CN109643069A - Lamp optical system, lithographic equipment and article manufacturing method - Google Patents
Lamp optical system, lithographic equipment and article manufacturing method Download PDFInfo
- Publication number
- CN109643069A CN109643069A CN201780051936.9A CN201780051936A CN109643069A CN 109643069 A CN109643069 A CN 109643069A CN 201780051936 A CN201780051936 A CN 201780051936A CN 109643069 A CN109643069 A CN 109643069A
- Authority
- CN
- China
- Prior art keywords
- light
- optical system
- illumination
- lens
- integrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Optical Elements Other Than Lenses (AREA)
- Microscoopes, Condenser (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
A kind of lamp optical system that light of the use from light source illuminates illuminated surface is provided.Lamp optical system includes light integrator, configures between light source and illuminated surface；And optical filter, there is adjustment to be incident to the adjustment section of the intensity of the light of light integrator.Light integrator is to make incident light in the rod type light integrator of interior surface reflection.Lamp optical system changes the illumination in illuminated surface by changing the position of the adjustment section on the direction vertical with the optical axis of the lamp optical system.
Description
Technical field
The present invention relates to lamp optical system, lithographic equipment and article manufacturing methods.
Background technique
It is projected in the exposure device for being coated with the substrate of the photosensitive materials such as resist in the pattern that will be formed in mask,
Seek the raising of the illuminance uniformity of the illuminated surfaces such as mask plane, real estate.It is known as the method for improving illuminance uniformity
Have using the lamp optical system for having rod type light integrator.By using rod type light integrator, with the inner surface in stick
The illumination light from secondary souce that order of reflection correspondingly forms is overlapped in stick ejecting end, hereby it is possible to make the photograph of stick outgoing plane
Spend distribution uniformity.
But in the lamp optical system for having rod type light integrator, there are following situations: due to optical system
Pollution, a variety of causes such as eccentric, antireflective coating is uneven, as a result the Illumination Distribution in illuminated surface is observed inhomogeneities.
For the project, patent document 1 is disclosed matches in the position for becoming optical conjugate relationship with the outgoing plane of rod type light integrator
The structure for the multiple light quantity adjustment sections being arranged in correspondence with multiple secondary souce pictures is set.
But in lamp optical system disclosed in patent document 1, when determining the angle point for being concentrated on illuminated surface
When cloth (hereinafter referred to as " efficient light sources distribution "), the Illumination Distribution correcting value in illuminated surface is fixed.Accordingly, it is difficult to correct because subtracting
(hereinafter referred to as " illumination is or not each enorganic even property of uneven illumination caused by film-forming state, assembly precision of reflectance coating etc.
").In addition, in long-time use device and optical element deteriorates, uneven illumination it is even with the time variation has occurred the case where
Under, it needs suitably to replace adjustment section.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2000-269114
Summary of the invention
According to an aspect of the present invention, a kind of lamp optical system is provided, using the light from light source to illuminated surface
It is illuminated comprising: light integrator, configures between the light source and the illuminated surface；It is filtered with optics
Wave device has the adjustment section being adjusted to the intensity for the light for being incident to the light integrator, and the light integrator is to make
Incident light is in the rod type light integrator of interior surface reflection, and the optical filter includes: multiple first areas, in the stick
The injection end face of type light integrator forms the picture of direction same to each other；With multiple second areas, formed in the injection end face
Relative to the picture as relationship with a mirror image, the adjustment section is at least set to the first area, passes through change and institute
The position of the adjustment section on the vertical direction of optical axis of lamp optical system is stated to change the illumination in the illuminated surface.
Detailed description of the invention
Fig. 1 is the figure for showing the structure of exposure device.
Fig. 2 is the schematic diagram for showing the relationship of adjustment section and secondary souce.
Fig. 3 A is the figure for showing the imaging relations of adjustment section and light integrator injection end face.
Fig. 3 B is the figure for showing the configuration example of the adjustment section on optical filter.
Fig. 3 C is the figure for showing the configuration example of the adjustment section on optical filter.
Fig. 4 is the figure for illustrating the effect of optical filter.
Fig. 5 A is the figure for illustrating the bearing calibration of uneven illumination.
Fig. 5 B is the figure for illustrating the bearing calibration of uneven illumination.
Fig. 5 C is the figure for illustrating the bearing calibration of uneven illumination.
Fig. 6 is the flow chart for showing the aligning step of skewed uneven illumination.
Fig. 7 is the flow chart for illustrating the aligning step of the symmetrical uneven illumination of optical axis.
Fig. 8 A is the figure for illustrating the effect of optical filter.
Fig. 8 B is the figure for illustrating the effect of optical filter.
Fig. 9 A is the figure for illustrating the bearing calibration of uneven illumination.
Fig. 9 B is the figure for illustrating the bearing calibration of uneven illumination.
Figure 10 A is the figure for illustrating the effect of optical filter.
Figure 10 B is the figure for illustrating the effect of optical filter.
Figure 11 A is the figure for illustrating the effect of optical filter.
Figure 11 B is the figure for illustrating the effect of optical filter.
Specific embodiment
Hereinafter, referring to attached drawing, the embodiment of the present invention will be described in detail.In addition, the present invention is not limited to following
Embodiment, the following embodiments and the accompanying drawings is only to show implementation concrete example of the invention.In addition, institute in the following embodiments and the accompanying drawings
Whole combinations of the feature of explanation are all not essential for solving the problem of the present invention.
<first embodiment>
Fig. 1 is the skeleton diagram for showing the structure of exposure device 100 of the present embodiment.Exposure device 100 is, for example,
Used in photo-mask process in the manufacturing process of semiconductor devices, it will be formed in master reticle (reticle) R's (mask)
Projection type exposure device in the picture exposure (transfer) to the wafer W as substrate of pattern.In Fig. 1, along the method for wafer W
Line direction is Z axis, using in the face parallel with wafer W face and mutually orthogonal direction is X-axis and Y-axis.Exposure device 100 has
Lamp optical system 101, master reticle mounting table 102, projection optical system 103, wafer stage 104 and control unit 105.
Lamp optical system 101 adjusts the light (light beam) from the discharge lamp 1 as light source, to as illuminable area
Master reticle R is illuminated.The extra-high-pressure mercury vapour lamp of the light such as can be supplied with i line (wavelength 365nm) of discharge lamp 1.In addition,
It is without being limited thereto, the wavelength of the KrF excimer laser, supply 193nm that for example supply the light of wavelength of 248nm also can be used
The ArF excimer laser of light.Supply the F2 laser of the light of the wavelength of 157nm.In addition, in lamp optical system 101 and
In the case that projection optical system 103 is made of catadioptric systems or reflecting system, X-ray, electronics is also can be used in light source
The charged particle rays such as ray.
Master reticle R is such as quartz glass system for foring the pattern (such as circuit pattern) that should be transferred in wafer W
Mother matrix.Master reticle mounting table 102 keeps master reticle R and is movable in each axis direction of X, Y.Projection optical system 103
The light for having passed through master reticle R is projected in wafer W with predetermined multiplying power.Wafer W is that be coated with resist on the surface (photosensitive
Property material), the substrate that is for example formed by monocrystalline silicon.Wafer stage 104 keeps chip through not shown wafer chuck
W is movable in X, Y, Z (sometimes also including ω x, the ω y, ω z as respective direction of rotation) each axis direction.Chip carries
Setting platform 104 can be driven by wafer stage driving portion 114.
Lamp optical system 101 includes oval shape mirror from discharge lamp 1 towards the master reticle R as illuminable area in order
2, the first relay optical system 3, light integrator 4, the second relay optical system 5.Oval shape mirror 2 is will to radiate from discharge lamp 1
Light (light beam) is concentrated on the condenser of the second focal position F2.Illumination region in the valve portion of discharge lamp 1 is for example configured at oval shape mirror 2
The first focus F1 near.The first relay optical system 3 as imaging optical system includes by single or multiple lens structures
At lens before organize 3a (the first lens) and the lens that are made of single or multiple lens after organize 3b (the second lens).Group before lens
3a makes the light from light source become directional light.3b is organized after lens, and the light for becoming directional light by organizing 3a after lens is concentrated on optics
The incident end face 4a of integrator 4.By organizing 3b, the second focal position F2 and light integrator after organizing 3a and lens before these lens
4 incident end face 4a becomes optical conjugate.In the present embodiment, lamp optical system 101, especially include first relaying light
System 3, the optical system of light integrator 4 and the second relay optical system 5 optical axis be set as Z-direction.
In the present embodiment, light integrator 4 is to make incident light in interior surface reflection and corresponding with its order of reflection
Ground forms the rod type light integrator of multiple secondary souce pictures.The shape of light integrator 4 is, for example, quadrangular.That is, optics product
The incident end face parallel with X/Y plane for dividing device 4 and the shape for projecting end face are in rectangle similar with illuminated surface.But,
Such shape is to illustrate, and does not interfere application to have the component with the same effect of light integrator 4.For example, optical integration
Device 4 can also be by the internal hollow bar construction for forming reflecting surface.In addition, the incident end face 4a of light integrator 4 and injection
Cross sectional shape of the end face 4b on X/Y plane can be the polygon other than quadrangle.
Between discharge lamp 1 and light integrator 4, near the conjugate planes S1 being conjugated with master reticle R, that is, wafer W,
Optical filter 6 is vertically configured with optical axis.Optical filter 6 is configured to two-dimensionally move along X/Y plane, the movement
Such as it is carried out by filter driving portion 7.Optical filter 6 can for example be contained in the first relay optical as shown in Figure 1
System 3, and be configured at before lens organize 3a and lens after organize between 3b.Optical filter 6 has to be formed with by light integrator 4
Secondary souce picture quantity be arranged in correspondence with for adjust the light for being incident on light integrator 4 intensity multiple adjustment
Portion.About the optical effect of optical filter 6, then it is described in detail.
Group 3b is configured at from the position of the virtual image face S2 of the secondary souce formed by light integrator 4 and leaves only coke after lens
Away from position at, the illumination light projected substantially in parallel from optical filter 6 and optical axis can temporarily be concentrated on virtual image face S2.
