CN109618485A - The current test method of flexible circuit board and flexible circuit board - Google Patents
The current test method of flexible circuit board and flexible circuit board Download PDFInfo
- Publication number
- CN109618485A CN109618485A CN201811430668.4A CN201811430668A CN109618485A CN 109618485 A CN109618485 A CN 109618485A CN 201811430668 A CN201811430668 A CN 201811430668A CN 109618485 A CN109618485 A CN 109618485A
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- Prior art keywords
- test point
- flexible circuit
- circuit board
- test
- section
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides the current test method of a kind of flexible circuit board and this flexible circuit board, flexible circuit board of the invention includes working region and test zone, working region includes multiple test blocks to be measured and multiple p-wires, it is separated between each test block to be measured by gap, p-wire extends to test zone and forms close access two-by-two, so that corresponding test block to be measured two-by-two is connected, the present invention solve the problems, such as in the prior art flexible circuit board in testing current due to using 0 Ohmic resistance and bring increases Material Cost, low efficiency and inconvenient prompt.
Description
Technical field
The present invention relates to field of display technology more particularly to the current test methods of flexible circuit board and flexible circuit board.
Background technique
In LCD (Liquid Crystal Display, liquid crystal display) or AMOLED (Active-matrix
Organic light-emitting diode, active matrix organic light-emitting diode) in module design, FPC (Flexible
Printed Circuit, flexible circuit board) it is essential component, the one of effect of FPC is just to provide panel and display
Drive the electrical testing position of IC.Test position on FPC can be divided into two class of voltage tester and testing current by structure, wherein
Testing current since it is desired that series connection inlet wire road, so the testing current position on FPC, which is one, can cut off this route
Device.Conventional method is by a 0 Ohmic resistance line disconnection, and when not using testing current function, resistance is welding shape
State, and when needing to measure electric current, resistance is removed.
There are three this method drawbacks: first is that, increased 0 Europe resistance will increase the electronic component region of mould group, and increase
Material Cost；It is disconnected second is that removing 0 Europe resistance when tested and will lead to the certain routes of product, Yao Huifu function must be again
By hand by electric resistance welding, efficiency is extremely low；Third is that 0 Europe resistance must be placed into defined element area, the difficulty of cabling design is increased
It may be because mechanism limitation when spending, while testing and be inconvenient to carry out.
FPC testing current there is a problem that increasing Material Cost, low efficiency and inconvenient victory in the prior art, because
This, above-mentioned technology has improved space.
Summary of the invention
The present invention provides the current test methods of flexible circuit board and flexible circuit board, for solving in flexible circuit board
Testing current in due to using 0 Ohmic resistance and bring increases Material Cost, low efficiency and the problem of inconvenient victory.
To solve the above problems, the present invention provides a kind of flexible circuit board, comprising:
At least one lug surface, the lug surface are formed in the flexible circuit board edge, and cropped area is defined on
On the lug surface；
At least one signal lead, the first section and the second section including being formed in the flexible circuit plate surface, with
And the third section between first section and second section, wherein the third section is formed in the sanction
It cuts in region.
In the flexible circuit board of the application, the flexible circuit board further includes test zone, including the first test point and
Second test point is spaced between first test point and second test point and is formed with to join domain；
First test point connects the first section of the signal lead, and second test point connects the signal and walks
Second section of line.
In the flexible circuit board of the application, the lug surface is semicircle.
In the flexible circuit board of the application, the lug surface is triangle.
It is logical sky in the flexible circuit board of the application, among the lug surface.
In the flexible circuit board of the application, the signal lead is copper foil circuit.
Correspondingly, the present invention provides the current test method of the flexible circuit board, which is characterized in that including walking as follows
It is rapid:
S101, the projection for cutting the flexible circuit board edge, to disconnect first test point and described second
Test point；
S102, first test point and second test point are correspondingly connected to the input, output end of ammeter into
Row testing current；
After S103, testing current, bonding pad will be needed between first test point and second test point
Domain carries out a tin processing, to be connected to first test point and second test point.
In the current test method of the flexible circuit board of the application, cutting described in the prominent flexible circuit board edge
Before lug surface, first test point is connected to second test point by the signal lead；Cut off the signal
After cabling, first test point and second test point are disconnected.
In the current test method of the flexible circuit board of the application, the processing of described tin be to first test point with
The join domain certain point that needs between second test point carries out a tin processing.
In the current test method of the flexible circuit board of the application, the processing of described tin be to first test point with
The join domain that entirely needs between second test point carries out a tin processing.
