CN109655735B - Power amplifier chip evaluation board and power amplifier chip evaluation board system - Google Patents
Power amplifier chip evaluation board and power amplifier chip evaluation board system Download PDFInfo
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- CN109655735B CN109655735B CN201811492911.5A CN201811492911A CN109655735B CN 109655735 B CN109655735 B CN 109655735B CN 201811492911 A CN201811492911 A CN 201811492911A CN 109655735 B CN109655735 B CN 109655735B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
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Abstract
The embodiment of the invention provides a power amplifier chip evaluation board and a power amplifier chip evaluation board system, wherein the power amplifier chip evaluation board comprises a voltage measurement module and a current measurement module, the voltage at two ends of a coil in a loudspeaker and the current flowing through the coil in the loudspeaker can be directly obtained, a complex voltage and current measurement circuit does not need to be designed in the power amplifier chip, or extra measurement equipment is used outside the power amplifier chip evaluation board system to measure parameters such as the voltage at two ends of the coil in the loudspeaker matched with the power amplifier chip, the current flowing through the coil in the loudspeaker, signal harmonic distortion degree and the like, so that the performance of the power amplifier chip is evaluated, and the evaluation cost of the power amplifier chip is reduced. Moreover, the power amplifier chip evaluation board provided by the embodiment of the invention can guide the design of the power amplifier chip, reduce the design cost and requirements of the power amplifier chip and improve the cost performance of the design of the power amplifier chip.
Description
Technical Field
The embodiment of the invention relates to the technical field of chip evaluation, in particular to a power amplifier chip evaluation board and a power amplifier chip evaluation board system.
Background
At present, most of the existing power amplifier chip evaluation board systems adopt a combination mode of an upper computer and a lower computer, wherein the upper computer is generally a computer, the lower computer is a processor in the power amplifier chip evaluation board, the upper computer is used for issuing an instruction to the lower computer, the lower computer is used for executing a received instruction, and the instruction issued by the upper computer is generally only an instruction for performing configuration operation on a register of the power amplifier chip.
The existing power amplifier chip evaluation board system is used for showing whether a power amplifier chip can successfully realize the function of playing music, the power amplifier chip evaluation board in the system is only used for configuring a register of the power amplifier chip, when the power amplifier chip evaluation board system evaluates the power amplifier chip, a hearing test needs to be carried out through the ears of a user, a complex voltage and current measurement circuit in the power amplifier chip is adopted to determine the voltage at two ends of a coil in a loudspeaker matched with the power amplifier chip and the current flowing through the coil in the loudspeaker, or extra measurement equipment is used outside the power amplifier chip evaluation board system to measure the voltage at two ends of the coil in the loudspeaker, the current flowing through the coil in the loudspeaker, the signal harmonic distortion degree and other parameters so as to evaluate the performance of the power amplifier chip, and the evaluation cost is greatly increased.
Therefore, it is urgently needed to provide a power amplifier chip evaluation board and a power amplifier chip evaluation board system to solve the problems existing in the prior art.
Disclosure of Invention
In order to overcome the above problems or at least partially solve the above problems, embodiments of the present invention provide a power amplifier chip evaluation board and a power amplifier chip evaluation board system.
In a first aspect, an embodiment of the present invention provides a power amplifier chip evaluation board, including: the device comprises a voltage measuring module, a current measuring module, a temperature compensating module and a first processor;
the voltage measuring module, the current measuring module and the temperature compensating module are all connected with the first processor;
the voltage measuring module is used for measuring the voltage at two ends of a coil in the loudspeaker matched with the power amplifier chip, the current measuring module is used for measuring the current flowing through the coil in the loudspeaker, and the temperature compensating module is used for measuring the ambient temperature of a current measuring resistor in the current measuring module and compensating the current measured by the current measuring module; the first processor is used for controlling the voltage measuring module, the current measuring module and the temperature compensation module, and acquiring and summarizing the voltage at two ends of a coil in the loudspeaker, the current flowing through the coil in the loudspeaker and the ambient temperature of a current measuring resistor in the current measuring module.
In a second aspect, an embodiment of the present invention provides a power amplifier chip evaluation board system, including: the power amplifier chip evaluation board, the power amplifier chip, the loudspeaker and the second processor are provided in the first aspect;
the first processor is connected with the second processor, the first processor transmits the acquired voltage at two ends of the coil in the loudspeaker, the acquired current flowing through the coil in the loudspeaker and the acquired environmental temperature of the current measuring resistor in the current measuring module to the second processor, and the second processor is used for processing the voltage at two ends of the coil in the loudspeaker, the acquired current flowing through the coil in the loudspeaker and the acquired environmental temperature of the current measuring resistor in the current measuring module to obtain a change curve of each parameter of the loudspeaker.
