CN109687724A - A kind of water-cooling electric electron power module - Google Patents
A kind of water-cooling electric electron power module Download PDFInfo
- Publication number
- CN109687724A CN109687724A CN201910000041.3A CN201910000041A CN109687724A CN 109687724 A CN109687724 A CN 109687724A CN 201910000041 A CN201910000041 A CN 201910000041A CN 109687724 A CN109687724 A CN 109687724A
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- China
- Prior art keywords
- water
- igbt
- power module
- support
- busbar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
Abstract
The invention discloses a kind of water-cooling electric electron power modules, including backboard, current sensor bracket, IGBT component and Support Capacitor component, support pallet is fixedly installed above IGBT component, IGBT component includes water-cooled plate and multiple IGBT modules, the exchange end of IGBT module is connected with the exchange end busbar of electrification flow sensor, Z-shaped stack bus bar is fixedly connected between the DC terminal of IGBT module and the connecting pin of Support Capacitor component, by being symmetrically connected with DC terminal copper bar before and after the soft busbar of direct current on Z-shaped stack bus bar, backboard right side central offers guide rail card slot, ground capacity plate and voltage sensor are fixedly installed in guide rail card slot；The present invention improves the space utilization rate inside power module, makes that module is more compact, volume is smaller；This power module can be installed with integral vertical type, slip into cabinet body, be easily installed, facilitated maintenance；The power device of this power module uses water cooling method, good heat dissipation effect.
Description
Technical field
The invention belongs to power electronics fields, and in particular to a kind of water-cooling electric electron power module is that one kind is adopted
With high-power, high power density the two level three-phase bridge inverter module of Z-shaped stack bus bar.
Background technique
With the rapid development of the universal and full-control type semiconductor power switching device of electric power, power electronic technique and its
System integration technology is concerned.Power switch circuit is formed using semiconductor power switching device, utilizes the integrated electricity of transistor
Road and microprocessor chip constitute signal processing and control system, to power switch circuit carry out in real time, the control of suitable formula, can be with
Cost-effectively realize the power converter and Electric control of switching mode.
In the fields such as modern industry, traffic, national defence, life, various types of Technics of Power Electronic Conversion devices are largely needed
And transformation system.Currently, the power electronic equipments such as big-power transducer in industrial occasions using than wide, technology is also increasingly
Maturation, but conventional big-power transducer volume is big, and be not able to satisfy front-face maintaining use environment etc. and require.
The power electronic equipments such as big-power transducer are particularly applied to the Modern Traffics such as marine electric power propulsion field,
Under the premise of guaranteeing reliability and maintenanceability, reduce the volume and weight of power electronic equipment as far as possible, improves electric power electricity
The power density of sub- equipment.Although having been developed that high-power, high power is close in large manufacturers such as external ABB, Alstom, Siemens
The applicable electric power electronic module such as degree, but China cannot be fully met due to delivery cycle, cost and technical restriction etc. and answered
Use the market demand.
Therefore, carry out to high-power, high power density electric and electronic power module and equipment autonomously technological development and grind
Work processed is necessary.
Summary of the invention
It is an object of the invention to deficiencies according to prior art, design a kind of water-cooling electric electron power module, purpose
Be to solve the power electronic equipments such as the existing big-power transducer routinely developed volume and in terms of deficiency,
One kind is provided under the premise of guaranteeing reliability and maintenanceability, it is high with installation small in size, light-weight, vertical, power density
Water-cooling electric electron power module.
The technical solution adopted by the present invention to solve the technical problems is: a kind of water-cooling electric electron power module, including
Backboard and the current sensor bracket being from left to right successively fixed on backboard upper surface, IGBT component and Support Capacitor
Component, the IGBT component top are fixedly installed support pallet, are fixedly installed driving circuit on the support pallet
Plate；The IGBT component includes that the water-cooled plate being fixed on backboard upper surface and front and back are disposed side by side on water-cooled plate upper end
The multiple IGBT modules being connected respectively with drive circuit board on face, the friendship on the end face of IGBT module upper left described in each
Stream end is fixedly connected to exchange end busbar, is arranged on the exchange end busbar described in each and is fixedly mounted on current sense
Current sensor on device bracket；In DC terminal and Support Capacitor component upper surface on the IGBT module upper right end face
Z-shaped stack bus bar is fixedly connected between connecting pin, the Z-shaped stack bus bar is located at the right side of Support Capacitor component side
It is upper that DC terminal copper bar, the inside upper and lower side difference of the DC terminal copper bar are symmetrically connected with by the soft busbar front and back of direct current respectively
It is provided with insulator, the Z-shaped stack bus bar, which is located on the right side of Support Capacitor component one end, to be additionally provided with and DC terminal
The first insulation board that copper bar is used cooperatively, the backboard right side central offer guide rail card slot, consolidate in the guide rail card slot
Surely the ground capacity plate and voltage sensor being connected with support capacitance component are provided with.
The Support Capacitor component includes that the capacitor fastening pallet being arranged on backboard and left and right are disposed side by side on capacitor
Multiple Support Capacitors on pallet are fastened, the connecting pin of the Support Capacitor described in each is connected with Z-shaped stack bus bar.
The Z-shaped stack bus bar, which is located on the upper surface of Support Capacitor component side, is fixedly installed busbar supporting element,
The second insulation board is provided between the Z-shaped stack bus bar and busbar supporting element.
Right-angle waterpipe connector, the lower-left of the backboard are respectively arranged in the inlet and outlet of the water-cooled plate
By the fixed setting of water pipe head support plate, there are two water pipe heads of transferring in portion, in the water-cooled plate inlet and outlet
Right-angle waterpipe connector is connected with two switching water pipe heads respectively by plastic flexible pipe.
The Z-shaped stack bus bar by screw respectively with the DC terminal of IGBT module, the connecting pin of Support Capacitor and mother
Row's supporting element is connected, and the exchange soft busbar in end described in each is connected by screw with the exchange end of corresponding IGBT module
It connects, the both ends of the soft busbar of the direct current are connected with DC terminal copper bar and Z-shaped stack bus bar respectively by screw.
The beneficial effects of the present invention are:
1, water-cooling electric electron power module disclosed by the invention is compared to conventional electric and electronic power module, using Z-shaped lamination
Busbar connection switch device IGBT module and Support Capacitor, reduce the mounting height of switching device IGBT module, to IGBT mould
Block upper space is used, and improves the space utilization rate inside this water-cooling electric electron power module, keeps module more compact.
2, water-cooling electric electron power module disclosed by the invention is by holding internal Support Capacitor and Z-shaped stack bus bar
Support and fixed design, install this water-cooling electric electron power module can with integral vertical type, slip into cabinet body, this water-cooling electric
Guarantee front-face maintaining is fastened by bolts between electron power module and cabinet body.
3, water-cooling electric electron power module disclosed by the invention is compact-sized, small in size, is easily installed, facilitates maintenance.
4, the IGBT component of water-cooling electric electron power module disclosed by the invention includes that water-cooled plate and front and back are arranged side by side
Multiple IGBT modules in water-cooled plate, power density is high, and power device uses water cooling method, good heat dissipation effect.
5, water-cooling electric electron power module disclosed by the invention includes current sensor, voltage sensor and driving circuit
Plate has information collections and the processing functions such as electric current, voltage, temperature, can reception optical fiber driving signal.
6, water-cooling electric electron power module disclosed by the invention can be used in parallel, to expand whole output work
Rate；Maximum can six this water-cooling electric electron power modules in parallel, output power can reach 2800kW, can be used for ship, iron
In the industrial circles large power power electronic appliance such as road, performance is stablized, securely and reliably.