The beneficial effects of the present invention are: the present invention provides the testing current sides of flexible circuit board and this flexible circuit board
Method, the flexible circuit board include working region and test zone, and working region includes multiple test blocks to be measured and multiple tests
Line is separated by gap between each test block to be measured, and p-wire extends to test zone and forms close access two-by-two.Normal
Under state, test block to be measured is connected to by being connected to the p-wire of test zone two-by-two, to guarantee display driving IC and panel energy
It works normally；When needing to carry out testing current, corresponding raised areas is cut, disconnects corresponding network line, by ammeter two
End is respectively connected to breakpoint and carries out current measurement；It, only need to will be at the gap between above-mentioned corresponding test block to be measured when restoring circuit
A tin processing is carried out, two test blocks to be measured is made to be connected.Therefore, present invention decreases Material Cost and save the time,
Circuit risk is small, also simplifies the layout designs of circuit.
Detailed description of the invention
Below by attached drawing, invention is further explained.It should be noted that the accompanying drawings in the following description is only
Explanation some embodiments of the present invention are only for not make the creative labor for those skilled in the art
Under the premise of, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of whole overlooking structure diagram of flexible circuit board provided in an embodiment of the present invention.
Fig. 2 is the whole overlooking structure diagram of another flexible circuit board provided in an embodiment of the present invention.
Fig. 3 is the whole overlooking structure diagram of another flexible circuit board provided in an embodiment of the present invention.
Fig. 4 is the cabling schematic diagram of the lug surface of flexible circuit board provided in an embodiment of the present invention.
Fig. 5 is the signal lead distribution schematic diagram of flexible circuit board provided in an embodiment of the present invention.
Fig. 6 is the flow chart of the current test method of flexible circuit board provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Whole description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, the orientation or positional relationship of the instructions such as term " edge ", " surface "
To be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description of the present invention and simplification of the description, rather than indicate or
It implies that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as
Limitation of the present invention.In addition, term " height ", be neutral words, thick or thin, wide or narrow, long or short, only visitor is not indicated to be biased to
The a certain attribute for indicating device is seen, and term " thickness " then implies that the distance between solid body two sides is larger.
In addition, it should also be noted that, attached drawing offer is only and Relationship Comparison of the present invention close structure and/or step
Suddenly, some and little details of inventive relationship is omitted, it is therefore intended that simplify attached drawing, keeps inventive point very clear, rather than table
Bright device in practice and/or method are exactly and attached drawing is the same, not as the limitation of device in practice and/or method.
Such as Fig. 1, a kind of whole overlooking structure diagram of flexible circuit board provided in an embodiment of the present invention is illustrated, such as scheme
Shown, flexible circuit board 101 includes lug surface 102, and the lug surface 102 is formed in 101 side of flexible circuit board
Edge, cropped area are defined on the lug surface 102, wherein the shape of the lug surface 102 (cropped area) is semicircle
Shape.
If the shape of Fig. 2, the cropped area 202 at 201 edge of flexible circuit board are the triangle hollowed out.
If the shape of Fig. 3, the cropped area 302 at 301 edge of flexible circuit board are the semicircle hollowed out.
To sum up, the shape of lug surface 102 (cropped area) as shown in Figure 1 can be, but not limited to be it is semicircle,
Triangle, it should be noted that the present invention compared with the increased lug surface 102 (cropped area) of traditional scheme, seem increase it is soft
Property circuit board 101 area, actually using flexible circuit board 101 be mostly this feature of polymorphic structure it is each to rationally design
The shapes and sizes of a lug surface 102 (cropped area) avoid the hollow plate price for increasing flexible circuit board 101；Further,
It cuts for convenience, intermediate to the lug surface 102 (cropped area) processing can be hollowed out.
Such as Fig. 4, the cabling schematic diagram of the lug surface of flexible circuit board provided in an embodiment of the present invention is illustrated, as schemed institute
Show, for the lug surface 401 (cropped area) at least provided with a bars cabling 402, the signal lead 402 includes being formed
In the first section 4021 and the second section 4022 of the flexible circuit plate surface, and it is located at first section and described the
Third section 4023 between two sections, wherein the third section shape 4023 is in the lug surface 401 (cropped area)
It is interior.
Wherein, the lug surface 401 (cropped area) is single layer region, and the later period is facilitated to cut the lug surface 401
(cropped area), it is to be understood that doubling plate is too thick, and shearing when may will affect the effective coverage of flexible circuit board.