The incident end face 4a of light integrator 4 is configured near the S2 of virtual image face.By the photograph for organizing 3b optically focused after lens
Mingguang City light integrator 4 inner surface multiple reflections and project.From light integrator 4 project illumination light according to as from
The mode of the virtual image of the corresponding discrete secondary souce of order of reflection outwardly projects.Therefore, the illumination projected from light integrator 4
The angle of light is suitable with the injection angle of the illumination light of the virtual image of the secondary souce from the virtual image face of being configured at S2.
The injection end face 4b of light integrator 4, is configured in the multiple light sources picture overlapping of virtual image face S2, and is equably shone
It is bright.After the second relay optical system of light transmission 5 for projecting end face 4b sending of light integrator 4, illumination is used as illuminated surface
Master reticle R.Second relay optical system 5 includes organizing 5a before the lens being made of single or multiple lens, group before the lens
5a makes the light of the injection end face 4b from light integrator 4 become directional light.5a is organized before lens to be configured to along in second
Optical axis direction (Z-direction) after optical system 5 is mobile.Second relay optical system 5 further includes by single or multiple lens structures
At lens after organize 5b, 5b is organized after the lens to be made to become the light of directional light to illuminated surface optically focused by organizing 5a before lens.Lens
The movement of preceding group of 5a is carried out by lens driving portion 51.It, can substantially not by keeping group 5a before lens mobile in optical axis direction
Change distortion while changing focal length.Periphery illumination can be made to increase and decrease by organizing the movement of 5a before lens using the effect.
In the present embodiment, the injection end face 4b of the front side focal position configuration light integrator 4 of 5a is organized before lens,
And the end face 4b and master reticle R as illuminated surface that projects of light integrator 4 is optical conjugate.In addition, strictly speaking,
In order to avoid the foreign matter on the injection end face 4b of light integrator 4 is transferred, the position of ejecting end face 4b can also be made from conjugation
Slightly it is staggered.Also, light, that is, the mask pattern projected from master reticle R is as that can be transferred to crystalline substance via projection optical system 103
On piece W.
Illumination Distribution measurement portion 115 measures the Illumination Distribution of the master reticle R as illuminated surface.Control unit 105 controls
Discharge lamp 1, filter driving portion 7, lens driving portion 51, wafer stage driving portion 114, Illumination Distribution measurement portion 115.Control
Portion 105 may include the storage unit 105a of various data needed for storage control.
Next, being illustrated to the optical effect of optical filter 6.Fig. 2 is to schematically illustrate to be set to optically filtering
The figure of multiple adjustment sections on device and the relationship of the multiple secondary souces formed by light integrator 4.Fig. 2 shows filter from optics
The optical path for the illumination light that wave device 6 and optical axis project in parallel.Adjustment section 60 on optical filter 6 on set optical axis is right
The intensity for the light beam from secondary souce 40 not reflected in the inner surface of light integrator 4 is adjusted.In addition, and adjustment section
60 two outside adjacent pair adjustment sections 61a, 61b are to the secondary souce for reflecting 1 time from the inner surface in light integrator 4
As the intensity of the light beam of 41a, 41b is adjusted.In addition, the two outside adjacent pair adjustment sections with adjustment section 61a, 61b
62a, 62b are to the intensity progress from the inner surface reflection 2 times secondary souces in light integrator 4 as the light beam of 42a, 42b
Adjustment.According to this structure, the respective light beam of multiple secondary souces formed by light integrator 4 can be independently controlled
Transmissivity.
Adjustment section 60,61a, 61b, 62a, 62b are configured at the conjugate planes S1 for projecting end face 4b conjugation with light integrator 4
Near.Therefore, the shape of an adjustment section is corresponding with the illumination region on the master reticle R or wafer W of Fig. 1, adjustment section 60,
The Illumination Distribution for the illumination region that the transmissivity distribution of 61a, 61b, 62a, 62b can be reflected as in wafer W.
Fig. 3 A is the imaging relations for illustrating the injection end face 4b of each adjustment section and light integrator 4 in optical filter 6
Figure.In light integrator 4, the beam reversal from adjacent secondary souce.Therefore, in the ejecting end of light integrator 4
When being oriented " F " of picture that face 4b is formed, the picture of adjacent adjustment section, which becomes, to be oppositely directed to, mutually mirror each other.
Fig. 3 B is the schematic diagram that the optical filter 6 near conjugate planes S1 is configured at from incident side.Here, conduct
Adjustment section has used pattern filter (or light-blocking member).In the present embodiment, multiple patterns of multiple adjustment sections are constituted
Filter is configured at that the mirror in multiple secondary souce pictures with light integrator 4 is corresponding, pre- on optical filter
Fixed position.Optical filter 6 includes multiple first area A, B and multiple secondth areas as the region in addition to first area
Domain.Here, multiple first area A, B are in the area for projecting end face 4b and forming mutually the picture of identical direction each other of light integrator 4
Domain.In addition, multiple second areas are to form the picture relative to first area with mirror image in the end face 4b that projects of light integrator 4
Relationship picture region.In the present embodiment, multiple secondary lights on the surface of optical filter 6, with light integrator 4
Accordingly, rectangular pattern filter 6A, 6B are respectively arranged at multiple first area A, B to source image.In addition, pattern filter
6A, 6B can not also be configured at the whole of multiple first area A, B, and be configured at least part of region.
In the present embodiment, by configuring the pattern filter of circular shape of different sizes as pattern filter
6A, 6B, to make each pattern filter part that there is such effect shown in Fig. 4 (A), (B).By making the straight of each pattern filter
Diameter, transmissivity, be configured to it is appropriate, finally in illuminated surface, as indicate Fig. 4 (A), (B) summation Fig. 4 (C), obtain
Approximatively with the effect of the illumination of the peripheral portion for square proportionally improving illuminated surface of image height.
Generally, in the lamp optical system of projection aligner, if it is desired to taking into account the numerical aperture in illuminated surface
The uniformity of diameter and the uniformity of Illumination Distribution, then due to the angular characteristics of the antireflective coating for lens, there are the photographs on periphery
Spend reduced trend.Therefore, as in the present embodiment, has the function of the optical filter for improving the illumination on periphery to illumination
The correction of distribution is effective.
In addition, the light beam for being incident on light integrator 4 is adjusted to have symmetrical Illumination Distribution relative to optical axis.As a result,
The efficient light sources distribution of illuminated surface is symmetrical relative to chief ray, therefore, defocus is not generated as deviateing.Thereby, it is possible to realities
Exposure under existing good telecentricity.
It is assumed that there is the case where asymmetrical Illumination Distribution relative to optical axis in the illumination light for being incident on light integrator 4
Under, the symmetry of efficient light sources distribution is lost, and is had an impact in the form of this by the deviation of telecentricity to as performance.But according to
Present embodiment is nearly free from the deviation of telecentricity since make pattern filter is configured to that optical axis is symmetrical.
In the present embodiment, as adjustment section used pattern filter 6A, 6B both, still, such as by changing
Become the density etc. of fine dot pattern, can also be made with a kind of pattern and approximatively be divided to square proportional illumination of image height
Cloth.
Hereinafter, being illustrated to the bearing calibration of such uneven illumination shown in Fig. 5 A.The uneven illumination of Fig. 5 A can divide
Solution is the symmetrical arc-shaped of such formation optical axis shown in such skewed uneven illumination and Fig. 5 C shown in Fig. 5 B and more court
To the periphery uneven illumination that then illumination more declines.By calculating the average illumination and inclination distinguished by image height according to Illumination Distribution
Ingredient, and they can be separated.
Firstly, being illustrated to the bearing calibration of the skewed uneven illumination of Fig. 5 B.As described above, present embodiment
Optical filter 6 has the effect of the illumination for substantially square proportionally improving peripheral portion with image height.At this point, if it is assumed that light
The incident end face 4a for learning integrator 4 is equal to illuminated surface, and uses normalized XY coordinate system, then is based on optical filter 6
Illumination Distribution adjustment effect z can write z=a (x 2+y 2).Wherein, a is constant.
Pattern filter 6A, 6B of optical filter 6 are configured to be formed mutually each other in the injection end face 4b of light integrator 4
At least part of multiple first area A, B of the picture of identical direction.Optical filter 6 can along multiple first area A,
It B and is moved along on the direction as multiple second areas in region in addition to this, i.e. on the direction of X/Y plane.Namely
It is the position that can change optical filter 6 in the direction vertical with the optical axis of lamp optical system (Z axis) (X-direction or Y-direction)
It sets.Even if being shone here, moving optical filter 6 on the direction along X/Y plane by what pattern filter 6A, 6B were assigned
The effect of the Illumination Distribution variation in bright face will not cancel out each other.
Therefore, optical filter 6 by optical filter 6 when moving predetermined distance delta in X-direction and Y-direction
The effect z ' of Illumination Distribution adjustment can write z '=a ((x+ δ) 2+ (y+ δ) 2).Wherein, a is constant.It that is to say, generation is depended on
Therefore skewed Illumination Distribution can be generated in 1 item of x, y of δ.
Fig. 6 is the flow chart for showing the aligning step of skewed uneven illumination.In S601, control unit 105 be based on by
The Illumination Distribution data that Illumination Distribution measurement portion 115 is measured calculate the uneven illumination (uneven illumination measurement 1) of illuminated surface.
When the maximum value of the brightness value in illuminated surface is set as Smax, when minimum value is set as Smin, then uneven illumination S for example passes through
Following formula calculates.
S=(Smax-Smin)/(Smax+Smin)
Later, control unit 105 makes optical filter 6 move predetermined distance delta in the X direction in S602, surveys in S603
Determine the uneven illumination (uneven illumination measurement 2) of illuminated surface.Next, control unit 105 makes optical filter 6 in Y in S604
Mobile predetermined distance delta on direction measures the uneven illumination (uneven illumination measurement 3) of illuminated surface in S605.Later, control unit
105 calculate the variable quantity of uneven illumination according to the result that uneven illumination measures 1,2,3 in S606, and are stored in storage unit
105a.The variable quantity is corresponding with the above-mentioned gradient of skewed Illumination Distribution.
Next, control unit 105 is based on the variable quantity calculated in S606, the shifting of calculating optical filter 6 in S607
Dynamic direction and amount of movement.Also, control unit 105 keeps optical filter 6 mobile to direction calculated by filter driving portion 7
The calculated amount of movement of institute.
Later, in S609, control unit 105 measures the uneven illumination (uneven illumination measurement 4) of illuminated surface again,
In S610, confirm whether the uneven illumination converges in scheduled permissible range.Here, if uneven illumination, which converges on, allows model
In enclosing, then processing terminate.On the other hand, if uneven illumination is not converged in permissible range, processing enters S611, feedback photograph
The uneven measurement 4 of degree as a result, returning to S607, then the moving direction and amount of movement of calculating optical filter 6.
Next, the flow chart referring to Fig. 7 is illustrated the bearing calibration of the symmetrical uneven illumination of the optical axis of Fig. 5 C.?
In the case where the symmetrical uneven illumination of optical axis has occurred, periphery illuminance correction amount can be adjusted.As described above, the second relay optical system
System 5 has the knot organized before making lens and change distortion and 5a is moved in the direction of the optical axis while not substantially changing focal length
Structure.Periphery illumination can be made to increase and decrease by organizing the movement of 5a before lens as a result,.
Control unit 105 is found out through group 5a before making lens by Illumination Distribution measurement portion 115 in optical axis direction in S701
On illuminated surface when moving preset distance Δ outermost circumference illumination variable quantity, and the variable quantity is made to be stored in storage
Portion 105a (uneven illumination measurement 1).In addition, the S701 can also be carried out in advance by simulation etc..In S702, control unit 105
Based on the variable quantity, amount of movement of the 5a to optical axis direction is organized before calculating lens.In S703, control unit 105 is driven by lens
The 5a mobile calculated amount of movement of institute in the direction of the optical axis is organized before making lens in portion 51.
Later, in S704, control unit 105 finds out group 5a before making lens again and moves preset distance in the direction of the optical axis
The variable quantity (uneven illumination measurement 2) of the illumination of the outermost circumference of illuminated surface when Δ, in S705, confirms that the variation is
It is no to converge in scheduled permissible range.Here, processing terminate if variation converges in permissible range.On the other hand,
If variation is not converged in permissible range, processing enters S706, feedback uneven illumination measurement 2 as a result, return to S703,
The amount of movement of calculating optical filter 6 again.In this way, control unit 105 carries out feedback control to the amount of movement of optical filter 6, with
Converge on the uneven illumination calculated according to the Illumination Distribution measured by Illumination Distribution measurement portion 115 in permissible range.
As described above, by carrying out the movement of the optical filter 6 of the rate-determining steps according to Fig. 6 and according to figure
This both sides of the driving organized before the lens of 7 rate-determining steps, are able to carry out more accurate correction.At this point, executed by control unit 105
The rate-determining steps of Fig. 6 and the rate-determining steps of Fig. 7 both can be executed serially in temporal sequence, can also be executed parallel.
In addition, the rate-determining steps of Fig. 6 and the respective implementing result of the rate-determining steps of Fig. 7 can be stored in storage unit 105a.
When being executed again under same lighting condition, implementing result is recalled from storage unit 105a and each factor_driven can be made to optimum bit
It sets.Thereby, it is possible to omit the such step of Fig. 6, Fig. 7, the photograph of skewed uneven illumination and concentric circles is promptly carried out
Spend the correction of uneven (the symmetrical uneven illumination of optical axis).
Furthermore, it is contemplated that when lamp optical system is by for a long time in use, the transmissivity of any one lens in device is bad
Change, rotates asymmetrical skewed uneven illumination.In this case, by executing the control of Fig. 6 and Fig. 7 again
Step processed can also carry out the uneven illumination (the symmetrical uneven illumination of optical axis) of skewed uneven illumination and concentric circles
Correction.
In addition, for example, in Japanese Unexamined Patent Publication 2001-135564 bulletin, in multiple micro lens two-dimensionally with scheduled
Near the plane of incidence of the light integrator of spacing arrangement, it is configured with optical filter.Optical filter has and can adjust and structure
At the light quantity adjustment section of the transmission light quantity of the corresponding multiple regions of multiple micro lens of light integrator.In this way
Structure, by making optical filter along moving the control for being also able to carry out uneven illumination in X/Y plane.
But the usual price of light integrator that multiple micro lens are two-dimensionally arranged with preset space length is relatively high, therefore,
Cost is relatively low for the rod type light integrator of present embodiment.According to the structure for the present embodiment for using rod type light integrator,
By utilizing the configuration position for determining each adjustment section the case where becoming such imaging relations shown in Fig. 3 A.Specifically,
Multiple adjustment sections are formed in the injection end face of rod type light integrator with the light by each adjustment section for transmiting multiple adjustment sections
The mode for being oriented identical direction of picture of each adjustment section configure on optical filter.Thus, it is possible to carry out uneven illumination control
System.
<second embodiment>
Next, being illustrated to the lamp optical system that second embodiment is related to.The outline structure of device and Fig. 1 are same
Sample.Fig. 3 C is the schematic diagram of the optical filter 6 of the present embodiment from incident side.In the table of the optical filter 6
Face, accordingly with multiple secondary souce pictures of light integrator 4, rectangular pattern filter 6C is configured at multiple first areas
C, rectangular pattern filter 6D are configured at multiple second area D.In addition, pattern filter 6C, 6D can also be unworthy of respectively
It is placed in the whole of multiple first area C and multiple second area D and is configured at least part region.Here, multiple first
Region C is to form the region of the picture of direction same to each other in the injection end face 4b of light integrator 4.In addition, multiple second area D
It is to form area relative to multiple first area C as the picture of relationship with a mirror image in the end face 4b that projects of light integrator 4
Domain.
In the present embodiment, make pattern filter 6C have as Fig. 8 A approximatively with image height square proportionally
Improve the effect of the illumination of the peripheral portion of illuminated surface.In addition, make pattern filter 6D have its opposite characteristic i.e. such as Fig. 8 B that
The approximatively effect with the illumination for square proportionally reducing peripheral portion of image height of sample.Pattern filter 6C in this way,
The combination of 6D, as a whole, the effect for being configured to Illumination Distribution variation are cancelled out each other.
Hereinafter, being illustrated to the bearing calibration of uneven illumination skewed as Fig. 9 A.If it is assumed that optical integration
4 incident end face 4a of device is equal to illuminated surface, and uses normalized XY coordinate system, then the effect z of optical filter 6 in order to
It is easy and only in an X direction it is upper with one-dimensional representation when, become z=ax2-ax2=0, Illumination Distribution do not had an impact.Wherein, a is
Constant.
For the effect z ' when optical filter 6 is moved predetermined distance delta in the X direction, due to being filtered in pattern
In wave device 6C, 6D, the direction change of δ, therefore z '=a (x+ δ) 2-a (x- δ) 2 can be write.It that is to say, generate the x for depending on δ
First order therefore can generate skewed Illumination Distribution.
It in the present embodiment, also can be by skewed illumination not by executing the step same as the flow chart of Fig. 6
It is corrected to as Fig. 9 B flat.In this way, the periphery luminance reduction in original secondary shape is small, skewed uneven illumination is accounted for
In the case where leading position, the structure of adjustment section is effective to the correction of Illumination Distribution as the present embodiment.
<third embodiment>
Next, the lamp optical system being related to third embodiment is illustrated.In the present embodiment, second is real
The effect for applying pattern filter 6C, 6D in mode is different.The pattern filter 6C in present embodiment is set to have Figure 10 A such
, the effect that Illumination Distribution approximatively proportionally changes with the cube of image height.In addition, making pattern filter 6D that there is its phase
The effect that anti-characteristic, that is, Figure 10 B is such, Illumination Distribution approximatively proportionally changes with the cube of image height.In this way
Pattern filter 6C, 6D combination, as a whole, be configured to Illumination Distribution variation effect cancel out each other.
It is same as second embodiment, for the effect z of optical filter 6, when only indicating that X-direction is one-dimensional, then
As z=ax3-ax3=0, Illumination Distribution is not influenced.Wherein, a is constant.
For the effect z ' when optical filter 6 is moved predetermined distance delta in the X direction, due to being filtered in pattern
In wave device 6C, 6D, the direction change of δ, therefore become z '=a (x+ δ) 3-a (x- δ) 3.In the present embodiment, generation depends on
Therefore the quadratic term of the x of δ can generate the secondary Illumination Distribution of concentric circles.
It in the present embodiment, also can will be two as Figure 11 A by executing the step same as the flow chart of Fig. 6
The Illumination Distribution of secondary shape is corrected into becomes flat as shown in fig. 11b.In this way, in originally not skewed uneven illumination, and
In the case that the secondary uneven illumination of concentric circles is occupied an leading position, the structure of adjustment section is to illumination as the present embodiment
Distribution correction is effective.
In addition, even if the Illumination Distribution for wanting correction is high order shape more than three times, by suitably setting pattern filtering
The transmissivity of device is distributed, and is also able to carry out uneven illumination correction.
According to above each embodiment, it is capable of providing to the advantageous technology of the raising of the correction performance of uneven illumination.
<embodiment of article manufacturing method>
Article manufacturing method in embodiments of the present invention, such as be suitble to the micro elements such as manufacturing semiconductor devices, have
Element of microstructure and other items.The article manufacturing method of present embodiment include using above-mentioned lithographic equipment (exposure device,
Imprinting apparatus, drawing apparatus etc.) to substrate transfer mother matrix pattern process and to the substrate for having transferred pattern by the process
The process processed.In turn, which includes that other well-known processes (film forming, vapor deposition, adulterate, is flat by oxidation
Change, etching, resist removing, cutting, bonding, encapsulation etc.).The article manufacturing method of present embodiment and previous method phase
Than being advantageous in terms of at least one of the performance of article, quality, productivity, production cost.
The present invention is not limited to the above embodiments, without departing from purport and range of the invention, is able to carry out various
Change and deformation.Therefore, in order to which open the scope of the present invention encloses claim below.
Advocate based on the Japanese Patent Application Patent 2016-168546 that the application was proposed by August 30th, 2016 excellent
It first weighs, so far by its whole contents reference.
Claims (9)
1. a kind of lamp optical system, illuminated surface is illuminated using the light from light source comprising:
Light integrator configures between the light source and the illuminated surface；With
Optical filter has the adjustment section being adjusted to the intensity for the light for being incident to the light integrator,
The light integrator is to make the light of incidence in the rod type light integrator of interior surface reflection,
The optical filter includes: multiple first areas, is formed in the injection end face of the rod type light integrator mutually mutual
With the picture of direction；With multiple second areas, formed in the injection end face relative to the picture as relationship with a mirror image,
The adjustment section is at least set to the first area,
It is changed by changing the position of the adjustment section on the direction vertical with the optical axis of the lamp optical system described
Illumination in illuminated surface.
2. lamp optical system according to claim 1, which is characterized in that
The adjustment section is set to multiple first areas, without being set to the second area.
3. lamp optical system according to claim 1, which is characterized in that
The adjustment section is configured at multiple first areas and multiple second areas,
The characteristic of the Illumination Distribution in the illuminated surface adjusted by the adjustment section of the first area and pass through institute
The characteristic for stating the Illumination Distribution in the illuminated surface of the adjustment section adjustment of second area is different.
4. lamp optical system according to claim 1, which is characterized in that
Also there is the first relay optical system, first relay optical system configuration the light source and the light integrator it
Between, the light from the light source is directed to the light integrator,
First relay optical system includes: the first lens, and the light from light source is made to become directional light；It, will with the second lens
The incident end face of the light integrator is concentrated on by the light that first lens become directional light,
The optical filter configuration is between first lens and second lens.
5. lamp optical system according to claim 1, which is characterized in that
Also there is measurement portion, which measures the Illumination Distribution of the illuminated surface,
The position of the optical filter is changed based on the Illumination Distribution measured by the measurement portion.
6. lamp optical system according to claim 5, which is characterized in that
Also there is control unit, which controls the driving of the optical filter,
The control unit is so as to converge on appearance according to the uneven illumination that the Illumination Distribution measured by the measurement portion calculates
Perhaps the mode in range carries out feedback control to the driving of the optical filter.
7. lamp optical system according to claim 6, which is characterized in that
Also have the second relay optical system, second relay optical system configuration the light integrator with it is described illuminated
Between face, the light of the injection end face from the light integrator is directed to the illuminated surface,
Second relay optical system includes the third lens, which makes the injection from the light integrator
The light of end face becomes directional light, and is configured to move on the optical axis direction of second relay optical system,
The control unit according to the uneven illumination that the Illumination Distribution measured by the measurement portion calculates also so as to converge on
Mode in permissible range carries out feedback control to the driving of the third lens.
8. the pattern of mother matrix is formed in substrate by a kind of lithographic equipment characterized by comprising
Lamp optical system described in claim 1 illuminates the mother matrix；With
The pattern is projected on the substrate by projection optical system.
9. a kind of article manufacturing method characterized by comprising
The process that pattern is formed in substrate using lithographic equipment according to any one of claims 8；With
To the process that the substrate for foring the pattern by the process is processed,
Article is obtained from the substrate processed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-168546 | 2016-08-30 | ||
| JP2016168546A JP6761306B2 (en) | 2016-08-30 | 2016-08-30 | Illumination optics, lithography equipment, and article manufacturing methods |
| PCT/JP2017/030779 WO2018043423A1 (en) | 2016-08-30 | 2017-08-28 | Illuminating optical system, lithography device, and article manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109643069A true CN109643069A (en) | 2019-04-16 |
| CN109643069B CN109643069B (en) | 2021-07-27 |
Family
ID=61300901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780051936.9A Active CN109643069B (en) | 2016-08-30 | 2017-08-28 | Illumination optical system, lithographic apparatus and article manufacturing method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6761306B2 (en) |
| KR (1) | KR102212855B1 (en) |
| CN (1) | CN109643069B (en) |
| TW (1) | TWI645261B (en) |
| WO (1) | WO2018043423A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7148268B2 (en) * | 2018-05-01 | 2022-10-05 | キヤノン株式会社 | Control apparatus, lithographic apparatus, and method of manufacturing an article |
| TWI700960B (en) * | 2019-05-29 | 2020-08-01 | 財團法人國家實驗研究院 | Light source adjusting method, light source system and computer program product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135564A (en) * | 1999-11-05 | 2001-05-18 | Canon Inc | Projection aligner |
| US20010046039A1 (en) * | 1999-03-16 | 2001-11-29 | Nikon Corporation | Illumination apparatus, exposure apparatus and exposure method |
| CN1400507A (en) * | 2001-07-27 | 2003-03-05 | 佳能株式会社 | Lighting system, projecting exposure apparatus and device making process |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3440458B2 (en) * | 1993-06-18 | 2003-08-25 | 株式会社ニコン | Illumination device, pattern projection method, and semiconductor element manufacturing method |
| JP4310816B2 (en) * | 1997-03-14 | 2009-08-12 | 株式会社ニコン | Illumination apparatus, projection exposure apparatus, device manufacturing method, and projection exposure apparatus adjustment method |
| JP3259657B2 (en) * | 1997-04-30 | 2002-02-25 | キヤノン株式会社 | Projection exposure apparatus and device manufacturing method using the same |
| AU1891299A (en) * | 1998-01-19 | 1999-08-02 | Nikon Corporation | Illuminating device and exposure apparatus |
| JP2000269114A (en) | 1999-03-16 | 2000-09-29 | Nikon Corp | Illuminating device, aligner and exposure method |
| AU2940600A (en) * | 1999-03-24 | 2000-10-09 | Nikon Corporation | Exposure method and apparatus |
| JP2001135560A (en) * | 1999-11-04 | 2001-05-18 | Nikon Corp | Illuminating optical device, exposure, and method of manufacturing micro-device |
| TW200625027A (en) * | 2005-01-14 | 2006-07-16 | Zeiss Carl Smt Ag | Illumination system for a microlithographic projection exposure apparatus |
| JP2010097975A (en) * | 2008-10-14 | 2010-04-30 | Nikon Corp | Correction unit, illumination optical system, exposure apparatus, and device manufacturing method |
-
2016
- 2016-08-30 JP JP2016168546A patent/JP6761306B2/en active Active
-
2017
- 2017-08-28 WO PCT/JP2017/030779 patent/WO2018043423A1/en active Application Filing
- 2017-08-28 KR KR1020197008164A patent/KR102212855B1/en active IP Right Grant
- 2017-08-28 TW TW106129100A patent/TWI645261B/en active
- 2017-08-28 CN CN201780051936.9A patent/CN109643069B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010046039A1 (en) * | 1999-03-16 | 2001-11-29 | Nikon Corporation | Illumination apparatus, exposure apparatus and exposure method |
| JP2001135564A (en) * | 1999-11-05 | 2001-05-18 | Canon Inc | Projection aligner |
| CN1400507A (en) * | 2001-07-27 | 2003-03-05 | 佳能株式会社 | Lighting system, projecting exposure apparatus and device making process |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201820045A (en) | 2018-06-01 |
| JP2018036425A (en) | 2018-03-08 |
| KR20190040294A (en) | 2019-04-17 |
| JP6761306B2 (en) | 2020-09-23 |
| CN109643069B (en) | 2021-07-27 |
| TWI645261B (en) | 2018-12-21 |
| KR102212855B1 (en) | 2021-02-05 |
| WO2018043423A1 (en) | 2018-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4352042B2 (en) | Use of substrate table or mask table surface flatness information to reduce overlay | |
| JP3303758B2 (en) | Projection exposure apparatus and device manufacturing method | |
| EP1083462A1 (en) | Exposure method and system, photomask, method of manufacturing photomask, micro-device and method of manufacturing micro-device | |
| JP2001313250A (en) | Aligner, its adjusting method, and method for fabricating device using aligner | |
| WO1999034255A1 (en) | Method and apparatus for manufacturing photomask and method of fabricating device | |
| KR20020004861A (en) | Lithographic apparatus, device manufacturing method, and device manufactured thereby | |
| JP3459773B2 (en) | Projection exposure apparatus and device manufacturing method | |
| KR20010085449A (en) | Method of measuring aberration in an optical imaging system | |
| US7369214B2 (en) | Lithographic apparatus and device manufacturing method utilizing a metrology system with sensors | |
| JP3916877B2 (en) | Lithographic apparatus, device manufacturing method, and device manufactured thereby | |
| WO2008126926A1 (en) | Exposure method and electronic device manufacturing method | |
| JP2004343079A (en) | Device manufacturing method | |
| US6614597B2 (en) | Illumination apparatus and projection exposure apparatus | |
| CN109643069A (en) | Lamp optical system, lithographic equipment and article manufacturing method | |
| JP5668999B2 (en) | Exposure method, exposure apparatus, and device manufacturing method | |
| JP2007194600A (en) | Lithography device, and device manufacturing method | |
| JP2001044116A (en) | Optical correction plate and application in lithography projector | |
| TW394862B (en) | Lithographic projection apparatus | |
| JP4277016B2 (en) | Illumination assembly, method of supplying a radiation beam, lithographic projection apparatus and device manufacturing method | |
| KR20230158096A (en) | Clamp electrode changes for improved overlay | |
| JP6371869B2 (en) | Method for modifying a lithographic apparatus | |
| JPWO2004066371A1 (en) | Exposure equipment | |
| JP2002139406A (en) | Mask for measuring optical characteristic, method of measuring optical characteristic and production method of exposer | |
| CN105446085B (en) | Illuminating and optical apparatus, exposure device and the method for manufacturing article | |
| TWI842962B (en) | Optical pulse stretcher, extended optical pulse stretcher, laser source, lithographic apparatus, and method for generating and directing a laser beam |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |