CN109640592A - A kind of radiator of electronic component - Google Patents
A kind of radiator of electronic component Download PDFInfo
- Publication number
- CN109640592A CN109640592A CN201811633557.3A CN201811633557A CN109640592A CN 109640592 A CN109640592 A CN 109640592A CN 201811633557 A CN201811633557 A CN 201811633557A CN 109640592 A CN109640592 A CN 109640592A
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- CN
- China
- Prior art keywords
- electronic component
- radiator
- cold plate
- heat dissipation
- uniform temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiator of electronic component, including heat dissipation cold plate and uniform temperature material, the uniform temperature material is arranged between the heat dissipation cold plate and the high heat flux density electronic component.By the way that uniform temperature material is added, the contact area of heat dissipation cold plate Yu high heat flux density electronic component is greatly increased, while also functioning to the effect of interface filling, reduction heat dissipation cold plate and to the thermal resistance value between electronic component.And compared with air-cooled and common liquid cooling, there is higher radiating efficiency.
Description
Technical field
The present invention relates to field of computer technology, it particularly relates to a kind of radiator of electronic component.
Background technique
With the continuous development of science and technology, electronic product starts to miniaturization.The miniaturization of electronic component is not only
Shape is reduced, and also increases the power loss density of electronic device, electronic device heater element is concentrated more, leads to list
Plane product internal heat generation amount increases sharply, and operating temperature rises rapidly.Therefore, heat dissipation technology is to restrict the miniaturization of electronic device
An important factor for.Research has shown that temperature is every to increase by 10 DEG C, and the reliability of system reduces by 50% when electronic device works.It is more than
Half electronic component failure be due to operating temperature it is excessively high caused by.Currently, commonly to the heat dissipation hand of electronic device
Section is generally the technical methods such as forced air cooling and water-cooled to radiate to electronic component.
For currently used technology, forced air cooling means can satisfy general technical requirements, but work as environment
When the temperature is excessively high, it is not able to satisfy the radiating requirements of electronic device.To solve the above-mentioned problems, many researchers are by cold plate
Formula heat dissipation technology is introduced into the cooling system of electronic device, since the specific heat of liquid is larger, so heat dissipation effect is preferable.But
Since liquid cannot be contacted directly with electronic device, so, liquid usually in pipeline internal flow, generally use heating device with
Liquid line carrys out contact heat-exchanging, due to the small volume of electronic device, and electronic device surface also and it is not all be processed as it is smooth
Plane, it is smaller that this will lead to the contact area between electronic device and cold plate, so, even if using liquid cooling, it can not be to high fever
The electronic device of current density is radiated well.
Summary of the invention
It being influenced for radiating in the related technology by circumstance temperature, electronic component contact heat dissipation area is small, and contact surface thermal resistance is big, from
And the problem for causing radiating efficiency low, the present invention propose a kind of radiator of high heat flux density electronic component, change electronics member
The radiating mode of part increases the heat dissipation area that cold plate effectively contacts, makes entire radiator radiating efficiency with higher.
The technical scheme of the present invention is realized as follows:
The present invention provides a kind of radiator of electronic component, including heat dissipation cold plate and uniform temperature material, the samming material
Material is arranged between the heat dissipation cold plate and the electronic component.
In some embodiments, the heat dissipation cold plate is the pipeline for having liquid to flow.
In some embodiments, the uniform temperature material include: heat-conducting pad, graphite patch, soft metal or liquid metals piece/
Cream.
In some embodiments, the heat-conducting pad with a thickness of 0.5-5.0mm, thermal coefficient 1.9-5.0w/mK,
150 DEG C of high temperature resistant.
In some embodiments, the horizontal thermal conductivity factor of the graphite patch is 1500w/mK, vertical thermal coefficient 10-
15w/m·K。
In some embodiments, the soft metal includes indium sheet, thermal coefficient 60-86w/mK.
In some embodiments, liquid metal sheet/cream thermal coefficient be 60-80w/mK, 500 DEG C of high temperature resistant.
Radiator provided in an embodiment of the present invention can be very good to solve the biggish electronic element radiating effect of heat flow density
The problem of fruit difference.And by the way that uniform temperature material is added, greatly increase connecing for heat dissipation cold plate and high heat flux density electronic component
Contacting surface product.And compared with air-cooled and common liquid cooling, there is higher radiating efficiency.
Detailed description of the invention
It in order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below will be to institute in embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the schematic diagram of the radiator of high heat flux density electronic component according to an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art's every other embodiment obtained belong to what the present invention protected
Range.
To solve the above-mentioned problems, the present invention radiates to high heat flux density element using liquid cold plate technology, still
Since the contact area between cold plate and heater element is smaller, it is difficult preferably to radiate to it, for this purpose, the application is in liquid
Uniform temperature material is embedded among the electronic component of flow duct and high heat flux density, the heat for making electronic component shed is transferred to first
Uniform temperature material, since uniform temperature material has good heating conduction, so, even heat is distributed in uniform temperature material surface,
Heat is preferably transferred in cold plate by adiabator again, and the liquid that heat is constantly flowed is taken away.To reach heater element
Better heat dissipation effect.
As shown in Figure 1, according to an embodiment of the invention, provide a kind of radiator of high heat flux density electronic component 5,
Including heat dissipation cold plate 1 and uniform temperature material 4, uniform temperature material 4 is arranged between heat dissipation cold plate 1 and high heat flux density electronic component 5.
In an embodiment of the present invention, heat dissipation cold plate 1 is liquid flow conduits, including cold plate inlet 2 and cold plate go out liquid
Mouth 3.
Uniform temperature material 4 includes: heat-conducting pad, graphite patch, soft metal or liquid metals piece/cream.