Specifically, the signal lead 402 of the lug surface 401 (cropped area) can be, but not limited to be one, herein
The number of signal lead 402 is carried out rationally according to the position for the route for needing to carry out testing current in flexible circuit board and number
Design.
Further, the signal lead 402 is copper foil circuit, and height value is almost nil, therefore the signal lead 402
It can be according to needing to carry out the line condition of testing current in the side foot areas case and flexible circuit board of flexible circuit board for institute
Any region that signal lead 402 is designed at flexible circuit board is stated, All other routes or element will not be impacted.Therefore,
The design method of lug surface 401 (cropped area) and signal lead 402 of the invention compared with prior art, eliminates big
0 Ohmic resistance is measured, saves Material Cost, while also simplifying circuit design.
Such as Fig. 5, the signal lead distribution schematic diagram of flexible circuit board provided in an embodiment of the present invention is illustrated, as schemed institute
Show, flexible circuit board 501 includes test zone 502, and test zone 502 includes the first test point 5021 and the second test point
5022, it is spaced and is formed with to join domain between first test point 5021 and second test point 5022；Described first
Test point 5021 connects the first section of the signal lead 503, and second test point 5022 connects the signal lead 503
The second section (division of the first section of the signal lead, the second section, third section with reference to Fig. 4 and its can be said
It is bright).
Wherein, the test zone 502 includes at least first test point 5021 and second test point 5022, institute
State between the first test point 5021 and second test point 5022 that interval formed need join domain be not limited to straight line or
Person is curve, as long as first test point 5021 can be made to disconnect between any two with second test point 5022.
Wherein, the signal lead 503 extends to cropped area 504 and forms close access, so that corresponding described first
Test point 5021 is connected with second test point 5022.
In addition to this, the edge of first test point 5021 and second test point 5022 is additionally provided with electric current entrance
(not shown) enables the flexible circuit board 501 to obtain power supply to guarantee the normal work of display driving IC and panel, figure
Signal lead 503 can also be connected to driving in addition to being connected to first test point 5021 and second test point 5022 in 5
The circuits such as IC are to guarantee the normal work of panel.
Such as Fig. 6, the flow chart of the current test method of flexible circuit board provided in an embodiment of the present invention is illustrated, in the reality
It applies in example, the current test method of the flexible circuit board includes the following steps:
S101, the projection for cutting the flexible circuit board edge, to disconnect first test point and described second
Test point；
Wherein, before cutting the signal lead, first test point and second test point pass through corresponding
The signal lead is connected；After cutting off the signal lead, first test point and second test point are disconnected.
S102, first test point and second test point are correspondingly connected to the input, output end of ammeter into
Row testing current；
It should be noted that by noted earlier, it is known that the signal lead of the cropped area can be, but not limited to be one
The signal lead, therefore will form at least a pair of of breakpoint after cutting the cropped area, therefore when carrying out testing current, can be with
The both ends of ammeter every a pair of of corresponding first test point of breakpoint is connected to according to actual needs to test with the second test point.
But under normal circumstances, can all have tested demand in the signal lead of cropped area design, so cutting a certain institute
After stating cropped area, testing current successively can be all carried out between multipair first test point and the second test point with ammeter
And data are recorded, are used convenient for the data in later period.
After S103, testing current, bonding pad will be needed between first test point and second test point
Domain carries out a tin processing, so that first test point is connected to second test point.
Wherein, described tin processing is between first test point and second test point to join domain
Certain point or multiple points carry out a tin processing either to entire between first test point and second test point
A tin processing is carried out to join domain.It is understood that only being needed between first test point and second test point
Certain point connection, then first test point is just connected with second test point, therefore no matter selects any tin side
Formula, as long as finally guaranteeing that first test point is connected to second test point.
Therefore, reset mode of the invention is compared with prior art, it is only necessary to point Xi Chu is carried out between two test points
Reason does not need and welds 0 Ohmic resistance in circuit again, and in batch production, the time is short, and also reduces damage electricity
The risk on road.
In conclusion the present invention provides the current test method of flexible circuit board and this flexible circuit board, the flexibility
Circuit board includes cropped area, signal lead and test zone, and test zone includes the first test point and the second test point, each
It is separated between test point by needing join domain, signal lead extends to cropped area and forms close access.In normal shape
Under state, the first test point is connected to the second test point by being connected to the signal lead of cropped area, to guarantee display driving
IC and panel can work normally；When needing to carry out testing current, corresponding cropped area is cut, keeps corresponding network line disconnected
It opens, ammeter both ends is respectively connected to breakpoint and carry out current measurement；It, only need to be by above-mentioned corresponding first test point when restoring circuit
And the second join domain that needs between test point carries out a tin processing, and the first test point is made to be connected i.e. with the second test point
It can.Therefore, present invention decreases Material Cost and save that the time, circuit risk is small, also simplifies the layout designs of circuit.