According to the power amplifier chip evaluation board and the power amplifier chip evaluation board system provided by the embodiment of the invention, the power amplifier chip evaluation board comprises the voltage measurement module and the current measurement module, so that the voltage at two ends of the coil in the loudspeaker and the current flowing through the coil in the loudspeaker can be directly obtained, a complex voltage and current measurement circuit does not need to be designed in the power amplifier chip, or extra measurement equipment is used outside the power amplifier chip evaluation board system to measure the voltage at two ends of the coil in the loudspeaker matched with the power amplifier chip, the current flowing through the coil in the loudspeaker, the signal harmonic distortion degree and other parameters, so that the performance of the power amplifier chip is evaluated, and the evaluation cost of the power amplifier chip is reduced. In addition, a complex voltage and current measuring circuit does not need to be designed in the power amplifier chip, so that the power amplifier chip evaluation board provided by the embodiment of the invention can guide the design of the power amplifier chip, the design cost and the requirement of the power amplifier chip are reduced, and the cost performance of the design of the power amplifier chip is improved. In addition, the power amplifier chip evaluation board provided by the embodiment of the invention further comprises a temperature compensation module, so that the environmental temperature of the current measuring resistor in the current measuring module can be measured, the current measured by the current measuring module is subjected to temperature compensation, and the power amplifier chip is evaluated through the change of the environmental temperature, so that the evaluation result of the power amplifier chip is more comprehensive. The current measured by the current measuring module is subjected to temperature compensation, so that the obtained current flowing through the coil in the loudspeaker is more accurate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an evaluation board of a power amplifier chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an evaluation board of a power amplifier chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a power amplifier chip evaluation board system according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a power amplifier chip evaluation board system according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have specific orientations, be configured in specific orientations, and operate, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1, an embodiment of the present invention provides a power amplifier chip evaluation board 1, including: a voltage measurement module 11, a current measurement module 12, a temperature compensation module 13, and a first processor 14. The voltage measuring module 11, the current measuring module 12 and the temperature compensating module 13 are all connected with the first processor 14. The power amplifier comprises a voltage measuring module 11, a current measuring module 12, a temperature compensating module 13 and a power amplifier chip, wherein the voltage measuring module 11 is used for measuring the voltage at two ends of a coil in a loudspeaker matched with the power amplifier chip, the current measuring module 12 is used for measuring the current flowing through the coil in the loudspeaker, and the temperature compensating module 13 is used for measuring the ambient temperature of a current measuring resistor in the current measuring module and compensating the current measured by the current measuring module; the first processor 14 is configured to control the voltage measurement module 11, the current measurement module 12, and the temperature compensation module 13, and obtain voltages at two ends of a coil in the speaker, a current flowing through the coil in the speaker, and an ambient temperature at which a current measuring resistor in the current measurement module is located, and perform summarization.
Specifically, the power amplifier chip evaluation board provided in the embodiment of the present invention is used for evaluating and testing a power amplifier chip matched with a speaker. The loudspeaker is a transducer for converting an electric signal into an acoustic signal, and the power amplifier chip is connected with the loudspeaker and amplifies a weak signal from a signal source to drive the loudspeaker to make sound. Therefore, the function of the power amplifier chip needs to be evaluated and tested to verify whether the power amplifier chip can work normally. The power amplifier chip evaluation board provided by the embodiment of the invention is respectively connected with the power amplifier chip and the loudspeaker, and comprises a voltage measurement module 11, a current measurement module 12, a temperature compensation module 13 and a first processor 14. The voltage measuring module 11 is used to measure the voltage at two ends of the coil in the speaker, and the voltage measuring module 11 may be specifically a voltage sensor, and is connected in parallel to two ends of the coil in the speaker. The current measuring module 12 is configured to measure a current of a coil in the speaker, the current measuring module 12 may be specifically a current sensor, and is connected in series with the coil in the speaker, and a current measuring resistor is disposed in the current measuring module 12. It should be noted that, the functions implemented by the voltage measuring module 11 and the current measuring module 12 in the embodiment of the present invention may be integrated on the same module, which is not specifically limited in the embodiment of the present invention. Because the current flowing through the current measuring resistor changes due to the change of the ambient temperature of the current measuring resistor in the current measuring module, the current measuring resistor has a temperature drift problem, and the current measured by the current measuring module 12 is inaccurate, in the embodiment of the invention, the ambient temperature of the current measuring resistor in the current measuring module is measured by the temperature compensating module 13 in the power amplifier chip evaluation board, and the current measured by the current measuring module is subjected to temperature compensation, and the measurement of the ambient temperature can be realized by a temperature sensor.
