, and forms pedestal in supporting layer.

As a kind of optional mode, optic reflector packaging method provided by the present application forms pedestal in supporting layer, It specifically includes:

Supporting layer is processed, so that supporting layer forms pedestal, the mode of processing is included any of the following or several: Patch, bonding, injection molding, coining.

As a kind of optional mode, optic reflector packaging method provided by the present application forms pedestal in supporting layer Later, further include,

In the inner wall of light passing chamber, light-absorption layer is set.

As a kind of optional mode, optic reflector packaging method provided by the present application is arranged reflective on substrate layer After layer further include:

Protective layer is set on reflective layer.

Optic reflector provided by the present application, fingerprint recognition mould group, mobile terminal and reflector packaging method, optics are reflective Light-reflecting portion is arranged in device, and light-reflecting portion has the reflective surface parallel with screen, and the fingerprint on the surface from screen is reflected by reflective surface Image;The pedestal for opening up light passing chamber is set, and light passing chamber has the first opening towards the side of light-reflecting portion, is arranged in the first opening and uses In the support portion of support optical lens, it is intracavitary that the fingerprint image of reflection by the first opening and optical lens exposes to light passing, and It exposes in the sensing face of the fingerprint detection chip on light passing chamber, ultimately forms fingerprint image to be identified, make to shield lower fingerprint Technology can be applied in LCD screen.

Detailed description of the invention

In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this Shen Some embodiments please for those of ordinary skill in the art without any creative labor, can be with It obtains other drawings based on these drawings.

Fig. 1 is a kind of structural schematic diagram of optic reflector provided by the embodiments of the present application;

Fig. 2 is the top view of Fig. 1;

Fig. 3 is a kind of use state diagram of optic reflector provided by the embodiments of the present application;

Fig. 4 is pedestal and the position view of light-reflecting portion one in a kind of optic reflector provided by the embodiments of the present application;

Fig. 5 is pedestal and the position view of light-reflecting portion two in a kind of optic reflector provided by the embodiments of the present application;

Fig. 6 is pedestal and the position view of light-reflecting portion three in a kind of optic reflector provided by the embodiments of the present application;

Fig. 7 is a kind of structural schematic diagram of fingerprint recognition mould group provided by the embodiments of the present application;

Fig. 8 is a kind of structural schematic diagram of mobile terminal provided by the embodiments of the present application;

Fig. 9 is a kind of flow chart of reflector packaging method provided by the embodiments of the present application.

Description of symbols:

100-pedestals;101-light passing chambers;102-the first opening;103-support portions;1031-evacuation notches;104— Extinction face;105-the second opening;200-light-reflecting portions;201-reflective surfaces;202-substrate layers;203-reflective layers;204-protect Sheath;205-light-absorption layers;300-screens;400-optical lens;500-fingerprint detection chips;600-fingerprint recognition mould groups; 700-optic reflectors;800-light sources;900-mobile terminals.

Specific embodiment

To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application In attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art Every other embodiment obtained without creative efforts, shall fall in the protection scope of this application.

The description and claims of this application and term " first ", " second ", " third " and " in above-mentioned attached drawing The (if present)s such as four " are to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should manage The data that solution uses in this way are interchangeable under appropriate circumstances, so as to embodiments herein described herein can in addition to Here the sequence other than those of diagram or description is implemented.

In addition, term " includes " and " having " and their any deformation, it is intended that covering non-exclusive includes example Such as, the process, method, system, product or equipment for containing a series of steps or units those of are not necessarily limited to be clearly listed Step or unit, but may include being not clearly listed or intrinsic for these process, methods, product or equipment other Step or unit.

The principle of luminosity of LCD screen are as follows: the filling liquid crystal material between two blocks of parallel-plates changes liquid crystal material by voltage The arrangement situation of interior molecules, image deep mixed to show to achieve the purpose that shading and light transmission, in picturesque disorder, two The filter layer of three-primary colours is added between block plate, so that it may realize display chromatic image.

LCD screen needs external light source, and the back of LCD screen needs that there is reflector the light of external light source is reflected towards screen Surface.And shield the principle of lower fingerprint technique are as follows: when finger contact screen, the light that screen issues penetrates screen surface for fingerprint Texture illuminates, and fingerprint reflection light penetrates screen Returning sensor, ultimately forms fingerprint image to be identified.Therefore, under screen Fingerprint technique is difficult to apply in LCD screen.

So optic reflector provided by the present application, it is intended to solve the technical problem as above of the prior art.

Optic reflector provided by the embodiments of the present application is described in detail in conjunction with multiple examples as follows.

Fig. 1 is a kind of structural schematic diagram of optic reflector provided by the embodiments of the present application;Fig. 2 is the top view of Fig. 1;Figure 3 be a kind of use state diagram of optic reflector provided by the embodiments of the present application.As shown in Figure 1-Figure 3, the present embodiment mentions The optic reflector 700 of confession, comprising: pedestal 100 and light-reflecting portion 200;

Pedestal 100 is used to be placed in the side of screen 300, and light-reflecting portion 200 and pedestal 100 connect, and light-reflecting portion 200 has The reflective surface 201 parallel with screen 300, with the fingerprint image for reflecting the surface from screen 300;

It should be understood that Fig. 3 is only schematic illustration, in a particular embodiment, this application involves pedestal 100 be mounted on screen The side of curtain 300 can actually refer to that pedestal 100 is particularly located at the side of screen 300 perhaps lower section or the neighbouring screen The side setting of curtain 300.For example, the thickness of screen 300 will be generally above pedestal, pedestal 100 is mounted on screen 300 wherein It is biased to the position of bottom, the i.e. position of side-lower in one side.In other alternate embodiments, pedestal 100 also be may be mounted at The lower section of screen 300, such as the marginal position of 300 lower section of screen.

Light passing chamber 101 is offered on pedestal 100, light passing chamber 101 has the first opening 102 towards the side of light-reflecting portion 200, And first is provided with the support portion 103 for being used to support optical lens 400 in opening 102, light passing chamber 101 with 200 institute of light-reflecting portion In the opposite side of plane for fingerprint detection chip 500, the fingerprint image that light passing chamber 101 is used to that light-reflecting portion 200 to be made to reflect to be arranged As being exposed in the sensing face of fingerprint detection chip 500 via optical lens 400, the inner wall of light passing chamber 101 is extinction face 104.

When specific implementation, light-reflecting portion 200 and pedestal 100 are mounted on to the side of the screen 300 of LCD screen, made and pedestal 100 The reflective surface 201 of the light-reflecting portion 200 of connection is parallel with screen 300, and light-reflecting portion 200 and the side of screen 300 abut against, and makes anti- Light portion 200 is between pedestal 100 and the side of screen 300.Light-reflecting portion 200 can be mounted on and be used for screen illuminating 300 Fingerprint identification region light source above.The first opening 102 is opened up in the side of light passing chamber 101 towards light-reflecting portion 200, first opens Setting is used to support the support portion 103 of optical lens 400 on mouth 102, optical lens 400 is supported by support portion 103, by fingerprint Detection chip 500 is mounted on the side opposite with 200 place plane of light-reflecting portion of light passing chamber 101.

Specifically, the first opening 102 can be rectangle, circle, ellipse or irregular shape, as long as the first opening 102 energy light transmissions, this is not restricted for the present embodiment.Support portion 103 is used to support optical lens 400, the branch of support portion 103 Support face can match with the outside of optical lens 400, so that being supported on support portion 103 of can consolidating of optical lens 400.It is logical It the side opposite with 200 place plane of light-reflecting portion of optical cavity 101, can be in light passing chamber 101 for fingerprint detection chip 500 to be arranged Inner sidewall be arranged fingerprint detection chip 500, in this way, the fingerprint image into light passing chamber 101 can expose to light passing chamber 101 in time On fingerprint detection chip 500 sensing face on;It can also be by one opposite with 200 place plane of light-reflecting portion of light passing chamber 101 Side is set as transparent surface, and fingerprint detection chip 500 is arranged in the outside of the transparent surface, in this way, being easily installed fingerprint detection core Piece 500.

When finger contact screen 300, the light of LCD screen external light source is reflected towards the surface of screen 300, and penetrates screen The fingerprint texture of fingerprint identification region is illuminated on 300 surfaces, independent light source can also be arranged in the side of LCD screen, independent The light of light source is reflected towards the surface of screen 300, and the fingerprint image on the surface from screen 300 passes through the reflective surface of light-reflecting portion 200 201 reflex at the first opening 102, and through being exposed at the first opening 102 by the optical lens 400 that support portion 103 supports It in light passing chamber 101, and exposes in the sensing face of the fingerprint detection chip 500 on light passing chamber 101, ultimately forms fingerprint image It is identified, enables to shield lower fingerprint technique and apply in LCD screen.

In the present embodiment, light-reflecting portion 200 is set, and light-reflecting portion 200 has the reflective surface 201 parallel with screen 300, passes through The fingerprint image on surface of the reflection of reflective surface 201 from screen 300;The pedestal 100 for opening up light passing chamber 101, light passing chamber 101 are set There is the first opening 102 towards the side of light-reflecting portion 200, setting is used to support the support of optical lens 400 in the first opening 102 The fingerprint image in portion 103, reflection is exposed in light passing chamber 101 by the first opening 102 and optical lens 400, and is exposed to logical In the sensing face of fingerprint detection chip 500 on optical cavity 101, fingerprint image is ultimately formed to be identified, makes to shield lower fingerprint skill Art can be applied in LCD screen.Extinction face 104 is set by the inner wall surface in light passing chamber 101, it is miscellaneous that extinction face 104 reduces light The interference of news.

In a kind of concrete implementation mode, the side opposite with 200 place plane of light-reflecting portion of light passing chamber 101 has the Two openings 105, the second opening 105 is for being arranged fingerprint detection chip 500.By the way that the second opening is arranged on light passing chamber 101 105, facilitate installation fingerprint detection chip 500.When specific implementation, can directly line detection chip 500 be covered and will be fixed on In second opening 105, to install fingerprint detection chip 500;Step-like opening can also be set by the second opening 105, Line detection chip 500 is embedded in and is fixed on the step surface of the second opening 105, and the upper surface of line detection chip 500 is opened with second The upper surface of mouth 105 is concordant, in this way, line detection chip 500 is not easily to fall off.Wherein, line detection chip 500 and the second opening 105 Fixed form can for bonding, or other types of connection type, details are not described herein again for the present embodiment.

Optionally, pedestal 100 is used to be mounted on the side of screen 300 or the side setting of adjacent screen 300, and pedestal 100 top is the plane parallel with reflective surface 201.In specific implementation, the top of pedestal 100 can be used for installing line detection Chip 500, that is to say, that line detection chip 500 is parallel with reflective surface 201, in this way, the fingerprint image that reflective surface 201 reflects is logical It crosses the first opening 102 and optical lens 400 exposes in light passing chamber 101, and the fingerprint detection core on light passing chamber 101 can be exposed to In the sensing face of piece 500.When specific implementation, the top of pedestal 100 can be concordant with reflective surface 201, and the top of pedestal 100 can be with Higher or lower than reflective surface 201, the present embodiment is not limited thereto.

Support portion 103 is used to support optical lens 400, for the support optical lens 400 for keeping support portion 103 firm. In a kind of concrete implementation mode, support portion 103 includes resettlement groove, has two evacuation notches being oppositely arranged on resettlement groove 1031, evacuation notch 1031 is for avoiding optical lens 400.Specifically, the shape of evacuation notch 1031 can be according to optical frames First 400 lateral surface setting, for example, evacuation notch 1031 can match with the lateral surface of optical lens 400, in this way, making light It learns camera lens 400 to be embedded in support portion 103, so that the support optical lens 400 that support portion 103 can consolidate.

Fig. 4 is pedestal and the position view of light-reflecting portion one in a kind of optic reflector provided by the embodiments of the present application;Fig. 5 For pedestal and the position view of light-reflecting portion two in a kind of optic reflector provided by the embodiments of the present application;Fig. 6 is that the application is real Pedestal and the position view of light-reflecting portion three in a kind of optic reflector of example offer are provided.As shown in Figure 4-Figure 6, the present embodiment mentions The optic reflector 700 of confession, the reflective layer for being provided with substrate layer 202 and being stacked with substrate layer 202 in light-reflecting portion 200 203.That is, light-reflecting portion 200 is divided to for two layers, first layer is substrate layer 202, and reflective layer is laminated on substrate layer 202 203, to form light-reflecting portion 200, substrate layer 202 is used to support reflective layer 203, and reflective layer 203 is for reflective.Wherein, reflective surface 201 can be used as reflective layer 203.

Specifically, substrate layer 202 can be opaque, it can also be with light transmission.The material of substrate layer 202 can for silicon wafer, glass, Metal plate, ceramics or organic material, 202 shape of substrate layer is unlimited, substrate layer 202 with a thickness of hundred micron orders, for example, substrate layer 202 with a thickness of 200 microns.Sputter can be passed through on substrate layer 202, vapor deposition, printing, deposit the processing methods production such as silver-plated Reflective layer 203.The mirror surfaces reflectorized material such as aluminium, silver can be used in the material of reflective layer 203, and the present embodiment is not limited thereto It is unlimited.The thickness of reflective layer 203 be usually point a micron order, such as reflective layer 203 with a thickness of 0.2um.

