CN109639873A - Electronic product middle frame and preparation method thereof - Google Patents
Electronic product middle frame and preparation method thereof Download PDFInfo
- Publication number
- CN109639873A CN109639873A CN201811455878.9A CN201811455878A CN109639873A CN 109639873 A CN109639873 A CN 109639873A CN 201811455878 A CN201811455878 A CN 201811455878A CN 109639873 A CN109639873 A CN 109639873A
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- China
- Prior art keywords
- frame
- electronic product
- metal master
- plastic parts
- outer peripheral
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
- B29C45/14475—Joining juxtaposed parts of a single article, e.g. edges of a folded container blank
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of electronic product middle frames, comprising: the frame of middle plate and the outer peripheral edge for being disposed around middle plate.Middle plate includes: the plastic parts of metal master with the outer peripheral edge for being disposed around metal master；Metal master is die cast part；Plastic parts is by being molded in the outer peripheral edge of metal master；Frame is the ceramic member of peripheral frame shape；It is Nian Jie by colloid between the inside of frame and the outside of plastic parts.Meanwhile also providing a kind of production method of electronic product middle frame.The invention has the benefit that using frame complexed metal main body made of ceramics, it can guarantee the intensity of electronic product middle frame, and using plastic parts as intermediate connector between frame and metal master, the weakening effect of the transmission signal to electronic product can be reduced.When electronic product falls and falls, the impact force that frame is subjected to first passes through plastic parts and colloid is buffered, it is possible to reduce the impact force to the electronic device being mounted on metal master strengthens the protective capability to electronic device.
Description
Technical field
The present invention relates to electronic products manufacturing technology fields, more particularly to a kind of electronic product middle frame and its production side
Method.
Background technique
Currently, most of electronic products is all that middle frame structure is used to construct product for core.For example, the center in mobile phone
As most of electronic devices supporting body and use.Traditional electronic product middle frame, it is most of to use aluminum alloy frame, mesh
Be to reinforce electronic product to fall impact resistance when falling, but aluminum alloy frame also functions to the transmission signal of electronic product
Certain weakening effect.In addition, aluminum alloy frame, when making impact with the ground, it is metal production that impact force, which can be transmitted to equally,
On middle plate, transition is not buffered, and main carriers of the middle plate as electronic device, this impact are easy to damage electronic device.Cause
This, needs to develop a kind of novel electronic product middle frame, under the premise of meeting the requirement of securement strength, reduces and produces to electronics
The weakening of the transmission signal of product, and reinforce falling protective capability when falling to electronic device.
Summary of the invention
Based on this, the present invention provides a kind of electronic product middle frame, and middle plate is composite structured, the gold that die cast is obtained
Owner's body obtains the plastic parts positioned at the outer peripheral edge of metal master using injection molding.Frame is ceramic member, and frame is interior
It is Nian Jie by colloid between side and the outside of plastic parts.Using frame complexed metal main body made of ceramics, it is ensured that electronics produces
The intensity of product center, and use plastic parts as intermediate connector between frame and metal master, it can reduce to electricity
The weakening effect of the transmission signal of sub- product.In addition, the impact force that frame is subjected to first passes through plastic cement when electronic product falls and falls
Part is buffered, and is then just transmitted on metal master, it is possible to reduce the impact to the electronic device being mounted on metal master
Power strengthens the protective capability to electronic device.
A kind of electronic product middle frame, comprising:
Middle plate；Middle plate includes: the plastic parts of metal master with the outer peripheral edge for being disposed around metal master；Metal master is die casting
Molded part；Plastic parts is by being molded in the outer peripheral edge of metal master；And
It is disposed around the frame of the outer peripheral edge of middle plate；Frame is the ceramic member of peripheral frame shape；The inside of frame and plastic parts it is outer
It is bonded between side by colloid.
