CN109655735A - Power amplifier chips evaluation board and power amplifier chips evaluation board system - Google Patents
Power amplifier chips evaluation board and power amplifier chips evaluation board system Download PDFInfo
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- CN109655735A CN109655735A CN201811492911.5A CN201811492911A CN109655735A CN 109655735 A CN109655735 A CN 109655735A CN 201811492911 A CN201811492911 A CN 201811492911A CN 109655735 A CN109655735 A CN 109655735A
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- loudspeaker
- power amplifier
- amplifier chips
- processor
- voltage
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
Abstract
The embodiment of the invention provides a kind of power amplifier chips evaluation board and power amplifier chips evaluation board systems, power amplifier chips evaluation board includes voltage measurement module and current measurement module, the voltage at loudspeaker coil both ends can be directly obtained and flow through the electric current of loudspeaker coil, without the voltage and current measurement circuit in power amplifier chips interior design complexity, or the voltage of additional measuring device pair and power amplifier chips matched loudspeaker coil both ends is used outside power amplifier chips evaluation board system, the parameters such as electric current and the signal harmonic distortion factor of loudspeaker coil are flowed through to measure, it is assessed with the performance to power amplifier chips, reduce the assessed cost to power amplifier chips.Moreover, the power amplifier chips evaluation board provided in the embodiment of the present invention can instruct the design of power amplifier chips, design cost and the requirement of power amplifier chips are reduced, improves the cost performance of power amplifier chips design.
Description
Technical field
The present embodiments relate to chip evaluation technical fields, more particularly, to power amplifier chips evaluation board and power amplifier
Chip evaluation plate system.
Background technique
Currently, existing power amplifier chips evaluation board system mostly uses greatly host computer+slave computer combination, wherein upper
Machine is generally computer, and slave computer is the processor in power amplifier chips evaluation board, and host computer is used for sending instructions under slave computer, the next
Machine generally only carries out configuration operation for the register of power amplifier chips for executing received instruction, the instruction that host computer issues
Instruction.
Existing power amplifier chips evaluation board system, for showing that power amplifier chips success realizes the function of broadcasting music,
Power amplifier chips evaluation board in system is only used for the register of configuration power amplifier chips, and power amplifier chips evaluation board system is to power amplifier core
When piece is assessed, need to carry out sense of hearing test by user's human ear, using voltage and current measurement complicated inside power amplifier chips
Circuit, determining and power amplifier chips matched loudspeaker coil both ends voltages, the electric current for flowing through loudspeaker coil, Huo Zhe
Outside power amplifier chips evaluation board system using additional measuring device to the voltage at loudspeaker coil both ends, flow through loudspeaker middle line
The parameters such as the electric current of circle and the signal harmonic distortion factor measure, and are assessed, are greatly increased with the performance to power amplifier chips
Assessed cost.
Therefore, now it is badly in need of providing a kind of power amplifier chips evaluation board and power amplifier chips evaluation board system, to solve existing skill
The problem of art.
Summary of the invention
In order to overcome the problems referred above or it at least is partially solved the above problem, the embodiment of the invention provides a kind of power amplifier cores
Piece evaluation board and power amplifier chips evaluation board system.
In a first aspect, the embodiment of the invention provides a kind of power amplifier chips evaluation boards, comprising: voltage measurement module, electric current
Measurement module, temperature compensation module and first processor；
The voltage measurement module, the current measurement module and the temperature compensation module with the first processor
Connection；
The voltage measurement module is for measuring and the voltage at power amplifier chips matched loudspeaker coil both ends, the electricity
Flow measurement module is for measuring the electric current for flowing through the loudspeaker coil, and the temperature compensation module is for measuring the electric current
Environment temperature locating for the current sensing resistance and electric current obtained to the current measurement module measurement compensates in measurement module；Institute
First processor is stated for controlling to the voltage measurement module, the current measurement module and the temperature compensation module
System, and obtain the voltage at loudspeaker coil both ends, the electric current for flowing through the loudspeaker coil and the electric current and survey
Environment temperature locating for current sensing resistance is summarized in amount module.
Second aspect, the embodiment of the invention provides a kind of power amplifier chips evaluation board systems, comprising: what first aspect provided
Power amplifier chips evaluation board, the power amplifier chips, the loudspeaker and second processor；
The first processor is connect with the second processor, in the loudspeaker that the first processor will acquire
The voltage at coil both ends flows through in the electric current and the current measurement module of the loudspeaker coil locating for current sensing resistance
Environment temperature is transmitted to the second processor, the second processor be used for the voltage to loudspeaker coil both ends,
It flows through in the electric current and the current measurement module of the loudspeaker coil at environment temperature locating for current sensing resistance
Reason, obtains the change curve of each parameter of the loudspeaker.
Power amplifier chips evaluation board provided in an embodiment of the present invention and power amplifier chips evaluation board system, power amplifier chips evaluation board
Including voltage measurement module and current measurement module, the voltage at loudspeaker coil both ends can be directly obtained and flow through loudspeaker
The electric current of coil, without the voltage and current measurement circuit in power amplifier chips interior design complexity, or in power amplifier chips
Outside evaluation board system using additional measuring device pair and power amplifier chips matched loudspeaker coil both ends voltage, flow through and raise
The parameters such as the electric current of sound device coil and the signal harmonic distortion factor measure, and are assessed with the performance to power amplifier chips,
Reduce the assessed cost to power amplifier chips.Moreover, because the voltage electricity in power amplifier chips interior design complexity can not needed
Flow measurement circuitry, the power amplifier chips evaluation board provided in the embodiment of the present invention can instruct the design of power amplifier chips, reduce power amplifier
The design cost of chip and requirement improve the cost performance of power amplifier chips design.In addition, due to the function provided in the embodiment of the present invention
Putting chip evaluation plate further includes temperature compensation module, can measure environment temperature locating for current sensing resistance in current measurement module,
And temperature-compensating is carried out to the electric current that current measurement module measurement obtains, power amplifier chips are commented by the variation of environment temperature
Valence keeps the evaluation result to power amplifier chips more comprehensive.Temperature benefit is carried out by the electric current obtained to current measurement module measurement
It repays, the electric current for flowing through loudspeaker coil made is more acurrate.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of power amplifier chips evaluation board provided in an embodiment of the present invention；
Fig. 2 is a kind of structural schematic diagram of power amplifier chips evaluation board provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of power amplifier chips evaluation board system provided in an embodiment of the present invention；
Fig. 4 is a kind of structural schematic diagram of power amplifier chips evaluation board system provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
In the description of the embodiment of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings,
It is merely for convenience of the description embodiment of the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to the embodiment of the present invention.In addition,
Term " first ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the embodiment of the present invention, it should be noted that unless otherwise clearly defined and limited, term " peace
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in embodiments of the present invention.
As shown in Figure 1, the embodiment of the invention provides a kind of power amplifier chips evaluation boards 1, comprising: voltage measurement module 11,
Current measurement module 12, temperature compensation module 13 and first processor 14.Voltage measurement module 11,12 and of current measurement module
Temperature compensation module 13 is connect with first processor 14.Voltage measurement module 11 is for measuring and the matched loudspeaking of power amplifier chips
The voltage at device coil both ends, current measurement module 12 is for measuring the electric current for flowing through loudspeaker coil, temperature compensation module
13 for measuring environment temperature locating for current sensing resistance in current measurement module and obtaining to the current measurement module measurement
Electric current compensates；First processor 14 is used for voltage measurement module 11, current measurement module 12 and temperature compensation module 13
It is controlled, and obtains the voltage at loudspeaker coil both ends, flows through the electric current of the loudspeaker coil and described
Environment temperature locating for current sensing resistance is summarized in current measurement module.