Wherein, heat-conducting pad with a thickness of 0.5-5.0mm, thermal coefficient 1.9-5.0w/mK, 150 DEG C of high temperature resistant.
In some embodiments, the horizontal thermal conductivity factor of graphite patch is 1500w/mK, vertical thermal coefficient about 10-
15w/m·K。
In some embodiments, soft metal includes indium sheet, and thermal coefficient can arrive 60-86w/mK, it can be achieved that ultra-thin, extension
Property is superpower.
In some embodiments, liquid metal sheet/cream thermal coefficient be 60-80w/mK, 500 DEG C of high temperature resistance.
Radiator provided in an embodiment of the present invention can be very good to solve the biggish electronic element radiating effect of heat flow density
The problem of fruit difference.And by the way that uniform temperature material is added, greatly increase connecing for heat dissipation cold plate and high heat flux density electronic component
Contacting surface product.And compared with air-cooled and common liquid cooling, there is higher radiating efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of radiator of electronic component, including heat dissipation cold plate and uniform temperature material, which is characterized in that the uniform temperature material is set
It sets between the heat dissipation cold plate and the electronic component.
2. the radiator of electronic component according to claim 1, which is characterized in that the heat dissipation cold plate is that have liquid flow
Dynamic pipeline.
3. the radiator of electronic component according to claim 1, which is characterized in that the uniform temperature material includes: thermally conductive
Gasket, graphite patch, soft metal or liquid metals piece/cream.
4. the radiator of electronic component according to claim 3, which is characterized in that the heat-conducting pad with a thickness of
0.5-5.0mm, thermal coefficient 1.9-5.0w/mK, 150 DEG C of high temperature resistant.
5. the radiator of electronic component according to claim 3, which is characterized in that the level of the graphite patch is thermally conductive
Coefficient is 1500w/mK, vertical thermal coefficient 10-15w/mK.
6. the radiator of electronic component according to claim 3, which is characterized in that the soft metal includes indium sheet, is led
Hot coefficient is 60-86w/mK.
7. the radiator of electronic component according to claim 3, which is characterized in that the thermally conductive system of liquid metal sheet/cream
Counting is 60-80w/mK, 500 DEG C of high temperature resistant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633557.3A CN109640592A (en) | 2018-12-29 | 2018-12-29 | A kind of radiator of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633557.3A CN109640592A (en) | 2018-12-29 | 2018-12-29 | A kind of radiator of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109640592A true CN109640592A (en) | 2019-04-16 |
Family
ID=66054458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811633557.3A Pending CN109640592A (en) | 2018-12-29 | 2018-12-29 | A kind of radiator of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109640592A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101420835A (en) * | 2007-10-26 | 2009-04-29 | 财团法人工业技术研究院 | Low melting point alloy thermal interface material |
| CN101427095A (en) * | 2006-01-06 | 2009-05-06 | 格拉弗技术国际控股有限公司 | Microchannel heat sink manufactured from graphite materials |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal radiating mechanism |
| CN107863330A (en) * | 2017-10-27 | 2018-03-30 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| KR20180113811A (en) * | 2017-04-07 | 2018-10-17 | 주식회사 엘지화학 | Battery module and battery pack including the same |
| CN108811447A (en) * | 2018-06-26 | 2018-11-13 | 西安交通大学 | A kind of liquid cooling plate of tape channel |
| CN208111637U (en) * | 2018-05-08 | 2018-11-16 | 苏州正力蔚来新能源科技有限公司 | New-energy automobile dynamic lithium battery liquid cooling plate |
| CN108987851A (en) * | 2018-08-22 | 2018-12-11 | 广州小鹏汽车科技有限公司 | A kind of water-cooled plate and water-cooled battery |
| CN109041537A (en) * | 2018-08-30 | 2018-12-18 | 西安电子科技大学 | A kind of the self-regulation runner cold plate and self-adjusting method of marmem driving |
-
2018
- 2018-12-29 CN CN201811633557.3A patent/CN109640592A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101427095A (en) * | 2006-01-06 | 2009-05-06 | 格拉弗技术国际控股有限公司 | Microchannel heat sink manufactured from graphite materials |
| CN101420835A (en) * | 2007-10-26 | 2009-04-29 | 财团法人工业技术研究院 | Low melting point alloy thermal interface material |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal radiating mechanism |
| KR20180113811A (en) * | 2017-04-07 | 2018-10-17 | 주식회사 엘지화학 | Battery module and battery pack including the same |
| CN107863330A (en) * | 2017-10-27 | 2018-03-30 | 西安交通大学 | A kind of grade micro-channel liquid cooling plate |
| CN208111637U (en) * | 2018-05-08 | 2018-11-16 | 苏州正力蔚来新能源科技有限公司 | New-energy automobile dynamic lithium battery liquid cooling plate |
| CN108811447A (en) * | 2018-06-26 | 2018-11-13 | 西安交通大学 | A kind of liquid cooling plate of tape channel |
| CN108987851A (en) * | 2018-08-22 | 2018-12-11 | 广州小鹏汽车科技有限公司 | A kind of water-cooled plate and water-cooled battery |
| CN109041537A (en) * | 2018-08-30 | 2018-12-18 | 西安电子科技大学 | A kind of the self-regulation runner cold plate and self-adjusting method of marmem driving |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100193 building 36, Zhongguancun Software Park, 8 North East West Road, Haidian District, Beijing. Applicant after: Dawning data infrastructure innovation technology (Beijing) Co.,Ltd. Address before: 100193 room 528, 5th floor, building 36, courtyard 8, Dongbeiwang West Road, Haidian District, Beijing Applicant before: SUGON ENERGY-SAVING TECHNOLOGY (BEIJING) Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |