CN109633823A - A kind of chip-packaging structure and adjustable damping device - Google Patents
A kind of chip-packaging structure and adjustable damping device Download PDFInfo
- Publication number
- CN109633823A CN109633823A CN201910117637.1A CN201910117637A CN109633823A CN 109633823 A CN109633823 A CN 109633823A CN 201910117637 A CN201910117637 A CN 201910117637A CN 109633823 A CN109633823 A CN 109633823A
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- chip
- packaging structure
- conductive film
- tube socket
- contact pin
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 238000013016 damping Methods 0.000 title claims abstract description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 30
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 10
- 239000013307 optical fiber Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 208000013651 non-24-hour sleep-wake syndrome Diseases 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
- G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
Abstract
The present invention relates to chip package fields, and in particular to a kind of chip-packaging structure and adjustable damping device.The chip-packaging structure includes the pedestal for stacking gradually setting, pinboard, cushion block and chip, the pinboard includes the conductive film for being at least partially disposed in non-chip following position directly, the conductive film is electrically connected with the conducting end of pedestal, and is connected by the pin of wire and chip.The adjustable damping device includes chip-packaging structure, and the pipe cap being set on the pedestal of chip-packaging structure and the beam collimation device being connected to the cap mouth of pipe cap.The present invention is by designing a kind of chip-packaging structure and adjustable damping device, so that the electrode of chip and electricity is touched position has enough distances in vertical direction, wire can be achieved and connect (welding) operation, take full advantage of the space in the vertical direction of tube socket, the outer diameter requirement for reducing tube socket, realizes the production of miniaturization, compact device.
Description
Technical field
The present invention relates to chip package fields, and in particular to a kind of chip-packaging structure and adjustable damping device.
Background technique
In the existing chip package based on tube socket, Fig. 1 can refer to, chip 13 is adhered to table on the metal platform 11 of TO tube socket
Face, contact pin 12 is through glass sintering on metal platform 11, and contact pin 12 is located at the periphery of chip 13, and contact pin 12 under normal circumstances
Upper surface and the pad 14 of chip 13 be located substantially in a plane, allow then to pass through gold there are certain difference in height
Belong to silk 15 to link together pad 14 and contact pin 12, realizes the electrical connection of 13 positive and negative anodes of chip.
Especially in adjustable optical attenuator, i.e. VOA is the important optical transmission apparatus of light communication system, for intensive
The power equalization of each interchannel in wavelength-division multiplex (DWDM) system, to realize flat gain.Specifically, by as MEMS chip
Chip 13 realize input path path change, to realize that optical attenuation is adjustable.
Above-mentioned adjustable optical attenuator or chip-packaging structure have structure simple, easy to operate, and mounting process simply waits spies
Point；But have the shortcomings that volume is larger, since welded wire workbench generally can only in one plane carry out mobile work
Industry carries out wire connection operation to different location in a plane, needs to keep certain between general contact pin and chip bonding pad
Spacing, certainly, the pad on different location allows certain difference in height.Therefore, the assembling of chip is completed to tube socket (TO pipe
Seat) size require it is all bigger, be not easy to realize compact, miniaturization production requirement.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of chip package knot
Structure and adjustable damping device, it is bigger than normal to solve chip package volume, while stability also poor problem.
The technical solution adopted by the present invention to solve the technical problems is: providing a kind of chip-packaging structure, the chip
Encapsulating structure includes the pedestal for stacking gradually setting, pinboard, cushion block and chip, and the pinboard includes being at least partially disposed in
The conductive film of non-chip following position directly, the conductive film are electrically connected with the conducting end of pedestal, and pass through wire and chip
Pin connection.
Wherein, preferred version is: the pedestal includes tube socket and at least two are arranged in tube socket and as conducting end
Contact pin, the conductive film are at least arranged two and mutually indepedent, and the contact pin is connected by wire with corresponding conductive film.
Wherein, preferred version is: the contact pin passes through tube socket and is arranged in the correspondence through-hole of pinboard.
Wherein, preferred version is: the pedestal includes conductive tube socket, and at least two contact pins as conducting end,
The conductive film is at least arranged two and mutually indepedent, and the tube socket connect as the contact pin of the first contact pin with one and passes through metal
Silk is connected with corresponding conductive film, remaining described contact pin is connected by wire with corresponding conductive film as the second contact pin.
Wherein, preferred version is: second contact pin, which passes through, tube socket and to be arranged in the correspondence through-hole of pinboard, and with pipe
Seat insulation set.
Wherein, preferred version is: being provided with insulating layer between second contact pin and a through-hole of tube socket.
Wherein, preferred version is: the pinboard includes the through-hole of a connecting pipe seating face.
Wherein, preferred version is: the tube socket includes being arranged in a through-hole of pinboard and as wire connecting pin
Boss.
Wherein, preferred version is: the cushion block is insulating substrate.
Wherein, preferred version is: the cushion block includes the opening for being arranged in immediately below chip and being used for empty avoiding conducting end.
Wherein, preferred version is: the two sides of cushion block are arranged in described be open.
Wherein, preferred version is: the pinboard includes base of ceramic and setting on base of ceramic surface and as leading
The gold-plated film of electrolemma.
Wherein, preferred version is: the surface of the base of ceramic is attached with resistive element, with the part of MEMS chip/complete
Portion's pins in parallel.
Wherein, preferred version is: the chip is MEMS chip.
Wherein, preferred version is: the chip includes the pad as pin, and includes at least a negative electrode and anode
Electrode.
The technical solution adopted by the present invention to solve the technical problems is: a kind of adjustable damping device is provided, it is described adjustable
Attenuating device includes chip-packaging structure, and the pipe cap being set on the pedestal of chip-packaging structure and the cap mouth company with pipe cap
Logical beam collimation device.
Wherein, preferred version is: the beam collimation device includes lens and double optical fiber head, and the lens are arranged in double light
Between fine head and chip.
Wherein, preferred version is: the chip of the chip-packaging structure is tilting mirror MEMS chip, the tilting mirror MEMS chip
Including a cathode and at least one anode；And the conducting end and conductive film are respectively provided with corresponding quantity and mutually indepedent, it is described
Conductive film passes through wire respectively and connects with corresponding conducting end, then is connected to a cathode and corresponding anode by wire.
Wherein, preferred version is: the pedestal includes electrically conductive and the tube socket as conducting end and two conducts are conductive
The contact pin at end, the tube socket bottom are also connected with a contact pin, and a conductive film is connect by wire with tube socket, in addition described in two
Conductive film passes through wire and the corresponding contact pin connection as conducting end respectively.
Wherein, preferred version is: the chip of the chip-packaging structure is twin shaft tilting mirror MEMS chip, the twin shaft tilting mirror
MEMS chip includes cathode and two independent control grades；And the conducting end and conductive film be respectively provided with corresponding quantity and
Independently of each other, the conductive film passes through wire respectively and connects with corresponding conducting end, then is connected to a cathode by wire
With corresponding independent control grade.
Wherein, preferred version is: the beam collimation device includes lens and multi fiber head, and the lens are arranged in mostly light
Between fine head and chip.
