CN116038988A

CN116038988A - Middle frame assembly, forming process thereof and electronic equipment

Info

Publication number: CN116038988A
Application number: CN202210860648.0A
Authority: CN
Inventors: 李养余; 张少辉
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-07-21
Filing date: 2022-07-21
Publication date: 2023-05-02
Anticipated expiration: 2042-07-21
Also published as: CN116038988B

Abstract

The embodiment of the application discloses center subassembly and shaping technology, electronic equipment thereof, the center subassembly of this application can be applied to electronic equipment such as cell-phone, panel computer accessory, wearable equipment, vehicle-mounted equipment, and the metal skeleton passes through stamping process shaping in this application, has eliminated die casting and has produced quality defects such as sand hole, has improved the shaping quality of center subassembly to stamping forming metal skeleton use intensity is also higher, and at metal skeleton's outer Zhou Zhusu plastic body, utilizes metal material and plastic material both to combine, can compromise center subassembly use intensity and lightweight design demand.

Description

Middle frame assembly, forming process thereof and electronic equipment

Technical Field

The application relates to the field of electronic products, in particular to a middle frame assembly, a forming process thereof and electronic equipment.

Background

Electronic devices such as mobile phones and PAD generally comprise a display screen, a middle frame and a rear cover, wherein the middle frame is used for connecting the display screen and the rear cover, and is one of important parts of the electronic device. With the continuous development of lighter and thinner electronic equipment products and battery capacity, the strength of the middle frame and other parts of the electronic equipment is continuously reduced, and the bending deformation risk of the electronic equipment is greatly increased. How to meet the design requirements and the use strength of the electronic products for light and thin design is one of the important problems of the people skilled in the art.

Disclosure of Invention

The embodiment of the application provides a middle frame assembly with higher use strength, lighter weight and higher molding quality, a molding process thereof and electronic equipment.

In one embodiment, the present application provides a molding process of a middle frame assembly, the molding process comprising:

and (3) machining: forming a metal framework through a stamping process, wherein the yield strength of the metal framework material is more than or equal to 280Mpa, the elongation is more than or equal to 8%, and the metal framework can be formed through a high-strength aluminum alloy sheet or stainless steel or titanium alloy;

and (3) injection molding: and the plastic body is formed by injection molding in the circumferential direction of the metal framework, and an integrated structure is formed with the metal framework during injection molding of the plastic body.

Compared with the prior art that metal framework passes through compression molding, metal framework passes through stamping process shaping in this application, has eliminated the die casting and has produced quality defects such as sand hole, has improved the shaping quality of well frame subassembly to stamping forming metal framework use intensity is also higher, and at metal framework's outer Zhou Zhusu plastic body, utilize metal material and plastic material two to combine, can compromise well frame subassembly use intensity and lightweight design demand.

In one example, the metal skeleton is stamped and formed circumferentially with at least one antenna structure. The number of the antenna structures is multiple, each antenna structure is arranged along the circumferential direction, the antenna structure is formed in the metal framework, the forming process is simple, the antenna structure is positioned in the plastic part to form a built-in antenna structure, and the antenna structure does not occupy the external space of the electronic equipment.

In one example, the machining specifically includes: respectively stamping and forming a middle plate and a metal frame, wherein an antenna structure is formed on the circumference of the metal frame; and positioning and connecting the positions of the metal frame and the middle plate to form a metal framework. The metal framework comprises two independent parts, the two parts are respectively formed by stamping, and the metal framework is formed by fixedly connecting positioning pieces in the later stage, so that the forming process of the metal framework can be reduced.

In one example, the metal frame is positionally attached to the midplane by a riveting or welding process. The metal frame and the middle plate are riveted or welded and positioned, so that the positioning reliability is high, and the subsequent injection molding process is not influenced.

In one example, a metal frame blank is formed in a machining process, the metal frame blank comprises a main body part and a frame part which are integrally formed, the frame part is positioned at the periphery of the main body part, an antenna structure is formed on the frame part in a stamping mode, the antenna structure comprises a feeding section extending towards the main body part, a first connecting body is formed at the free end of at least part of the feeding section in the machining process in a stamping mode, and the feeding section is connected with the main body part through the first connecting body in a supporting mode; after the injection molding step, the method further comprises a removal processing step of: the first connecting body is removed by machining or by tool removal or manually. Like this the first connector can both provide certain supporting strength to antenna structure at punching press process and injection molding process, avoids antenna structure to warp, improves the shaping quality of center subassembly.