The first processor 14 is connected to the voltage measurement module 11, the current measurement module 12, and the temperature compensation module 13, and the first processor 14 is configured to control the voltage measurement operation of the voltage measurement module 11, the current measurement operation of the current measurement module 12, and the temperature measurement operation and the temperature compensation operation of the temperature compensation module 13, and acquire the voltage measured by the voltage measurement module 11, the current measured by the current measurement module 12, and the ambient temperature measured by the temperature compensation module 13 for summarizing. That is, the voltage measured by the voltage measuring module 11, the current measured by the current measuring module 12, and the ambient temperature measured by the temperature compensating module 13 need to be sent to the first processor 14.
The power amplifier chip evaluation board provided by the embodiment of the invention comprises the voltage measurement module and the current measurement module, can directly obtain the voltage at two ends of the coil in the loudspeaker and the current flowing through the coil in the loudspeaker, and does not need to design a complex voltage and current measurement circuit in the power amplifier chip, or uses an additional measurement device outside the power amplifier chip evaluation board system to measure the parameters such as the voltage at two ends of the coil in the loudspeaker matched with the power amplifier chip, the current flowing through the coil in the loudspeaker, the signal harmonic distortion degree and the like, so as to evaluate the performance of the power amplifier chip and reduce the evaluation cost of the power amplifier chip. In addition, a complex voltage and current measuring circuit does not need to be designed in the power amplifier chip, so that the power amplifier chip evaluation board provided by the embodiment of the invention can guide the design of the power amplifier chip, the design cost and the requirement of the power amplifier chip are reduced, and the cost performance of the design of the power amplifier chip is improved. In addition, the power amplifier chip evaluation board provided by the embodiment of the invention further comprises a temperature compensation module, so that the environmental temperature of the current measuring resistor in the current measuring module can be measured, the current measured by the current measuring module is subjected to temperature compensation, and the power amplifier chip is evaluated through the change of the environmental temperature, so that the evaluation result of the power amplifier chip is more comprehensive. The current measured by the current measuring module is subjected to temperature compensation, so that the obtained current flowing through the coil in the loudspeaker is more accurate.
As shown in fig. 2, on the basis of the above embodiment, the power amplifier chip evaluation board provided in the embodiment of the present invention further includes: an external interface 15, wherein the external interface 15 comprises a digital interface;
the first processor is connected with the power amplifier chip;
the first processor is also used for reading and writing the register of the power amplifier chip.
Specifically, the power amplifier chip evaluation board in the embodiment of the present invention is provided with an external interface, where the external interface may be a digital interface, and the transmission of the control instruction and the information between the first processor and the power amplifier chip is realized through the digital interface.
On the basis of the above embodiment, in the power amplifier chip evaluation board provided in the embodiment of the present invention, the external interface further includes an analog interface;
and the first processor transmits the audio signal to the power amplifier chip through the digital interface or the analog interface.
Specifically, in the embodiment of the present invention, when the power amplifier chip is evaluated, an audio signal needs to be provided to the power amplifier chip, and the audio signal is generally an analog signal, and needs to be transmitted through an analog interface, or the audio signal may be converted into a digital signal and then transmitted through a digital interface.
As shown in fig. 3, on the basis of the above embodiments, an embodiment of the present invention provides a power amplifier chip evaluation board system, which includes: the power amplifier chip evaluation board 1, the power amplifier chip 2, the loudspeaker 3 and the second processor 4 in the above embodiment;
the first processor 14 is connected to the second processor 4, the first processor 14 transmits the acquired voltage across the coil in the speaker 3, the acquired current flowing through the coil in the speaker 3, and the acquired ambient temperature at which the current measuring resistor in the current measuring module is located to the second processor 4, and the second processor is configured to process the voltage across the coil in the speaker 3, the acquired current flowing through the coil in the speaker 3, and the acquired ambient temperature at which the current measuring resistor in the current measuring module is located, so as to obtain a change curve of each parameter of the speaker 3.
Specifically, in the embodiment of the present invention, the first processor in the power amplifier chip evaluation board sends the collected data to the second processor, so that the second processor processes the received data, where the collected data includes voltages at two ends of a coil in the speaker, a current flowing through the coil in the speaker, and an ambient temperature at which a current measuring resistor in the current measuring module is located.
The second processor processes the received data to obtain the variation curve of each parameter of the loudspeaker. The parameters of the loudspeaker may include: after the parameters such as the voltage at the two ends of the coil in the loudspeaker, the current flowing through the coil in the loudspeaker, the ambient temperature of the current measuring resistor in the current measuring module and the like are processed by the second processor, a voltage curve at the two ends of the coil in the loudspeaker, a current curve flowing through the coil in the loudspeaker and an ambient temperature curve of the current measuring resistor in the current measuring module can be obtained, wherein the current curve is a curve of the current changing along with the temperature.
According to the power amplifier chip evaluation board system provided by the embodiment of the invention, the second processor is used for processing the received data, so that the change curve of each parameter of the loudspeaker can be obtained, and the evaluation on the stability of the power amplifier chip is further realized.
As shown in fig. 4, on the basis of the above embodiment, the power amplifier chip evaluation board system provided in the embodiment of the present invention further includes: and the laser displacement sensor 5 are respectively connected with the second processor 4 and the loudspeaker 3.
The laser displacement sensor 5 is used for measuring the amplitude of a diaphragm in the loudspeaker;
the second processor 4 is further configured to determine the speaker static physical model according to the voltage across the coil in the speaker and the amplitude of the diaphragm in the speaker, where the speaker static physical model is used to represent a quantitative relationship between the voltage across the coil in the speaker and the amplitude of the diaphragm in the speaker.
Specifically, the laser displacement sensor in the embodiment of the present invention is configured to measure the amplitude of the diaphragm in the speaker, where the amplitude of the diaphragm in the speaker corresponds to the voltage at two ends of the coil in the speaker one by one, so that the amplitude of the diaphragm in the speaker can be measured by the laser displacement sensor while the voltage measurement module measures the voltage. The laser displacement sensor sends the measured amplitude to the second processor, and the second processor determines a static physical model of the loudspeaker according to the voltage at two ends of the coil in the loudspeaker and the amplitude of the vibrating diaphragm in the loudspeaker, namely determines the quantitative relation between the voltage at two ends of the coil in the loudspeaker and the amplitude of the vibrating diaphragm in the loudspeaker.
The power amplifier chip evaluation board system provided by the embodiment of the invention is added with the laser displacement sensor, the static physical model of the loudspeaker can be determined through the second processor, in the design of the power amplifier chip, the amplitude of the vibrating diaphragm in the loudspeaker can be predicted by using the static physical model of the loudspeaker, a complex voltage and current measuring circuit does not need to be designed in the power amplifier chip, the dynamic amplitude of the loudspeaker is calculated in real time, the design requirement and the cost of the power amplifier chip are greatly reduced, and the cost performance of the design of the power amplifier chip is improved. For example, a digital power amplifier chip with fixed gain amplification factor is designed, a static physical model of a loudspeaker is utilized to predict the amplitude of a vibrating diaphragm in the loudspeaker, the voltage at two ends of a coil in the loudspeaker is changed by adjusting the size of an input signal of the digital power amplifier chip, and then the amplitude of the vibrating diaphragm in the loudspeaker obtained by prediction is changed, so that the amplitude of the vibrating diaphragm in the loudspeaker obtained by prediction is not more than the physical limit of the vibrating diaphragm, the amplitude protection function of the vibrating diaphragm in the loudspeaker by the power amplifier chip is realized, and the design requirement of the digital power amplifier chip with fixed gain amplification factor is lower.
On the basis of the foregoing embodiment, in the power amplifier chip evaluation board system provided in the embodiment of the present invention, the second processor is further configured to:
and when the impedance of the loudspeaker is a fixed value, determining the voltages at two ends of the coil in the loudspeaker based on the gain amplification factor of the power amplifier chip, and determining the predicted power of the loudspeaker based on the determined voltages at two ends of the coil in the loudspeaker.
Specifically, in the embodiment of the present invention, when the impedance Z of the speaker is constant, for an input signal of the speaker, based on the gain amplification factor of the power amplifier chip, the voltage U at two ends of the coil in the speaker may be determined, and the predicted power P of the speaker may be calculated according to the determined voltage U at two ends of the coil in the speaker1. Specifically, the predicted power P of the speaker can be calculated by the following formula1。
Using predicted power P of loudspeaker1The power monitoring and protecting functions of the power amplifier chip can be realized, a complex voltage and current measuring circuit does not need to be designed in the power amplifier chip to calculate the power of the loudspeaker in real time, the design requirement and the cost of the power amplifier chip are greatly reduced,the cost performance of the design of the power amplifier chip is improved.
On the basis of the above embodiment, in the power amplifier chip evaluation board system provided in the embodiment of the present invention, the parameters of the speaker include: an output power of the speaker;
accordingly, the second processor is specifically configured to: obtaining the output power of the loudspeaker based on the voltage at two ends of a coil in the loudspeaker and the current flowing through the coil in the loudspeaker;
the second processor is further configured to: calibrating the predicted power of the speaker based on the output power of the speaker.
Specifically, the second processor in the embodiment of the present invention is specifically configured to: the output power of the loudspeaker is determined by the voltage across the coil in the loudspeaker and the current flowing through the coil in the loudspeaker, and can be specifically determined by the following formula:
P2＝UI
wherein, P2For the output power of a loudspeaker, U is the voltage across the coil in the loudspeaker, and I is the current flowing through the coil in the loudspeaker. The second processor may plot an output power curve based on the determined output power.
The second processor is also for predicting the power P of the loudspeaker1Output power P of loudspeaker2By comparison, according to the output power P of the loudspeaker2Predicted power P to loudspeaker1Calibrating, specifically predicting power P of loudspeaker by the following calibration formula1And (6) carrying out calibration.
P1′＝P1+K(P2-P1)
Where K is the calibration coefficient, and since the current measurement is related to the ambient temperature T, K can also be written as K (T), P1' is the predicted power after calibration.
The predicted power of the loudspeaker is calibrated by using the calibration formula, so that the predicted power is more accurate, the power protection precision of the power amplifier chip is further improved, and the cost performance of the design of the power amplifier chip is improved.
On the basis of the above embodiment, in the power amplifier chip evaluation board system provided in the embodiment of the present invention, each parameter of the speaker further includes: impedance of the loudspeaker at a preset frequency;
accordingly, the second processor is specifically configured to: obtaining the impedance of the loudspeaker under a preset frequency based on the voltage at two ends of a coil in the loudspeaker and the current flowing through the coil in the loudspeaker;
the second processor is further configured to: and determining an impedance curve of the loudspeaker at the preset frequency.
Specifically, in the embodiment of the present invention, the second processor may determine the impedance of the speaker at the preset frequency according to the voltage across the coil in the speaker and the current flowing through the coil in the speaker, so as to determine the impedance curve of the speaker. For example, the preset frequency may be 50Hz, and the like. The second processor may specifically perform Fast Fourier Transform (FFT) on the obtained voltage at the two ends of the coil in the speaker and the current flowing through the coil in the speaker to obtain a voltage amplitude at the two ends of the coil in the speaker and a current amplitude flowing through the coil in the speaker at a preset frequency, and obtain the impedance of the speaker at the preset frequency by dividing the voltage amplitude and the current amplitude.
On the basis of the foregoing embodiment, in the power amplifier chip evaluation board system provided in the embodiment of the present invention, the second processor is further configured to: and determining the coil temperature of the loudspeaker according to the impedance of the loudspeaker under the preset frequency, and determining the coil temperature curve of the loudspeaker.
Specifically, in the embodiment of the present invention, after the current flows through the coil in the speaker, the temperature of the coil of the speaker may change, so that the impedance of the speaker at the preset frequency changes, and therefore, according to the impedance of the speaker at the preset frequency, the temperature of the coil of the speaker may be determined, and the temperature curve of the coil of the speaker may be further determined.
The power amplifier chip evaluation board system provided by the embodiment of the invention can realize the voltage at two ends of the coil in the loudspeaker, the current flowing through the coil, the amplitude of a loudspeaker diaphragm, the power of the loudspeaker, the ambient temperature of a current measuring resistor in a current measuring module, the impedance measurement of the loudspeaker and the establishment of a static physical model of the loudspeaker, can evaluate the power amplifier chip comprehensively, can also provide great help for the design of the power amplifier chip, converts the functions of amplitude protection and power protection which need to be realized at a chip level into a mode of using a circuit board level by using the physical model as a bridge, greatly reduces the design requirement and cost of the power amplifier chip, improves the cost performance of the design of the power amplifier chip, and is favorable for realizing commercialization of the power amplifier chip.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. The utility model provides a power amplifier chip aassessment board which characterized in that includes: the power amplifier chip evaluation board system comprises a voltage measurement module, a current measurement module, a temperature compensation module and a first processor, wherein the first processor is connected with a second processor in the power amplifier chip evaluation board system;
the voltage measuring module, the current measuring module and the temperature compensating module are all connected with the first processor; the voltage measuring module is connected in parallel with two ends of a coil in the loudspeaker matched with the power amplifier chip, and the current measuring module is connected in series with the coil in the loudspeaker;
the voltage measuring module is used for measuring the voltage at two ends of a coil in the loudspeaker matched with the power amplifier chip, the current measuring module is used for measuring the current flowing through the coil in the loudspeaker, and the temperature compensating module is used for measuring the ambient temperature of a current measuring resistor in the current measuring module and compensating the current measured by the current measuring module; the first processor is used for controlling the voltage measuring module, the current measuring module and the temperature compensation module, and acquiring and summarizing voltage at two ends of a coil in the loudspeaker, current flowing through the coil in the loudspeaker and ambient temperature of a current measuring resistor in the current measuring module;
the first processor is further configured to transmit the acquired voltage across the coil in the speaker, the acquired current flowing through the coil in the speaker, and the acquired ambient temperature at which the current measuring resistor in the current measuring module is located to the second processor;
the second processor is used for determining the voltage at two ends of the coil in the loudspeaker based on the gain amplification factor of the power amplifier chip when the impedance of the loudspeaker is a fixed value, and determining the predicted power P of the loudspeaker based on the determined voltage at two ends of the coil in the loudspeaker1；
The second processor is further configured to obtain an output power P of the speaker based on a voltage across a coil in the speaker and a current flowing through the coil in the speaker2And based on the calibration formula P1′＝P1+K(P2-P1) Obtaining the calibrated predicted power P1′；
Wherein K is a calibration coefficient.
2. The power amplifier chip evaluation board of claim 1, further comprising: an external interface comprising a digital interface;
the first processor is connected with the power amplifier chip;
the first processor is also used for reading and writing the register of the power amplifier chip.
3. The power amplifier chip evaluation board of claim 2, wherein the external interface further comprises an analog interface;
and the first processor transmits the audio signal to the power amplifier chip through the digital interface or the analog interface.
4. The utility model provides a power amplifier chip aassessment board system which characterized in that includes: the power amplifier chip evaluation board of any one of claims 1-3, the power amplifier chip, the speaker, and a second processor;
the first processor is connected with the second processor, the first processor transmits the acquired voltage at two ends of the coil in the loudspeaker, the acquired current flowing through the coil in the loudspeaker and the acquired environment temperature where the current measuring resistor in the current measuring module is located to the second processor, and the second processor is used for processing the voltage at two ends of the coil in the loudspeaker, the acquired current flowing through the coil in the loudspeaker and the acquired environment temperature where the current measuring resistor in the current measuring module is located to obtain a change curve of each parameter of the loudspeaker;
further comprising: the laser displacement sensor is respectively connected with the second processor and the loudspeaker;
the laser displacement sensor is used for measuring the amplitude of a vibrating diaphragm in the loudspeaker;
the second processor is further configured to determine the speaker static physical model according to the voltage across the coil in the speaker and the amplitude of the diaphragm in the speaker, where the speaker static physical model is used to represent a quantitative relationship between the voltage across the coil in the speaker and the amplitude of the diaphragm in the speaker.
5. The power amplifier chip evaluation board system of claim 4, wherein the parameters of the speaker include: the output power of the speaker.
6. The power amplifier chip evaluation board system of claim 4, wherein the parameters of the speaker further comprise: impedance of the loudspeaker at a preset frequency;
accordingly, the second processor is specifically configured to: obtaining the impedance of the loudspeaker under a preset frequency based on the voltage at two ends of a coil in the loudspeaker and the current flowing through the coil in the loudspeaker;
the second processor is further configured to: and determining an impedance curve of the loudspeaker at the preset frequency.
7. The power amplifier chip evaluation board system of claim 6, wherein the second processor is further configured to: and determining the coil temperature of the loudspeaker according to the impedance of the loudspeaker under the preset frequency, and determining the coil temperature curve of the loudspeaker.
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| CN112887893A (en) * | 2021-02-03 | 2021-06-01 | 北京小米移动软件有限公司 | Loudspeaker using method, device and medium |
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