The beneficial effects of the present invention are, compared with prior art, the present invention by design a kind of chip-packaging structure and
Adjustable damping device makes the electrode of chip have distance enough, it can be achieved that wire connect (welding) in vertical direction with electricity touching position
The vertical space of tube socket is utmostly utilized in operation, especially reduces the outer diameter requirement of tube socket, realizes miniaturization, tight
It gathers the production of type device, further increases overall performance electrical performance；Further, since MEMS chip size is smaller, manufacturing cost
It is higher, larger-size MEMS chip can be used under the requirement of same outer dimension, to reduce the cost of entire device.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the structural schematic diagram of prior art chip-packaging structure；
Fig. 2 is the structural schematic diagram of chip-packaging structure embodiment one of the present invention；
Fig. 3 is the schematic perspective view of Fig. 2；
Fig. 4 is the structural schematic diagram of chip-packaging structure embodiment two of the present invention；
Fig. 5 is the schematic perspective view of Fig. 4；
Fig. 6 is the structural schematic diagram of insulating substrate of the present invention；
Fig. 7 is the structural schematic diagram of adjustable damping device of the present invention；
Fig. 8 is that the present invention is based on the structural schematic diagrams of the light path switching device of twin shaft tilting mirror MEMS chip.
Specific embodiment
Now in conjunction with attached drawing, elaborate to presently preferred embodiments of the present invention.
As shown in Figures 2 and 3, the present invention provides a kind of preferred embodiment of chip-packaging structure.
A kind of chip-packaging structure, the chip-packaging structure include the pedestal 21 for stacking gradually setting, pinboard 22, pad
Block 23 and chip 24, the pinboard 22 includes the conductive film for being at least partially disposed in non-24 following position directly of chip, described to lead
Electrolemma is electrically connected with the conducting end of pedestal 21, and is connect by wire with the pin of chip 24.
Specifically, the conductive film being arranged on cushion block 23 is independently arranged, and conducting end is to be used for transmission electric signal, with control
Coremaking piece 24 receives 24 signal of chip.Chip 24 is arranged the cushion block 23 far from pinboard 22, i.e., sets far from conductive film
It sets, certain distance is set in vertical direction, connect (welding) operation convenient for wire；Meanwhile the conductive film is at least partly
It is arranged in non-24 following position directly of chip, avoids colliding in wire connection (welding) operation process, it is especially conductive
On the travel path of film and 24 pin of chip, prevent from colliding with 24 main body of chip.Wherein, conductive film can be provided entirely in
It is not 24 following position directly of chip, can also partially be arranged in is not 24 following position directly of chip, and remainder is arranged in chip
24 following position directly can be used for carrying out wire connection (welding) operation of conducting end and conductive film, to reduce chip package
The volume of structure optimizes overall structure.
For example, 30% or more the reduced diameter of pedestal, is greatly saved space.
Wire connection (welding) operation may be implemented to make chip-packaging structure not only, while can also be from transverse direction (water
Square to) reduce pedestal 21 area, realize compactedness, miniaturization setting, reduce the distance of conducting end.Alternatively, using larger
The chip 24 of size, i.e., same shape, size pedestal 21 under, can be used larger size chip 24, reduce integral device
The cost of (chip-packaging structure).(welding) operation is connected convenient for subsequent metal silk, optimizes integrated artistic, while improving pedestal 21
Stability, improve product quality.
In the present embodiment, chip 24 is preferably MEMS chip, wherein MEMS is MEMS, Micro-
Electro-Mechanical System.In general, the size of MEMS chip is smaller, cost is higher, is sealed by said chip
Assembling structure, same shape, size pedestal 21 under, can be used larger size MEMS chip, reduce integral device (chip envelope
Assembling structure) cost.Further, the chip 24 includes the pad as pin, and including at least a negative electrode and just
Pole electrode.
In the present embodiment, the pinboard 22 includes base of ceramic and is arranged on base of ceramic surface and as conduction
The gold-plated film of film.Further, the surface of the base of ceramic is attached with resistive element, draws with part/whole of MEMS chip
Foot is in parallel, and specific connection type can be, the pins in parallel of resistive element, gold-plated film and chip 24, to realize the guarantor to chip
Shield prevents from destroying caused by the excessive damage for leading to chip of electric current or other impacts；Alternatively, resistive element and gold-plated film can adopt
Other connection types are taken to connect, the pins in parallel of resistive element and chip 24 is realized that effect is identical, no longer described one by one herein.
In the present embodiment, cushion block 23 is preferably insulating substrate, and the material of insulating substrate can be but not limited to include glass
The insulating materials such as glass, ceramics.By insulating substrate, when preventing from being covered on 22 surface of pinboard, is touched with conductive film and electricity occurs
Transmission.
In the present embodiment, and referring to figs. 2 and 3, the pedestal 21 includes conductive tube socket 31, and at least two make
For the contact pin of conducting end, two and mutually indepedent, the tube socket 31 and first contact pin 321 of conduct is at least arranged in the conductive film
Contact pin connect and pass through wire 2521 and corresponding conductive film and connect, remaining described contact pin passes through gold as the second contact pin 322
Belong to silk 2511 to connect with corresponding conductive film.
For example, two and mutually indepedent, including the first conductive film 222 and the second conductive film is at least arranged in the conductive film
221, first contact pin 321 connects tube socket 31, and the tube socket 31 first passes through wire 2521 and connect with the first conductive film 222,
First conductive film 222 is connect with a pin of chip 24 by wire 2522 again；Second contact pin 322 preferably one or
Two, second contact pin 322, which passes through, tube socket 31 and to be arranged in the second through-hole of correspondence 223 of pinboard 22, and with tube socket 31
Insulation set first passes through wire 2511 and connect with the second conductive film 221, is passing through wire 2512 for the second conductive film 221
It is connect with another pin of chip 24.
Wherein, pinboard 22 includes two through hole, first through hole 224 and the second through-hole 223, and second contact pin 322 passes through
Tube socket 31 is simultaneously arranged in the second through-hole 223, and the first through hole 224 is connected to 31 surface of tube socket.Further, the second contact pin
322 end is equipped with elongated end 3211, and the diameter of elongated end 3211 is slightly larger than the diameter in contact pin needle portion, for being connected to tube socket 31
On, while it is suitable with the diameter of the second through-hole 223；And the tube socket 31 includes being arranged in first through hole 224 and as gold
Belong to the boss 313 of silk connecting pin.Certainly, boss 313 also can have sufficiently high height, and 313 surface of boss is made to stretch out first
Through-hole 224, in this way, also must assure that the position of first through hole 224 and the position of the first conductive film 222 have certain distance, with
Just wire connects (welding) operation.
Preferably, the boss 313 is set up directly on above tube socket 31, therefore higher height can be set, directly
It is suitable with the height of pin of chip 24, it can also directly be connected in this way with wire.
Preferably, it is provided with insulating layer 312 between second contact pin 322 and a through-hole 311 of tube socket 31, certainly, pipe
Seat 31 is arranged itself using insulating materials, also belongs to a kind of mode of insulation set.
About conductive tube socket 31, preferably conductive material is constituted, or plates conductive material, the first contact pin for surface
321 are connected and fixed with the bottom surface of tube socket 31, realize electrical connection；Corresponding position (can be with the company of the first contact pin 321 on the tube socket 31
Positional symmetry is connect, 31 center of circle two sides of tube socket are arranged at) through-hole 311 is set, the second contact pin 322 can penetrate in through-hole 311, if
It sets in inside, entire through-hole 311 and the setting that extends outwardly can also be passed through.
As shown in Figure 4 and Figure 5, the present invention provides a kind of preferred embodiment of pedestal.
The pedestal 21 includes that tube socket 41 and the contact pin as conducting end is arranged in tube socket 41 and at least two, described
Conductive film is at least arranged two and mutually indepedent, and the contact pin is connected by wire with corresponding conductive film.
For example, two and mutually indepedent, including the first conductive film 222 and the second conductive film is at least arranged in the conductive film
221, the contact pin includes third contact pin 421 and the 4th contact pin 422, and the third contact pin 421 and the 4th contact pin 422 both pass through pipe
Seat 41 is arranged, and is arranged in the correspondence through-hole of pinboard 22, such as first through hole 224 and the second through-hole 223.
The end of third contact pin 421 and the 4th contact pin 422 is equipped with elongated end (attached drawing is not shown), and the diameter of elongated end is big
Diameter in contact pin needle portion, for being connected to tube socket 41, and meanwhile it is suitable with the diameter of first through hole 224 and the second through-hole 223.
Specifically, third contact pin 421 is connect by wire 2521 with the first conductive film 222, then passes through wire 2522
First conductive film 222 is connect with the corresponding pin of chip 24；4th contact pin 422 passes through wire 2511 and the second conductive film
221 connections, then connect the second conductive film 221 with the corresponding pin of chip 24 by wire 2512.
As shown in fig. 6, the present invention provides a kind of preferred embodiment of cushion block.
In the present embodiment, the cushion block 23 is insulating substrate.
In the present embodiment, the cushion block 23 includes the opening (231,232) being arranged in immediately below chip 24, at least partly
The conducting end is connected to opening (231,232).The main function of cushion block 23 is to increase 24 lower surface of chip and pinboard 22
Between spacing, avoid wire (2511,2521) and the lower surface of chip 24 from touching.It does so convenient for reducing tube socket
(31,41) size or the chip 24 that larger size can be used, and acted on by the intermediate bridge joint of pinboard 22, it is further excellent
Change size requirement, avoids the position dimension problem (too small excessive) due to contact pin, influence the size of tube socket (31,41), Huo Zhenan
To realize that wire connects (welding) operation.
Further, the two sides of cushion block 23 are arranged in the opening (231,232).To meet the basis of tube socket (31,41)
The positional relationship of the symmetrically arranged contact pin/through-hole in tube socket (the 31,41) center of circle, advanced optimizes the size of tube socket (31,41).
As shown in Figure 7 and Figure 8, the present invention provides a kind of preferred embodiment of adjustable damping device.
It is described so that pedestal 21 is the embodiment of attached drawing 2 and attached drawing 3 as an example.
With reference to Fig. 7, a kind of preferable case study on implementation of adjustable damping device based on uniaxial tilting mirror MEMS chip is provided.
A kind of adjustable damping device, the adjustable damping device includes chip-packaging structure, and is set in chip package
Pipe cap 26 on the pedestal 21 of structure and the beam collimation device 27 being connected to the cap mouth 261 of pipe cap 26.Wherein, pedestal 21 and pipe
26 sealed set of cap, i.e. tube socket 31 and 26 sealed set of pipe cap, shape are integral.
In the present embodiment, the beam collimation device 27 includes lens and double optical fiber head, and the lens are arranged in double light
Between fine head and chip 24.
Specifically, external optical signal is incident on chip 24 by beam collimation device 27, and chip 24 is according to control signal
Its angle position is adjusted, and light is reflected back and is passed through from beam collimation device 27.MEMS core is controlled by voltage swing
The corner of the tilting mirror of piece realizes the variation of optical coupling loss, reaches the function of variable optical attenuation.
With reference to Fig. 8, a kind of preferred embodiment of optical path switching based on twin shaft tilting mirror MEMS chip is provided.
It is described so that pedestal 21 is the embodiment of attached drawing 2 and attached drawing 3 as an example.
The chip 24 of the chip-packaging structure is twin shaft tilting mirror MEMS chip, and the twin shaft tilting mirror MEMS chip includes one
Cathode and two independent control poles；And the conducting end and conductive film are respectively provided with three and mutually indepedent, the conductive film point
Not Tong Guo wire connected with corresponding conducting end, then by wire be connected to a cathode and two independent controls extremely in one
It is a.
Further, the pedestal 21 includes that electrically conductive and tube socket 31 as conducting end and two are used as conducting end
Contact pin (322,323), 31 bottom of tube socket is also connected with a contact pin 321, and a conductive film passes through wire and tube socket 31
Connection, in addition two conductive films pass through wire respectively and connect with the corresponding contact pin (322,323) as conducting end.
