CN206294439U - A kind of electronic product frame structure and electronic product - Google Patents
A kind of electronic product frame structure and electronic product Download PDFInfo
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- CN206294439U CN206294439U CN201621309838.XU CN201621309838U CN206294439U CN 206294439 U CN206294439 U CN 206294439U CN 201621309838 U CN201621309838 U CN 201621309838U CN 206294439 U CN206294439 U CN 206294439U
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- electronic product
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- ceramic frame
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Abstract
The utility model discloses a kind of electronic product frame structure and electronic product, the electronic product frame structure includes ceramic frame and the metal medium plate being arranged in the ceramic frame, the ceramic frame inner side and metal medium plate outside are joined integrally with injection moulding plastic, integrally formed with drawing plastic structure on the inwall of the ceramic frame, the ceramic frame is combined together by the drawing plastic structure with the injection moulding plastic.This structure can realize lightweight fuselage, solve ceramic labyrinth sintering warpage, it is ensured that product size precision, reduce processing cost.
Description
Technical field
The utility model is related to a kind of electronic product frame structure and electronic product.
Background technology
The widely used plastic cement of center of existing mobile terminal, metal material such as magnadure, stainless steel are made, plastic material
Wear resistance slowly abandoned by people, and metal material is present to the shielding of signal.Ceramic material because its is wear-resistant, no
Meeting shielded signal characteristic, slowly into field of mobile terminals.However, using the ceramic center of integration, there is ceramic weight
Greatly, integrative-structure is yielding in high temperature sintering, and dimensional contraction tolerance is big, material and high processing costs, apparent flaws yields
It is low, the drawback such as production capacity deficiency.
Utility model content
Main purpose of the present utility model is to overcome the deficiencies in the prior art, there is provided a kind of electronic product frame structure and
Electronic product, realizes lightweight fuselage, solves ceramic labyrinth sintering warpage, it is ensured that product size precision, reduction is processed into
This.
To achieve the above object, the utility model uses following technical scheme：
A kind of electronic product frame structure, including ceramic frame, also including being arranged in the metal in the ceramic frame
Plate, the ceramic frame inner side and metal medium plate outside are joined integrally with injection moulding plastic, on the inwall of the ceramic frame
It is combined together with the injection moulding plastic by the drawing plastic structure integrally formed with plastic structure, the ceramic frame is drawn.
Further：
The drawing plastic structure includes the protuberance being integrally formed on the inwall of the ceramic frame.
Hole is offered on the protuberance, a part for the injection moulding plastic is packed into the hole, with the protuberance
It is combined.
The hole is the through hole opened up perpendicular to the in-plane of the frame structure.
The protuberance includes extension and fore-end, and the lateral dimension of the fore-end is more than the extension
The lateral dimension for dividing, forms back-off structure, and the injection moulding plastic coats the back-off structure.
The drawing plastic structure includes the groove being formed on the inwall of the ceramic frame, a part for the injection moulding plastic
It is packed into the groove.
The metal medium plate is embedded in the groove, is combined with the ceramic frame by the injection moulding plastic in the groove
Together.
The position being combined with the injection moulding plastic of the ceramic frame is coated with porous ceramic layer.
The ceramic frame is zirconia ceramics frame, and the metal medium plate is stainless plate.
A kind of electronic product, with described electronic product frame structure.
The beneficial effects of the utility model：
Electronic product frame structure of the present utility model is included in ceramic frame, the metal being arranged in the ceramic frame
Plate, the ceramic frame inner side and metal medium plate outside are joined integrally with injection moulding plastic, on the inwall of the ceramic frame
It is combined together with the injection moulding plastic by the drawing plastic structure, is passed through integrally formed with plastic structure, the ceramic frame is drawn
This design, forms ceramics, plastic cement, the center product of metal-integral structure, effectively overcomes existing ceramics integration fuselage
The problem for deforming big, difficult processing, being difficult volume production of presence, realizes lightweight fuselage, it is to avoid ceramic labyrinth sintering warpage, protects
Product size precision has been demonstrate,proved, processing cost has been reduced.