In order to protect reflective layer 203, further, light-reflecting portion 200 further includes transparent protective layer 204, and protective layer 204 In 203 outside of reflective layer.Protective layer 204 avoids reflective layer 203 from being damaged for protecting reflective layer 203.

Optionally, the material of protective layer 204 is silica, silicon nitride or organic coating.

Specifically, can be made by processing methods such as chemical vapor deposition, gluing, printings in the outside of reflective layer 203 Protective layer 204.The thickness of protective layer 204 is usually micron order, for example, protective layer 204 with a thickness of 1um.

Optionally, light-reflecting portion 200 extends to the bottom part down of pedestal 100, and connect with the bottom of pedestal 100.Namely It says, the link position of light-reflecting portion 200 and pedestal 100 is the bottom of pedestal 100.Specifically, light-reflecting portion 200 has three layers, respectively For substrate layer 202 and the reflective layer being stacked with substrate layer 202 203, the protective layer 204 in 203 outside of reflective layer, pedestal 100 can connect with substrate layer 202, reflective layer 203 or protective layer 204.

In specific implementation, light-reflecting portion 200 also has a light-absorption layer 205, and light-absorption layer 205 is located at the bottom of pedestal 100.When reflective Portion 200 and when being connect with the bottom of pedestal 100, if the bottom of the light passing chamber 101 of pedestal 100 and pedestal 100 is connected, reflective Light-absorption layer 205 in portion 200, and light-absorption layer 205 is located at the bottom of pedestal 100, so that energy extinction in the region of light passing chamber 101, To reduce the interference of light noise in light passing chamber 101.

Optionally, the material of light-absorption layer 205 is organic gel or inorganic coating.Added by gluing, silk-screen, chromium plating, anode etc. Work mode makes light-absorption layer 205.

Due to light-reflecting portion 200 have substrate layer 202, reflective layer 203, protective layer 204 and light-absorption layer 205, light-reflecting portion 200 with Relative position between pedestal 100 also can have diversified forms, below to the various phases between light-reflecting portion 200 and pedestal 100 Position is described in detail.

As shown in figure 4, the first opposite position between light-reflecting portion 200 and pedestal 100 specifically:

Reflective layer 203 and pedestal 100 are located at the same side of substrate layer 202, and reflective layer 203 extends to the bottom of pedestal 100 Lower section, specifically, substrate layer 202, reflective layer 203 and protective layer 204 are cascading, the top of protective layer 204, which is arranged, inhales Photosphere 205, light-absorption layer 205 are located at the bottom of pedestal 100, that is to say, that light-absorption layer 205 is located at bottom and the protection of pedestal 100 Between layer 204, light-absorption layer 205 and the setting of 203 different layers of reflective layer, protective layer 204 be located at reflective layer 203 and light-absorption layer 205 it Between.In this way, sequentially forming substrate layer 202, reflective layer 203, protective layer 204, light-absorption layer 205 and pedestal 100 in production.System Simple process is made, the accuracy of manufacture is high.

As shown in figure 5, second of opposite position between light-reflecting portion 200 and pedestal 100 specifically:

Reflective layer 203 and pedestal 100 are located at the same side of substrate layer 202, the edge of reflective layer 203 and the court of pedestal 100 It is flushed to the one side edge of light-reflecting portion 200, specifically, light-absorption layer 205 and reflective is arranged between substrate layer 202 and protective layer 204 Layer 203, light-absorption layer 205 and the setting of 203 same layer of reflective layer.In production, the light-absorption layer 205 of same layer is formed on substrate layer 202 With reflective layer 203, on light-absorption layer 205 and reflective layer 203 formed protective layer 204, on protective layer 204 with 205 phase of light-absorption layer Pair part formed pedestal 100.In this way, light-absorption layer 205 and 203 same layer of reflective layer are arranged, reduce costs.

As shown in fig. 6, the third opposite position between light-reflecting portion 200 and pedestal 100 specifically:

Reflective layer 203 and pedestal 100 are located at the opposite two sides of substrate layer 202, and light-absorption layer 205 is located at substrate layer Between 202 and pedestal 100, reflective layer 203 is between pedestal 100 and protective layer 204.In production, the one of substrate layer 202 Side is cascading reflective layer 203 and protective layer 204, is cascading extinction in the opposite side of substrate layer 202 Layer 205 and pedestal 100.

