CN109648278A - A kind of production technology of pcb board target drill - Google Patents
A kind of production technology of pcb board target drill Download PDFInfo
- Publication number
- CN109648278A CN109648278A CN201910004107.6A CN201910004107A CN109648278A CN 109648278 A CN109648278 A CN 109648278A CN 201910004107 A CN201910004107 A CN 201910004107A CN 109648278 A CN109648278 A CN 109648278A
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- CN
- China
- Prior art keywords
- pcb board
- hard alloy
- drill
- carbide
- drill point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drilling Tools (AREA)
Abstract
The invention discloses a kind of production technologies of pcb board target drill, a kind of production technology of pcb board target drill is the following steps are included: choose the hard alloy of certain specification as manufacture raw material, the hard alloy is using tungsten-carbide powder as matrix, make that binder is pressurized, is sintered with cobalt powder, usual 94-96% containing tungsten carbide, it is extremely abrasive since its hardness is very high, there is some strength, is suitable for high-speed cutting.The present invention can carry out scale of mass production to drill point steel handle using the production stage of traditional drill point steel handle, and the hard alloy wherein used is using tungsten-carbide powder as matrix, make that binder is pressurized, is sintered with cobalt powder, usually contain tungsten carbide 94% or so, since its hardness is very high, it is extremely abrasive, there is some strength, suitable for high-speed cutting, and the ultrahard titanium carbide (TIC) or titanium nitride (TIN) of one layer of 5-7um of chemical vapor deposition is used on the hard alloy substrate chosen, make it have higher hardness.
Description
Technical field
The present invention relates to micro- brill technical field, specially a kind of production technology of pcb board target drill.
Background technique
PCB(Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is weight
The electronic component wanted is the supporter of electronic component, is the carrier of electronic component electrical connection.Since it is using electronics
Art of printing production, therefore referred to as " print " circuit board.
Need to use drill point in pcb board production, and drill point needs to be bored for a long time after manufacturing completion
Hole work, and common borehole strength is inadequate, does not have toughness, may reduce the time that uses of steel handle, for this purpose, it is proposed that
A kind of production technology of pcb board target drill.
Summary of the invention
The purpose of the present invention is to provide a kind of production technologies of pcb board target drill, to solve to propose in background technique
The problem of.
To achieve the above object, the invention provides the following technical scheme: a kind of production technology of pcb board target drill, institute
State a kind of production technology of pcb board target drill the following steps are included:
(1) choose certain specification hard alloy as manufacture raw material, the hard alloy be using tungsten-carbide powder as matrix, with
Cobalt powder makees that binder is pressurized, is sintered, usual 94-96% containing tungsten carbide, extremely abrasive since its hardness is very high, there is one
Determine intensity, is suitable for high-speed cutting；
(2) the ultrahard titanium carbide of one layer of 5-7um of chemical vapor deposition is used on the hard alloy substrate that step (1) is chosen
(TIC) or titanium nitride (TIN), higher hardness is made it have；
(3) kelvin effect and kindred effect of high-frequency current are utilized, the edge of quick drill point and drill point steel handle makes up to melting
State squeezes the method that fused metal realizes welding under compression roller effect, and 1-2 should be wrapped up other than welding position in welding
Layer wet cloth, prevents remaining part burned because being heated, and when encountering paint position, Ying Caiyong wet cloth adds the method for iron sheet baffle to carry out
Operation can make painted surface without any burnt trace in this way；
(4) the soldered drill point of step (3) and drill point steel handle are carried out purged and packed can be obtained a kind of pcb board special jewel
Head.
The present invention can carry out scale of mass production to drill point steel handle using the production stage of traditional drill point steel handle, and wherein
The hard alloy used is to make that binder is pressurized, is sintered with cobalt powder using tungsten-carbide powder as matrix, usually contains tungsten carbide
94%, it is extremely abrasive since its hardness is very high, there is some strength, is suitable for high-speed cutting, and adopted on the hard alloy substrate chosen
With the ultrahard titanium carbide (TIC) or titanium nitride (TIN) of one layer of 5-7um of chemical vapor deposition, higher hardness is made it have.
