CN109618507A - A kind of circuit board laminating method - Google Patents
A kind of circuit board laminating method Download PDFInfo
- Publication number
- CN109618507A CN109618507A CN201811310844.0A CN201811310844A CN109618507A CN 109618507 A CN109618507 A CN 109618507A CN 201811310844 A CN201811310844 A CN 201811310844A CN 109618507 A CN109618507 A CN 109618507A
- Authority
- CN
- China
- Prior art keywords
- laminating
- board
- lamination
- temperature
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of circuit board laminating methods, and following technique is used to be laminated: stock: preparing that multilayer is met the size requirements, to be laminated pcb board and glued board；Lamination: pcb board and glued board being stacked alternately to form combination layer, and guarantee the edges of boards alignment of each pcb board and glued board；It puts plate: the laminate overlapped is put into the lamination board of laminating machine；Lamination: setting laminating temperature and lamination pressure, it opens laminating machine and laminating operation is carried out to laminate, wherein, the laminating temperature setting are as follows: 2.5~3.0 DEG C of heating rate, until temperature rises to 150 DEG C, the lamination pressure setting are as follows: at 70 DEG C of laminating temperature or less, pressure is 0.25Mpa~0.35Mpa, at 70 DEG C of laminating temperature or more, pressure rises to 0.65Mpa~0.75Mpa.Laminating technology proposed by the present invention enables to glued board sufficiently to melt simultaneously Uniform Flow, guarantees the laminate thickness after solidifying uniformly and there is no vacuoles by controlling laminating temperature and lamination pressure.
Description
Technical field
The present invention relates to board production fields, and in particular to a kind of circuit board laminating method.
Background technique
There are following technical problem underlyings for circuit board laminating technology in the prior art: laminating temperature and lamination pressure control
Make it is unreasonable, it is uneven so as to cause the flowing after the molten words of offset plate, eventually lead to the in uneven thickness of the laminate after solidifying,
And vacuole is easy to produce between adjacent circuit plate.
Summary of the invention
In order to solve the above technical problems, specific technical solution is such as the invention proposes a kind of circuit board laminating method
Under:
A kind of circuit board laminating method, uses following technique to be laminated:
Stock: prepare that multilayer is met the size requirements, to be laminated pcb board and glued board；
Lamination: pcb board and glued board being stacked alternately to form combination layer, and guarantee the edges of boards of each pcb board and glued board
Alignment；
It puts plate: the laminate overlapped is put into the lamination board of laminating machine；
Laminating temperature: heating rate is controlled at 2.5~3.0 DEG C, until temperature rises to 150 DEG C；
Lamination pressure: at 70 DEG C of laminating temperature or less, pressure be 0.25Mpa~0.35Mpa, 70 DEG C of laminating temperature or more
When, pressure rises to 0.65Mpa~0.75Mpa.
As a further improvement of the present invention, the laminating machine is oily heating layer press, uses thermal conductivity oil as heat
Source.
As a further improvement of the present invention, the layer board of the laminating machine is to shake board, in lamination process, vibration
The vibration frequency of board is 3000-4000Hz.
Compared with laminating method in the prior art, laminating technology proposed by the present invention passes through to laminating temperature and lamination
Pressure is controlled, and glued board is enabled to sufficiently to melt and Uniform Flow, does not guarantee the laminate thickness after solidifying uniformly and not
There are vacuoles.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, With reference to embodiment
The present invention is described in further detail.
In a specific embodiment, circuit board laminating method provided by the invention includes the following steps:
Stock: prepare that multilayer is met the size requirements, to be laminated pcb board and glued board；
Step 1: lamination: pcb board and glued board being stacked alternately to form combination layer, and guarantee each PCB plate and gluing
The edges of boards of plate are aligned.
Step 2: putting plate: the laminate overlapped is put into the lamination board of laminating machine.
As a preferred embodiment, in the present embodiment, the lamination board is oily heating layer press, uses thermal conductivity
Oil is used as heat source, and thermal conductivity oil, which can be realized, is evenly heated laminate, so that glued board uniform melt, flowing.
Step 3: lamination: setting laminating temperature and lamination pressure open laminating machine and carry out laminating operation to laminate,
In, the laminating temperature setting are as follows: 2.5~3.0 DEG C of heating rate, until temperature rises to 150 DEG C, the lamination pressure is set
Be set to: at 70 DEG C of laminating temperature or less, pressure is 0.25Mpa~0.35Mpa, and at 70 DEG C of laminating temperature or more, pressure is risen to
0.65Mpa~0.75Mpa.By carrying out above-mentioned control to laminating temperature and lamination pressure, glued board is enabled to sufficiently to melt
And Uniform Flow, guarantee the laminate thickness after solidifying uniformly and there is no bubbles.
As a preferred embodiment, the layer board of the laminating machine is to shake board, in lamination process, shakes board
Vibration frequency be 3000-4000Hz.By vibration, the flowing of the material after fusing is more uniform, and can further prevent sky
The generation of bubble.
The description with certain particularity detailed enough has been carried out to the present invention above.Common skill in fields
Art personnel are it should be understood that the description in embodiment is only exemplary, without departing from true spirit and scope of the present invention
Under the premise of make it is all change all should belong to protection scope of the present invention.Scope of the present invention is by described
Claims be defined, rather than limited by the foregoing description in embodiment.
Claims (3)
1. a kind of circuit board laminating method, which is characterized in that it uses following technique to be laminated:
Stock: prepare that multilayer is met the size requirements, to be laminated pcb board and glued board；
Lamination: pcb board and glued board being stacked alternately to form combination layer, and guarantee the edges of boards alignment of each pcb board and glued board；
It puts plate: the laminate overlapped is put into the lamination board of laminating machine；
Lamination: setting laminating temperature and lamination pressure open laminating machine and carry out laminating operation to laminate, wherein the lamination
Temperature setting are as follows: 2.5~3.0 DEG C of heating rate, until temperature rises to 150 DEG C, the lamination pressure setting are as follows: laminating temperature
At 70 DEG C or less, pressure is 0.25Mpa~0.35Mpa, at 70 DEG C of laminating temperature or more, pressure rise to 0.65Mpa~
0.75Mpa。
2. circuit board laminating method as described in claim 1, which is characterized in that the laminating machine is oily heat-laminator, is adopted
Use thermal conductivity oil as heat source.
3. circuit board laminating method as described in claim 1, which is characterized in that the layer board of the laminating machine is jarring machine
Platform, in lamination process, the vibration frequency for shaking board is 3000-4000Hz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811310844.0A CN109618507A (en) | 2018-11-06 | 2018-11-06 | A kind of circuit board laminating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811310844.0A CN109618507A (en) | 2018-11-06 | 2018-11-06 | A kind of circuit board laminating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109618507A true CN109618507A (en) | 2019-04-12 |
Family
ID=66001862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811310844.0A Pending CN109618507A (en) | 2018-11-06 | 2018-11-06 | A kind of circuit board laminating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109618507A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188758A (en) * | 2020-09-08 | 2021-01-05 | 深圳市兴森快捷电路科技股份有限公司 | Printed circuit board pressing method and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0415995A (en) * | 1990-05-09 | 1992-01-21 | Fujitsu Ltd | Lamination of multilayer substrate |
| CN102387661A (en) * | 2010-08-31 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacture method thereof |
| CN108012468A (en) * | 2017-12-21 | 2018-05-08 | 四川九洲电器集团有限责任公司 | A kind of lamination of cyanate ester resin quartz fabric multilayer board and processing technology |
-
2018
- 2018-11-06 CN CN201811310844.0A patent/CN109618507A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0415995A (en) * | 1990-05-09 | 1992-01-21 | Fujitsu Ltd | Lamination of multilayer substrate |
| CN102387661A (en) * | 2010-08-31 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacture method thereof |
| CN108012468A (en) * | 2017-12-21 | 2018-05-08 | 四川九洲电器集团有限责任公司 | A kind of lamination of cyanate ester resin quartz fabric multilayer board and processing technology |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188758A (en) * | 2020-09-08 | 2021-01-05 | 深圳市兴森快捷电路科技股份有限公司 | Printed circuit board pressing method and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190412 |