Fig. 7 is a kind of structural schematic diagram of fingerprint recognition mould group provided by the embodiments of the present application.As shown in fig. 7, above-mentioned On the basis of each embodiment, the present embodiment also provides a kind of fingerprint recognition mould group 600, including fingerprint recognition chip 500, optical frames First 400 and optic reflector provided by the above embodiment 700, it is anti-that fingerprint recognition chip 500 and optical lens 400 are respectively positioned on optics In the light passing chamber 101 of light device 700.

Wherein, the structure and working principle of optic reflector 700 are described in detail in the above-described embodiments, herein not It repeats one by one.

Optionally, fingerprint recognition mould group 600 provided in this embodiment, further includes light source 800, and light source 800 is arranged in screen 300 side, the fingerprint of the fingerprint identification region on screen illuminating 300.Specifically, light source 800 is located at light-reflecting portion 200 Lower section.

When specific implementation, the light-reflecting portion 200 of optic reflector 700 and pedestal 100 are mounted on the screen 300 of LCD screen Side keeps the reflective surface 201 of the light-reflecting portion 200 connected with pedestal 100 parallel with screen 300, light-reflecting portion 200 and screen 300 Side abuts against, and makes light-reflecting portion 200 between pedestal 100 and the side of screen 300.In light passing chamber 101 towards light-reflecting portion 200 side opens up the first opening 102, and setting is used to support the support portion 103 of optical lens 400 in the first opening 102, passes through Support portion 103 supports optical lens 400, and fingerprint detection chip 500 is mounted on putting down with where light-reflecting portion 200 for light passing chamber 101 The opposite side in face.

Arrow direction in Fig. 7 shows the trend of optical path, specifically, the fingerprint recognition on 800 screen illuminating 300 of light source The fingerprint image of the fingerprint in region, the surface from screen 300 reflexes to the first opening by the reflective surface 201 of light-reflecting portion 200 At 102, and through being exposed in light passing chamber 101 at the first opening 102 by the optical lens 400 that support portion 103 supports, and irradiate In the sensing face of fingerprint detection chip 500 on to light passing chamber 101, fingerprint image is ultimately formed to be identified.

By the way that individual light source 800 is arranged come the fingerprint of the fingerprint identification region on screen illuminating 300, make the light in Fig. 7 Moving towards for road is more accurate.

Fig. 8 is a kind of structural schematic diagram of mobile terminal provided by the embodiments of the present application.As shown in figure 8, in above-mentioned each reality On the basis of applying example, the present embodiment provides also a kind of mobile terminals 900, including above-mentioned fingerprint recognition mould group 600.

Wherein, the structure of fingerprint recognition mould group 600 and working principle are described in detail in the above-described embodiments, herein It does not repeat one by one.

In the present embodiment, which can be liquid crystal display panel, Electronic Paper, Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) panel, mobile phone, tablet computer, television set, display, laptop, digital phase Any products or components having a display function such as frame, navigator, wearable device or household appliance.

Fig. 9 is a kind of flow chart of reflector packaging method provided by the embodiments of the present application.As shown in Figure 9.Above-mentioned each On the basis of embodiment, the present embodiment provides a kind of optic reflector packaging methods.

Specifically, this method comprises:

S101, reflective layer 203 and light-absorption layer 205, at least partly formation of reflective layer 203 are respectively set on substrate layer 202 For reflecting the reflective surface 201 of the fingerprint image on the surface from screen 300.

Specifically, reflective layer 203 and light-absorption layer 205 can be located at the ipsilateral of substrate layer 202, further, reflective layer 203 It is arranged with 205 same layer of light-absorption layer, can also be different layer setting.Reflective layer 203 and light-absorption layer 205 can be located at substrate layer 202 Opposite sides, as long as at least partly reflective layer 203 forms the reflective surface for being used to reflect the fingerprint image on the surface from screen 300 201, the present embodiment is not limited thereto.

S102, pedestal 100 is set at the position for being provided with light-absorption layer 202 of substrate layer 202, is offered on pedestal 100 logical Optical cavity 101, light passing chamber 101 are used to making fingerprint image to expose to the sensing face of fingerprint detection chip 500, light passing chamber 101 it is interior Wall is extinction face 104.

When specific implementation, supporting layer is set on substrate layer 202, and forms pedestal 100 in supporting layer.