Specific embodiment
Technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Embodiment one:
A kind of production technology of pcb board target drill, a kind of production technology of pcb board target drill the following steps are included:
(1) choose certain specification hard alloy as manufacture raw material, the hard alloy be using tungsten-carbide powder as matrix, with
Cobalt powder makees that binder is pressurized, is sintered, and usually contains tungsten carbide 94%, extremely abrasive since its hardness is very high, has certain strong
Degree is suitable for high-speed cutting；
(2) the ultrahard titanium carbide (TIC) of one layer of 5um of chemical vapor deposition is used on the hard alloy substrate that step (1) is chosen
Or titanium nitride (TIN), make it have higher hardness；
(3) kelvin effect and kindred effect of high-frequency current are utilized, the edge of quick drill point and drill point steel handle makes up to melting
State squeezes the method that fused metal realizes welding under compression roller effect, and 1 layer should be wrapped up other than welding position in welding
Wet cloth prevents remaining part burned because being heated, and when encountering paint position, Ying Caiyong wet cloth adds the method for iron sheet baffle to be grasped
Make, can make painted surface without any burnt trace in this way；
(4) the soldered drill point of step (3) and drill point steel handle are carried out purged and packed can be obtained a kind of pcb board special jewel
Head.
Embodiment two:
A kind of production technology of pcb board target drill, a kind of production technology of pcb board target drill the following steps are included:
(1) choose certain specification hard alloy as manufacture raw material, the hard alloy be using tungsten-carbide powder as matrix, with
Cobalt powder makees that binder is pressurized, is sintered, and usually contains tungsten carbide 96%, extremely abrasive since its hardness is very high, has certain strong
Degree is suitable for high-speed cutting；
(2) the ultrahard titanium carbide (TIC) of one layer of 6um of chemical vapor deposition is used on the hard alloy substrate that step (1) is chosen
Or titanium nitride (TIN), make it have higher hardness；
(3) kelvin effect and kindred effect of high-frequency current are utilized, the edge of quick drill point and drill point steel handle makes up to melting
State squeezes the method that fused metal realizes welding under compression roller effect, and 2 layers should be wrapped up other than welding position in welding
Wet cloth prevents remaining part burned because being heated, and when encountering paint position, Ying Caiyong wet cloth adds the method for iron sheet baffle to be grasped
Make, can make painted surface without any burnt trace in this way；
(4) the soldered drill point of step (3) and drill point steel handle are carried out purged and packed can be obtained a kind of pcb board special jewel
Head.
Embodiment three:
A kind of production technology of pcb board target drill, a kind of production technology of pcb board target drill the following steps are included:
(1) choose certain specification hard alloy as manufacture raw material, the hard alloy be using tungsten-carbide powder as matrix, with
Cobalt powder makees that binder is pressurized, is sintered, and usually contains tungsten carbide 95%, extremely abrasive since its hardness is very high, has certain strong
Degree is suitable for high-speed cutting；
(2) the ultrahard titanium carbide (TIC) of one layer of 6um of chemical vapor deposition is used on the hard alloy substrate that step (1) is chosen
Or titanium nitride (TIN), make it have higher hardness；
(3) kelvin effect and kindred effect of high-frequency current are utilized, the edge of quick drill point and drill point steel handle makes up to melting
State squeezes the method that fused metal realizes welding under compression roller effect, and 2 layers should be wrapped up other than welding position in welding
Wet cloth prevents remaining part burned because being heated, and when encountering paint position, Ying Caiyong wet cloth adds the method for iron sheet baffle to be grasped
Make, can make painted surface without any burnt trace in this way；
(4) the soldered drill point of step (3) and drill point steel handle are carried out purged and packed can be obtained a kind of pcb board special jewel
Head.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (1)
1. a kind of production technology of pcb board target drill, it is characterised in that: a kind of production technology of pcb board target drill
The following steps are included:
(1) choose certain specification hard alloy as manufacture raw material, the hard alloy be using tungsten-carbide powder as matrix, with
Cobalt powder makees that binder is pressurized, is sintered, usual 94-96% containing tungsten carbide, extremely abrasive since its hardness is very high, there is one
Determine intensity, is suitable for high-speed cutting；
(2) the ultrahard titanium carbide of one layer of 5-7um of chemical vapor deposition is used on the hard alloy substrate that step (1) is chosen
(TIC) or titanium nitride (TIN), higher hardness is made it have；
(3) kelvin effect and kindred effect of high-frequency current are utilized, the edge of quick drill point and drill point steel handle makes up to melting
State squeezes the method that fused metal realizes welding under compression roller effect, and 1-2 should be wrapped up other than welding position in welding
Layer wet cloth, prevents remaining part burned because being heated, and when encountering paint position, Ying Caiyong wet cloth adds the method for iron sheet baffle to carry out
Operation can make painted surface without any burnt trace in this way；
(4) the soldered drill point of step (3) and drill point steel handle are carried out purged and packed can be obtained a kind of pcb board special jewel
Head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910004107.6A CN109648278A (en) | 2019-01-03 | 2019-01-03 | A kind of production technology of pcb board target drill |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910004107.6A CN109648278A (en) | 2019-01-03 | 2019-01-03 | A kind of production technology of pcb board target drill |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109648278A true CN109648278A (en) | 2019-04-19 |
Family
ID=66117513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910004107.6A Pending CN109648278A (en) | 2019-01-03 | 2019-01-03 | A kind of production technology of pcb board target drill |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109648278A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2512197Y (en) * | 2001-10-11 | 2002-09-18 | 林芳贤 | Small drill for soldering circuit board |
| CN2700044Y (en) * | 2003-05-19 | 2005-05-18 | 任京建 | Thin wall diamond drill bit with profiled tooth |
| CN2823528Y (en) * | 2005-09-14 | 2006-10-04 | 河北小蜜蜂工具集团有限公司 | Integrated dill bit with diamond bit |
| DE102005050974A1 (en) * | 2005-10-25 | 2007-04-26 | Keil Werkzeugfabrik Karl Eischeid Gmbh | Method for production of rotating tool in particular drill bit or router bit, comprises creation of clamping segment with drawing die |
| CN102974871A (en) * | 2012-11-27 | 2013-03-20 | 深圳市金洲精工科技股份有限公司 | Substrate for processing cutter and manufacturing method of substrate and drill bit using substrate |
| CN104416194A (en) * | 2013-08-28 | 2015-03-18 | 天工爱和特钢有限公司 | Chip separation drill |
-
2019
- 2019-01-03 CN CN201910004107.6A patent/CN109648278A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2512197Y (en) * | 2001-10-11 | 2002-09-18 | 林芳贤 | Small drill for soldering circuit board |
| CN2700044Y (en) * | 2003-05-19 | 2005-05-18 | 任京建 | Thin wall diamond drill bit with profiled tooth |
| CN2823528Y (en) * | 2005-09-14 | 2006-10-04 | 河北小蜜蜂工具集团有限公司 | Integrated dill bit with diamond bit |
| DE102005050974A1 (en) * | 2005-10-25 | 2007-04-26 | Keil Werkzeugfabrik Karl Eischeid Gmbh | Method for production of rotating tool in particular drill bit or router bit, comprises creation of clamping segment with drawing die |
| CN102974871A (en) * | 2012-11-27 | 2013-03-20 | 深圳市金洲精工科技股份有限公司 | Substrate for processing cutter and manufacturing method of substrate and drill bit using substrate |
| CN104416194A (en) * | 2013-08-28 | 2015-03-18 | 天工爱和特钢有限公司 | Chip separation drill |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190419 |