In the present embodiment, the beam collimation device 28 include lens and multi fiber head, at least with three or more optical fiber
The optical fiber head of connection, the lens are arranged between multi fiber head and chip 24.Specifically, external optical signal passes through beam collimation
Device 28 enters the MEMS chip 24 in component from one of optical fiber, is reflected back toward the second optical fiber.It is controlled by voltage swing
The corner of the tilting mirror of MEMS chip, the reflected beams enter third optical fiber or other optical fiber, realize between different channel fibers
Switching.
Preferably, the optical axis MEMS chip, i.e. twin shaft tilting mirror MEMS chip, the anode of possessed two independent controls,
It is just corresponding with two on tube socket independent positive grade contact pins, realize the angle control of two axial directions of MEMS chip.Further
Ground can realize the MEMS type adjustable attenuator of 1*N or N*M by twin shaft tilting mirror MEMS chip.
Present invention could apply in terms of the small-sized encapsulated of MEMS Chip, including adjustable attenuator, mems optical switch,
MEMS type tunable filter etc..
As described above, only preferred embodiment is not intended to limit the scope of the present invention, Fan Yibenfa
Equivalent change or modification made by bright claim is all that the present invention is contained.
Claims (21)
1. a kind of chip-packaging structure, it is characterised in that: the chip-packaging structure includes the pedestal for stacking gradually setting, switching
Plate, cushion block and chip, the pinboard include the conductive film for being at least partially disposed in non-chip following position directly, the conductive film
It is electrically connected with the conducting end of pedestal, and is connected by the pin of wire and chip.
2. chip-packaging structure according to claim 1, it is characterised in that: the pedestal includes tube socket, and at least two
A to be arranged in tube socket and the contact pin as conducting end, the conductive film is at least arranged two and mutually indepedent, and the contact pin passes through
Wire is connected with corresponding conductive film.
3. chip-packaging structure according to claim 2, it is characterised in that: the contact pin passes through tube socket and is arranged and transferring
In the correspondence through-hole of plate.
4. chip-packaging structure according to claim 1, it is characterised in that: the pedestal includes conductive tube socket, with
And two and mutually indepedent, the tube socket and a conduct is at least arranged at least two contact pins as conducting end, the conductive film
The contact pin of first contact pin connects and passes through wire and connects with corresponding conductive film, remaining described contact pin passes through gold as the second contact pin
Belong to silk to connect with corresponding conductive film.
5. chip-packaging structure according to claim 4, it is characterised in that: second contact pin passes through tube socket and is arranged
In the correspondence through-hole of pinboard, and with tube socket insulation set.
6. chip-packaging structure according to claim 5, it is characterised in that: a through-hole of second contact pin and tube socket it
Between be provided with insulating layer.
7. chip-packaging structure according to claim 4, it is characterised in that: the pinboard includes a connecting pipe seating face
Through-hole.
8. chip-packaging structure according to claim 7, it is characterised in that: the tube socket includes one that pinboard is arranged in
In through-hole and the boss as wire connecting pin.
9. chip-packaging structure according to claim 1, it is characterised in that: the cushion block is insulating substrate.
10. according to claim 1 or chip-packaging structure described in 9, it is characterised in that: the cushion block include setting chip just
Lower section and the opening for being used for empty avoiding conducting end.
11. chip-packaging structure according to claim 10, it is characterised in that: the two sides of cushion block are arranged in described be open.
12. chip-packaging structure according to any one of claims 1 to 8, it is characterised in that: the pinboard includes ceramic base
Seat and base of ceramic surface and the gold-plated film as conductive film be set.
13. chip-packaging structure according to claim 12, it is characterised in that: the surface of the base of ceramic is attached with electricity
Resistance element, part/whole pins in parallel with MEMS chip.
14. chip-packaging structure according to any one of claims 1 to 8, it is characterised in that: the chip is MEMS chip.
15. chip-packaging structure according to any one of claims 1 to 8, it is characterised in that: the chip includes being used as pin
Pad, and include at least a negative electrode and anode electrode.
16. a kind of adjustable damping device, it is characterised in that: the adjustable damping device includes such as any institute of claim 1 to 15
The chip-packaging structure stated, and the pipe cap being set on the pedestal of chip-packaging structure and the light beam being connected to the cap mouth of pipe cap
Collimating element.
17. adjustable damping device according to claim 16, it is characterised in that: the beam collimation device include lens and
Double optical fiber head, the lens are arranged between double optical fiber head and chip.
18. adjustable damping device according to claim 16, it is characterised in that: the chip of the chip-packaging structure is to turn
Mirror MEMS chip, the rotary mirror type MEMS chip include cathode and at least one anode；And the conducting end and conductive film it is equal
Corresponding quantity and mutually indepedent is set, and the conductive film passes through wire respectively and connects with corresponding conducting end, then passes through
Wire is connected to a cathode and corresponding anode.
19. adjustable damping device according to claim 18, it is characterised in that: the chip of the chip-packaging structure is double
Axis tilting mirror MEMS chip, the twin shaft tilting mirror MEMS chip include cathode and two independent control grades；And the conducting end and
Conductive film is respectively provided with corresponding quantity and mutually indepedent, and the conductive film passes through wire respectively and connects with corresponding conducting end
It connects, then a cathode and corresponding independent control grade is connected to by wire.
20. adjustable damping device according to claim 18, it is characterised in that: the pedestal includes electrically conductive and as leading
The tube socket at electric end and two contact pins as conducting end, tube socket bottom are also connected with a contact pin, and a conductive film passes through
Wire is connect with tube socket, and in addition two conductive films pass through wire and the corresponding contact pin connection as conducting end respectively.
21. 8 to 20 any adjustable damping device according to claim 1, it is characterised in that: the beam collimation device packet
Lens and multi fiber head are included, the lens are arranged between multi fiber head and chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910117637.1A CN109633823A (en) | 2019-02-15 | 2019-02-15 | A kind of chip-packaging structure and adjustable damping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910117637.1A CN109633823A (en) | 2019-02-15 | 2019-02-15 | A kind of chip-packaging structure and adjustable damping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109633823A true CN109633823A (en) | 2019-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910117637.1A Pending CN109633823A (en) | 2019-02-15 | 2019-02-15 | A kind of chip-packaging structure and adjustable damping device |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135269A (en) * | 1996-10-31 | 1998-05-22 | Sumitomo Bakelite Co Ltd | Glass board semiconductor element, high density mounting board and its manufacture |
| US20050023667A1 (en) * | 2003-07-29 | 2005-02-03 | Advanced Semiconductor Engineering, Inc. | Multi-chips module package and manufacturing method thereof |
| WO2010105492A1 (en) * | 2009-03-20 | 2010-09-23 | 浙江迈勒斯照明有限公司 | Method for encapsulating multiple led chips with vertical structure on base to fabricate led lihgt source |
| CN104614854A (en) * | 2015-03-03 | 2015-05-13 | 四川飞阳科技有限公司 | Variable optical attenuator |
-
2019
- 2019-02-15 CN CN201910117637.1A patent/CN109633823A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10135269A (en) * | 1996-10-31 | 1998-05-22 | Sumitomo Bakelite Co Ltd | Glass board semiconductor element, high density mounting board and its manufacture |
| US20050023667A1 (en) * | 2003-07-29 | 2005-02-03 | Advanced Semiconductor Engineering, Inc. | Multi-chips module package and manufacturing method thereof |
| WO2010105492A1 (en) * | 2009-03-20 | 2010-09-23 | 浙江迈勒斯照明有限公司 | Method for encapsulating multiple led chips with vertical structure on base to fabricate led lihgt source |
| CN104614854A (en) * | 2015-03-03 | 2015-05-13 | 四川飞阳科技有限公司 | Variable optical attenuator |
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