Specifically, and in supporting layer formed pedestal 100, specifically include:

Supporting layer is processed, so that supporting layer forms pedestal 100, the mode of processing is included any of the following or several Kind: patch, bonding, injection molding, coining.

Optionally, optic reflector packaging method provided in this embodiment, on substrate layer 202 formed reflective layer 203 it Afterwards, further includes:

Protective layer 204 is set on reflective layer 203.By the way that protective layer 204 is arranged, protective layer 204 is for protecting reflective layer 203, avoid reflective layer 203 from being damaged.

Optionally, optic reflector packaging method provided in this embodiment is formed after pedestal 100 in supporting layer, also Including,

In the inner wall of light passing chamber 101, light-absorption layer 205 is set.

Below according in Fig. 4-Fig. 6 between light-reflecting portion 200 and pedestal 100 three kinds of opposite positions to light provided by the embodiment Reflector packaging method is learned to be described in detail.

700 packaging method of optic reflector of the first opposite position can between light-reflecting portion 200 and pedestal 100 in Fig. 4 To include:

S201, reflective layer 203 is set on substrate layer 202.

Specifically, the material of substrate layer 202 can be silicon wafer, glass, metal plate, ceramics or organic material, and substrate layer 202 shapes are unlimited.By substrate layer 202 be machined to need thickness, substrate layer 202 with a thickness of hundred micron orders, for example, substrate layer 202 with a thickness of 200 microns.

Pass through the processing methods systems such as sputter, vapor deposition, printing, silver-plated, the highly doped sputtering aluminum of deposition on the surface of substrate layer 202 Make reflective layer 203.Wherein sputter, vapor deposition, printing, the deposition processing methods such as silver-plated specific machined parameters using it is existing i.e. Can, the present embodiment is not limited thereto.

The mirror surfaces reflectorized material such as aluminium, silver can be used in the material of production reflective layer 203, and the present embodiment is not limited thereto. The thickness of reflective layer 203 be usually point a micron order, such as reflective layer 203 with a thickness of 0.2um.

S202, protective layer 204 is set on reflective layer 203.

Specifically, the material of protective layer 204 is silica, silicon nitride or organic coating.It is logical on the surface of reflective layer 203 Cross the processing methods such as chemical vapor deposition, gluing, printing production protective layer 204, wherein chemical vapor deposition, gluing, printing etc. Using existing, the present embodiment is not limited thereto the specific machined parameters of processing method.The thickness of protective layer 204 is usual For micron order, for example, protective layer 204 with a thickness of 1um.Protective layer 204 for protecting reflective layer 203, avoid reflective layer 203 by To damage.The not necessarily step of protective layer 204 is set, such as reflective layer 203 uses and deposits adding for silver-plated or highly doped sputtering aluminum When work mode, this protective layer 204 can be cancelled.

S203, light-absorption layer 205 is set on protective layer 204.

Specifically, the extinctions class materials such as organic gel, inorganic coating can be used in the material of light-absorption layer 205.In protective layer 204 Surface makes light-absorption layer 205 by processing methods such as gluing, silk-screen, chromium plating, anodes, wherein gluing, silk-screen, chromium plating, anode etc. Using existing, the present embodiment is not limited thereto the specific machined parameters of processing method.The region of light-absorption layer 205 is greater than The region of protective layer 204, the i.e. area (area of reflective layer 203) of protective layer 204 are greater than the area of light-absorption layer 205, so that extremely Small part reflective layer 203 forms the reflective surface 201 of the fingerprint image for reflecting the surface from screen 300.Light-absorption layer 205 at Exposure development or dry, wet etching method, the specific processing method of light-absorption layer 205, position, shape, size can be used in shape method It is configured according to actual needs, the present embodiment is not limited thereto.

S204, pedestal 100 is set on light-absorption layer 205.

Specifically, making pedestal 100 by processing methods such as patch, bonding, injection molding, coinings on the surface of light-absorption layer 205. The structure of the present embodiment pedestal 100 can be with are as follows: offers light passing chamber 101 on pedestal 100, light passing chamber 101 is towards light-reflecting portion 200 Side has the first opening 102, and is provided with the support portion 103 for being used to support optical lens 400, light passing in the first opening 102 For fingerprint detection chip 500 to be arranged, light passing chamber 101 is anti-for making for the side opposite with 200 place plane of light-reflecting portion of chamber 101 The fingerprint image that light portion 200 is reflected is exposed to via optical lens 400 in the sensing face of fingerprint detection chip 500, light passing chamber 101 Inner wall be extinction face 104.The absorptivity in extinction face 104 is unlimited, and the thickness in extinction face 104 is usually micron order, such as 20um。

The material of pedestal 100 can be used any solid-state materials such as organic gel, plastic particles, metal, and the present embodiment is herein not It limits.The location and shape of pedestal 100 are designed according to the design needs of optical path in Fig. 7, and the present embodiment does not limit herein It is fixed.

700 packaging method of optic reflector of second of opposite position can between light-reflecting portion 200 and pedestal 100 in Fig. 5 To include:

S301, reflective layer 203 and light-absorption layer 205 are set on substrate layer 202.

S302, protective layer 204 is set on light-absorption layer 205.

S304, pedestal 100 is set on protective layer 204.

Specifically, in the present embodiment reflective layer 203 and the setting of light-absorption layer 205 in same layer, remaining packaging method with it is above-mentioned The 700 packaging method embodiment of optic reflector of the first opposite position is identical between light-reflecting portion 200 and pedestal 100, herein It does not repeat one by one.

700 packaging method of optic reflector of the third opposite position can between light-reflecting portion 200 and pedestal 100 in Fig. 6 To include:

S401, reflective layer 203 is set in the side of substrate layer 202;

S402, protective layer 204 is set on reflective layer 203;

S403, light-absorption layer 205 is set in the opposite side that reflective layer 203 is arranged in substrate layer 202;

S404, pedestal 100 is set on light-absorption layer 205.

Specifically, reflective layer 203 and light-absorption layer 205 are located at the opposite two sides of substrate layer 202 in the present embodiment, 700 packaging method of optic reflector of the first opposite position between remaining packaging method and above-mentioned light-reflecting portion 200 and pedestal 100 Embodiment is identical, will not repeat them here.

Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the application, rather than its limitations;To the greatest extent Pipe is described in detail the application referring to foregoing embodiments, those skilled in the art should understand that: its according to So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into Row equivalent replacement;And these are modified or replaceed, each embodiment technology of the application that it does not separate the essence of the corresponding technical solution The range of scheme.

Claims (24)