Specifically, a kind of power amplifier chips evaluation board provided in the embodiment of the present invention, for the matched function of loudspeaker
It puts chip and carries out assessment test.Loudspeaker is a kind of energy transducer for converting electrical signals to acoustical signal, power amplifier chips and loudspeaking
Device is connected, and is made a sound amplifying from the small-signal of signal source with drive the speaker.Therefore it needs to power amplifier core
Can the function of piece carries out assessment test, be worked normally with verifying power amplifier chips.The power amplifier chips provided in the embodiment of the present invention
Evaluation board is connect with power amplifier chips, loudspeaker respectively, includes voltage measurement module 11, current measurement mould in power amplifier chips evaluation board
Block 12, temperature compensation module 13 and first processor 14.Voltage measurement module 11 is for measuring loudspeaker coil both ends
Voltage, voltage measurement module 11 are specifically as follows voltage sensor, are connected in parallel on loudspeaker coil both ends.Current measurement module 12
For measuring the electric current of loudspeaker coil, current measurement module 12 is specifically as follows current sensor, with loudspeaker coil
It is connected in series, is provided with current sensing resistance in current measurement module 12.It should be noted that the voltage measurement in the embodiment of the present invention
The function that module 11 and current measurement module 12 are realized can integrate in the same module, not make in the embodiment of the present invention to this
It is specific to limit.The variation of the environment temperature as locating for current sensing resistance in current measurement module can cause the electricity for flowing through current sensing resistance
Stream changes, and current sensing resistance is made to generate temperature drift problems, and current measurement module 12 is caused to measure obtained electric current inaccuracy,
Therefore flow measurement in current measurement module is measured using the temperature compensation module 13 in power amplifier chips evaluation board in the embodiment of the present invention
Environment temperature locating for resistance, and temperature-compensating is carried out to the electric current that current measurement module measurement obtains, measurement environment temperature can
To be realized by temperature sensor.
First processor 14 is connect with voltage measurement module 11, current measurement module 12, temperature compensation module 13 respectively, the
One processor 14 be used to control the voltage measurement movement of voltage measurement module 11, the current measurement of current measurement module 12 movement with
And temperature measurement movement, the temperature-compensating movement of temperature compensation module 13, and obtain voltage measurement module 11 and measure obtained electricity
Pressure, current measurement module 12 measure obtained electric current and temperature compensation module 13 measures obtained environment temperature and summarized.
That is, voltage measurement module 11 measures obtained voltage, current measurement module 12 measures obtained electric current and temperature is mended
The environment temperature that the measurement of module 13 obtains is repaid to be required to be sent to first processor 14.
The power amplifier chips evaluation board provided in the embodiment of the present invention, including voltage measurement module and current measurement module, can
To directly obtain the voltage at loudspeaker coil both ends and flow through the electric current of loudspeaker coil, without in power amplifier chips
The complicated voltage and current measurement circuit of portion's design, or outside power amplifier chips evaluation board system using additional measuring device pair with
The voltage at power amplifier chips matched loudspeaker coil both ends, the electric current for flowing through loudspeaker coil and the signal harmonic distortion factor
Etc. parameters measure, assessed with the performance to power amplifier chips, reduce the assessed cost to power amplifier chips.Moreover, by
In the voltage and current measurement circuit in power amplifier chips interior design complexity, the power amplifier provided in the embodiment of the present invention can not needed
Chip evaluation plate can instruct the design of power amplifier chips, reduce design cost and the requirement of power amplifier chips, improve power amplifier chips and set
The cost performance of meter.It, can be in addition, since the power amplifier chips evaluation board provided in the embodiment of the present invention further includes temperature compensation module
Environment temperature locating for current sensing resistance in current measurement module is measured, and temperature is carried out to the electric current that current measurement module measurement obtains
Degree compensation, evaluates power amplifier chips by the variation of environment temperature, keeps the evaluation result to power amplifier chips more comprehensive.It is logical
It crosses and temperature-compensating is carried out to the electric current that current measurement module measurement obtains, the electric current for flowing through loudspeaker coil made is more quasi-
Really.