In one example, the antenna structure further includes an antenna body extending in a circumferential direction, and a second connector is further formed between a cantilever end part of the antenna body and the body part by punching to support the cantilever end; in the removal machining step, the second connection body is removed by machining or by tool removal or manually. In this example, through setting up the second connector at the cantilever end that supports weak antenna main part, further connect the cantilever end through the second connector and support in main part, further support the cantilever end of antenna main part like this, improve the stamping forming quality of antenna main part to avoid the antenna main part atress deformation when moulding plastics, and then improve the shaping quality of center subassembly, get rid of the second connector after center subassembly shaping, get rid of the technology is also relatively simpler.

In one example, in the machining step, a third connector is further formed between the cantilever ends of the adjacent antenna bodies, and the cantilever ends of the two antenna bodies are connected by the third connector; in the removal machining step, the third connector is removed by machining or by tool removal or manually removed to form a gap between adjacent cantilevered ends. Namely, when the antenna main body is stamped, the cantilever ends of the adjacent antenna main bodies can be stamped and formed into an integrated structure, so that the antenna main bodies are prevented from being stamped and deformed, the deformation caused by injection molding force is avoided, and the third connecting body is easy to remove after the plastic body is subjected to injection molding. The shape and position of the third connector can be reasonably selected according to the specific position.

In one example, prior to the injection molding step, a portion of the antenna structure is also supported to the midplane via a connector; after the injection molding step, the connection is removed by machining or by tools. When there is no body portion near the antenna structure or relatively close to the middle plate, the antenna structure may be connected to the middle plate by a connection member.

In one example, a tensile bending section is stamped on the body portion during the machining step, and the bending section is then upsetted to form a battery compartment sidewall that meets design requirements. The upsetting process may upset the local structure to a thicker structure to increase the service strength of the location.

In one example, the metal framework has a material yield strength of greater than or equal to 280Mpa and an elongation of greater than or equal to 8%.

In a second aspect, the application also provides a middle frame assembly, wherein the middle frame assembly comprises a metal framework formed through a stamping process, the middle frame assembly further comprises a plastic body positioned on the circumference of the metal framework, the plastic body is of a plastic structure, and the plastic body and the metal framework form an integrated structure during injection molding.

In one example, the metal skeleton includes an antenna structure.

In one example, the metal framework comprises a middle plate and a metal frame, an antenna structure is formed on the circumference of the metal frame, and the middle plate and the metal frame are connected and fixed into a whole through a positioning piece.

In one example, the positioning piece comprises a riveting column and a riveting hole which are in riveting fit, wherein one of the positioning piece and the riveting hole is arranged on the middle plate, and the other positioning piece is arranged on the metal frame;

alternatively, the middle plate and the metal frame are welded together by a welding process.

In one example, the metal frame has at least two antenna structures with a gap between adjacent antenna structures to fill a portion of the plastic body.

In one example, the material of the metal skeleton is an aluminum alloy or stainless steel or titanium alloy.

In a third aspect, the present application further provides an electronic device, including a middle frame assembly as described in any one of the above.

The middle frame component is formed by the forming process of the middle frame component, and the electronic equipment comprises the middle frame component, so the middle frame component and the electronic equipment also have the technical effects of the middle frame component.

Drawings

FIG. 1 is a schematic front view of an electronic device provided in one example of the present application;

FIG. 2 is a schematic rear view of the electronic device of FIG. 1;

FIG. 3 is a schematic view of an electronic device without a rear cover of the housing;

FIG. 4 is a schematic diagram of an electronic device with a portion of the components hidden;

FIG. 5 is a cross-sectional view B-B in FIG. 3;

FIG. 6 is a three-dimensional schematic of a center frame assembly provided herein;

FIG. 7 is a schematic front view of FIG. 6;

FIG. 8 is an exploded view of the center assembly of FIG. 6;

FIG. 9 is a schematic structural view of the metal framework of FIG. 6;

FIG. 10 is a front view of FIG. 9;

FIG. 11 is an exploded view of the metal armature of FIG. 9;

FIG. 12 is a flow chart of a process for forming a middle frame assembly provided herein;

FIG. 13 is a flow chart of a molding process for a middle frame assembly in one example of the present application;

FIG. 14 is a flow chart of a molding process for a middle frame assembly in another example of the present application;

FIG. 15 is a flow chart of a molding process for a middle frame assembly in yet another example of the present application;

FIG. 16 is a schematic illustration of a blank of a metal skeleton in one example of the present application;

FIG. 17 is a cross-sectional view A-A of FIG. 16;

FIG. 18 is an enlarged schematic view of FIG. 16 at C;

FIG. 19 is an enlarged schematic view of FIG. 16 at D;

fig. 20 is a schematic illustration of a rivet in an example of the present application.

Wherein, the one-to-one correspondence between the reference numerals and the component names in fig. 1 to 20 is as follows:

100 electronic devices; a 101 housing; 101a middle frame assembly; 101b rear cover; 1, molding; 2a metal framework; 21 a metal frame; 22 middle plate; 2-1 a first antenna; 2-2 a second antenna; 2-3 a third antenna; 2-4 fourth antennas; 2-5 fifth antennas; 2-6 sixth antennas; 2-7 seventh antennas; 2-8 eighth antennas; 2-9 th antenna; 2-10 tenth antennas; 2-11 eleventh antennas; 2a feed section; 23 gaps; 211 a main body; 212 frame parts; 213 battery compartment sidewalls; 214 a first via; 215 a second via; 216 riveting columns;

102, displaying a screen; 103 cameras.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

The application carries out intensive research to the technical problems that the use intensity is lower and the bending deformation risk is higher in the electronic equipment in the current electronic product provided in the background art, and researches find that the middle frame of the current electronic product generally comprises a metal part, and the metal part is formed through a die-casting process through a die-casting alloy.

Based on the research findings, the application further explores and provides a technical scheme for solving the technical problems.

In the description of the present application, it should be noted that, in the embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; may be directly connected or indirectly connected through an intermediate medium. Wherein, "fixedly connected" means that the relative positional relationship is unchanged after being connected with each other. "rotationally coupled" means coupled to each other and capable of relative rotation after coupling. "slidingly coupled" means coupled to each other and capable of sliding relative to each other after being coupled.

References to directional terms in the embodiments of the present application, such as "inner", "outer", etc., are only with reference to the directions of the drawings, and thus, the directional terms are used to better and more clearly describe and understand the embodiments of the present application, rather than to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. Furthermore, unless otherwise indicated herein, the term "plurality" as used herein refers to two or more.

In the description of embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.

The middle frame provided in the embodiment of the application may be applied to an electronic device, where the electronic device may be a mobile phone, a tablet computer accessory, a wearable device, a vehicle-mounted device, an augmented reality (augmented reality, AR)/Virtual Reality (VR) device, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (personal digital assistant, PDA) or a mobile terminal, or may also be a photographing device of a digital camera, a single-lens reflex camera/micro-lens camera, a motion camera, a pan-tilt camera, an unmanned aerial vehicle or other professionals.

Referring to fig. 1 and 2, fig. 1 is a schematic front view of an electronic device according to an embodiment of the present application; fig. 2 is a schematic back view of the electronic device shown in fig. 1.

The electronic device 100 provided in the embodiment of the present application includes a display screen 102 and a housing 101. The main functions of the housing 101 are two-way, one providing a mounting base for the components of the electronic device 100 and the other providing protection for parts. The housing 101 may be formed therein with a receiving chamber inside which various components of the electronic device 100 may be disposed. In one example, the case 101 may include a middle frame assembly 101a and a rear cover 101b, and the display screen 102 and the rear cover 101b are disposed at both sides of the middle frame assembly 101a in the thickness direction thereof. The side of the middle frame assembly 101a facing the rear cover 101b typically has a cavity to form a battery compartment, which the rear cover 101b can seal. The material of the rear cover 101b is not limited herein, and in specific practice, a person skilled in the art may select according to actual needs; for example, the material may be a metal material, a plastic material, a ceramic material, a glass material, or the like.

Referring to fig. 3, 4 and 5, fig. 3 is a schematic view of the electronic device 100 without the rear cover 101B of the housing 101, fig. 4 is a schematic view of the electronic device 100 with part of the components hidden, and fig. 5 is a cross-sectional view B-B in fig. 3. Specifically, the components may include a main board support 104, a battery module 105, a secondary PCB 106, NFC (english full name Near Field Communication, chinese is near field communication) 107, a graphite sheet 108, an aerogel 109, a main PCB 110, a heating device 111, an aerogel gum 112, a graphite sheet gum 113, a camera 103, and the arrangement position and the installation manner of these components are not specifically limited in this application.

At least a portion of the display screen 102 can be supported above the center frame assembly 101a and connected to the center frame assembly 101a. The display screen 102 may be an organic light emitting diode display screen 102 or a liquid crystal display screen 102, etc. The display screen 102 may be a flexible display screen 102 or a hard display screen 102, where the flexible display screen 102 imparts a foldable function, and can cooperate with the structural design of the housing 101 to implement operations such as folding the electronic device 100. The display screen 102 may be a regular screen or a special-shaped screen, for example, an outer edge portion of the display screen 102 may be configured in an arc shape to form a curved screen.

The display screen 102 may be disposed on the front surface of the electronic device 100, may be disposed on the back surface of the electronic device 100, or may be disposed on both the front surface and the back surface of the electronic device 100. The front side of the electronic device 100 may be understood as the side facing the user when the user uses the electronic device 100, i.e. the side where the display 102102 in fig. 1 is located, and the back side of the electronic device 100 may be understood as the side facing away from the user when the user uses the electronic device 100.

Taking the front side of the electronic device 100 as an example, in terms of arrangement range, the display screen 102 may cover all areas on the front side of the electronic device 100, that is, the electronic device 100 may form a full screen, where the display screen 102 has not only a display function, but also a touch function, that is, the electronic device 100 may be operated by clicking the display screen 102; alternatively, the display screen 102 may cover only a partial area of the front surface of the electronic device 100, which is a possible choice in specific practice, and in this case, the display screen 102 may have a touch function or may have only a display function, and it is understood that, when only the display function is provided, a region of the housing 101 where the display screen 102 is not provided may be configured with corresponding man-machine operation components such as keys, so as to operate the electronic device 100, and these man-machine operation components may be provided at any position such as the front surface, the back surface, or the side surface of the electronic device 100.

The display screen 102 may include a display module and a transparent cover plate, where the display module is capable of displaying images, videos, and the like, and the display module may include a touch screen, a light emitting layer, a back plate layer, a substrate layer, and other structural layers. The specific structure of the display module can be selected according to different products. The display module may employ a liquid crystal display 102 (liquid crystal display, LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED) or an active-matrix organic light-emitting diode (matrix organic light emitting diode), a flexible light-emitting diode (FLED), a quantum dot light-emitting diode (quantum dot light emitting diodes, QLED), or the like. The transparent cover plate covers the outer side of the display module and plays a role in protecting the display module. The transparent cover plate can be a glass cover plate, and can be other transparent materials with protection function.

Referring to fig. 6, 7 and 8, fig. 6 is a three-dimensional schematic diagram of a middle frame assembly 101a provided in the present application; FIG. 7 is a schematic front view of FIG. 6; fig. 8 is an exploded view of the middle frame assembly 101a of fig. 6.

The application provides a middle frame assembly 101a, including metal skeleton 2 and shaping in metal skeleton 2 circumferential plastic body 1, metal skeleton 2 can be the metal material, and the kind of metal material is not restricted here, and in the concrete practice, the person skilled in the art can select according to actual need, can be for example aluminum alloy, stainless steel, titanium alloy etc.. In one example, the yield strength of the metal skeleton 2 material is equal to or greater than 280MPa, the elongation is equal to or greater than 8%, and particularly the metal skeleton 2 can be made of an ultrahigh-strength aluminum alloy rolled sheet. In one example, the present application can obtain a metal skeleton having a relatively high quality by press-molding the metal skeleton from an aluminum alloy sheet material having a yield strength of 280MPa, 300MPa, 320MPa, or 350MPa, and an elongation of any two of 8%, 10%, and 12%. It will be appreciated by those skilled in the art that the yield strength of the metal armature 2 material herein may be a value greater than or equal to 280MPa and the elongation may be any value greater than or equal to 8%.

Referring to fig. 9, 10 and 13, fig. 9 is a schematic structural view of the metal skeleton 2 in fig. 6; FIG. 10 is a front view of FIG. 9; fig. 13 is a flow chart of a molding process of the middle frame assembly 101a in one example of the present application.

The middle frame assembly 101a of the present application is formed by:

s1, machining: forming a metal framework 2 through a stamping process;

s2, injection molding: the molding body 1 is injection molded in the circumferential direction of the metal skeleton 2, and forms an integral structure with the metal skeleton 2 when the molding body 1 is injection molded.

Correspondingly, the molded middle frame component 101a comprises a metal framework 2 molded by a stamping process and a plastic body 1 molded on the circumference of the metal framework 2 in an injection molding way, wherein the plastic body 1 is of a plastic structure, and the plastic body 1 and the metal framework 2 form an integral structure during injection molding.

The metal framework 2 in this application is through stamping process shaping, and inside injection moulding die cavity was put into to metal framework 2 after the shaping, then at metal framework 2 circumference shaping plastic body 1, the circumference of whole metal framework 2 can be wrapped up to plastic body 1, and plastic body 1 can be the circumference of closed annular structure parcel at metal framework 2 promptly, forms an integrated structure with metal framework 2 when plastic body 1 injection moulding, and plastic body 1 uses metal framework 2 as base member injection moulding promptly.

Compared with the prior art that the metal framework 2 is formed through die casting, the metal framework 2 is formed through a stamping process, quality defects such as sand holes generated by die casting are eliminated, the forming quality of the middle frame component 101a is improved, the use strength of the stamping forming metal framework 2 is also high, the metal framework 2 is coated with the Zhou Zhusu plastic body 1, and the metal material and the plastic material are combined, so that the use strength and the light-weight design requirement of the middle frame component 101a can be met. The thickness of the metal skeleton 2 formed by stamping can be reduced by about 1.5mm compared to die casting.

The types of the plastisol 1 can be various, and in practical application, the person skilled in the art can select according to specific needs. For example, the molding compound 1 may be one or more of PPA (poly (phthalamide), PA (Polyamide), PBT (polybutylene terephthalate ), PPS (Polyphenylene sulfide, polyphenylene sulfide), PEEK (poly (ether-ether-ketone), and PC (Polycarbonate). It should be clear that when the molding body 1 is a combination of materials, for example, a combination of PPA and PA, the ratio between PPA and PA is not limited, and regardless of the ratio adopted between the two, the molding body 1 is a mixture of two existing materials of PPA and PA, and should not be interpreted as a new material.

In the present application, the metal skeleton 2 of the middle frame component 101a is formed with at least one antenna structure by circumferential stamping. That is, the antenna structure is formed on the metal framework 2, and the antenna structure can be integrally formed with the metal framework 2 in the stamping forming process, so that the forming process of the antenna structure is simplified. Depending on the functions of the antenna structures, which may include a plurality of antenna structures, the antenna structures may be arranged along the circumferential direction of the metal bobbin 2 with gaps 23 therebetween so as not to affect the operation performance of the antenna structures, fig. 9 shows an example having 11 antenna structures, respectively, a first antenna structure 2-1, a second antenna structure 2-2, a third antenna structure 2-3, a fourth antenna structure 2-4, a fifth antenna structure 2-5, a sixth antenna structure 2-6, a seventh antenna structure 2-7, an eighth antenna structure 2-8, a ninth antenna structure 2-9, a tenth antenna structure 2-10, and an eleventh antenna structure 2-11, each of which is arranged in order counterclockwise. Each antenna structure has a feed section 2a, the feed section 2a extending towards the interior of the metal chassis 2 to facilitate connection of corresponding components mounted inside the mid-frame assembly 101a.

The antenna structures in the present application are located inside the plastic body 1, that is, the antenna structures are built-in antennas, and do not occupy the external space of the electronic device 100.

In order to reduce the molding process of the metal bobbin 2, the metal bobbin 2 may be designed as follows.

Referring to fig. 11, 12 and 14, fig. 11 is an exploded view of the metal skeleton 2 shown in fig. 9; FIG. 12 is a flow chart of a molding process of the middle frame assembly 101a provided herein; fig. 14 is a flow chart of a molding process of a frame assembly 101a according to another example of the present application.

In this application, the metal framework 2 of the middle frame assembly 101a further includes a metal frame 21 and a middle plate 22, where the metal frame 21 and the middle plate 22 may be made of the same metal material, or of course, two different metal materials. The metal frame 21 may be disposed around the middle plate 22, i.e., the metal frame 21 may form a closed loop shape, and the middle plate 22 may be located inside the metal frame 21. The middle plate 22 may be connected to the metal frame 21, and the connection position between the middle plate 22 and the metal frame 21 in the thickness direction of the electronic device 100 is not limited herein, and in specific practice, one skilled in the art may determine according to actual design requirements. The metal frame 21 may be stamped with a bending section, as shown in fig. 8 and 11, the metal frame 21 is stamped with a first through hole 214, the periphery of the first through hole 214 is stamped and stretched to form the bending section, and the bending section may be formed into the battery compartment sidewall 213 through a upsetting process.

Of course, the second through hole 215 may also be machined above the first through hole 214 to realize the installation of other components.

Such machining steps may include:

s11, respectively stamping and forming a middle plate 22 and a metal frame 21, wherein an antenna structure is formed in the circumferential direction of the metal frame 21;

s12, positioning and connecting the positions of the metal frame 21 and the middle plate 22 to form the metal skeleton 2.

Wherein the metal frame 21 and the middle plate 22 can be positioned and connected by a welding process or riveting. That is, the middle plate 22 and the metal frame 21 are connected and fixed into a whole through the positioning member, and the two can be riveted and positioned for the riveting member, that is, the positioning member comprises riveting columns and riveting holes which are riveted and matched, one of the positioning members is arranged on the middle plate 22, and the other positioning member is arranged on the metal frame 21. Of course, the middle plate 22 and the metal frame 21 may be positioned by welding, that is, the middle plate 22 and the metal frame 21 are welded together by a welding process.

In fig. 17, it is shown that the metal frame 21 and the middle plate 22 are positioned by riveting connection, wherein the metal frame 21 is provided with a rivet post 216, and the middle plate 22 is provided with a rivet hole (reference numeral is not shown in the figure), and the rivet post 216 is fixedly connected inside the rivet hole by a riveting process. The shape of the rivet 216 may take many forms, for example, the cross section of the rivet 216 may be circular, square, rectangular or other polygonal, please refer to fig. 20, in which two types of rivet are shown in detail, the cross section of the left two rivet is approximately circular, and the cross section of the lower two rivet is approximately rectangular. Of course, the specific structural form of the rivet post is not limited to that described herein, as long as reliable rivet fixing can be achieved, and is not specifically exemplified herein.

In this application the metal skeleton 2 is divided into two parts: the middle plate 22 and the metal frame 21 can be respectively formed through a stamping process, the forming process is relatively simple, and the middle plate 22 and the metal frame 21 are connected through positioning pieces to form a whole and then are placed into an injection molding cavity, so that the overall strength of the formed middle frame assembly 101a can be improved.

The metal frame 21 has at least two sections of antenna structures in the circumferential direction, and a gap 23 is formed between every two adjacent sections of antenna structures to fill part of the structure of the plastic body 1, which is not only beneficial to the fixing reliability of the plastic body 1 and the metal frame 21.

For the antenna structure, the antenna structure comprises an antenna main body and a feed section 2a which extend along the circumferential direction, and the antenna main body and the feed section 2a are weak, so that the antenna main body and the feed section 2a are easy to deform when being stressed during stamping, are easy to deform when being subjected to injection molding pressure during injection molding, and further influence the quality of the middle frame assembly 101a after being molded. Therefore, the application further improves the forming process of the middle frame as follows.

In the present application, the metal frame 21 of the final structural form is not formed during the press forming, but a metal frame blank is formed first, the metal frame blank includes a main body portion 211 and a frame portion 212 that are integrally formed, the frame portion 212 is located at the periphery of the main body portion 211, and the antenna structure is press formed at the frame portion 212. In the machining step S1, at least part of the free ends of the feed segments 2a are stamped with a first connecting body, by means of which the feed segments 2a support the connecting body part 211 or the middle plate 22. Each connecting body is directly formed on the metal frame blank during stamping forming.

As will be understood with reference to fig. 16, 18, 19 and the foregoing fig. 10, the dashed line portion in fig. 16, 18 and 19 indicates the solid structure of the metal frame blank after the stamping is completed, the first connector 2b is provided between the two feeding sections 2a and the main body portion 211 of the third antenna structure at the lower end of fig. 16, the first connector 2b is formed between the feeding section 2a and the main body portion 211211 of the tenth antenna structure 2-10 in a stamping manner in fig. 19, and the free end portion of the feeding section 2a of the tenth antenna structure 2-10 is connected to the main body portion 211211 through the first connector 2b. When the injection molding is completed, the first connecting body 2b is removed by machining, for example, the first connecting body 2b is removed by cutting by a numerical control machine.

Similarly, a second connector may be formed between the part of the cantilever end of the antenna main body extending in the circumferential direction and the main body 211 by press forming, as shown in fig. 16, a second connector 2d is connected between the cantilever end of the first antenna structure 2-1 and the main body 211, and a second connector 2d is connected between the cantilever end of the right end of the second antenna structure 2-2 and the main body 211. As shown in fig. 17, after press molding, a second connector 2d is provided between the first antenna structure 2-1 and the main body 211. Each second connecting body 2d is removed by machining after the injection molding of the middle frame assembly 101a.

In the machining step, a third connector 2e is formed between the cantilever ends of the adjacent antenna bodies, and the cantilever ends of the two antenna bodies are connected with each other through the third connector 2e; referring to the upper end of fig. 16, the cantilever ends adjacent to both the eighth antenna structure 2-8 and the seventh antenna structure 2-7 are connected with a third connector 2e, and the third connector 2e can be removed by machining after the injection molding of the middle frame assembly 101a.

Prior to the injection molding step, a portion of the antenna structure is also supported by the midplane 22 via the connector; after the injection molding step, the connection is removed by machining or by a tool; the feed section 2a of the sixth antenna structure in fig. 18 has a connection piece 2c, the connection piece 2c is fixedly connected to the middle plate 2222 by welding, and after the injection molding process, the connection piece 2c is removed by machining.

In another example, the molding process of the middle frame assembly 101a may be as follows:

s13, stamping: respectively stamping and forming a middle plate 22 and a metal frame blank, wherein an antenna structure is formed in the circumferential direction of the metal frame blank;

s14, positioning: positioning both the connecting metal frame blank and the middle plate 22 to form a metal skeleton 2 blank;

s2, injection molding: the plastic body 1 is formed by injection molding in the circumferential direction of the metal framework 2 blank, and an integral structure is formed with the metal framework 2 blank during injection molding of the plastic body 1;

s3, removing the processing steps: the first, second and third connectors are removed by machining or by tool or manually.

In the removal processing step, the first connection body, the second connection body, the third connection body and the connection piece are removed by machining or by tool removal or manually removal. Wherein fig. 10 shows the final metal skeleton 2 with the first, second and third connectors removed.

Furthermore, the adjacent antenna structures can be integrated during stamping forming, and after the injection molding process is finished, part of the structures are removed to form mutually independent antenna structures. For example, the principle is that a third connector is provided between the cantilever ends of two adjacent antenna structures, and a gap 23 is formed between the adjacent cantilever ends after the third connector is removed.

Furthermore, the present application also provides an electronic device 100, including the middle frame assembly 101a described in any one of the above.

The middle frame assembly 101a in this application is formed by the above-described forming process, and the electronic device 100 includes the middle frame assembly 101a, so both have the above-described technical effects of the forming process of the middle frame assembly 101a.

Specific examples are set forth herein to illustrate the principles and embodiments of the present application, and the description of the examples above is only intended to assist in understanding the methods of the present application and their core ideas. It should be noted that it would be obvious to those skilled in the art that various improvements and modifications can be made to the present application without departing from the principles of the present application, and such improvements and modifications fall within the scope of the claims of the present application.

Claims

1. A process for forming a center assembly, the process comprising:

and (3) machining: the metal framework is formed through a stamping process,

and (3) injection molding: and molding the plastic body in the circumferential direction of the metal framework by injection molding, and forming an integrated structure with the metal framework during injection molding of the plastic body.

2. The process for forming a center assembly of claim 1, wherein the metal armature is stamped with at least one antenna structure in a circumferential direction.

3. The process for forming a center assembly of claim 2, wherein the machining comprises: respectively stamping and forming a middle plate and a metal frame, wherein the antenna structure is formed in the circumferential direction of the metal frame; and positioning and connecting the positions of the metal frame and the middle plate to form the metal framework.

4. A process for forming a middle frame assembly according to claim 3, wherein the metal frame is positionally joined to the middle plate by a riveting or welding process.

5. The process of claim 3 or 4, wherein a metal frame blank is formed in the machining, the metal frame blank including an integrally formed main body portion and a rim portion, the rim portion being located at a periphery of the main body portion, the antenna structure being press-formed at the rim portion, the antenna structure including a feeding section extending toward the main body portion, at least a portion of free ends of the feeding section being press-formed with a first connector by which the feeding section is supportably connected to the main body portion;

after the injection molding step, the method further comprises a removal processing step of: the first connection body is removed by machining or by tool removal or manually.

6. The process of forming a center assembly of claim 5, wherein the antenna structure further comprises a circumferentially extending antenna body, a second connector being also stamped and formed between a cantilevered end portion of the antenna body and the body portion to support the cantilevered end;

in the removal processing step, the second connection body is removed by machining or by tool removal or manually.

7. The process of forming a center assembly according to claim 6, wherein in the machining step, a third connecting body is further formed between the cantilever ends of the adjacent antenna bodies, and the cantilever ends of the two antenna bodies are connected by the third connecting body;

in the removing process step, the third connector is removed by machining or by tool removal or manually removed to form a gap between adjacent ones of the cantilevered ends.

8. The process of forming a center assembly of claim 5, wherein prior to the injection molding step, a portion of the antenna structure is further supported to the midplane by a connector; after the injection molding step, the connection is removed by machining or by tools.

9. The process of forming a center assembly according to any one of claims 5 to 8, wherein a bending section is punched and stretched on the main body part in the machining step, and the bending section is formed into a battery compartment sidewall satisfying design requirements through a upsetting process.

10. The process for forming a middle frame assembly according to any one of claims 1 to 9, wherein the metal skeleton has a material yield strength of not less than 280Mpa and an elongation of not less than 8%.

11. The middle frame assembly is characterized by comprising a metal framework formed through a stamping process, and further comprises a plastic body positioned on the circumference of the metal framework, wherein the plastic body is of a plastic structure, and the plastic body and the metal framework form an integrated structure during injection molding.

12. The mullion assembly of claim 11, wherein the metal framework includes an antenna structure.

13. The center assembly of claim 12, wherein the metal frame includes a middle plate and a metal frame, the antenna structure being formed in a circumferential direction of the metal frame, the middle plate and the metal frame being integrally connected and fixed by a positioning member.

14. The middle frame assembly of claim 13, wherein the positioning member comprises a staking post and a staking hole in a staking fit, one of which is disposed in the middle plate and the other of which is disposed in the metal frame;

or the middle plate and the metal frame are welded into a whole through a welding process.

15. A mid-frame assembly as claimed in claim 13 or 14, wherein the metal frame has at least two antenna structures with a gap between adjacent antenna structures to fill part of the plastic body.

16. The mullion assembly of any one of claims 11 to 15, wherein the metal framework has a material yield strength of greater than or equal to 280Mpa and an elongation of greater than or equal to 8%.

17. The mullion assembly of claim 16, wherein the material of the metal framework is an aluminum alloy or stainless steel or titanium alloy.

18. An electronic device comprising the midframe assembly of any one of claims 11-16.