CN115863959A - Terminal device, main board antenna bracket and preparation method thereof - Google Patents

Terminal device, main board antenna bracket and preparation method thereof Download PDF

Info

Publication number
CN115863959A
CN115863959A CN202111129527.0A CN202111129527A CN115863959A CN 115863959 A CN115863959 A CN 115863959A CN 202111129527 A CN202111129527 A CN 202111129527A CN 115863959 A CN115863959 A CN 115863959A
Authority
CN
China
Prior art keywords
antenna
plastic
motherboard
metal frame
antenna circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111129527.0A
Other languages
Chinese (zh)
Inventor
熊立志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honor Device Co Ltd
Original Assignee
Honor Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202111129527.0A priority Critical patent/CN115863959A/en
Publication of CN115863959A publication Critical patent/CN115863959A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Details Of Aerials (AREA)

Abstract

The embodiment of the application discloses mainboard antenna boom. The main board antenna bracket is usually configured in a shell of the terminal equipment and is mainly used for realizing the functions of configuring an antenna circuit, fixedly connecting a main board, crimping a BTB connector and the like. This mainboard antenna boom includes metal frame portion and plastic portion, and metal frame portion and plastic portion can fixed connection. The two opposite surfaces of the plastic part are respectively provided with an antenna circuit and a feeding part, and the processing technology of the antenna circuit and the feeding part is one or more of a spraying technology, a printing technology and a 3D printing technology. The main board antenna support is relatively short in manufacturing process, the yield of products can be improved, a preparation process with high pollution does not exist, and the harm to the environment and the life health of workers can be reduced. The embodiment of the application also provides a preparation method of the terminal device and the main board antenna bracket.

Description

Terminal device, main board antenna bracket and preparation method thereof
Technical Field
The embodiment of the application relates to the technical field of terminal equipment, in particular to terminal equipment, a main board antenna support and a preparation method of the main board antenna support.
Background
Terminal equipment of forms such as cell-phone mainly comprises display screen, mainboard antenna boom etc. and wherein, mainboard antenna boom includes metal frame portion and plastic part, and plastic part and metal frame portion form the integral type structure through the membrane technology of moulding plastics, and plastic part still is equipped with antenna circuit.
At present, the forming process of the antenna circuit is mainly an LDS (Laser Direct Structuring) process. However, because of the forming characteristics of the LDS process, the forming material of the plastic part must be modified plastic containing organic metal compound, which further increases the cost; moreover, the LDS process sequentially needs the working procedures of laser etching, cleaning by corrosive solutions such as strong acid and strong base, chemical copper plating and the like, so that the whole main board antenna bracket is longer in manufacturing procedure, and the yield of products is relatively low due to excessive working procedures; meanwhile, since the LDS process must be cleaned by corrosive solutions such as strong acid and strong base, the metal frame portion needs to be made of corrosion-resistant stainless steel, or at least needs to be coated with a corrosion-resistant shielding coating, which may cause the manufacturing cost of the main board antenna bracket to increase or the manufacturing process to become long.
Therefore, how to provide a solution to overcome at least some of the above drawbacks is still a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The embodiment of the application provides terminal equipment, a main board antenna bracket and a preparation method thereof. The manufacturing method of the main board antenna support is relatively short in manufacturing process, is beneficial to ensuring the yield of products, does not have strong polluting procedures such as a cleaning procedure of corrosive solutions such as strong acid and strong alkali and a chemical copper plating procedure, and can reduce the harm to the environment and the life health of field workers in the manufacturing process of the main board antenna support.
A first aspect of an embodiment of the present application provides a method for manufacturing a motherboard antenna bracket, where the motherboard antenna bracket includes a metal frame portion and a plastic portion, and the method includes the following steps: s1, configuring a metal frame part; s2, preparing a plastic material, and integrally injection-molding a plastic part on the metal frame part by taking the metal frame part as a base so that the plastic part and the metal frame part can be fixedly connected into a whole; step S3, respectively processing an antenna circuit and a feed part on two opposite surfaces of the plastic part, wherein the feed part is electrically connected with the antenna circuit; the processing technology of the antenna circuit and the feeding part is one or more of a spraying technology, a printing technology and a 3D printing technology.
Different from a conventional LDS process, the antenna circuit and the feeding portion in the embodiment of the application can be manufactured by one or more of a spraying process, a printing process and a 3D printing process, and the processes have no requirements on the material of the plastic portion. That is, the plastic material used to form the plastic part may not contain organic metal compound, so that the conventional plastic material may also meet the requirement of use, the plastic material may be obtained simply, and the processing cost of the plastic part may be reduced.
More importantly, compared with the traditional LDS process, the manufacturing method of the main board antenna support provided by the embodiment of the application has the advantages that the manufacturing process can be greatly shortened, the related process steps are fewer, so that the links with possible problems are relatively fewer, and the yield of products can be improved; in addition, the cleaning process of corrosive solutions such as strong acid and strong alkali and the like, the process of chemical copper plating and other processes with strong pollution do not exist, and the harm to the environment and the life health of field workers in the preparation process of the main board antenna support can be reduced.
It should be noted that, the method for manufacturing the motherboard antenna bracket provided in the embodiment of the present application provides a possibility for using a plastic material without an organic metal compound, but this does not mean that the plastic material without an organic metal compound is necessarily used in the implementation, and in fact, the above manufacturing method does not limit the materials of the plastic part and the metal frame part; that is, the selection of the materials of the plastic part and the metal frame part cannot be taken as a limitation to the implementation range of the main board antenna support provided in the embodiments of the present application.
Based on the first aspect, an embodiment of the present application further provides a first implementation manner of the first aspect: before step S1, the method may further include: s0, preparing a metal raw material; in this case, step S1 may specifically be: the metal stock is processed to form a metal frame portion.
The metal frame portion may be a preform, so that when the manufacturing method provided by the embodiments of the present application is performed, the metal frame portion is directly accessible.
In addition, the metal frame portion may be formed by machining, so that the shape of the metal frame portion can be adjusted more conveniently as needed. In this case, the metal material is disposed before the metal frame portion is used. The metal material may be a metal coil, a plate, or the like, and the metal frame portion configured in step S1 may be a metal frame portion formed by processing the metal material. The machining of the metal frame portion may involve cutting, stamping and the like processes, which are particularly linked to the type of metal stock used and the moulding requirements of the final metal frame portion.
Based on the first implementation manner of the first aspect, the present application provides a second implementation manner of the first aspect: the metal raw material can be in a density of 3.0g/cm 3 The following light metals.
As described above, the preparation method provided in the embodiments of the present application does not involve the cleaning process and the electroless copper plating process of the corrosive solution such as strong acid and strong base, and therefore, the density of less than 3.0g/cm can be used in the embodiments of the present application 3 The corrosion resistance of the alloy is relatively poor, and the alloy is light metal, such as aluminum alloy, magnesium alloy, aluminum magnesium alloy and the like. Compared with the traditional steel material or titanium material metal frame part (the density is 4.5g/cm generally) 3 Above), under the condition of the same volume, weight can lighten by a wide margin, can satisfy mainboard antenna boom and terminal equipment's lightweight design requirement.
In addition, the thermal conductivity of the light metal is generally high (for example, the thermal conductivity of the aluminum alloy is generally over 100w/mk, and the thermal conductivity of the magnesium alloy is generally over 50 w/mk), and when the metal frame portion is made of the light metal, the heat dissipation performance of the main board antenna bracket provided by the embodiment of the present application can be improved.
Based on the first implementation manner or the second implementation manner of the first aspect, an embodiment of the present application further provides a third implementation manner of the first aspect: an important function of the main board antenna bracket is to press the BTB connector, and the area for pressing the BTB connector is usually located in the metal frame portion, and for convenience of description, the area in the metal frame portion for pressing the BTB connector may be referred to as a press-bonding area, and the aforementioned processing metal materials may specifically include: the crimping area is processed, and a reinforcing structure and/or a reinforcing member is arranged in the crimping area.
The reinforcing structure is a structure formed by the metal frame part after the metal frame part is locally optimized; the reinforcing member is an external structural member, and may be attached to the metal frame portion by mechanical connection such as adhesion, welding, or caulking. By arranging the reinforcing structure and/or the reinforcing member in the crimping region, the structural strength of the crimping region can be improved, and the technical purpose of reliably crimping the BTB connector can be better satisfied.
The scheme is particularly suitable for the metal frame part made of light metal, and can well make up the defect that the structural strength of the light metal is relatively low. Of course, the reinforcing structure and/or the reinforcing member described above may be configured as well when not made of light metal.
Based on the third implementation manner of the first aspect, the present application provides an example of the fourth implementation manner of the first aspect: the reinforcing structure may include at least one of a bending structure and a multi-layer plate structure, where the bending structure is a structure in which a bending portion is provided in a crimping region, and the multi-layer plate structure is a structure in which the crimping region is provided with multiple layers by folding; and/or, the reinforcing member may include at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer, and these structural members may be attached to the crimping region by mechanical connection such as bonding, welding, riveting, and the like, so as to reinforce the strength of the metal frame portion.
Based on any one of the first to fourth embodiments of the first aspect, an example of the present application further provides a fifth embodiment of the first aspect: the metal frame portion may have a stamped area, and the above-mentioned machined metal stock includes: and processing the stamping area by adopting a multi-stage stamping mode to form a multi-stage stamping section, wherein the stamping section of the lower stage is formed by stamping the bottom wall of the stamping section of the adjacent upper stage, and a transition step surface is formed between the two adjacent stamping sections.
When carrying out stamping operation, especially when carrying out stamping operation to the metal frame portion of the relatively poor light metal preparation of ductility, can adopt the mode of punching press step by step to in the punching process of each grade is dispersed to the relatively great punching press degree of depth, like this, the degree of depth of punching press each time is all not big, can avoid single punching press too deeply and the fracture problem that causes to a great extent. During concrete operation, the punching press that carries on that can be step by step, the punching press section of punching press higher order earlier, then at the punching press section of the adjacent lower order of diapire punching press of higher order punching press section, the part that is not punched in the diapire of higher order punching press section can form the transition step face between two adjacent punching press sections.
Based on any one of the first implementation manner to the fifth implementation manner of the first aspect, embodiments of the present application further provide a sixth implementation manner of the first aspect: the metal frame portion has a flap plate area, and the processing of the metal stock includes: and processing a turnover plate area by adopting a turnover process.
In addition to the multi-stage punching scheme, a flap plate area can be arranged on the metal frame part, so that the problem of cracking caused by over-deep single punching when the ductility of the metal frame part is insufficient can be avoided well.
Based on any one of the implementation manners of the first aspect, an embodiment of the present application further provides a seventh implementation manner of the first aspect: the step S2 may specifically include: step S21, configuring a plastic mold; step S22, implanting the metal frame part into a plastic mold; and S23, injecting the plastic material in a molten state into a plastic mold, and demolding after the plastic material is cooled to obtain the metal frame part and the plastic part which are fixedly connected into a whole.
Based on any one of the implementation manners of the first aspect, an example of the present application further provides an eighth implementation manner of the first aspect: step S3 may be followed by: and S4, performing finish machining on the antenna circuit by adopting an edge processing process.
When the antenna circuit is processed by adopting a spraying process, a printing process or a 3D printing process, a certain margin can be preset, the margin can be determined by combining with the actual situation, and then the antenna circuit is subjected to fine machining by adopting an edge processing process so as to remove redundant parts, thereby forming the final antenna circuit. So set up, antenna circuit's tolerance size can be controlled within 0.1mm, can even be within 0.07mm for antenna circuit's precision can obtain promotion by a relatively large margin.
The edge processing process is a trimming process for performing a fine processing on the edge of the edge circuit, and may be a laser etching process.
Based on any one of the implementation manners of the first aspect, an embodiment of the present application further provides a ninth implementation manner of the first aspect: the feeding portion and the antenna circuit may each include a plurality of layers, and each layer may be spaced apart from the plastic portion, so that the foregoing step S3 may specifically be: the antenna circuit and the feeding portion are processed layer by layer on opposite surfaces of the plastic portion.
By adopting the scheme of layer-by-layer processing, the antenna circuit and the feeding part with a three-dimensional structure can be obtained more conveniently, the structural form of the antenna circuit and the feeding part can be better ensured, the defects of wire breakage and the like can be avoided to a greater extent, and the processing quality of the antenna circuit and the feeding part can be further ensured.