In preferred scheme,
Brief description of the drawings
Fig. 1 is a kind of structural representation of embodiment of the utility model electronic product frame structure；
Fig. 2 is the ceramic frame structural representation in a kind of the utility model embodiment of electronic product frame structure；
Three kinds of drawings that Fig. 3 to Fig. 5 is respectively ceramic frame in the utility model electronic product frame structure embodiment are cementing
The schematic diagram of structure；
Fig. 6 is the signal of the ceramic frame with porous ceramic layer in the utility model electronic product frame structure embodiment
Figure.
Specific embodiment
Implementation method of the present utility model is elaborated below.It is emphasized that the description below is only example
Property, rather than in order to limit scope of the present utility model and its application.
Refering to Fig. 1 to Fig. 6, in one embodiment, a kind of electronic product frame structure (also referred to as middle frame structure), bag
Ceramic frame 2 is included, also including the metal medium plate 1 being arranged in the ceramic frame 2, the inner side of the ceramic frame 2 and the gold
The outside of plate 1 is joined integrally with injection moulding plastic 3 in category, integrally formed with drawing plastic structure, the pottery on the inwall of the ceramic frame 2
Porcelain frame 2 is combined together by the drawing plastic structure with the injection moulding plastic 3.The electronic product can be mobile phone or other are each
Plant consumption electronic product.
Refering to Fig. 3 to Fig. 4, in a preferred embodiment, the drawing plastic structure includes being integrally formed in the ceramic frame 2
Inwall on protuberance 4.
Refering to Fig. 3, in a more preferred embodiment, hole, one of the injection moulding plastic 3 are offered on the protuberance 4
Divide and be packed into the hole, be combined with the protuberance 4.It is furthermore preferred that the hole is perpendicular to the flat of the frame structure
The through hole 5 that face direction opens up.
Refering to Fig. 4, in another preferred embodiment, the protuberance 4 includes extension and fore-end, institute
The lateral dimension of the lateral dimension more than the extension of fore-end is stated, back-off structure is formed, the injection moulding plastic 3 is coated
The back-off structure.
Refering to Fig. 5, in another preferred embodiment, the drawing plastic structure includes being formed in the ceramic frame 2
Groove 6 on inwall a, part for the injection moulding plastic 3 is packed into the groove 6.
In a more preferred embodiment, the metal medium plate 1 is embedded in the groove 6, by the injection in the groove 6
Plastic cement 3 is combined together with the ceramic frame 2.
Refering to Fig. 6, in a preferred embodiment, the position being combined with the injection moulding plastic 3 of the ceramic frame 2 applies
It is covered with porous ceramic layer 7.Porous ceramic layer 7 is coated by inner wall surface, injection moulding plastic 3 and ceramic frame can be further lifted
2 adhesion.
In a kind of specific embodiment, the ceramic frame 2 is zirconia ceramics frame, and the metal medium plate 1 is not for
Plate in rust steel.
In another embodiment, a kind of electronic product, the electronic product frame structure with foregoing any embodiment.
The preparation of electronic product frame structure
In order to form the center product of ceramics, plastic cement, steel disc integral structure, gluing method is molded using ceramic inserts,
Ceramic frame is placed in embedding die, is fixed by mould and location structure, to injecting molten state in embedding and injection molding mould
Plastic cement so that the plastic cement of molten state is covered in the structure on the inside of ceramic frame, and is combined with steel disc.For increase ceramics with
Plastic cement bond strength, can there is following manner：
Multiple back-offs or pore structure are designed in ceramic inner walls, allows plastic cement to encase back-off and pore structure, increase bond strength.
Ceramic inner walls design groove structure, and steel disc is set in groove, are filled with plastic cement injecting glue and fixed.
Polished by diamond grinding head in center inwall, increase surface roughness, or use blasting craft, the shape on inwall
Into pitting, strengthen the bond strength of ceramics and plastic cement after injection.
At plastic cement and Ceramic bond position, (the metalloid T treatment of one layer of porous ceramics is coated using plasma spraying mode
Mode), plastic cement filling porous ceramics, increases adhesion during injecting glue.
Concrete technology is as follows：
1. ceramic frame mould is prepared：The size of constriction coefficient, product according to zirconia ceramics feeding carries out zirconium oxide
Ceramic die design processing.Size when zirconia ceramic mould is designed is carried out by the coefficient that product size carries out 1.25-1.30
Amplify.
2. ceramic frame shaping：Injection particle is that cerul zirconium oxide kneads particle, using injection machine injection moulding.
3. extract degreasing sintered：
Extraction：Because being cerul structure, shaping green compact need to be positioned in 50 ± 20 DEG C of hydrocarbon environment-friendly cleaning agent extraction solution,
Solution is higher than more than product 5mm, and immersion is separated wax in 12-24 hours.
Degreasing：Base substrate is put in tunnel debinding furnace after paraffin removal, 360 ± 10 DEG C of maximum temperature, degreasing time 48H.
Sintering：Base substrate is put in temperature in sintering furnace, 0 → 1450 ± 10 DEG C, sintering time 48H after degreasing.
4. ceramic frame plain grinding：Center is positioned in two-sided flat-grinding machine, is fixed with fixture, ground using diamond grinding liquid
To desired size.
5. ceramic frame CNC profiles, inwall：Center is positioned in CNC boards, is fixed using fixture, use diamond
Center profile, inwall are machined to drawing size by bistrique.
6. porous ceramics is coated：At plastic cement and Ceramic bond position, one layer of porous pottery is coated using plasma spraying mode
Porcelain (metalloid T processing modes), plastic cement filling porous ceramics, increases adhesion during injecting glue.
7. the preparation of embedding and injection molding process mould：The breaking of making as far as possible of the useful inserts sealing of mould structure avoids making
Insert broken, prevent pressing mold.
8. center in-mould injection：Because wanting Assembly part on plastic structure, so intensity is high, should be used on plastic cement materials
Expect to increase intensity and use the low plastic rubber material of shrinkage factor containing glass.
9. burr is repaiied：Mould breaking structure sealing easily runs glue due to tolerance, so needing to prevent influence from filling burr removal
Assembling fittings.
10. ceramic frame grinding, polishing：Center is positioned over 3D polishing machines, sand line is ground using Liquid diamond is removed, then
Polished using Ludox polishing fluid.
Example one：
1. ceramic frame mould is prepared：
The size of constriction coefficient, product according to zirconia ceramics feeding carries out zirconia ceramic mould design processing.
Size when zirconia ceramic mould is designed is amplified by the coefficient that product size carries out 1.29.
2. ceramic frame shaping：Injection particle is that cerul zirconium oxide kneads particle, using injection machine injection moulding.
3. extract degreasing sintered：
Extraction：Because being cerul structure, shaping green compact need to be positioned in 50 DEG C of hydrocarbon environment-friendly cleaning agent extraction solution, solution
Higher than more than product 5mm, immersion is separated wax in 12 hours.
Degreasing：Base substrate is put in tunnel debinding furnace after paraffin removal, 360 DEG C of design temperature, degreasing time 48H.
Sintering：Base substrate is put in temperature in sintering furnace, 1450 DEG C of maximum temperature, sintering time 48H after degreasing.
4. ceramic frame plain grinding：Center is positioned in two-sided flat-grinding machine, is fixed with fixture, ground using diamond grinding liquid
To desired size.
5. ceramic frame CNC profiles, inwall：Center is positioned in CNC boards, is fixed using fixture, use diamond
Center profile, inwall are machined to drawing size by bistrique.
6. porous ceramics is coated：At plastic cement and Ceramic bond position, one layer of porous pottery is coated using plasma spraying mode
Porcelain (figure below red area), plastic cement filling porous ceramics micropore, increases adhesion during injecting glue.
7. embedding and injection molding process mould is prepared：
The breaking of making as far as possible of the useful inserts sealing of mould structure is avoided making and inserts broken, prevents pressing mold.
8. center in-mould injection：Center is positioned in mould, is molded using PC+ glasses plastic rubber material.
9. burr is repaiied：The burr that injecting glue position is run out is removed with CNC.
10. ceramic frame grinding, polishing：Center is positioned over 3D polishing machines, sand line is ground using Liquid diamond is removed, then
Polished using Ludox polishing fluid.
Above content is to combine specific/preferred embodiment further detailed description of the utility model, no
Can assert that specific implementation of the present utility model is confined to these explanations.For the common skill of the utility model art
For art personnel, without departing from the concept of the premise utility, its implementation method that can also have been described to these is made
Some replacements or modification, and these are substituted or variant should all be considered as belonging to protection domain of the present utility model.
Claims (10)
1. a kind of electronic product frame structure, including ceramic frame, it is characterised in that also including being arranged in the ceramic frame
Metal medium plate, ceramic frame inner side and metal medium plate outside, the ceramic frame joined integrally with injection moulding plastic
Inwall on integrally formed with draw plastic structure, the ceramic frame by it is described drawing plastic structure combined one with the injection moulding plastic
Rise.
2. electronic product frame structure as claimed in claim 1, it is characterised in that the drawing plastic structure includes being integrally formed in
Protuberance on the inwall of the ceramic frame.
3. electronic product frame structure as claimed in claim 2, it is characterised in that hole is offered on the protuberance, it is described
A part for injection moulding plastic is packed into the hole, is combined with the protuberance.
4. electronic product frame structure as claimed in claim 3, it is characterised in that the hole is perpendicular to the frame structure
The through hole that opens up of in-plane.
5. electronic product frame structure as claimed in claim 2, it is characterised in that the protuberance includes extension and preceding
End part, the lateral dimension of the lateral dimension more than the extension of the fore-end, forms back-off structure, the injection
Plastic cement coats the back-off structure.
6. electronic product frame structure as claimed in claim 1, it is characterised in that the drawing plastic structure includes being formed in described
Groove on the inwall of ceramic frame a, part for the injection moulding plastic is packed into the groove.
7. electronic product frame structure as claimed in claim 6, it is characterised in that the metal medium plate is embedded in the groove
It is interior, it is combined together with the ceramic frame by the injection moulding plastic in the groove.
8. the electronic product frame structure as described in any one of claim 1 to 7, it is characterised in that the ceramic frame with
The position that the injection moulding plastic is combined is coated with porous ceramic layer.
9. the electronic product frame structure as described in any one of claim 1 to 7, it is characterised in that the ceramic frame is oxygen
Change zircon ceramic frame, the metal medium plate is stainless plate.
10. a kind of electronic product, it is characterised in that with the electronic product framework knot as described in any one of claim 1 to 9
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621309838.XU CN206294439U (en) | 2016-12-01 | 2016-12-01 | A kind of electronic product frame structure and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621309838.XU CN206294439U (en) | 2016-12-01 | 2016-12-01 | A kind of electronic product frame structure and electronic product |
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| CN206294439U true CN206294439U (en) | 2017-06-30 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107517556A (en) * | 2017-09-21 | 2017-12-26 | 广东欧珀移动通信有限公司 | Cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN107683055A (en) * | 2017-09-21 | 2018-02-09 | 广东欧珀移动通信有限公司 | Cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN108273990A (en) * | 2018-02-02 | 2018-07-13 | 东莞华晶粉末冶金有限公司 | A kind of titanium alloy cerul feeding and preparation method thereof |
| CN108380867A (en) * | 2018-02-02 | 2018-08-10 | 东莞华晶粉末冶金有限公司 | Low-cost and high-performance 17-4PH cerul stainless steel feedings and preparation method thereof |
| CN108380866A (en) * | 2018-02-02 | 2018-08-10 | 东莞华晶粉末冶金有限公司 | A kind of low cost 440C stainless steel cerul feedings and preparation method thereof |
| CN109429458A (en) * | 2017-08-22 | 2019-03-05 | 北京小米移动软件有限公司 | Electronic equipment and its method of surface finish |
| CN109639873A (en) * | 2018-11-30 | 2019-04-16 | 广东长盈精密技术有限公司 | Electronic product middle frame and preparation method thereof |
| CN110324467A (en) * | 2019-06-17 | 2019-10-11 | 潮州三环（集团）股份有限公司 | A kind of mobile terminal Ceramic Composite center and preparation method thereof |
| CN110505325A (en) * | 2019-07-17 | 2019-11-26 | 华为技术有限公司 | A kind of center, battery cover and electronic equipment |
| WO2020034434A1 (en) * | 2018-08-16 | 2020-02-20 | 广州视源电子科技股份有限公司 | Miracast screen and front case assembly therefor |
| CN111319323A (en) * | 2020-03-30 | 2020-06-23 | 歌尔股份有限公司 | Composite material, preparation method thereof and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109429458A (en) * | 2017-08-22 | 2019-03-05 | 北京小米移动软件有限公司 | Electronic equipment and its method of surface finish |
| CN107517556A (en) * | 2017-09-21 | 2017-12-26 | 广东欧珀移动通信有限公司 | Cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN107683055A (en) * | 2017-09-21 | 2018-02-09 | 广东欧珀移动通信有限公司 | Cover plate of electronic equipment and preparation method thereof and electronic equipment |
| CN108273990A (en) * | 2018-02-02 | 2018-07-13 | 东莞华晶粉末冶金有限公司 | A kind of titanium alloy cerul feeding and preparation method thereof |
| CN108380867A (en) * | 2018-02-02 | 2018-08-10 | 东莞华晶粉末冶金有限公司 | Low-cost and high-performance 17-4PH cerul stainless steel feedings and preparation method thereof |
| CN108380866A (en) * | 2018-02-02 | 2018-08-10 | 东莞华晶粉末冶金有限公司 | A kind of low cost 440C stainless steel cerul feedings and preparation method thereof |
| WO2020034434A1 (en) * | 2018-08-16 | 2020-02-20 | 广州视源电子科技股份有限公司 | Miracast screen and front case assembly therefor |
| CN109639873A (en) * | 2018-11-30 | 2019-04-16 | 广东长盈精密技术有限公司 | Electronic product middle frame and preparation method thereof |
| CN110324467A (en) * | 2019-06-17 | 2019-10-11 | 潮州三环（集团）股份有限公司 | A kind of mobile terminal Ceramic Composite center and preparation method thereof |
| WO2020252851A1 (en) * | 2019-06-17 | 2020-12-24 | 潮州三环（集团）股份有限公司 | Ceramic composite middle frame of mobile terminal and manufacturing method therefor |
| CN110505325A (en) * | 2019-07-17 | 2019-11-26 | 华为技术有限公司 | A kind of center, battery cover and electronic equipment |
| CN111319323A (en) * | 2020-03-30 | 2020-06-23 | 歌尔股份有限公司 | Composite material, preparation method thereof and electronic equipment |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: 523843 Guangdong Province, Dongguan city Changan town Xiabian Yincheng Road No. 7 Co-patentee after: Guangdong wins smart group Limited by Share Ltd Patentee after: Dongguan Hua Jing powder metallurgy company limited Address before: 523843 Guangdong Province, Dongguan city Changan town Xiabian Yincheng Road No. 7 Co-patentee before: Dongguan Janus Precision Components Co., Ltd. Patentee before: Dongguan Hua Jing powder metallurgy company limited |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190807 Address after: 523843 No. 2 Weifeng Road, Niushan External Economic Industrial Park, Dongcheng Street, Dongguan City, Guangdong Province Patentee after: Dongguan Hua Jing powder metallurgy company limited Address before: 523843 Guangdong Province, Dongguan city Changan town Xiabian Yincheng Road No. 7 Co-patentee before: Guangdong wins smart group Limited by Share Ltd Patentee before: Dongguan Hua Jing powder metallurgy company limited |