Detailed description of the invention
Fig. 1 is main view of the invention；
Fig. 2 is top view of the invention；
Fig. 3 is shape top view of the invention；
Fig. 4 is shape main view of the invention；
Fig. 5 is the structural schematic diagram of the Z-shaped stack bus bar of the present invention.
Each appended drawing reference are as follows: 1-current sensor bracket, 2-exchange end busbars, 3-support pallets, 4-driving circuits
Plate, 5-Z-shaped stack bus bars, 6-Support Capacitors, the 7-the first insulation board, 8-insulators, the soft busbar of 9-direct currents, 10-direct currents
End copper bar, 11-ground capacity plates, 12-voltage sensors, 13-capacitors fastening pallet, 14-backboards, 15-IGBT modules,
16-water-cooled plates, 17-current sensors, 18-right-angle waterpipe connectors, 19-switching water pipe heads, 20-water pipe heads support
Plate, the 21-the second insulation board, 22-busbar supporting elements, 23-guide rail card slots, 24-cover boards, 25-fans, 26-bottom plates, 27-
Handle, 28-top plates, 29-back side panels, 30-front side boards.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings.
Referring to figs. 1 to shown in Fig. 5, the invention discloses a kind of water-cooling electric electron power module, including backboard 14 and
Current sensor bracket 1, IGBT component and the Support Capacitor component being from left to right successively fixed on 14 upper surface of backboard,
It is fixedly installed support pallet 3 above the IGBT component, is fixedly installed on the support pallet 3 by hexagonal insulated column
There is drive circuit board 4.
The IGBT component includes that the water-cooled plate 16 being fixed on 14 upper surface of backboard and front and back are disposed side by side on
3 IGBT modules 15 being connected respectively with drive circuit board 4 on 16 upper surface of water-cooled plate, the IGBT module 15 described in each
Exchange end on the end face of upper left passes through screw and is fixedly connected with exchange end busbar 2, on the exchange end busbar 2 described in each
It is arranged with the current sensor 17 being fixedly mounted on current sensor bracket 1.
The Support Capacitor component includes that the capacitor fastening pallet 13 being arranged on backboard 14 and left and right are disposed side by side on
Capacitor fastens multiple Support Capacitors 6 on pallet 13, and the capacitor fastening pallet 13 is fixedly connected with module side plate, each
The Support Capacitor 6 is fixedly connected on backboard 14 by nut.
Pass through between the connecting pin on 6 upper surface of DC terminal and Support Capacitor on the 15 upper right end face of IGBT module
Screw is fixedly connected with Z-shaped stack bus bar 5, and the Z-shaped stack bus bar 5 is located on the right side of Support Capacitor component side and divides
It Tong Guo not be symmetrically connected with DC terminal copper bar 10 before and after the soft busbar 9 of direct current, the both ends of the soft busbar 9 of the direct current pass through spiral shell respectively
Nail is connected with DC terminal copper bar 10 and Z-shaped stack bus bar 5, and the inside upper and lower side of the DC terminal copper bar 10 is respectively arranged with
Insulator 8.The Z-shaped stack bus bar 5, which is located on the right side of Support Capacitor component side, to be additionally provided with and DC terminal copper bar
10 the first insulation boards 7 being used cooperatively, the first insulation board 7 ensure that the electric clearance for charging position on Z-shaped stack bus bar 5 and climb
Electrical distance.14 right side central of backboard offers guide rail card slot 23, is fixedly installed and props up in the guide rail card slot 23
The ground capacity plate 11 and voltage sensor 12 that support capacitor 6 is connected.
The Z-shaped stack bus bar 5, which is located on the upper surface of Support Capacitor component side, is fixedly installed mother by screw
Supporting element 22 is arranged, the busbar supporting element 22 is connected by screw with module side plate, the Z-shaped stack bus bar 5 and mother
The second insulation board 21 is provided between row's supporting element 22, the second insulation board 21 ensure that the electricity that position is charged on Z-shaped stack bus bar 5
Gas gap and creepage distance.