More importantly, when the design scheme of layer-by-layer processing is adopted, the same material or different materials can be adopted for each layer; when different materials are adopted, the main functions of each layer can be different, and performance parameters such as conductivity, wear resistance and the like of the antenna circuit and the feeding part can be conveniently adjusted; meanwhile, the thicknesses of the antenna circuit and the feeding part can be increased, and the service lives of the antenna circuit and the feeding part can be guaranteed to a certain extent.
Based on any one of the implementation manners of the first aspect, an embodiment of the present application further provides a tenth implementation manner of the first aspect: after step S3, the method may further include: and step S5, arranging a shielding layer outside the antenna circuit.
The shielding layer can play a role in protecting the antenna circuit, so that the risk that the antenna circuit partially falls off due to damages such as scratch, abrasion and scratch of other components to the antenna circuit in the installation and use processes can be reduced, and the reliable and stable operation of the antenna circuit in a relatively long time can be ensured. In a specific practice, the shielding layer may be made of an insulating material, so that the electrical connection between the antenna circuit and unnecessary components can be avoided, and the normal operation of the antenna circuit can be prevented from being affected.
A second aspect of the embodiments of the present application provides a motherboard antenna bracket, which is generally disposed inside a housing of a terminal device, and is mainly used for implementing functions of configuring an antenna circuit, fixedly connecting a motherboard, and crimping a BTB connector; the main board antenna bracket can comprise a metal frame part and a plastic part, wherein the metal frame part and the plastic part can be fixedly connected, and generally speaking, the plastic part can be fixedly connected with the metal frame part in an integral injection molding mode; the two opposite surfaces of the plastic part are respectively provided with an antenna circuit and a feeding part, and the feeding part is electrically connected with the antenna circuit, wherein the processing technology of the antenna circuit and the feeding part is one or more of a spraying technology, a printing technology and a 3D printing technology.
The main board antenna support provided by the second aspect of the present application corresponds to the manufacturing method of the main board antenna support provided by the first aspect, and therefore, the technical effects mentioned in the manufacturing method and the main board antenna support provided by the embodiment of the present application also have the same technical effects, and repeated descriptions are not provided herein.
Based on the second aspect, the embodiments of the present application provide a first implementation manner of the second aspect: the material of the metal frame portion may be a material having a density of 3.0g/cm 3 The following light metals.
Based on the second aspect or the first implementation manner of the second aspect, the present application provides a second implementation manner of the second aspect: the metal frame portion may have a crimping area for crimping the BTB connector, which crimping area may be configured with a reinforcement structure and/or a reinforcement member.
Based on the second implementation manner of the second aspect, the present application provides a third implementation manner of the second aspect: the reinforcing structure may include at least one of a bent structure and a multi-layer plate structure; and/or, the reinforcing member may include at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer.
Based on the third implementation manner of the second aspect, the present application provides a fourth implementation manner of the second aspect: an adhesion force increasing layer can be arranged between the reinforcing plating layer and the metal frame part. The adhesion force increasing layer can improve the surface roughness of the metal frame part so as to facilitate the reliable installation of the reinforcing coating.
Based on any one of the embodiments of the second aspect, the present application provides a fifth embodiment of the second aspect: the metal frame portion may have a stamping region, and the stamping region may include a plurality of stamping sections, wherein the stamping section of the lower stage is stamped and formed by the bottom wall of the stamping section of the adjacent upper stage, and a transition step surface is formed between the stamping sections of the adjacent two stages.
Based on any one of the embodiments of the second aspect, the present examples further provide a sixth embodiment of the second aspect: the metal shelf portion may have a flap area.
Based on any one of the embodiments of the second aspect, the present application provides a seventh embodiment of the second aspect: the material of the plastic part may be free of organometallic compounds.
The antenna circuit and the feeding portion in the application embodiment can be formed by one or more of a spraying process, a printing process and a 3D printing process, and the processes have no requirements on the material of the plastic portion. Therefore, the plastic material used for forming the plastic part in the embodiment of the present application may not contain the organic metal compound, so that the obtaining of the plastic material may become simple and the processing cost of the plastic part may be reduced.
In specific practice, the plastic material used for preparing the plastic part may be any one or a combination of ABS, PP, PC, PE, PA + GF, PC + GF, etc.
Based on any one of the implementation manners of the second aspect, the present examples further provide an eighth implementation manner of the second aspect: the plastic part and the antenna circuit may each comprise several layers.
Based on the eighth implementation manner of the second aspect, the present application provides the ninth implementation manner of the second aspect: in each layer of the feeding part, the wear resistance of the outermost layer is greater than that of the rest layers of the feeding part; and/or the abrasion resistance of the outermost layer of the layers of the antenna circuit is greater than that of the rest layers of the antenna circuit.
The outermost layer is the layer farthest from the plastic part, the outermost layers of the antenna circuit and the feeding part are both made to be high in wear resistance, abrasion of the antenna circuit and the feeding part in the using process can be reduced, the antenna circuit and the feeding part can both keep reliable and stable operation within a relatively long time, and the service lives of the antenna circuit and the feeding part can be prolonged.
Based on the eighth implementation manner or the ninth implementation manner of the second aspect, the present application provides a tenth implementation manner of the second aspect: the wear resistance of each layer of the feed part is gradually reduced from outside to inside; and/or the wear resistance of each layer of the antenna circuit is gradually reduced from outside to inside.
In specific practice, the wear-resisting performance of each layer of the antenna circuit and the feeding part can be gradually decreased from outside to inside, so that the reliable and stable operation of the antenna circuit and the feeding part in a long time can be ensured, and the service lives of the antenna circuit and the feeding part are further prolonged.
Based on the eighth implementation manner, the ninth implementation manner or the tenth implementation manner of the second aspect, the examples of the present application further provide an eleventh implementation manner of the second aspect: the conductivity of each layer of the feeding part can be gradually increased from outside to inside; and/or the conducting performance of each layer of the antenna circuit can be gradually increased from outside to inside. Thus, the electrical connection between the antenna circuit and the feeding portion can be more reliable; meanwhile, the use of materials with higher conductivity such as silver paste can be avoided, and the processing cost of the antenna circuit and the feeding portion can be reduced.
Based on any one of the implementation manners of the second aspect, the present application provides a twelfth implementation manner of the second aspect: the outer side of the antenna circuit can be provided with a shielding layer.
A third aspect of the embodiments of the present application further provides a terminal device, including a housing, a motherboard, and a motherboard antenna mount, where the motherboard and the motherboard antenna mount are both installed in the housing, and the motherboard antenna mount is a motherboard antenna mount related to any one of the implementation manners of the second aspect.
Since the main board antenna bracket of the second aspect has the above technical effects, the terminal device having the main board antenna bracket also has similar technical effects, and therefore, the detailed description thereof is omitted here.
Drawings
Fig. 1 is a schematic structural diagram of a specific implementation of a terminal device according to an embodiment of the present application;
FIG. 2 is a fragmentary view of FIG. 1;
fig. 3 is a schematic flowchart of a specific implementation of a method for manufacturing a motherboard antenna bracket according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating a manufacturing process of a main board antenna bracket according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of a process of injection molding a plastic part based on a metal frame part;
fig. 6 is a schematic diagram of a side where a feeding portion of a main board antenna bracket according to an embodiment of the present application is located;
FIG. 7 is a cross-sectional view of the plastic part, the antenna circuit and the feeding part;
fig. 8 is a connection structure diagram of the crimping region, the BTB connector 105, the main board, and the middle frame;
FIG. 9 is a schematic view of the structure of the crimping zone;
FIG. 10 isbase:Sub>A cross-sectional view in the direction A-A of the first embodiment of some of the embodiments of the crimp zone shown in FIG. 9, includingbase:Sub>A number of different scenarios;
FIG. 11 isbase:Sub>A cross-sectional view in the direction A-A of the second embodiment of some examples of the crimp zone shown in FIG. 9;
FIG. 12 isbase:Sub>A cross-sectional view of the first embodiment of the crimp zone shown in FIG. 9 taken in the direction A-A;
FIG. 13 isbase:Sub>A cross-sectional view in the direction A-A of the second embodiment of the crimp zone of FIG. 9;
FIG. 14 isbase:Sub>A cross-sectional view in the direction A-A ofbase:Sub>A third alternative embodiment of the crimp zone shown in FIG. 9;
fig. 15 is a schematic view of a metal frame portion in the prior art and in the embodiment of the present application.
The reference numerals in fig. 1-15 are illustrated as follows:
100-terminal equipment, 101-display screen, 102-shell, 102 a-middle frame, 102 b-rear cover, 103-main board antenna bracket, 104-main board, 105-BTB connector and 106-locking screw;
1-metal coil stock;
2-metal frame part, 21-crimping area, 211-bending structure, 212-multilayer plate structure, 213-plastic layer, 214-reinforcing plate, 215-reinforcing plating layer, 216-adhesion force increasing layer, 217-connecting hole, 22-primary stamping section, 23-secondary stamping section, 24-transition step surface, 25-folding plate area, 201-high-tension convex area and 202-high-tension concave area;
3-plastic part, 31-conductive part;
4-antenna circuit, 41-first layer, 42-second layer, 43-third layer;
5-feeding part, 51-fourth layer, 52-fifth layer, 53-sixth layer, 54-seventh layer and 55-eighth layer;
6-a shielding layer;
m-plastic mold.
Detailed Description
In order to make the technical solutions of the present application better understood by those skilled in the art, the present application is further described in detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a specific implementation of a terminal device according to an embodiment of the present application, and fig. 2 is a split view of fig. 1.
The terminal device 100 referred to in embodiments of the present application may comprise a handheld device, a vehicle mounted device, a wearable device, a computing device or other processing device connected to a wireless modem. But may also include cellular phones, smart phones, personal digital assistant computers, tablet computers, handheld computers, laptop computers, video cameras, video recorders, cameras, smart watches, smart bracelets, in-vehicle computers, and other terminal devices 100 with imaging capabilities. In the embodiment of the present application, a specific form of the terminal device 100 is not particularly limited, and for convenience of understanding, the following description is given by taking the terminal device 100 as a mobile phone as an example.
As shown in fig. 1 and 2, the terminal device 100 may generally include a housing 102 and a display 101. A receiving cavity may be formed inside the housing 102, and various components of the terminal device 100 may be disposed in the receiving cavity, and specific components may include a battery, a main board 104, a main board antenna support 103, a camera assembly, and the like, and the disposition position and the installation manner of these components are not limited herein.
The housing 102 serves as an external frame and may protect the terminal device 100. The display screen 101 may be mounted to the housing 102. In some embodiments, in conjunction with fig. 2, the housing 102 may include a middle frame 102a and a rear cover 102b, and the aforementioned display screen 101 may be fixedly mounted on the middle frame 102 a. The material of the housing 102 is not limited herein, and in particular practice, those skilled in the art can select the material according to actual needs; for example, the material may be a metal material, a plastic material, a ceramic material, a glass material, or the like.
The display 101 may be an organic light emitting diode display or a liquid crystal display, etc. The display screen may be a flexible display screen or a hard display screen, wherein the flexible display screen is provided with a foldable function, and can be matched with the structural design of the housing 102 to realize operations such as folding of the terminal device 100. The display screen 101 may be a regular screen or a irregular screen, for example, the outer edge of the display screen 101 may be curved to form a curved screen.
The display 101 may be disposed on the front side of the terminal device 100, may be disposed on the back side of the terminal device 100, or may be disposed on both the front side and the back side of the terminal device 100. The front side of the terminal device 100 may be understood as the side facing the user when the user uses the terminal device 100, i.e. the side marked with the reference numeral 101 shown in fig. 1, and the back side of the terminal device 100 may be understood as the side facing away from the user when the user uses the terminal device 100.