1. a kind of optic reflector characterized by comprising pedestal and light-reflecting portion;
The pedestal is used to be placed in the side of screen, and the light-reflecting portion connect with the pedestal, and the light-reflecting portion with The parallel reflective surface of the screen, with the fingerprint image for reflecting the surface from the screen;
Light passing chamber is offered on the pedestal, the light passing chamber has the first opening towards the side of the light-reflecting portion, and described Be provided with the support portion for being used to support optical lens in first opening, the light passing chamber it is opposite with plane where the light-reflecting portion Side for being arranged fingerprint detection chip, the light passing chamber is used to make the fingerprint image of the light-reflecting portion reflection via the light It learns camera lens to expose in the sensing face of the fingerprint detection chip, the inner wall of the light passing chamber is extinction face.
2. optic reflector according to claim 1, which is characterized in that the light passing chamber is put down with the light-reflecting portion place The opposite side in face has the second opening, and second opening is for being arranged the fingerprint detection chip.
3. optic reflector according to claim 2, which is characterized in that the pedestal is used to be mounted on the side of the screen Face or the side of the neighbouring screen are arranged, and the top of the pedestal is the plane parallel with the reflective surface.
4. optic reflector according to claim 1, which is characterized in that the support portion includes resettlement groove, the placement There are two evacuation notches being oppositely arranged, the evacuation notch is for avoiding the optical lens on slot.
5. optic reflector according to claim 1, which is characterized in that be provided in the light-reflecting portion substrate layer and with The reflective layer that the substrate layer is stacked.
6. optic reflector according to claim 5, which is characterized in that the light-reflecting portion further includes transparent protective layer, The protective layer is located on the outside of the reflective layer.
7. optic reflector according to claim 6, which is characterized in that the light-reflecting portion extends to the bottom of the pedestal Lower section, and connect with the bottom of the pedestal.
8. optic reflector according to claim 7, which is characterized in that the light-reflecting portion also has light-absorption layer, light-absorption layer position In the bottom of the pedestal.
9. optic reflector according to claim 7, which is characterized in that the reflective layer and the pedestal are located at the base The same side of material layer.
10. optic reflector according to claim 9, which is characterized in that the edge of the reflective layer and the pedestal It is flushed towards the one side edge of the light-reflecting portion;Alternatively, the reflective layer extends to the bottom part down of the pedestal.
11. optic reflector according to claim 8, which is characterized in that the reflective layer extends to the bottom of the pedestal Below portion, and the reflective layer and the light-absorption layer are located at different layers, and the protective layer is located at the reflective layer and the extinction Between layer.
12. optic reflector according to claim 7, which is characterized in that the reflective layer and the pedestal are located at The opposite two sides of the substrate layer.
13. optic reflector according to claim 12, which is characterized in that the light-absorption layer is located at the substrate layer and institute It states between pedestal.
14. optic reflector according to claim 12 or 13, which is characterized in that the protective layer is located at the reflective layer Outside.
15. according to the described in any item optic reflectors of claim 6-10, which is characterized in that the material of the protective layer is two Silica, silicon nitride or organic coating.
16. -10 described in any item optic reflectors according to claim 1, which is characterized in that the material of the light-absorption layer is to have Machine glue or inorganic coating.
17. a kind of fingerprint recognition mould group, which is characterized in that appoint including fingerprint recognition chip, optical lens and claim 1-11 Optic reflector described in one, the fingerprint recognition chip and the optical lens are respectively positioned on the light passing of the optic reflector It is intracavitary.
18. fingerprint recognition mould group according to claim 17, which is characterized in that further include light source, the light source setting exists The side of screen, the fingerprint of the fingerprint identification region on screen illuminating.
19. a kind of mobile terminal, which is characterized in that including fingerprint recognition mould group described in claim 17 or 18.
20. a kind of optic reflector packaging method characterized by comprising
Reflective layer and light-absorption layer are respectively set on substrate layer, at least partly described reflective layer is formed for reflecting from screen The reflective surface of the fingerprint image on surface;
Pedestal is set at the position for being provided with the light-absorption layer of the substrate, light passing chamber is offered on the pedestal, it is described logical The sensing face that optical cavity is used to that the fingerprint image to be made to expose to fingerprint detection chip, the inner wall of the light passing chamber are extinction face.
21. optic reflector packaging method according to claim 20, which is characterized in that the setting in the substrate There is the position setting pedestal of the light-absorption layer to specifically include:
Supporting layer is set on the substrate layer, and forms the pedestal in the supporting layer.
22. optic reflector packaging method according to claim 21, which is characterized in that the shape in the supporting layer At the pedestal, specifically include:
The supporting layer is processed, so that the supporting layer forms the pedestal, the mode of the processing includes following Meaning is one or more of: patch, bonding, injection molding, coining.
23. optic reflector packaging method according to claim 21, which is characterized in that the shape in the supporting layer After the pedestal, further include,
In the inner wall of the light passing chamber, light-absorption layer is set.
24. optic reflector packaging method according to claim 20, which is characterized in that institute is arranged on the substrate layer After stating reflective layer further include:
Protective layer is set on the reflective layer.
CN201880002696.8A 2018-12-04 2018-12-04 Optic reflector, fingerprint recognition mould group, mobile terminal and reflector packaging method CN109690366A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108446677A (en) * 2018-05-03 2018-08-24 东莞市美光达光学科技有限公司 A kind of fingerprint recognition module for below screen
CN108491833A (en) * 2018-05-22 2018-09-04 昆山丘钛微电子科技有限公司 A kind of optical finger print module and mobile terminal
US20180260602A1 (en) * 2017-03-07 2018-09-13 Shenzhen GOODIX Technology Co., Ltd. Devices with peripheral task bar display zone and under-lcd screen optical sensor module for on-screen fingerprint sensing
CN209543373U (en) * 2018-12-04 2019-10-25 深圳市汇顶科技股份有限公司 Optic reflector, fingerprint recognition mould group and mobile terminal

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180260602A1 (en) * 2017-03-07 2018-09-13 Shenzhen GOODIX Technology Co., Ltd. Devices with peripheral task bar display zone and under-lcd screen optical sensor module for on-screen fingerprint sensing
CN108446677A (en) * 2018-05-03 2018-08-24 东莞市美光达光学科技有限公司 A kind of fingerprint recognition module for below screen
CN108491833A (en) * 2018-05-22 2018-09-04 昆山丘钛微电子科技有限公司 A kind of optical finger print module and mobile terminal
CN209543373U (en) * 2018-12-04 2019-10-25 深圳市汇顶科技股份有限公司 Optic reflector, fingerprint recognition mould group and mobile terminal

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