The current test method for being provided for the embodiments of the invention flexible circuit board and this flexible circuit board above carries out
It is discussed in detail, used herein a specific example illustrates the principle and implementation of the invention, above embodiments
Explanation be merely used to help understand technical solution of the present invention and its core concept；Those skilled in the art should manage
Solution: it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into
Row equivalent replacement；And these are modified or replaceed, the skill for various embodiments of the present invention that it does not separate the essence of the corresponding technical solution
The range of art scheme.
Claims (10)
1. a kind of flexible circuit board characterized by comprising
At least one lug surface, the lug surface are formed in the flexible circuit board edge, and cropped area is defined on described
On lug surface；
At least one signal lead, the first section and the second section including being formed in the flexible circuit plate surface, Yi Jiwei
Third section between first section and second section, wherein the third section, which is formed in, described cuts area
In domain.
2. flexible circuit board as described in claim 1, which is characterized in that further include test zone, including the first test point and
Second test point is spaced between first test point and second test point and is formed with to join domain；
First test point connects the first section of the signal lead, and second test point connects the signal lead
Second section.
3. flexible circuit board as described in claim 1, which is characterized in that the lug surface is semicircle.
4. flexible circuit board as described in claim 1, which is characterized in that the lug surface is triangle.
5. flexible circuit board as described in claim 1, which is characterized in that be logical sky among the lug surface.
6. flexible circuit board as described in claim 1, which is characterized in that the signal lead is copper foil circuit.
7. a kind of current test method of flexible circuit board as described in claim 1, which comprises the steps of:
S101, the lug surface for cutting the flexible circuit board edge, to disconnect first test point and described second
Test point；
S102, the input, output end that first test point and second test point are correspondingly connected to ammeter carry out electricity
Current test；
After S103, testing current, by between first test point and second test point need join domain into
Row point tin processing, to be connected to first test point and second test point.
8. the method for claim 7, which is characterized in that in the projection table for cutting the prominent flexible circuit board edge
Before face, first test point is connected to second test point by the signal lead；Cut off the signal lead it
Afterwards, first test point and second test point disconnect.
9. the method for claim 7, which is characterized in that the processing of described tin is to first test point and described the
The join domain certain point that needs between two test points carries out a tin processing.
10. the method for claim 7, which is characterized in that the processing of described tin be to first test point with it is described
The join domain that entirely needs between second test point carries out a tin processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811430668.4A CN109618485B (en) | 2018-11-28 | 2018-11-28 | Flexible circuit board and current testing method of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811430668.4A CN109618485B (en) | 2018-11-28 | 2018-11-28 | Flexible circuit board and current testing method of flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109618485A true CN109618485A (en) | 2019-04-12 |
| CN109618485B CN109618485B (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811430668.4A Active CN109618485B (en) | 2018-11-28 | 2018-11-28 | Flexible circuit board and current testing method of flexible circuit board |
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| Country | Link |
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| CN (1) | CN109618485B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110501567A (en) * | 2019-08-01 | 2019-11-26 | RealMe重庆移动通信有限公司 | A kind of power consumption test device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1652672A (en) * | 2005-03-21 | 2005-08-10 | 友达光电股份有限公司 | Patterned insulation layer and display paned using the same |
| CN106658947A (en) * | 2016-12-30 | 2017-05-10 | 上海天马有机发光显示技术有限公司 | Flexible circuit board and display panel |
| CN106793487A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | Display device and its flexible PCB |
-
2018
- 2018-11-28 CN CN201811430668.4A patent/CN109618485B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1652672A (en) * | 2005-03-21 | 2005-08-10 | 友达光电股份有限公司 | Patterned insulation layer and display paned using the same |
| CN106793487A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | Display device and its flexible PCB |
| CN106658947A (en) * | 2016-12-30 | 2017-05-10 | 上海天马有机发光显示技术有限公司 | Flexible circuit board and display panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110501567A (en) * | 2019-08-01 | 2019-11-26 | RealMe重庆移动通信有限公司 | A kind of power consumption test device |
| CN110501567B (en) * | 2019-08-01 | 2022-07-19 | RealMe重庆移动通信有限公司 | Power consumption testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109618485B (en) | 2020-06-16 |
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