Right-angle waterpipe connector 18, the backboard 14 are respectively arranged in the inlet and outlet of the water-cooled plate 16
Lower left quarter by water pipe head support plate 20 fixed setting there are two transfer water pipe head 19,16 water inlet of water-cooled plate
It is connected respectively with one end of two switching water pipe heads 19 with the right-angle waterpipe connector 18 on water outlet by plastic flexible pipe, two
The other end of a switching water pipe head 19 is connected with external water inlet pipe and outlet pipe respectively.
Water-cooling electric electron power module disclosed by the invention is compared to conventional electric and electronic power module, using Z-shaped folded
5 connection switch device IGBT module 15 of layer busbar and Support Capacitor 6, reduce the mounting height of switching device IGBT module 15,
15 upper space of IGBT module is used, 15 upper space of IGBT module being available is for installing support pallet 3 and driving
Dynamic circuit board 4, improves the space utilization rate inside this water-cooling electric electron power module, keeps module more compact.
Water-cooling electric electron power module disclosed by the invention passes through holding to internal Support Capacitor 6 and Z-shaped stack bus bar 5
Support and fixed design, install this water-cooling electric electron power module can with integral vertical type, slip into cabinet body, this water-cooling electric
Guarantee front-face maintaining is fastened by bolts between electron power module and cabinet body.
Water-cooling electric electron power module disclosed by the invention is six face rectangular parallelepiped structures, the main components of inside modules
And electronic component is all mounted on backboard 14.As shown in Figures 3 and 4, remaining five face be respectively bottom plate 26, front side board 30,
Top plate 28, back side panel 29, cover board 24, six faces are fixed by screw from each other, compact-sized, small in size, are easily installed, side
Just it repairs.Fan 25 is housed on back side panel 29.Handle 27 is housed on front side board 30, module is facilitated to install.
The IGBT component of water-cooling electric electron power module disclosed by the invention includes that water-cooled plate 16 and front and back are arranged side by side
3 IGBT modules 15 in water-cooled plate 16, power density is high, and power device uses water cooling method, good heat dissipation effect.
Water-cooling electric electron power module disclosed by the invention includes current sensor 17, voltage sensor 12 and driving electricity
Road plate 4 has information collections and the processing functions such as electric current, voltage, temperature, can reception optical fiber driving signal.
Water-cooling electric electron power module disclosed by the invention can be used in parallel, to expand whole output power；
Maximum can six this water-cooling electric electron power modules in parallel, output power can reach 2800kW, can be used for ship, railway etc.
In industrial circle large power power electronic appliance, performance is stablized, securely and reliably.
Effect of the present invention and technical parameter are as follows:
The power density of a kind of water-cooling electric electron power module of the present invention are as follows: the output of single electric power electronic module is held
Amount is 690kVA, volume 877*497*240mm3, the power density of single electric power electronic module are as follows: 690kVA/0.877*
0.497*0.240m3=6.6MVA/m3。
A kind of water-cooling electric electron power module of the present invention is examined by vibration, impact test, meets national military standard
And the type approval test requirement of China Classification Society defined, it is reliable and stable.
This power module can be used in parallel, to expand whole output power, can be used for the industry neck such as ship, railway
In the large power power electronic appliance of domain, performance is stablized, securely and reliably.
The above-described embodiments merely illustrate the principles and effects of the present invention, and the embodiment that part uses, for
For those skilled in the art, without departing from the concept of the premise of the invention, can also make it is several deformation and
It improves, these are all within the scope of protection of the present invention.
Claims (5)
1. a kind of water-cooling electric electron power module, it is characterised in that: from left to right fix including backboard (14) and successively and set
Set current sensor bracket (1), IGBT component and the Support Capacitor component on backboard (14) upper surface, the IGBT component
Top is fixedly installed support pallet (3), is fixedly installed drive circuit board (4) on the support pallet (3)；Described
IGBT component includes that the water-cooled plate (16) being fixed on backboard (14) upper surface and front and back are disposed side by side on water-cooled plate (16)
The multiple IGBT modules (15) being connected respectively with drive circuit board (4) on upper surface, the IGBT module (15) described in each
Exchange end on the end face of upper left is fixedly connected to exchange end busbar (2), is arranged on the exchange end busbar (2) described in each
There is the current sensor (17) being fixedly mounted on current sensor bracket (1)；On described IGBT module (15) the upper right end face
DC terminal and Support Capacitor component upper surface on connecting pin between be fixedly connected with Z-shaped stack bus bar (5), described is Z-shaped
Stack bus bar (5) is located on the right side of Support Capacitor component side respectively by being symmetrically connected with before and after the soft busbar of direct current (9)
The inside upper and lower side of DC terminal copper bar (10), the DC terminal copper bar (10) is respectively arranged with insulator (8), and described is Z-shaped
Stack bus bar (5) is located at for being additionally provided on the right side of Support Capacitor component side and being used cooperatively with DC terminal copper bar (10)
One insulation board (7), the backboard (14) right side central offer guide rail card slot (23), fixed in the guide rail card slot (23)
It is provided with the ground capacity plate (11) and voltage sensor (12) being connected with Support Capacitor component.
2. a kind of water-cooling electric electron power module according to claim 1, which is characterized in that the Support Capacitor group
Part includes that capacitor fastening pallet (13) being arranged on backboard (14) and left and right are disposed side by side in capacitor fastening pallet (13)
The connecting pin of multiple Support Capacitors (6), the Support Capacitor (6) described in each is connected with Z-shaped stack bus bar (5).
3. a kind of water-cooling electric electron power module according to claim 2, which is characterized in that the Z-shaped lamination is female
Row (5), which is located on the upper surface of Support Capacitor component side, to be fixedly installed busbar supporting element (22), the Z-shaped stack bus bar
(5) it is provided between busbar supporting element (22) the second insulation board (21).
4. a kind of water-cooling electric electron power module according to claim 3, which is characterized in that the water-cooled plate (16)
Inlet and outlet on be respectively arranged with right-angle waterpipe connector (18), the lower left quarter of the backboard (14) is connect by water pipe
Head support plate (20) is transferred water pipe head (19) there are two being fixedly installed, in the water-cooled plate (16) inlet and outlet
Right-angle waterpipe connector (18) is connected with two switching water pipe heads (19) respectively by plastic flexible pipe.
5. a kind of water-cooling electric electron power module according to claim 4, which is characterized in that the Z-shaped lamination is female
Arrange (5) by screw respectively with the DC terminal of IGBT module (15), the connecting pin of Support Capacitor (6) and busbar supporting element (22) phase
Connection, the soft busbar in exchange end (2) described in each are connected by screw with the exchange end of corresponding IGBT module (15), institute
The both ends of the soft busbar of the direct current stated (9) are connected with DC terminal copper bar (10) and Z-shaped stack bus bar (5) respectively by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000041.3A CN109687724A (en) | 2019-01-01 | 2019-01-01 | A kind of water-cooling electric electron power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000041.3A CN109687724A (en) | 2019-01-01 | 2019-01-01 | A kind of water-cooling electric electron power module |
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| Publication Number | Publication Date |
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| CN109687724A true CN109687724A (en) | 2019-04-26 |
Family
ID=66190442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910000041.3A Pending CN109687724A (en) | 2019-01-01 | 2019-01-01 | A kind of water-cooling electric electron power module |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110266199A (en) * | 2019-07-19 | 2019-09-20 | 常州博瑞电力自动化设备有限公司 | A kind of low explosion-proof soft straight distribution bus assembly of sense |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110266199A (en) * | 2019-07-19 | 2019-09-20 | 常州博瑞电力自动化设备有限公司 | A kind of low explosion-proof soft straight distribution bus assembly of sense |
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Application publication date: 20190426 |
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| RJ01 | Rejection of invention patent application after publication |