Taking the front side of the terminal device 100 as an example, in terms of the arrangement range, the display screen 101 may cover all areas of the front side of the terminal device 100, that is, the terminal device 100 of a full screen may be formed, at this time, the display screen 101 not only has a display function, but also generally has a touch function, that is, the terminal device 100 may be operated by clicking the display screen 101; or, the display screen 101 may only cover a partial area of the front surface of the terminal device 100, which is also an option in specific practice, in this case, the display screen 101 may have a touch function, or may only have a display function, and it is understood that, when only having the display function, a corresponding human-machine operation component such as a key may be configured in an area of the housing 102 where the display screen 101 is not disposed, so as to operate the terminal device 100, and the human-machine operation component may be disposed at any position of the front surface, the back surface, or the side surface of the terminal device 100.
The main Board antenna bracket 103 is disposed inside the housing 102, and is mainly used for implementing functions of configuring the antenna circuit 4, fixedly connecting the main Board 104, and crimping a BTB (Board To Board) connector. As described in the background art, the antenna circuit 4 of the conventional motherboard antenna chassis 103 is generally manufactured by the LDS process, but the LDS process has problems of high requirements for molding materials of the plastic part 3, long manufacturing process, low product yield, and high manufacturing cost due to the necessity of using the metal frame part 2 made of corrosion-resistant materials such as stainless steel or at least using a corrosion-resistant shielding coating to coat the metal frame part 2.
Referring to fig. 3 to 6, fig. 3 is a schematic flow chart of an embodiment of a method for manufacturing a motherboard antenna bracket according to an embodiment of the present disclosure, fig. 4 is a schematic flow chart of a manufacturing process of the motherboard antenna bracket according to the embodiment of the present disclosure, fig. 5 is a schematic flow chart of a metal frame portion-based injection molding plastic portion, and fig. 6 is a schematic flow chart of a feeding portion side of the motherboard antenna bracket according to the embodiment of the present disclosure.
In view of the above technical problems, as shown in fig. 3 to 6, an embodiment of the present application provides a method for manufacturing a novel main board antenna bracket, which may include at least steps S1 to S3 described below.
In step S1, a metal frame part 2 is disposed.
The metal frame part 2 may be a pre-prepared intermediate element, such as a component manufactured by outsourcing or other processes, in which case step S1 simply prepares the pre-prepared metal frame part 2 ready for use. Alternatively, the metal frame portion 2 may be formed by machining, and in this case, the method may further include, before step S1: preparing a metal raw material, wherein the metal raw material can be a metal coil stock 1, a plate stock and the like, and the step S1 can be specifically processing the metal raw material to form a metal frame part 2; the machining of the metal frame part 2 may involve cutting, stamping and the like processes, which are in particular associated with the type of metal stock used.
In some embodiments, as shown in fig. 4, the metal feedstock may be a metal coil 1. At this time, the metal coil stock 1 may be cut to obtain a base material for processing the metal frame portion 2, and the base material may be a substantially square plate or a substantially rectangular plate; then, further cutting and cutting the base material to process corresponding hollowed-out areas on the base material according to requirements, and further forming an intermediate material basically meeting the shape requirement, wherein the intermediate material is still flat; then, the intermediate material may be pressed to obtain a corresponding concave-convex shape, and the final metal frame portion 2 may be obtained. The specific processes of the cutting process, and the stamping process are not described or limited herein.
Step S2, plastic materials are configured, and the metal frame part 2 is taken as a base, and the plastic part 3 is integrally formed on the metal frame part 2 in an injection molding mode.
To elaborate, as shown in fig. 5, a desired plastic mold M may be configured first; then, the metal frame part 2 in step S1 may be implanted into the plastic mold M, and the specific structural form of the plastic mold M may be determined according to actual needs; then, the plastic material may be heated to a molten state, and the molten plastic material may be injected into the cavity of the plastic mold M. The plastic material can form the plastic part 3 after being solidified by cooling, and the plastic part 3 and the metal frame part 2 can have good joint effect to ensure the connection reliability of the two parts. The position of the plastic part 3 relative to the metal frame part 2 is not limited herein, and in particular practice, the skilled person can set the position according to actual needs.
And S3, respectively forming the antenna circuit 4 and the feeding part 5 on two opposite surfaces of the plastic part 3 by adopting a spraying process, wherein the feeding part 5 and the antenna circuit 4 can be electrically connected. Wherein, the antenna circuit 4 is a device for radiating and receiving radio waves (energy), and functions to transmit digital signals modulated to radio frequency to a spatial wireless channel, or receive digital signals modulated on radio frequency from the spatial wireless channel, in an exemplary scheme, the antenna circuit 4 can radiate and receive two 5G frequency bands of N78 (N78 frequency band supports 3400MHz-3600 MHz) and N79 (N79 frequency band supports 4800MHz-5000 MHz), so as to really realize full network communication; the feeding portion 5 is a connection portion between the antenna circuit 4 and the main board 104, and generally, a conductive contact element in the form of a spring sheet or a conductive foam is welded on the main board 104, and the conductive contact element can contact with the feeding portion 5 to achieve electrical connection and impedance matching; thus, the antenna circuit 4 and the main board 104 can be electrically connected.
Different from the conventional design, the antenna circuit 4 and the feeding portion 5 in the embodiment of the present application are both formed by a spraying process, and the process has no requirement on the material of the plastic portion 3, that is, the plastic material for forming the plastic portion 3 may not contain an organic metal compound, so that the conventional plastic material may also meet the requirement of use, the obtaining of the plastic material may be simplified, and the processing cost of the plastic portion 3 may be reduced.
Besides the spraying process, the antenna circuit 4 and the feeding portion 5 may also be prepared by a printing process or a 3D printing process in the embodiment of the present application, which may not be required for the material of the plastic portion 3. It should be noted that the antenna circuit 4 and the feeding portion 5 may not be formed by the same process, that is, the antenna circuit 4 and the feeding portion 5 may be manufactured by any one or more of a spraying process, a printing process, and a 3D printing process. The structural form of the device required to be used in the spraying process, the printing process, and the 3D printing process, the specific operation flow of the spraying process, the printing process, and the 3D printing process, and the like are not limited herein, as long as the antenna circuit 4 and the feeding portion 5 in the embodiment of the present application can be obtained.
The type of the conventional plastic material is not limited herein, and in particular practice, the skilled person can determine the type of the plastic material according to the actual situation. As an exemplary illustration, the plastic material used for preparing the plastic part 3 in the embodiment of the present invention may be any one or a combination of ABS (Acrylonitrile Butadiene Styrene), PP (polypropylene), PVC (Polyvinyl chloride), PC (Polycarbonate), PA (polyamide), PE (polyethylene), PA + GF (Glass Fiber), PC + GF (Polyvinyl chloride), etc.; when the plastic part 3 is made of a mixture of multiple materials (such as PA + GF), the ratio of the materials of each part is not limited herein, and in particular practice, those skilled in the art can make a combination adjustment according to the relevant properties of different materials.
More importantly, compared with the traditional LDS process, the manufacturing method of the main board antenna support provided by the embodiment of the application has the advantages that the manufacturing process can be greatly shortened, the related process steps are fewer, so that the links with possible problems are relatively fewer, and the yield of products can be improved; in addition, the cleaning process of corrosive solutions such as strong acid and strong alkali, the process of chemical copper plating and other processes with strong pollution do not exist, and the harm to the environment and the life health of field workers in the preparation process of the main board antenna support 103 can be reduced.
Referring to fig. 7, fig. 7 is a cross-sectional view of the plastic part, the antenna circuit and the feeding part.
As shown in fig. 7, the electrical connection between the antenna circuit 4 and the feeding portion 5 is mainly achieved by the conductive portion 31 provided in the plastic portion 3.
In detail, the plastic part 3 may be provided with a communication hole (not labeled in the drawings), and at least a part of the communication hole may be designed as a tapered section to facilitate filling and flowing of the conductive medium therein, the kind of the conductive medium is not limited herein, and those skilled in the art can determine the type of the conductive medium in combination with the actual situation in the specific practice, or can also set the type of the conductive medium with reference to the contents in the following text. The tapered section may include a large neck end and a small neck end, and in the embodiment of the drawing, the large neck end is relatively closer to the antenna circuit 4, so that the conductive medium may be injected into the communication hole when the antenna circuit 4 is prepared, so as to facilitate the filling and flowing of the conductive medium in the communication hole; in addition, the large neck end of the tapered section may be set close to the feeding portion 5, that is, the communication hole in fig. 7 may be inverted, and in this case, a conductive medium may be injected into the communication hole to facilitate the flow of the conductive medium in the communication hole when the feeding portion 5 is prepared.
In fact, the communication hole is not limited to the design of the tapered hole, and it may be designed as another hole type, such as a stepped hole. In detail, the stepped hole may include a plurality of branch hole sections with different flow areas, and along the axial direction of the communication hole, the flow area of each branch hole section may be gradually changed, that is, sequentially increased from top to bottom (referring to the orientation relationship in fig. 7) or sequentially decreased, and a stepped surface may be formed between two adjacent branch hole sections, so that the filling and the flow guiding of the conductive medium may be easily achieved. If the difficulty of filling is not considered, the communicating hole can also adopt a design scheme with equal flow area in the axial direction, such as a circular hole with equal diameter. The above-mentioned "a plurality" means specifically two or more.
Further, the antenna circuit 4 and the feeding unit 5 in step S3 may be formed by multiple spraying or multiple printing to form the antenna circuit 4 and the feeding unit 5 having a three-dimensional structure. Therefore, the structural form of the antenna circuit 4 and the feeding part 5 can be ensured, the defects of wire breakage and the like can be avoided to a greater extent, and the processing quality of the antenna circuit 4 and the feeding part 5 can be ensured; in addition, according to this configuration, the antenna circuit 4 and the feeding unit 5 actually include a plurality of layers, and these layers may be made of the same material or different materials, and when different materials are used, the main functions of the layers may differ, and performance parameters such as conductivity and wear resistance of the antenna circuit 4 and the feeding unit 5 may be easily adjusted.
Taking the feeding portion 5 as an example, in each layer, the layer relatively close to the plastic portion 3 may adopt a material with relatively better conductivity, such as silver paste, silver-coated copper paste, etc., to ensure conductivity, and the layer relatively far away from the plastic portion 3, especially the outermost layer, may adopt a material with higher hardness, such as wear-resistant silver paste added with wear-resistant material, etc., to improve the wear-resistant performance of the feeding portion 5, thereby ensuring that the feeding portion 5 is not damaged within a relatively long time, and further improving the service life of the feeding portion 5. The outermost layer herein refers to the layer farthest from the plastic part 3, and in conjunction with fig. 7, refers to the uppermost layer of the antenna circuit 4 and the lowermost layer of the feeding part 5.
The antenna circuit 4 may adopt a structural form similar to that of the feeding portion 5, that is, a material with higher hardness may be adopted for the lamination relatively far away from the plastic portion 3 or at least for the lamination at the outermost layer, so as to reduce damages such as scratch and the like caused by other components to the antenna circuit 4, thereby ensuring reliable and stable operation of the antenna circuit 4 within a relatively long time, and further improving the service life of the antenna circuit 4.
Alternatively, in addition to this scheme, the embodiment of the present application may further include, after step S3, step S5: a shielding layer 6 is coated on the antenna circuit 4. The shielding layer 6 can also protect the antenna circuit 4, so that the risk that the antenna circuit 4 is partially dropped due to damages such as scratches, abrasion, scratches and the like of other parts to the antenna circuit 4 in the installation and use processes can be reduced, and the reliable and stable operation of the antenna circuit 4 in a relatively long time can be ensured. The shielding layer 6 can be made of ink, paint, a film or mylar sheet, and the paint can be PU (polyurethane) paint which can be cured at low temperature or high temperature, has strong adhesive force and high elongation at break, and is not easy to break; furthermore, the shielding layer 6 may be made of an insulating material, so that the antenna circuit 4 is prevented from being affected by the electrical connection between the antenna circuit 4 and unnecessary components.