Above-mentioned electronic product middle frame, middle plate is composite structured, the metal master that die cast is obtained, using being molded into
Type obtains the plastic parts positioned at the outer peripheral edge of metal master.Frame is ceramic member, and the outside of the inside of frame and plastic parts
Between pass through colloid be bonded.Using frame complexed metal main body made of ceramics, it is ensured that the intensity of electronic product middle frame, and
Using plastic parts as intermediate connector between frame and metal master, the transmission signal to electronic product can be reduced
Weakening effect.In addition, the impact force that frame is subjected to first passes through plastic parts and colloid is buffered when electronic product falls and falls,
Then it is just transmitted on metal master, it is possible to reduce the impact force to the electronic device being mounted on metal master is strengthened to electricity
The protective capability of sub- device.
The outside of middle plate is equipped with groove in one of the embodiments,；The convex block for patching groove is convexly equipped on the inside of frame.
It when middle plate is docked with frame, can be aligned using groove and convex block, improve the precision of assembling, and plate and side in reinforcement
The stability of frame after assembling.
Groove takes shape in the outer peripheral edge of metal master in one of the embodiments,；Plastic parts is equipped with and passes through for convex block
Keep away a hole.
The outer peripheral edge of plastic parts forms slit antenna in one of the embodiments,.When electronic product, which is fallen, to be fallen, frame
Also extruding can be generated to slit antenna, since the slit antenna takes shape on plastic parts, therefore slit antenna also has plastic cement
The elastic deformation ability of part, can also play the role of buffering.
Frame includes: a plurality of ceramic edge strip for being successively spliced into window frame structure in one of the embodiments,.Frame is set
It is calculated as a plurality of ceramic edge strip successively spliced, is conducive to the convenience for improving processing and assembling.
Meanwhile providing a kind of production method of electronic product middle frame.
A kind of production method of electronic product middle frame, comprising steps of
Raw metal is obtained into metal master by die cast；
Metal master is placed in mold and carries out injection process, so that the outer peripheral edge of metal master molds plastic parts,
Obtain middle plate；
Ceramic raw material is obtained into the blank part for being used to make frame by injection molding and sinter molding；
Blank part is subjected to CNC machine-shaping, obtains frame；
It is obtained by the dispensing between the outside of moulding and the inside of frame so that middle plate bonds together with frame
Electronic product middle frame.
In one of the embodiments, by the dispensing between the outside of moulding and the inside of frame so that middle plate with
Frame bonds together, obtain electronic product middle frame comprising steps of
In the points outside hot melt adhesive of moulding；
The outside of moulding will be tightly attached on the inside of frame, so that middle plate and frame are bonded together；
The middle plate and frame of bonding are carried out pressure maintaining to fix, is taken out after waiting the preset time, obtains electronic product middle frame.
Frame includes: a plurality of ceramic edge strip for being successively spliced into window frame structure in one of the embodiments,.
In one of the embodiments, in die casting, the outer peripheral edge of metal master molds groove；It is molded and burns in frame
When forming type, the convex block for patching groove is molded on the inside of frame；In metal master injection molding, molded on plastic parts
A hole is kept away for what convex block passed through.
In one of the embodiments, in frame injection molding and when sinter molding, to the lateral thickness of the corner of frame into
Row thickening processing.When electronic product falls and falls, the corner of frame is easy cracking, therefore, when to frame injection molding and sinter molding,
Thickening processing is carried out to the lateral thickness of the corner of frame, is reduced because falling the wind for falling and the corner of frame being caused to crack
Danger.
The production method of above-mentioned electronic product middle frame, the metal master obtained using die cast, then by by metal master
Body is put into mold and is injection molded to obtain the plastic parts positioned at the outer peripheral edge of metal master, obtains middle plate.Frame is then using injection molding
Blank part is obtained with sinter molding, then processes to obtain the frame of finished product by CNC.After plate and frame make respectively in the middle,
Will be bonded by mode for dispensing glue between the inside of frame and the outside of plastic parts, obtain electronic product middle frame.Using ceramic system
Frame complexed metal main body, it is ensured that the intensity of electronic product middle frame, and between frame and metal master using modeling
Glue part can reduce the weakening effect of the transmission signal to electronic product as intermediate connector.In addition, being fallen in electronic product
When falling, the impact force that frame is subjected to first passes through plastic parts and colloid for dispensing glue is buffered, and is then just transmitted to metal master
On, it is possible to reduce the impact force to the electronic device being mounted on metal master strengthens the protective capability to electronic device.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the electronic product middle frame of embodiment of the invention；
Fig. 2 is the decomposition diagram of electronic product middle frame shown in FIG. 1；
Fig. 3 is the enlarged diagram of the part A in electronic product middle frame shown in Fig. 2；
Fig. 4 is the enlarged diagram of the part B in electronic product middle frame shown in Fig. 2；
Fig. 5 is the decomposition diagram of the middle plate in electronic product middle frame shown in Fig. 2；
Fig. 6 is the decomposition diagram of the frame in electronic product middle frame shown in Fig. 2.
The meaning of each label in attached drawing are as follows:
100- electronic product middle frame；
Plate in 10-, 11- metal master, 111- groove, 12- plastic parts, 121- keep away a hole, 122- slit antenna；
20- frame, 21- convex block, 22- short side item, 23- long edge strip.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
It as shown in Figures 1 to 6, is a kind of electronic product middle frame 100 of embodiment of the invention.
As depicted in figs. 1 and 2, which includes: the side of middle plate 10 and the outer peripheral edge for being disposed around middle plate 10
Frame 20.Wherein, middle plate 10 is the composite members that metal and plastic cement are constituted, and is used to carry the electronic device in electronic product, and side
Frame 20 is then ceramic member.
As shown in Figure 2 and Figure 5, middle plate 10 includes: the plastic cement of metal master 11 with the outer peripheral edge for being disposed around metal master 11
Part 12.Metal master 11 is die cast part.Plastic parts 12 is by being molded in the outer peripheral edge of metal master 11.Wherein, should
Metal master 11 can be the aluminium alloy plate titanium alloy sheet or stainless steel plate of die cast, or be other
Belong to the metal plate of type.
As shown in Fig. 2, frame 20 is the ceramic member of peripheral frame shape.Pass through between the inside of frame 20 and the outside of plastic parts 12
Colloid bonding.In the present embodiment, which is zirconium oxide by injection molding and sinter molding, and (is utilized by CNC processing
CNC carries out side opening processing) obtained ceramic member, it is specifically as follows zirconia ceramics perhaps aluminium oxide ceramics or other potteries
Ceramic member made of porcelain raw material.
In addition, in the present embodiment, as shown in fig. 6, frame 20 includes: a plurality of ceramic side for being successively spliced into window frame structure
Item.Frame 20 is designed as a plurality of ceramic edge strip successively spliced, is conducive to the convenience for improving processing and assembling.Specifically,
In this embodiment, which includes: four ceramic edge strips for being successively spliced into window frame structure, wherein two ceramic edge strips are
Isometric short side item 22, two other ceramics edge strip are isometric long edge strip 23.The short side of the corresponding electronic product of short side item 22, and
The long side of the corresponding electronic product of long edge strip 23.
Further, in the present embodiment, the corner of frame 20 is located at the both ends of long edge strip 23, in order to improve its anti-impact
Ability is hit, the both ends of long edge strip 23 have carried out the thickening processing of lateral thickness.
In other embodiments, the corner of frame 20 can also be set on short side item 22, or in long edge strip 23
The turning of half is respectively set with the both ends of short side item 22, or is the corner of frame 20 to be separately provided for one individually
Ceramic edge strip.Similarly, the thickening that can also do lateral thickness to these corners is handled.
For plate 10 in improving and the precision when assembled of frame 20, can be improved with centering plate 10 and frame 20.
For example, as shown in Figure 3 and Figure 4, in the present embodiment, the outside of middle plate 10 is equipped with groove 111.The inside of frame 20
It is convexly equipped with the convex block 21 for patching groove 111.When middle plate 10 is docked with frame 20, can be carried out using groove 111 and convex block 21
Contraposition improves the precision of assembling, and plate 10 and the stability of frame 20 after assembling in reinforcement.
Further, in the present embodiment, groove 111 takes shape in the outer peripheral edge of metal master 11.Plastic parts 12, which is equipped with, to be supplied
What convex block 21 passed through keeps away a hole 121.In other embodiments, which can also take shape on plastic parts 12.Or when,
Groove 111 is taken shape in the inside of frame 20, convex block 21 takes shape on metal master 11 or moulding.
In addition, as shown in figure 5, in the present embodiment, the outer peripheral edge of plastic parts 12 forms slit antenna 122.Work as electronics
Product is fallen when falling, and frame 20 also can generate extruding to slit antenna 122, since the slit antenna 122 is to take shape in plastic parts 12
On, therefore slit antenna 122 also has the elastic deformation ability of plastic parts 12, can also play the role of buffering.In addition, the design
It is also possible that the segment difference between slit antenna 122 and frame 20 is managed in ± 0.1mm, gap between the two can be managed
In 0.1mm.
Further, in the present embodiment, which is located at the boundary of above-mentioned short side item 22 and long edge strip 23
Place.
Above-mentioned electronic product middle frame 100, middle plate 10 are composite structured, the metal master 11 that die cast is obtained, benefit
The plastic parts 12 positioned at the outer peripheral edge of metal master 11 is obtained with injection molding.Frame 20 is ceramic member, and frame 20 is interior
It is Nian Jie by colloid between side and the outside of plastic parts 12.Using 20 complexed metal main body 11 of frame made of ceramics, it is ensured that
The intensity of electronic product middle frame 100, and intermediate connector is used as using plastic parts 12 between frame 20 and metal master 11,
Its weakening effect that can reduce the transmission signal to electronic product, can guarantee the transmission signal of electronic product well
Intensity especially can satisfy 5G communication for the intensity requirement of transmission signal.In addition, when electronic product falls and falls, frame 20
The impact force being subjected to first passes through plastic parts 12 and colloid is buffered, and is then just transmitted on metal master 11, can subtract
Few impact force to the electronic device being mounted on metal master 11, strengthens the protective capability to electronic device.
Meanwhile in conjunction with 100 structure of electronic product middle frame that Fig. 1 to Fig. 6 is shown, it is set forth below in a kind of electronic product
The production method of frame 100.
The production method of the electronic product middle frame 100, comprising steps of
S100: raw metal is obtained into metal master 11 by die cast.
S200: metal master 11 being placed in mold and carries out injection process, so that the outer peripheral edge of metal master 11 forms
Plastic parts 12 out obtain middle plate 10.
S300: ceramic raw material is obtained into the blank part for being used to make frame 20 by injection molding and sinter molding.
In step S300, which may include: a plurality of ceramic edge strip for being successively spliced into window frame structure.
S400: blank part is subjected to CNC machine-shaping, obtains frame 20.CNC processing herein, which refers to, carries out blank part
Hole milling obtains the cavernous structures such as various data port, keyway and the card slot in outside of corresponding electronic product middle frame 100.
S500: by the dispensing between the outside of moulding and the inside of frame 20, so that middle plate 10 is Nian Jie with frame 20
Together, electronic product middle frame 100 is obtained.
In the present embodiment, step S500 may include step:
S510: in the points outside hot melt adhesive of moulding.
The inside of frame 20: being tightly attached to the outside of moulding by S520, so that middle plate 10 and frame 20 are bonded together.
S530: the middle plate 10 of bonding and frame 20 are subjected to pressure maintaining and fixed, is taken out after waiting the preset time, obtains electronics
Product center 100.
In addition, but also both can be improved and to combine in order to enable middle plate 10 docks more accurate and quick with frame 20
Stability, in the present embodiment, in the press casting procedure of step S100, the outer peripheral edge of metal master 11 molds groove 111.
Correspondingly, it during the injection molding of the frame 20 of step S400 and sinter molding, is molded in the inside of frame 20 and patches groove 111
Convex block 21.Also, it in 11 injection molding process of step S200 metal master, molds on plastic parts 12 and is passed through for convex block 21
Keep away a hole 121, specific structure may refer to Fig. 2 to Fig. 4.
In addition, during the injection molding of the frame 20 of step S300 and sinter molding, to the lateral thickness of the corner of frame 20
Degree carries out thickening processing.When electronic product falls and falls, the corner of frame 20 is easy cracking, therefore, is molded and burns to frame 20
When forming type, thickening processing is carried out to the lateral thickness of the corner of frame 20, is reduced and is fallen because falling and lead to turning for frame 20
The risk to crack at angle.
It should be added that middle plate 10 and the respective manufacturing process of frame 20 be it is mutually indepedent, therefore, the system of the two
Work can have sequencing, or synchronous progress, however it is not limited to which plate 10 in the first production shown in the present embodiment makes side afterwards
The sequence of frame 20.
The production method of above-mentioned electronic product middle frame 100, the metal master 11 obtained using die cast, then by will be golden
Owner's body 11 is put into mold and is injection molded to obtain the plastic parts 12 positioned at the outer peripheral edge of metal master 11, obtains middle plate 10.Side
Frame 20 then obtains blank part using injection molding and sinter molding, then processes to obtain the frame 20 of finished product by CNC.Plate 10 and side in the middle
, will be bonded by mode for dispensing glue between the inside of frame 20 and the outside of plastic parts 12 after frame 20 makes respectively, it obtains
Electronic product middle frame 100.Using 20 complexed metal main body 11 of frame made of ceramics, it is ensured that electronic product middle frame 100 it is strong
Degree, and intermediate connector is used as using plastic parts 12 between frame 20 and metal master 11, it can reduce and electronics is produced
The weakening effect of the transmission signal of product.In addition, the impact force that frame 20 is subjected to first passes through plastic parts when electronic product falls and falls
12 and colloid for dispensing glue buffered, be then just transmitted on metal master 11, it is possible to reduce to being mounted on metal master 11
On electronic device impact force, strengthen to the protective capability of electronic device.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
Above embodiments only express the preferred embodiments of the present invention, and the description thereof is more specific and detailed, but not
It can therefore be construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of electronic product middle frame, it is characterised in that: include:
Middle plate；The middle plate includes: the plastic parts of metal master with the outer peripheral edge for being disposed around the metal master；The metal master
Body is die cast part；The plastic parts is by being molded in the outer peripheral edge of the metal master；And
It is disposed around the frame of the outer peripheral edge of the middle plate；The frame is the ceramic member of peripheral frame shape；The inside of the frame and institute
It states and is bonded between the outside of plastic parts by colloid.
2. electronic product middle frame according to claim 1, which is characterized in that the outside of the middle plate is equipped with groove；It is described
The convex block for patching the groove is convexly equipped on the inside of frame.
3. electronic product middle frame according to claim 2, which is characterized in that the groove takes shape in the metal master
Outer peripheral edge；The plastic parts, which is equipped with, keeps away a hole for what the convex block passed through.
4. electronic product middle frame according to claim 1, which is characterized in that the outer peripheral edge of the plastic parts forms slit
Antenna.
5. electronic product middle frame according to claim 1, which is characterized in that the frame includes: a plurality of to be successively spliced into
The ceramic edge strip of window frame structure.
6. a kind of production method of electronic product middle frame, which is characterized in that comprising steps of
Raw metal is obtained into metal master by die cast；
Metal master is placed in mold and carries out injection process, so that the outer peripheral edge of metal master molds plastic parts, is obtained
Middle plate；
Ceramic raw material is obtained into the blank part for being used to make frame by injection molding and sinter molding；
Blank part is subjected to CNC machine-shaping, obtains frame；
Electronics is obtained so that middle plate bonds together with frame by the dispensing between the outside of moulding and the inside of frame
Product center.
7. the production method of electronic product middle frame according to claim 6, which is characterized in that by the outside of moulding
The dispensing between the inside of frame so that middle plate bonds together with frame, obtain electronic product middle frame comprising steps of
In the points outside hot melt adhesive of moulding；
The outside of moulding will be tightly attached on the inside of frame, so that middle plate and frame are bonded together；
The middle plate and frame of bonding are carried out pressure maintaining to fix, is taken out after waiting the preset time, obtains electronic product middle frame.
8. the production method of electronic product middle frame according to claim 6, which is characterized in that the frame includes: a plurality of
Successively it is spliced into the ceramic edge strip of window frame structure.
9. the production method of electronic product middle frame according to claim 6, which is characterized in that in die casting, metal master
Outer peripheral edge mold groove；In frame injection molding and sinter molding, is molded on the inside of frame and patch the convex of the groove
Block；In metal master injection molding, is molded on plastic parts and keep away a hole for what convex block passed through.
10. the production method of electronic product middle frame according to claim 6, which is characterized in that be molded and be sintered in frame
When molding, thickening processing is carried out to the lateral thickness of the corner of frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455878.9A CN109639873A (en) | 2018-11-30 | 2018-11-30 | Electronic product middle frame and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811455878.9A CN109639873A (en) | 2018-11-30 | 2018-11-30 | Electronic product middle frame and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109639873A true CN109639873A (en) | 2019-04-16 |
Family
ID=66069996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811455878.9A Pending CN109639873A (en) | 2018-11-30 | 2018-11-30 | Electronic product middle frame and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111107205A (en) * | 2020-01-09 | 2020-05-05 | 陈丽红 | Ceramic composite middle frame and preparation method thereof |
| CN112311908A (en) * | 2019-07-24 | 2021-02-02 | Oppo广东移动通信有限公司 | Rear shell, manufacturing method of rear shell and mobile terminal |
| CN116038988A (en) * | 2022-07-21 | 2023-05-02 | 荣耀终端有限公司 | Middle frame assembly, forming process thereof and electronic equipment |
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| US20090009941A1 (en) * | 2007-07-04 | 2009-01-08 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing for an electronic device, electronic device using the housing, and method for making the housing |
| CN104883841A (en) * | 2015-05-22 | 2015-09-02 | 奥捷五金(江苏)有限公司 | Middle frame structure manufacturing technology and middle frame structure |
| CN206294439U (en) * | 2016-12-01 | 2017-06-30 | 东莞华晶粉末冶金有限公司 | A kind of electronic product frame structure and electronic product |
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| US20090009941A1 (en) * | 2007-07-04 | 2009-01-08 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing for an electronic device, electronic device using the housing, and method for making the housing |
| CN104883841A (en) * | 2015-05-22 | 2015-09-02 | 奥捷五金(江苏)有限公司 | Middle frame structure manufacturing technology and middle frame structure |
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| CN112311908A (en) * | 2019-07-24 | 2021-02-02 | Oppo广东移动通信有限公司 | Rear shell, manufacturing method of rear shell and mobile terminal |
| CN111107205A (en) * | 2020-01-09 | 2020-05-05 | 陈丽红 | Ceramic composite middle frame and preparation method thereof |
| CN116038988A (en) * | 2022-07-21 | 2023-05-02 | 荣耀终端有限公司 | Middle frame assembly, forming process thereof and electronic equipment |
| CN116038988B (en) * | 2022-07-21 | 2023-10-24 | 荣耀终端有限公司 | Middle frame assembly, forming process thereof and electronic equipment |
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Application publication date: 20190416 |