As shown in Fig. 2, on the basis of the above embodiments, a kind of power amplifier chips assessment provided in the embodiment of the present invention
Plate, further includes: external interface 15, the external interface 15 include digital interface；
The first processor is connect with the power amplifier chips；
The first processor is also used to be written and read the register of the power amplifier chips.
Specifically, it is provided with external interface in the power amplifier chips evaluation board in the embodiment of the present invention, wherein external interface can
Think digital interface, the transmission of control instruction and information between first processor and power amplifier chips is realized by digital interface.
On the basis of the above embodiments, a kind of power amplifier chips evaluation board provided in the embodiment of the present invention, it is described external
Interface further includes analog interface；
The first processor is by the digital interface or the analog interface by audio signal transmission to the power amplifier
Chip.
Specifically, it in the embodiment of the present invention when assessing power amplifier chips, needs to provide a kind of sound to power amplifier chips
Frequency signal, audio signal are generally analog signal, then need to be transmitted by analog interface, audio signal can also be converted
It for digital signal, is then transmitted by digital interface, this is not especially limited in the embodiment of the present invention.
As shown in figure 3, providing a kind of power amplifier chips evaluation board on the basis of the above embodiments, in the embodiment of the present invention
System, comprising: power amplifier chips evaluation board 1 described in above-described embodiment, the power amplifier chips 2, the loudspeaker 3 and second
Processor 4；
The first processor 14 is connect with the second processor 4, and what the first processor 14 will acquire described raises
The voltage at 3 coil both ends of sound device flows through flow measurement electricity in the electric current and the current measurement module of 3 coil of loudspeaker
The locating environment temperature of resistance is transmitted to the second processor 4, and the second processor is used for 3 coil two of loudspeaker
The voltage at end flows through environment locating for current sensing resistance in the electric current and the current measurement module of 3 coil of loudspeaker
Temperature is handled, and the change curve of each parameter of the loudspeaker 3 is obtained.
Specifically, in the embodiment of the present invention, the data summarized are sent to by the first processor in power amplifier chips evaluation board
Second processor, so that second processor handles the data received, wherein the data summarized include loudspeaker middle line
It encloses the voltage at both ends, flow through environment temperature locating for current sensing resistance in the electric current and current measurement module of loudspeaker coil.
Second processor handles the data received, the change curve of each parameter of available loudspeaker.It raises
Each parameter of sound device can include: the voltage at loudspeaker coil both ends, the electric current for flowing through loudspeaker coil and current measurement
The parameters such as environment temperature locating for current sensing resistance in module, after second processor is handled, available loudspeaker coil two
The voltage curve at end flows through environment temperature locating for current sensing resistance in the current curve and current measurement module of loudspeaker coil
It writes music line, wherein current curve is the curve that electric current varies with temperature.
The power amplifier chips evaluation board system provided in the embodiment of the present invention, by second processor to the data received into
Row processing, the change curve of each parameter of available loudspeaker are further realized and are commented the stability of power amplifier chips
Estimate.
As shown in figure 4, on the basis of the above embodiments, the power amplifier chips evaluation board system provided in the embodiment of the present invention
Further include: laser displacement sensor 5, laser displacement sensor 5 are connect with second processor 4 and loudspeaker 3 respectively.
The laser displacement sensor 5 is used to measure the amplitude of vibrating diaphragm in the loudspeaker；
The second processor 4 is also used to shake in voltage and the loudspeaker according to loudspeaker coil both ends
The amplitude of film determines the loudspeaker static physical model, and the loudspeaker static physical model is for characterizing the loudspeaker
Quantitative relationship in the voltage at coil both ends and the loudspeaker between the amplitude of vibrating diaphragm.
Specifically, the laser displacement sensor in the embodiment of the present invention is used to measure the amplitude of vibrating diaphragm in loudspeaker, loudspeaking
The amplitude of vibrating diaphragm and the voltage at loudspeaker coil both ends are one-to-one in device, therefore can be measured in voltage measurement module
The amplitude of vibrating diaphragm in loudspeaker is measured while voltage by laser displacement sensor.Laser displacement sensor obtains measurement
Amplitude is sent to second processor, and second processor is then according to vibrating diaphragm in the voltage and loudspeaker at loudspeaker coil both ends
Amplitude determines loudspeaker static physical model, that is, determines the amplitude of vibrating diaphragm in the voltage and loudspeaker at loudspeaker coil both ends
Between quantitative relationship.
The power amplifier chips evaluation board system provided in the embodiment of the present invention, joined laser displacement sensor, can pass through
Second processor determines loudspeaker static physical model, can be with using loudspeaker static physical model in power amplifier chips design
The amplitude of vibrating diaphragm in loudspeaker is predicted, the voltage and current measurement circuit without being used in power amplifier chips interior design complexity,
The dynamic amplitude for calculating loudspeaker in real time is removed, the requirement and cost of power amplifier chips design is greatly reduced, improves power amplifier chips
The cost performance of design.For example, the digital power amplifier chip of one fixed gain amplification factor of design, utilizes loudspeaker static physical mould
Type predicts the amplitude of vibrating diaphragm in loudspeaker, by adjusting the size of the input signal of digital power amplifier chip, changes loudspeaking
The voltage at device coil both ends, and then change the amplitude of vibrating diaphragm in the loudspeaker that prediction obtains, guarantee the loudspeaker that prediction obtains
The amplitude of middle vibrating diaphragm is no more than vibrating diaphragm physics limit, realize power amplifier chips to the amplitude defencive function of vibrating diaphragm in loudspeaker, and consolidate
It is relatively low for determining the digital power amplifier chip design requirement of gain amplification factor.
On the basis of the above embodiments, the power amplifier chips evaluation board system provided in the embodiment of the present invention, described second
Processor is also used to:
The loudspeaker impedance be definite value when, the gain amplification factor based on the power amplifier chips, determine described in raise
The voltage at sound device coil both ends, and based on the voltage at determining loudspeaker coil both ends, determine the loudspeaker
Prediction power.
Specifically, in the embodiment of the present invention when the timing of the impedance Z of loudspeaker one, for an input signal of loudspeaker,
Gain amplification factor based on power amplifier chips can determine that the voltage U at loudspeaker coil both ends, and be raised according to what is determined
The voltage U at sound device coil both ends, calculates the prediction power P of loudspeaker1.Specifically loudspeaker can be calculated by following formula
Prediction power P1。
Utilize the prediction power P of loudspeaker1, the power monitoring of power amplifier chips and the function of protection may be implemented, do not have to
The voltage and current measurement circuit of power amplifier chips interior design complexity removes the power for calculating loudspeaker in real time, greatly reduces power amplifier core
The requirement and cost of piece design, improve the cost performance of power amplifier chips design.
On the basis of the above embodiments, the power amplifier chips evaluation board system provided in the embodiment of the present invention, the loudspeaking
It include: the output power of the loudspeaker in each parameter of device；
Correspondingly, the second processor is specifically used for: voltage based on loudspeaker coil both ends, flow through it is described
The electric current of loudspeaker coil obtains the output power of the loudspeaker；
The second processor is also used to: the output power based on the loudspeaker, to the prediction power of the loudspeaker
It is calibrated.
Specifically, second processor is specifically used in the embodiment of the present invention: passing through the voltage at loudspeaker coil both ends, stream
The electric current for crossing the loudspeaker coil determines the output power of loudspeaker, can specifically be determined by following formula:
P2=UI
Wherein, P2For the output power of loudspeaker, U is the voltage at loudspeaker coil both ends, and I flows through in the loudspeaker
The electric current of coil.Second processor can draw output power curve according to the output power determined.
Second processor is also used to the prediction power P of loudspeaker1With the output power P of loudspeaker2It compares, according to
The output power P of loudspeaker2To the prediction power P of loudspeaker1It is calibrated, especially by following calibration equation to loudspeaker
Prediction power P1It is calibrated.
P1'=P1+K(P2-P1)
Wherein, K is calibration factor, and since the measurement of electric current is related with environment temperature T, K can also be write as K (T),
P1' for calibration after prediction power.
It is calibrated using prediction power of the calibration equation to loudspeaker, prediction power can be made more acurrate, further mentioned
The precision of high power amplifier chips power protection, improves the cost performance of power amplifier chips design.
On the basis of the above embodiments, the power amplifier chips evaluation board system provided in the embodiment of the present invention, the loudspeaking
In each parameter of device further include: impedance of the loudspeaker under predeterminated frequency；
Correspondingly, the second processor is specifically used for: voltage based on loudspeaker coil both ends, flow through it is described
The electric current of loudspeaker coil obtains impedance of the loudspeaker under predeterminated frequency；
The second processor is also used to: determining impedance curve of the loudspeaker under the predeterminated frequency.
Specifically, in the embodiment of the present invention second processor can according to the voltage at loudspeaker coil both ends, flow through institute
The electric current for stating loudspeaker coil determines impedance of the loudspeaker under predeterminated frequency, and then determines the impedance curve of loudspeaker.Example
Such as, predeterminated frequency concretely 50Hz etc..Second processing implement body can voltage to obtained loudspeaker coil both ends, stream
The electric current for crossing the loudspeaker coil carries out Fast Fourier Transform (FFT) (i.e. FFT transform), obtains under predeterminated frequency in loudspeaker
The voltage magnitude at coil both ends and the current amplitude for flowing through loudspeaker coil, voltage magnitude is divided by with current amplitude to be obtained
Impedance of the loudspeaker under predeterminated frequency.
On the basis of the above embodiments, the power amplifier chips evaluation board system provided in the embodiment of the present invention, described second
Processor is also used to: according to impedance of the loudspeaker under predeterminated frequency, being determined the coil temperature of the loudspeaker, and is determined
The coil temperature curve of the loudspeaker.
Specifically, in the embodiment of the present invention, after having electric current to flow through due to loudspeaker coil, the coil temperature of loudspeaker can be made
Degree changes, and causes impedance of the loudspeaker under predeterminated frequency to change, therefore according to loudspeaker under predeterminated frequency
Impedance, it can determine the coil temperature of loudspeaker, and further determine the coil temperature curve of loudspeaker.
The power amplifier chips evaluation board system provided in the embodiment of the present invention, may be implemented the electricity at loudspeaker coil both ends
Press, flow through the electric current of coil, the amplitude of the diaphragm of loudspeaker, the power of loudspeaker, in current measurement module locating for current sensing resistance
Environment temperature, the measurement of the impedance of loudspeaker, the foundation of loudspeaker static physical model, not only can be very comprehensively to power amplifier core
Piece is assessed, moreover it is possible to itself provide very big help to power amplifier chips design, the amplitude protection that will need to realize in chip-scale with
The function of power protection, using physical model as bridge, being converted to can be used circuit board level and realizes otherwise, drop significantly
The requirement and cost of low power amplifier chips design, improve the cost performance of power amplifier chips design, are conducive to power amplifier chips and realize quotient
Industry.
The apparatus embodiments described above are merely exemplary, wherein described, unit can as illustrated by the separation member
It is physically separated with being or may not be, component shown as a unit may or may not be physics list
Member, it can it is in one place, or may be distributed over multiple network units.It can be selected according to the actual needs
In some or all of the modules achieve the purpose of the solution of this embodiment.Those of ordinary skill in the art are not paying creativeness
Labour in the case where, it can understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It realizes by means of software and necessary general hardware platform, naturally it is also possible to pass through hardware.Based on this understanding, on
Stating technical solution, substantially the part that contributes to existing technology can be embodied in the form of software products in other words, should
Computer software product may be stored in a computer readable storage medium, such as ROM/RAM, magnetic disk, CD, including several fingers
It enables and using so that a computer equipment (can be personal computer, server or the network equipment etc.) executes each implementation
Method described in certain parts of example or embodiment.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (9)
1. a kind of power amplifier chips evaluation board characterized by comprising voltage measurement module, current measurement module, temperature-compensating mould
Block and first processor；
The voltage measurement module, the current measurement module and the temperature compensation module connect with the first processor
It connects；
The voltage measurement module is surveyed for measuring with the voltage at power amplifier chips matched loudspeaker coil both ends, the electric current
Amount module is for measuring the electric current for flowing through the loudspeaker coil, and the temperature compensation module is for measuring the current measurement
Environment temperature locating for the current sensing resistance and electric current obtained to the current measurement module measurement compensates in module；Described
One processor is used to control the voltage measurement module, the current measurement module and the temperature compensation module, and
The electric current and the current measurement module for obtaining the voltage at loudspeaker coil both ends, flowing through the loudspeaker coil
Environment temperature locating for middle current sensing resistance is summarized.
2. power amplifier chips evaluation board according to claim 1, which is characterized in that further include: external interface, it is described to external
Mouth includes digital interface；
The first processor is connect with the power amplifier chips；
The first processor is also used to be written and read the register of the power amplifier chips.
3. power amplifier chips evaluation board according to claim 2, which is characterized in that the external interface further includes that simulation connects
Mouthful；
The first processor is by the digital interface or the analog interface by audio signal transmission to the power amplifier chips.
4. a kind of power amplifier chips evaluation board system characterized by comprising power amplifier core of any of claims 1-3
Piece evaluation board, the power amplifier chips, the loudspeaker and second processor；
The first processor is connect with the second processor, the loudspeaker coil that the first processor will acquire
The voltage at both ends flows through environment locating for current sensing resistance in the electric current and the current measurement module of the loudspeaker coil
Temperature is transmitted to the second processor, and the second processor is used for the voltage to loudspeaker coil both ends, flows through
Environment temperature locating for current sensing resistance is handled in the electric current and the current measurement module of the loudspeaker coil, is obtained
To the change curve of each parameter of the loudspeaker.
5. power amplifier chips evaluation board system according to claim 4, which is characterized in that further include: laser displacement sensor,
The laser displacement sensor is connect with the second processor and the loudspeaker respectively；
The laser displacement sensor is used to measure the amplitude of vibrating diaphragm in the loudspeaker；
The second processor is also used to vibrating diaphragm in voltage and the loudspeaker according to loudspeaker coil both ends
Amplitude determines the loudspeaker static physical model, and the loudspeaker static physical model is for characterizing the loudspeaker middle line
Enclose the quantitative relationship in the voltage and the loudspeaker at both ends between the amplitude of vibrating diaphragm.
6. power amplifier chips evaluation board system according to claim 5, which is characterized in that the second processor is also used to:
When the impedance of the loudspeaker is definite value, the gain amplification factor based on the power amplifier chips determines the loudspeaker
The voltage at coil both ends, and based on the voltage at determining loudspeaker coil both ends, determine the prediction of the loudspeaker
Power.
7. power amplifier chips evaluation board system according to claim 6, which is characterized in that wrapped in each parameter of the loudspeaker
It includes: the output power of the loudspeaker；
Correspondingly, the second processor is specifically used for: voltage based on loudspeaker coil both ends flows through the loudspeaking
The electric current of device coil obtains the output power of the loudspeaker；
The second processor is also used to: the output power based on the loudspeaker, is carried out to the prediction power of the loudspeaker
Calibration.
8. power amplifier chips evaluation board system according to claim 4, which is characterized in that in each parameter of the loudspeaker also
It include: impedance of the loudspeaker under predeterminated frequency；
Correspondingly, the second processor is specifically used for: voltage based on loudspeaker coil both ends flows through the loudspeaking
The electric current of device coil obtains impedance of the loudspeaker under predeterminated frequency；
The second processor is also used to: determining impedance curve of the loudspeaker under the predeterminated frequency.
9. power amplifier chips evaluation board system according to claim 8, which is characterized in that the second processor is also used to:
According to impedance of the loudspeaker under predeterminated frequency, the coil temperature of the loudspeaker is determined, and determine the loudspeaker
Coil temperature curve.
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