With continued reference to fig. 7, in the embodiment of the drawings, the antenna circuit 4 may include three sub-layers, which may be named as a first sub-layer 41, a second sub-layer 42 and a third sub-layer 43 respectively for convenience of description, and an outer side (i.e. a side far from the second sub-layer 42) of the third sub-layer 43 may be further provided with a shielding layer 6; the feeding portion 5 may include five layers, which may be named as a fourth layer 51, a fifth layer 52, a sixth layer 53, a seventh layer 54, and an eighth layer 55 in a direction away from the plastic portion 3 for convenience of description, and at least the eighth layer 55 of the layers may be made of a material with high hardness to improve the wear resistance of the feeding portion 5; the first sublayer 41 and the fourth sublayer 51 can be electrically connected by the conductive portion 31.
Table 1 material selection table for each layer, shielding layer, and conductive part of antenna circuit and feeding part
Figure BDA0003279960710000111
Specifically, the materials of the layers of the antenna circuit 4 and the power feeding unit 5, the shielding layer 6, and the conductive unit 31 may be selected by referring to the examples in table 1. In the three schemes a, B, and C shown in table 1, the scheme C is a comparison scheme (which can also be implemented), low-impedance silver paste is used for the three layers of the antenna circuit 4 and the conductive portion 31 in the scheme C to ensure the conductive performance, and wear-resistant silver paste is used for each layer of the feeding portion 5 to ensure the wear-resistant performance. A. In the scheme B, silver-coated copper paste or copper paste is introduced to replace expensive silver paste in the configuration process of the antenna circuit 4, so that the cost can be greatly reduced; in the configuration process of the feeding portion 5, the fourth to sixth layers 51 to 53 relatively close to the plastic portion 3 are made of materials with relatively better conductivity, such as silver-clad copper paste or copper paste, so that the conductivity of the feeding portion 5 can be ensured, and the stability of the electrical connection between the antenna circuit 4 and the main board 104 can be greatly improved; in addition, in the configuration process of the feeding portion 5, the seventh lamination 54 and the eighth lamination 55 which are relatively far away from the plastic portion 3 can be made of wear-resistant silver paste so as to ensure the wear resistance. As is clear from the analysis, the cost of the solutions a and B can be significantly reduced compared to the solution C, the conductivity of the power feeding unit 5 can be improved, and the wear resistance of the power feeding unit 5 can be considered at the same time, which is a preferable solution of the embodiment of the present application.
It is understood that the material choices of the layers of the antenna circuit 4 and the feeding portion 5, the shielding layer 6 and the conductive portion 31 in table 1 are only an exemplary illustration of the embodiment of the present application, and cannot be regarded as a limitation to the implementation range of the motherboard antenna holder and the manufacturing method thereof provided in the embodiment of the present application; in practical applications, those skilled in the art may use other materials to process the layers of the antenna circuit 4 and the feeding unit 5, the shielding layer 6, and the conductive unit 31 as long as the requirements of the application can be met.
Further, the step S3 may be followed by a step S4: and performing finish machining on the antenna circuit 4 by adopting a laser etching process to ensure the dimensional tolerance of the antenna circuit 4. In practice, this step S4 exists between step S3 and the aforementioned step S5, as shown in fig. 3.
Specifically, when the antenna circuit 4 is processed by using a spraying process, a printing process or a 3D printing process, a certain margin may be preset, the size of the margin may be determined by combining with actual conditions, in some embodiments, the area of the printed antenna circuit 4 may be increased by about 0.1mm on one side, and then the excess portion is removed by using a laser etching process, thereby forming the final antenna circuit 4. So set up, antenna circuit 4's tolerance size can be controlled within 0.1mm, can even be within 0.07mm for antenna circuit 4's precision can obtain promotion by a relatively large margin.
In addition, because the preparation method of the main board antenna support provided by the embodiment of the present application does not need to adopt a process of cleaning with a strong acid, a strong base and other corrosive solutions in the LDS process, the material of the metal frame portion 2 may also be more selected, and the metal frame portion may be made of stainless steel or other materials in the prior art, as long as the processing and preparation requirements of the specific structural form of the metal frame portion 2 can be met, so that the acquisition of the metal frame portion 2 may be relatively simple. Moreover, even if the metal frame portion 2 does not use stainless steel or other metal having corrosion resistance, it is not necessary to provide a corrosion-resistant masking coating, and the processing of the metal frame portion 2 can be simplified.
Since the performance requirements for corrosion protection need not be considered, in the examples of the present application, a density of less than 3.0g/cm may be preferably used 3 Compared with the traditional steel or titanium metal frame part 2 (the density is generally 4.5 g/cm) 3 Above), the weight of mainboard antenna boom can also be lightened in the chooseing of light metal to satisfy the light-weighted design requirement of current terminal equipment 100.
In addition, the thermal conductivity of the conventional steel frame portion 2 is generally about 16.3w/mk, the thermal conductivity of the conventional titanium frame portion 2 is generally about 15w/mk, and the thermal conductivity of the light metal may be relatively large (e.g., the thermal conductivity of aluminum alloy is generally more than 100w/mk, and the thermal conductivity of magnesium alloy is generally more than 50 w/mk), and the heat dissipation performance of the motherboard antenna bracket 103 according to the embodiment of the present invention may be improved.
Referring to fig. 8-14, fig. 8 isbase:Sub>A connection structure diagram ofbase:Sub>A crimping zone,base:Sub>A BTB connector 105,base:Sub>A main board andbase:Sub>A middle frame, fig. 9 isbase:Sub>A structural diagram of the crimping zone, fig. 10 isbase:Sub>A sectional view ofbase:Sub>A first embodiment of some embodiments of the crimping zone shown in fig. 9 inbase:Sub>A-base:Sub>A direction, which includesbase:Sub>A plurality of different situations, fig. 11 isbase:Sub>A sectional view ofbase:Sub>A second embodiment of some embodiments of the crimping zone shown in fig. 9 inbase:Sub>A-base:Sub>A direction, fig. 12 isbase:Sub>A sectional view ofbase:Sub>A first embodiment of other embodiments of the crimping zone shown in fig. 9 inbase:Sub>A-base:Sub>A direction, fig. 13 isbase:Sub>A sectional view ofbase:Sub>A second embodiment of other embodiments of the crimping zone shown in fig. 9 inbase:Sub>A-base:Sub>A direction, and fig. 14 isbase:Sub>A sectional view ofbase:Sub>A third embodiment of other embodiments of the crimping zone shown in fig. 9 inbase:Sub>A-base:Sub>A direction.
As described above, an important function of the main board antenna chassis is to press the BTB connector 105, and in particular, to press-contact the BTB connector 105 through the metal chassis part 2, which requires that at least the press-contact area 21 of the metal chassis part 2 has a certain strength. However, the strength of the lightweight metal is relatively low, and the crimping region 21 of the metal frame part 2 may also be suitably structurally optimized or designed with reinforcement in order to accommodate the crimping of the BTB connector 105.
As shown in fig. 8 and 9, the two sides of the crimping area 21 in the first direction may be respectively provided with a connecting hole 217 for installing a lock screw 106, and the lock screw 106 may pass through the connecting hole 217 and be connected with the main board 104 and the middle frame 102a, so as to fixedly connect the main board antenna support 103 provided by the embodiment of the present application with the main board 104 and the middle frame 102a of the terminal device 100.
In some embodiments, the strength of the crimp zone 21 may be enhanced by structural optimization.
As shown in fig. 10, in the first embodiment, a specific optimization manner may be to provide a bending structure 211 in at least one of the two ends of the crimping region 21 in the second direction. The second direction here refers to a direction perpendicular to the first direction within the pressure contact surface of the pressure contact region 21 and the BTB connector 105. Due to the design of the bent structure 211, the structural strength of the crimping region 21 of the metal shelf part 2 is improved, and the requirement for crimping of the BTB connector 105 can be satisfied.
In the illustrated embodiment, as shown in fig. 10-a, the bend structure 211 may be a U-shaped bend that opens toward the BTB connector 105. Besides, the bending structure 211 can be provided in other structures. For example, as shown in fig. 10-b, the bending structure 211 may also be a U-shaped bend with an opening away from the BTB connector 105, and the solutions of fig. 10-a and 10-b each show a U-shaped bend, which can form three bends compared to a flat plate-shaped member, and can better improve the strength of the crimping region 21; or, as shown in fig. 10-c and 10-d, the bending structure 211 may also be a V-shaped bend with an opening facing or deviating from the BTB connector 105, and compared with a U-shaped bend, the V-shaped bend forms two bends, and the structure is relatively simple, and is more convenient to process, and also has a better technical effect of improving strength; or, as shown in fig. 10-e and 10-f, the bending structure 211 may also be a bending plate in a flanging form, where the flanging direction of the flanging in the embodiment of fig. 10-e may be a direction toward the BTB connector 105, and the flanging direction of the flanging in the embodiment of fig. 10-f may be a direction away from the BTB connector 105, and compared with a U-shaped bending and a V-shaped bending, the bending plate in the flanging form has only one bending, and the structure is simpler, the processing difficulty is lower, and the occupied space in the second direction may also be smaller.
In a second embodiment, the crimp zone 21 may employ a multi-layer plate structure 212 to compensate for the relatively limited strength of the single plates. The number of layers of the single plates included in the multi-layer plate structure 212 can be designed according to actual needs, and in the embodiment of the drawings, as shown in fig. 11, the crimping area 21 can be a double-layer plate structure, which can be formed by folding the metal frame portion 2, and a gap can exist between the double-layer plates.
In other embodiments, the strength of the crimping region 21 may be enhanced by providing a reinforcing member.
In the first embodiment, as shown in fig. 12, the reinforcing member may be a plastic layer 213, and the plastic layer 213 may be disposed on the surface of the compression joint area 21 to compensate for the insufficient strength of the compression joint area 21 due to the plastic layer 213. The plastic layer 213 may be located on a surface of the compression joint area 21 facing the BTB connector 105, in which case the compression joint area 21 may compress the BTB connector 105 through the plastic layer 213; alternatively, the plastic layer 213 may be the surface of the compression bonding area 21 facing away from the BTB connector 105; alternatively, the plastic layer 213 may be located on both surfaces of the crimping area 21 facing toward and away from the BTB connector 105, and in this case, the crimping area 21 also crimps the BTB connector 105 through the plastic layer 213.
The material of the plastic layer 213 is not limited herein, and may be selected with reference to the material of the plastic part 3, and may be modified plastic containing organic metal compound, or may be ordinary plastic, as long as it can reinforce the pressure-bonding region 21. Similarly, the thickness of the plastic layer 213 is not limited herein, and it can be understood that, in the case that the material of the plastic layer 213 is determined, the greater the thickness of the plastic layer 213 is, the better the reinforcing effect is, and in particular practice, one skilled in the art can determine the thickness of the plastic layer 213 by combining the material of the plastic layer 213 and the reinforcing requirement. Similarly, the arrangement area of the plastic layer 213 may not be limited as long as it can achieve the corresponding reinforcing effect; in consideration of the ease of control over the region where the plastic layer 213 is disposed, a groove (not labeled) may be provided at a position of the crimping region 21 where the plastic layer 213 is to be disposed, and the plastic layer 213 may be directly provided in the groove.
In the second embodiment, as shown in fig. 13, the reinforcing member may be a reinforcing plate 214 provided in the pressure-bonding region 21 so that the strength of the pressure-bonding region 21 is increased by the reinforcing plate 214. The reinforcing plate 214 may be made of metal or nonmetal, as long as it has a corresponding reinforcing effect; it should be noted that, if the reinforcing plate 214 is made of a metal material, the type of the metal material may be the same as the metal frame portion 2, or may not be the same as the metal frame portion 2, which is a practical choice.
The fixing manner of the reinforcing plate 214 and the metal frame portion 2 may be selected from various manners, such as a welding process, a riveting process, a threaded connection process, an in-mold injection molding process, and the like, as long as the connection reliability of the reinforcing plate 214 and the metal frame portion 2 can be ensured. The stiffener 214 may be a surface of the crimping region 21 facing the BTB connector 105, in which case the crimping region 21 may crimp the BTB connector 105 through the stiffener 214; alternatively, the stiffener 214 may also be a surface located at the crimp zone 21 facing away from the BTB connector 105; alternatively, the stiffener 214 may be located on both surfaces of the crimping region 21 facing toward and away from the BTB connector 105, and in this case, the crimping region 21 also crimps the BTB connector 105 through the stiffener 214.
In the third embodiment, as shown in fig. 14, the reinforcing member may be a reinforcing plating layer 215 provided in the pressure-bonding area 21 so that the pressure-bonding area 21 is reinforced by the reinforcing plating layer 215. The reinforcing plating layer 215 may be made of metal or nonmetal, as long as it has a corresponding reinforcing effect; it should be noted that, if the reinforcing plating layer 215 is made of a metal material, the kind of the metal material may be the same as that of the metal frame portion 2, or may not be the same as that of the metal frame portion 2, which is a practical choice.
Specifically, the reinforcing plating layer 215 may be located on the surface of the crimping region 21 facing the BTB connector 105, and in this case, the crimping region 21 may crimp the BTB connector 105 through the reinforcing plating layer 215; alternatively, the reinforcement plating 215 may also be the surface located at the crimp zone 21 facing away from the BTB connector 105; alternatively, the reinforcing plating 215 may be located on both surfaces of the crimping region 21 facing toward and away from the BTB connector 105, and in this case, the crimping region 21 also crimps the BTB connector 105 through the reinforcing plating 215.
Further, in order to improve the bondability between the reinforcing plating layer 215 and the metal frame portion 2, an adhesion increasing layer 216 may be further provided between the reinforcing plating layer 215 and the metal frame portion 2, and the adhesion increasing layer 216 may increase the surface roughness of the metal frame portion 2 to facilitate reliable mounting of the reinforcing plating layer 215.
It should be noted that the three embodiments described above are only exemplary illustrations of specific structures of the reinforcing member shown in the examples of the present application, and cannot be taken as limitations to the implementation scope of the main board antenna support and the manufacturing method thereof provided by the present application, and the reinforcing member described above may actually take other structural forms if the reinforcing condition is satisfied; for example, the reinforcing member may also be a reinforcing rib or the like; in addition, the solution of providing the reinforcing member and the aforementioned solution of structural optimization may also coexist to better ensure the structural strength of the crimping zone 21.
Referring to fig. 15, fig. 15 is a schematic structural view of a metal frame portion in the prior art and in the embodiment of the present application.
In a terminal device such as a mobile phone, a main board antenna bracket is located between a main board 104 and a rear camera bracket, and the metal frame part 2 needs to conduct the camera bracket and the main board 104 to ground at the same time, so as to reduce or avoid interference of RSE (Radiated stray, which is Emission generated or amplified by a mobile station outside a working frequency Radiated by cables of the mobile station enclosure, a power supply, a control device and audio when the mobile station is connected with a non-radiative pure impedance load or in a receiving state). In view of this, in the manufacturing process of the metal shelf portion 2, it is generally necessary to press a partial region of the metal shelf portion 2 to form regions for electrical connection with the main board 104 and the rear camera holder, respectively, and since the interval between the main board 104 and the rear camera holder in the thickness direction (Z direction) of the terminal device is large, the pressing depth is generally large, as shown by the high-tensile convex region 201 and the high-tensile concave region 202 in fig. 15-a. However, the ductility of the lightweight metal is relatively poor, and an excessive punching depth may cause punching cracks of the metal frame portion 2, which also affects the yield of the metal frame portion 2.
For this purpose, the embodiment of the present application may adopt a multi-stage punching scheme, as shown in fig. 15-b, specifically, a first-stage punching section 22 is punched on the metal frame portion 2, and then, a further punching is performed on the bottom wall of the first-stage punching section 22 to form a second-stage punching section 23, and a transition step surface 24 (i.e., an unmapped portion of the bottom wall of the first-stage punching section 22) may be formed between the first-stage punching section 22 and the second-stage punching section 23. So set up, the degree of depth of single punching press is all relatively less, can disperse stamping stress effectively, and then can alleviate the too deep fracture problem that leads to of light metal single punching press.
The number of specific punches is related to the ductility of the specific lightweight metal and the total depth to be punched and is not limited in detail herein. In the embodiment of fig. 15-b, the number of punching times may be two, and in this case, the number of the transition step surfaces 24 may be one.
Alternatively, the stamping may be changed into bending, for example, the high tensile recessed area 202 in fig. 15-a may be directly replaced by the flap area 25 in fig. 15-b, so that the problems of stamping cracking and the like caused by relatively poor ductility of the light metal can be well avoided.
In this way, in step S1, that is, in the process of configuring the metal frame part 2, the metal frame part 2 may be processed according to the above-mentioned processing technology, so that the folding area 21 of the metal frame part 2 can meet the strength requirement, and the area to be punched of the metal frame part 2 can be prevented from being punched and cracked, so as to ensure the yield and performance of the product.
The embodiments of the present application may further provide a motherboard antenna bracket, where the motherboard antenna bracket is related to the manufacturing method of the motherboard antenna bracket, and the following parts that are not mentioned in the related description of the motherboard antenna bracket structure may be understood with reference to the foregoing contents. In detail, the main board antenna bracket may include a metal frame portion 2 and a plastic portion 3, and an antenna circuit 4 and a feeding portion 5 are respectively disposed on two opposite surfaces of the plastic portion 3. The antenna circuit 4 and the feeding portion 5 may be manufactured by any one or more of a spraying process, a printing process, and a 3D printing process.
With this arrangement, since the antenna circuit 4 and the feeding portion 5 are both formed by spraying, the process has no requirement for the material of the plastic portion 3, that is, the plastic material for forming the plastic portion 3 may not contain organic metal compound, so that the conventional plastic material may also meet the requirement for use, the obtaining of the plastic material may be simplified, and the processing cost of the plastic portion 3 may be reduced. For the selection of the type of the conventional plastic material, reference is made to the above description, and a repetitive description will not be made herein.
More importantly, compared with the traditional LDS process, the preparation process of the main board antenna support 103 provided by the embodiment of the application can be greatly shortened, and the related process steps are fewer, so that the links with possible problems are relatively fewer, and the yield of products can be improved; in addition, the cleaning process of corrosive solutions such as strong acid and strong alkali and the like, the chemical copper plating process and other processes with strong pollution are not available, so that the harm to the environment and the life health of field workers in the preparation process of the main board antenna support 103 can be reduced.
The electrical connection between the antenna circuit 4 and the feeding portion 5 may be realized by a conductive portion 31 provided in the plastic portion 3. In detail, as shown in fig. 7, the plastic part 3 may be provided with a communication hole for filling with a conductive medium to form the conductive part 31.
Further, the antenna circuit 4 and the feeding portion 5 may each have a multilayer structure including a plurality of layers, and each layer may be formed by any one of a spraying process, a printing process, or a 3D printing process, so as to obtain the antenna circuit 4 and the feeding portion 5 having a three-dimensional structure. Therefore, the structural form of the antenna circuit 4 and the feeding part 5 can be ensured, the defects of wire breakage and the like can be avoided to a greater extent, and the processing quality of the antenna circuit 4 and the feeding part 5 can be ensured; moreover, when the design scheme of the multiple layers is adopted, the layers can be made of the same material or different materials, when different materials are adopted, the main functions of the layers can be different, and performance parameters such as conductivity, wear resistance and the like of the antenna circuit 4 and the feeding part 5 can be conveniently adjusted; meanwhile, the thicknesses of the antenna circuit 4 and the feeding portion 5 can be increased, which can ensure the service lives of the antenna circuit 4 and the feeding portion 5 to some extent.
The material selection of the layers of the antenna circuit 4 and the feeding unit 5 and the technical effects that can be achieved can be referred to the above description, and will not be described in detail here.
Further, a shielding layer 6 may be provided on the outer side of the antenna circuit 4. The shielding layer 6 can protect the antenna circuit 4, so that the risk that the antenna circuit 4 is partially dropped due to damages such as scratches, abrasion and scratches of other parts to the antenna circuit 4 in the installation and use processes can be reduced, and the reliable and stable operation of the antenna circuit 4 in a relatively long time can be ensured.
In addition, the main board antenna support provided by the embodiment of the present application does not need to adopt a procedure of cleaning with corrosive solutions such as strong acid and strong base in the LDS process, and the material of the metal frame portion 2 may also be selected more, and may adopt a material such as stainless steel in the prior art, or may adopt other materials, as long as the requirements of processing and preparation of the specific structural form of the metal frame portion 2 can be met, so that the acquisition of the metal frame portion 2 may be relatively simple. Moreover, even if the metal frame portion 2 does not use stainless steel or other metal having corrosion resistance, it is not necessary to provide a corrosion-resistant masking coating, and the processing of the metal frame portion 2 can be simplified.
Since the performance requirements for corrosion protection need not be considered, in the examples of the present application, a density of less than 3.0g/cm may be preferably used 3 Compared with the traditional steel or titanium metal frame part 2 (the density is generally 4.5 g/cm) 3 Above), the light metal is selected to reduce the weight of the main board antenna bracket, so as to meet the design requirement of light weight of the current terminal device 100; moreover, the light metal has a high thermal conductivity, and the heat exchange performance of the main board antenna support 103 can be improved.
Further, the metal frame part 2 includes a crimping region 21 for crimping and fixing the BTB connector 105. Specifically, as shown in fig. 8 and 9, the two sides of the crimping area 21 in the first direction may be respectively provided with a connecting hole 217 for installing a lock screw 106, and the lock screw 106 may pass through the connecting hole 217 and be connected with the main board 104 and the middle frame 102a, so as to fixedly connect the main board antenna support 103 provided by the embodiment of the present application with the main board 104 and the middle frame 102a of the terminal device 100.
To increase the strength of the crimping region 21, various aspects such as structural optimization, provision of a reinforcing member, and the like may be implemented to ensure that the crimping region 21 can reliably compress the BTB connector 105. The specific structural optimization and the structural form of the reinforcing member can be referred to the foregoing, and will not be described repeatedly herein.
Further, the metal frame portion may include a stamping region, the stamping region may be of a stepped structure, the stamping region includes a plurality of stamping sections, in the stamping direction, the stamping section of the lower stage may be stamped out from the bottom wall of the stamping section of the adjacent upper stage, the stamping area of the stamping section of the lower stage is smaller than that of the stamping section of the adjacent upper stage, and a transition step surface 24 may be formed between the two adjacent stamping sections. So set up, the degree of depth of each punching press section in the punching press direction all can be less relatively, can disperse stamping stress effectively, and then can alleviate the light metal single punching press too deeply and the fracture problem that leads to.
The number of punch segments is related to the ductility of the particular lightweight metal and the overall punch depth, and is not limited in detail herein. In the embodiment shown in fig. 15-b, the number of the punching sections may be two, namely, the first-stage punching section 22 and the second-stage punching section 23, when punching is performed, the first-stage punching section 22 may be punched first, and then the second-stage punching section 23 may be punched on the bottom wall of the first-stage punching section 22 by replacing the punching head with a relatively small punching area, and a transition step surface 24 may be formed between the first-stage punching section 22 and the second-stage punching section 23, where the transition step surface 24 actually refers to a portion of the bottom wall of the first-stage punching section 22 that is not subjected to secondary punching.
Further, the metal frame part 2 may also comprise a flap area 25, instead of a stamped area, by means of the flap area 25. Thus, the problems of press cracking and the like caused by relatively poor ductility of the light metal can be well avoided.
The above-mentioned stamped or folded-over areas 25 can each form a raised or recessed portion on the metal shelf part 2 for electrical connection with the main board 103 and the rear camera support.
The foregoing is only a preferred embodiment of the present application and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.

Claims (25)

1. The main board antenna bracket is characterized by comprising a metal frame part and a plastic part which are fixedly connected, wherein an antenna circuit and a feeding part are respectively arranged on two opposite surfaces of the plastic part, and the feeding part is electrically connected with the antenna circuit, wherein the antenna circuit and the feeding part are processed by one or more of a spraying process, a printing process and a 3D printing process.
2. Motherboard antenna support as claimed in claim 1, the density of the material of the metal frame part is 3.0gcm 3 The following light metals.
3. Motherboard antenna support according to claim 1 or 2, characterized in that the metal shelf part has a crimping area for crimping a BTB connector, which crimping area is provided with a stiffening structure and/or a stiffening member.
4. A motherboard antenna bracket as recited in claim 3, wherein the stiffening structure comprises at least one of a bent structure, a multi-layer board structure; and/or the presence of a gas in the gas,
the reinforcing member includes at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer.
5. The motherboard antenna bracket as recited in claim 4, further comprising an adhesion increasing layer disposed between the reinforcement plating and the metal frame portion.
6. The motherboard antenna bracket as recited in any one of claims 1 to 5, wherein the metal frame portion has a stamping region, the stamping region comprises a plurality of stamping sections, wherein the stamping section of the lower stage is stamped and formed by the bottom wall of the stamping section of the adjacent upper stage, and a transition step surface is formed between the stamping sections of the adjacent two stages.
7. A motherboard antenna stand as claimed in any of claims 1 to 6, characterised in that the metal shelf part has a flap area.
8. A motherboard antenna mounting as claimed in any of claims 1 to 7, characterized in that the material of the plastic part is free of organometallic compounds.
9. A motherboard antenna mounting as claimed in any of claims 1 to 8, wherein the plastics part and the antenna circuitry each comprise a number of sub-layers.
10. The main board antenna bracket according to claim 9, wherein in each of the layers of the feeding portion, the outermost layer of the layers has a higher wear resistance than the remaining layers of the feeding portion; and/or the presence of a gas in the atmosphere,
in each of the layers of the antenna circuit, the outermost layer has a wear resistance greater than the remaining layers of the antenna circuit.
11. The main board antenna bracket according to claim 9 or 10, wherein the wear resistance of each of the layers of the feeding portion gradually decreases from outside to inside; and/or the presence of a gas in the atmosphere,
the wear resistance of each of the layers of the antenna circuit is gradually decreased from the outside to the inside.
12. The main board antenna support according to any one of claims 9-11, wherein the electrical conductivity of each of the layers of the feeding portion gradually increases from outside to inside; and/or the presence of a gas in the gas,
the conductive performance of each layer of the antenna circuit is gradually increased from outside to inside.
13. A motherboard antenna bracket as recited in any of claims 1-12, characterized in that the outside of the antenna circuit is provided with a shielding layer.
14. A preparation method of a mainboard antenna support is characterized in that the mainboard antenna support comprises a metal frame part and a plastic part, and the preparation method comprises the following steps:
disposing a metal frame portion;
plastic materials are configured, the metal frame part is taken as a base, and the plastic part is integrally formed on the metal frame part in an injection molding mode;
respectively processing an antenna circuit and a feed part on two opposite surfaces of the plastic part, wherein the feed part is electrically connected with the antenna circuit;
the processing technology of the antenna circuit and the feeding part is one or more of spraying technology, printing technology and 3D printing technology.
15. A method for manufacturing a motherboard antenna bracket as recited in claim 14, wherein the step of disposing the metal frame portion further comprises: preparing a metal raw material;
the configuration metal frame part is specifically as follows: processing the metal stock to form the metal shelf portion.
16. A method for manufacturing a main board antenna bracket according to claim 15, wherein the metal material has a density of 3.0g/cm 3 The following light metals.
17. A method for manufacturing a motherboard antenna bracket as recited in claim 15 or 16, wherein the metal frame portion has a crimping region for crimping a BTB connector, and the processing of the metal material includes: processing the crimping zone and arranging a reinforcing structure and/or a reinforcing member in the crimping zone.
18. A method for manufacturing a motherboard antenna bracket as recited in claim 17, wherein the reinforcing structure comprises at least one of a bent structure and a multi-layer board structure; and/or the presence of a gas in the gas,
the reinforcing member includes at least one of a plastic layer, a reinforcing plate, and a reinforcing plating layer.
19. A method of manufacturing a motherboard antenna bracket as recited in any of claims 15 to 18, wherein the metal frame portion has a stamped area, and the processing of the metal stock includes: and processing the stamping area in a multi-stage stamping mode to form a multi-stage stamping section, wherein the stamping section of the lower stage is formed by stamping the bottom wall of the stamping section of the adjacent upper stage, and transition step surfaces are formed between the stamping sections of the two adjacent stages.
20. A method of manufacturing a motherboard antenna bracket as recited in any one of claims 15 to 19, wherein the metal frame portion has a flap area, and the processing of the metal stock includes: and processing the turnover plate area by adopting a turnover process.
21. A method for manufacturing a motherboard antenna bracket as recited in any one of claims 14 to 20, wherein the integrally injection-molding of the plastic part on the metal frame part comprises:
configuring a plastic mold;
implanting the metal frame portion into the plastic mold;
and injecting the plastic material in a molten state into the plastic mold so as to integrally form a plastic part on the metal frame part in an injection molding manner.
22. The manufacturing method of a main board antenna bracket according to any one of claims 14-21, further comprising, after processing the antenna circuit and the feeding portion on two opposite surfaces of the plastic portion respectively:
and performing finish machining on the antenna circuit by adopting an edge processing process.
23. The method for manufacturing a motherboard antenna bracket as recited in any one of claims 14 to 22, wherein the feeding portion and the antenna circuit each include a plurality of layers, and the processing of the antenna circuit and the feeding portion on the two opposite surfaces of the plastic portion respectively specifically comprises: and processing the antenna circuit and the feeding part layer by layer on two opposite surfaces of the plastic part.
24. A method for manufacturing a motherboard antenna bracket as recited in any one of claims 14 to 23, wherein the method further comprises, after the antenna circuit and the feeding portion are respectively processed on two opposite sides of the plastic portion:
and arranging a shielding layer on the outer side of the antenna circuit.
25. A terminal device, comprising a housing, a motherboard and a motherboard antenna mount, wherein the motherboard and the motherboard antenna mount are both mounted in the housing, and wherein the motherboard antenna mount is the motherboard antenna mount according to any of claims 1 to 13.
CN202111129527.0A 2021-09-26 2021-09-26 Terminal device, main board antenna bracket and preparation method thereof Pending CN115863959A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111129527.0A CN115863959A (en) 2021-09-26 2021-09-26 Terminal device, main board antenna bracket and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111129527.0A CN115863959A (en) 2021-09-26 2021-09-26 Terminal device, main board antenna bracket and preparation method thereof

Publications (1)

Publication Number Publication Date
CN115863959A true CN115863959A (en) 2023-03-28

Family

ID=85652199

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111129527.0A Pending CN115863959A (en) 2021-09-26 2021-09-26 Terminal device, main board antenna bracket and preparation method thereof

Country Status (1)

Country Link
CN (1) CN115863959A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117832820A (en) * 2024-03-05 2024-04-05 荣耀终端有限公司 Shell of electronic equipment and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117832820A (en) * 2024-03-05 2024-04-05 荣耀终端有限公司 Shell of electronic equipment and electronic equipment

Similar Documents

Publication Publication Date Title
KR102592280B1 (en) Middle frame, battery cover and electronics
EP4024835A1 (en) Middle frame, rear cover and preparation method therefor, and electronic device
US9937526B2 (en) Antenna structures with molded and coated substrates
CN101482764A (en) Electronic devices
CN107148188B (en) Preparation method of shell assembly, shell assembly and mobile terminal
CN102934531A (en) Printed circuit board, antenna, wireless communication device and manufacturing methods thereof
EP2071909A1 (en) Portable terminal and thin case reinforcing structure
CN102856638A (en) Method of forming antenna
CN101826654A (en) Type RF antenna in the mould, comprise the device and the correlation technique of type RF antenna in this mould
WO2023185178A1 (en) Middle frame assembly, manufacturing method therefor, and electronic device
CN115863959A (en) Terminal device, main board antenna bracket and preparation method thereof
EP4123252A1 (en) Vapor chamber and manufacturing method therefor, middle frame assembly and manufacturing method therefor, and electronic device
CN116038988B (en) Middle frame assembly, forming process thereof and electronic equipment
EP3416233B1 (en) Housing, method for producing the same and mobile terminal
CN101997156A (en) Method and device for manufacturing antenna pattern frame
CN210670153U (en) Shell and electronic equipment
US20180063303A1 (en) Mobile terminal, housing component, and manufacturing method thereof
CN210692756U (en) Electronic equipment, shell assembly and battery cover
CN1508906A (en) Built-in antenna and its manufacturing method and fixing method, and electronic apparatus asing same
US20200245487A1 (en) Core shell with various filler materials for enhanced thermal conductivity
CN102412437A (en) Manufacturing method of antenna
CN113365447B (en) Shell, electronic equipment and manufacturing method of shell
CN103945662A (en) Apparatus for a case for an electronic device
KR20170073321A (en) Method for manufacturing case of mobile terminal
CN217768752U (en) Cover plate assembly and terminal equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination