CN109618485B - Flexible circuit board and current testing method of flexible circuit board - Google Patents
Flexible circuit board and current testing method of flexible circuit board Download PDFInfo
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- CN109618485B CN109618485B CN201811430668.4A CN201811430668A CN109618485B CN 109618485 B CN109618485 B CN 109618485B CN 201811430668 A CN201811430668 A CN 201811430668A CN 109618485 B CN109618485 B CN 109618485B
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- test point
- circuit board
- flexible circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
Abstract
The invention provides a flexible circuit board and a current testing method of the flexible circuit board, the flexible circuit board comprises a working area and a testing area, the working area comprises a plurality of blocks to be tested and a plurality of testing lines, each block to be tested is separated by a gap, the testing lines extend to the testing area and form closed passages in pairs, so that the corresponding blocks to be tested are communicated, and the problems of material cost increase, low efficiency and inconvenient operation caused by using 0 ohm resistor in the current testing of the flexible circuit board in the prior art are solved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible circuit board and a current testing method of the flexible circuit board.
Background
In LCD (Liquid Crystal Display) or AMOLED (Active-matrix organic light-emitting diode) module designs, a Flexible Printed Circuit (FPC) is an essential component, and one of the FPCs serves as an electrical test site for the panel and the Display driver IC. The testing position on the FPC can be divided into a voltage testing type and a current testing type according to the structure, wherein the current testing needs to be connected into a line in series, so that the current testing position on the FPC is a device capable of cutting off the line. The traditional method is to cut off the line through a 0 ohm resistor, when the current test function is not used, the resistor is in a welding state, and when the current needs to be measured, the resistor is taken down.
The method has three disadvantages: firstly, the increased 0 ohm resistance increases the electronic component area of the module and increases the material cost; secondly, when the test is carried out, the 0 ohm resistor is taken down, some circuits of the product are disconnected, the resistor needs to be manually welded again to restore the function, and the efficiency is extremely low; thirdly, the 0 ohm resistor must be placed in the specified element area, which increases the difficulty of wiring design, and the testing may be inconvenient because of the mechanism limitation.
FPC current test has the problem that increases material cost, inefficiency and the simple operation among the prior art, consequently, above-mentioned technique has the space of improving.
Disclosure of Invention
The invention provides a flexible circuit board and a current testing method of the flexible circuit board, which are used for solving the problems of increased material cost, low efficiency and inconvenient operation caused by using a 0 ohm resistor in the current testing of the flexible circuit board.
To solve the above problems, the present invention provides a flexible circuit board, including:
at least one bump surface formed at an edge of the flexible circuit board, a cut-out area being defined on the bump surface;
at least one signal trace, including a first section and a second section formed on the surface of the flexible circuit board, and a third section located between the first section and the second section, wherein the third section is formed in the cutting area.
In the flexible circuit board, the flexible circuit board further comprises a test area which comprises a first test point and a second test point, and an area to be connected is formed between the first test point and the second test point at intervals;
the first test point is connected to a first section of the signal trace, and the second test point is connected to a second section of the signal trace.
In the flexible circuit board of the present application, the bump surface is semicircular.
In the flexible circuit board of the present application, the bump surface is triangular.
In the flexible circuit board of the present application, the bump surface is hollow in the middle.
In the flexible circuit board of the application, the signal routing is a copper foil circuit.
Correspondingly, the invention provides a current testing method of the flexible circuit board, which is characterized by comprising the following steps:
s101, cutting off the bump at the edge of the flexible circuit board to disconnect the first test point and the second test point;
s102, correspondingly connecting the first test point and the second test point to an input end and an output end of an ammeter to perform current test;
s103, after the current test is finished, tin dotting treatment is carried out on the region to be connected between the first test point and the second test point so as to communicate the first test point and the second test point.
In the current testing method of the flexible circuit board, before the surface of the bump at the edge of the protruding flexible circuit board is cut off, the first testing point is communicated with the second testing point through the signal routing; and after the signal routing is cut off, the first test point is disconnected with the second test point.
In the current testing method of the flexible circuit board, the tin dotting treatment is performed on a certain point of a region to be connected between the first testing point and the second testing point.
In the current testing method of the flexible circuit board, the tin dotting treatment is performed on the whole region to be connected between the first testing point and the second testing point.
The invention has the beneficial effects that: the invention provides a flexible circuit board and a current testing method of the flexible circuit board, wherein the flexible circuit board comprises a working area and a testing area, the working area comprises a plurality of blocks to be tested and a plurality of testing lines, each block to be tested is separated by a gap, and the testing lines extend to the testing area and form closed passages pairwise. Under the normal state, every two blocks to be tested are communicated through a test line connected to the test area, so that the display drive IC and the panel can work normally; when the current test is needed, cutting off the surface of the corresponding bump to disconnect the corresponding network line, and respectively connecting the two ends of the ammeter to the break points to carry out the current measurement; when the circuit is recovered, only the gap between the corresponding blocks to be tested needs to be subjected to tin dotting treatment, so that the two blocks to be tested are communicated. Therefore, the invention reduces the material cost, saves time, has small circuit risk and simplifies the layout design of the circuit.
Drawings
The invention is further illustrated by the following figures. It should be noted that the drawings in the following description are only for illustrating some embodiments of the invention, and that other drawings may be derived from those drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic overall top view structure diagram of a flexible circuit board according to an embodiment of the present invention.
Fig. 2 is a schematic overall top view structure diagram of another flexible circuit board according to an embodiment of the present invention.
Fig. 3 is a schematic overall top view structure diagram of another flexible circuit board according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of traces on a bump surface of a flexible circuit board according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of signal trace distribution of a flexible circuit board according to an embodiment of the present invention.
Fig. 6 is a flowchart of a current testing method of a flexible circuit board according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "edge", "surface", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the term "height" is a neutral word and does not mean a bias toward being thick or thin, wide or narrow, long or short, but rather a property of the device, whereas the term "thick" implies a larger distance between two sides of a solid object.
It should be noted that the drawings only provide the structures and/or steps which are relatively closely related to the present invention, and some details which are not related to the present invention are omitted, so as to simplify the drawings and make the present invention clear, but not to show that the actual devices and/or methods are the same as the drawings and are not limitations of the actual devices and/or methods.
Referring to fig. 1, which shows an overall top view structure diagram of a flexible circuit board according to an embodiment of the present invention, as shown in the figure, a flexible circuit board 101 includes a bump surface 102, the bump surface 102 is formed at an edge of the flexible circuit board 101, and a cut-out area is defined on the bump surface 102, wherein the bump surface 102 (the cut-out area) has a semicircular shape.
As shown in fig. 2, the shape of the cut-out area 202 of the edge of the flexible circuit board 201 is a hollowed-out triangle.
As shown in fig. 3, the cut-out area 302 of the edge of the flexible circuit board 301 has a shape of a hollowed-out semicircle.
In summary, as the shape of the bump surface 102 (cut area) in fig. 1 can be, but not limited to, a semicircle or a triangle, it should be noted that the added bump surface 102 (cut area) in the present invention compared with the conventional solution seems to increase the area of the flexible circuit board 101, and actually, the shape and size of each bump surface 102 (cut area) are designed reasonably by using the characteristic that the flexible circuit board 101 is mostly in a special-shaped structure, so as to avoid increasing the price of the empty board of the flexible circuit board 101; further, in order to facilitate cutting, a hollowing process may be performed in the middle of the bump surface 102 (cut area).
Referring to fig. 4, which shows a trace diagram of a bump surface of a flexible circuit board according to an embodiment of the present invention, as shown in the figure, at least one signal trace 402 is disposed on the bump surface 401 (cut region), where the signal trace 402 includes a first section 4021 and a second section 4022 formed on the surface of the flexible circuit board, and a third section 4023 located between the first section and the second section, where the third section 4023 is formed in the bump surface 401 (cut region).
The bump surface 401 (cutting area) is a single-layer area, so that the bump surface 401 (cutting area) can be conveniently cut off at a later stage, and it can be understood that the double-layer board is too thick and the effective area of the flexible circuit board can be affected during cutting.
Specifically, the signal trace 402 on the bump surface 401 (cut area) may be, but is not limited to, one, where the number of the signal trace 402 is reasonably designed according to the position and the number of the lines to be subjected to the current test in the flexible circuit board.
Further, the signal trace 402 is a copper foil line, and the height value is almost zero, so that the signal trace 402 can be designed in any area of the flexible circuit board according to the condition of the margin area of the flexible circuit board and the condition of the line in the flexible circuit board, which needs to be subjected to current testing, and no influence is caused on other lines or elements. Therefore, compared with the prior art, the design mode of the bump surface 401 (cutting area) and the signal routing 402 of the invention eliminates a large amount of 0 ohm resistors, saves material cost and simplifies circuit design.
As shown in fig. 5, which shows a schematic signal trace distribution diagram of a flexible circuit board according to an embodiment of the present invention, as shown in the figure, a flexible circuit board 501 includes a test area 502, where the test area 502 includes a first test point 5021 and a second test point 5022, and an area to be connected is formed between the first test point 5021 and the second test point 5022 at an interval; the first test point 5021 is connected to a first segment of the signal trace 503, and the second test point 5022 is connected to a second segment of the signal trace 503 (the first, second and third segments of the signal trace can be divided as shown in fig. 4 and the description thereof).
The test region 502 at least includes a first test point 5021 and a second test point 5022, and a region to be connected formed at an interval between the first test point 5021 and the second test point 5022 is not limited to a straight line or a curve, as long as the first test point 5021 and the second test point 5022 can be disconnected with each other.
The signal trace 503 extends to the cut region 504 to form a closed path, so that the corresponding first test point 5021 is communicated with the second test point 5022.
In addition, a current inlet and outlet (not shown) is further disposed at the edge of the first test point 5021 and the second test point 5022, so that the flexible circuit board 501 can obtain power supply to ensure normal operation of the display driver IC and the panel, and in fig. 5, the signal trace 503 is connected to the driving IC and other circuits to ensure normal operation of the panel besides being connected to the first test point 5021 and the second test point 5022.
Referring to fig. 6, a flowchart of a current testing method for a flexible circuit board according to an embodiment of the present invention is shown, in which the current testing method for the flexible circuit board includes the following steps:
s101, cutting off the bump at the edge of the flexible circuit board to disconnect the first test point and the second test point;
before the signal routing is cut off, the first test point and the second test point are communicated through the corresponding signal routing; and after the signal routing is cut off, the first test point and the second test point are disconnected.
S102, correspondingly connecting the first test point and the second test point to an input end and an output end of an ammeter to perform current test;
it should be noted that, as described above, it is known that the signal trace in the cutting area may be, but is not limited to, one signal trace, so that at least one pair of break points is formed after the cutting area is cut off, and therefore, when performing a current test, two ends of the electric meter may be connected to the first test point and the second test point corresponding to each pair of break points according to actual needs to perform a test. However, in general, signal traces designed in the trimming area have the requirement of being tested, so after a certain trimming area is trimmed, the ammeter can be used for sequentially carrying out current test and data recording between the pairs of first test points and the second test points, and the data use at the later stage is facilitated.
S103, after the current test is finished, tin dotting treatment is carried out on the region to be connected between the first test point and the second test point, so that the first test point is communicated with the second test point.
The tin dotting treatment is to perform tin dotting treatment on one point or a plurality of points of an area to be connected between the first test point and the second test point or perform tin dotting treatment on the whole area to be connected between the first test point and the second test point. It can be understood that only a certain point is needed to be communicated between the first test point and the second test point, and therefore, no matter which tin point mode is selected, only the first test point and the second test point are ensured to be communicated.
Therefore, compared with the prior art, the recovery mode of the invention only needs to carry out tin dotting treatment between two test points, does not need to weld the 0 ohm resistor in the circuit again, has short time during batch production, and reduces the risk of damaging the circuit.
In summary, the present invention provides a flexible circuit board and a current testing method for the flexible circuit board, the flexible circuit board includes a trimming area, a signal trace and a testing area, the testing area includes a first testing point and a second testing point, each testing point is separated by an area to be connected, the signal trace extends to the trimming area and forms a closed path. Under a normal state, the first test point and the second test point are communicated through a signal wire connected to the cutting area, so that the display drive IC and the panel can work normally; when the current test is needed, cutting off the corresponding cutting area to disconnect the corresponding network line, and respectively connecting the two ends of the ammeter to the break points to carry out the current measurement; when the circuit is recovered, the tin point treatment is carried out on the region to be connected between the corresponding first test point and the second test point, so that the first test point is communicated with the second test point. Therefore, the invention reduces the material cost, saves time, has small circuit risk and simplifies the layout design of the circuit.
The flexible circuit board and the current testing method of the flexible circuit board provided by the embodiment of the invention are described in detail, a specific example is applied in the text to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A flexible circuit board, comprising:
at least one bump surface formed at an edge of the flexible circuit board, a cut-out area being defined on the bump surface;
at least one signal trace, including a first section and a second section formed on the surface of the flexible circuit board, and a third section located between the first section and the second section, wherein the third section is formed in the cutting area;
the test area comprises a first test point and a second test point, and an area to be connected is formed between the first test point and the second test point at intervals; the first test point is connected to a first section of the signal trace, and the second test point is connected to a second section of the signal trace.
2. The flexible circuit board of claim 1, wherein the bump surface is semi-circular.
3. The flexible circuit board of claim 1, wherein the bump surface is triangular.
4. The flexible circuit board of claim 1, wherein the bump surface has a hollowed out area in the middle, the hollowed out area being triangular or semi-circular.
5. The flexible circuit board of claim 1, wherein the signal traces are copper foil traces.
6. A current testing method for testing a current in a flexible circuit board according to any one of claims 1 to 5, characterized in that the flexible circuit board comprises at least one bump surface, at least one signal wire and a test area, the bump surface is formed on the edge of the flexible circuit board, a cutting area is defined on the bump surface, the signal trace includes a first section and a second section formed on the surface of the flexible circuit board, and a third section located between the first section and the second section, the third section being formed within the cut area, the test area includes a first test point and a second test point, the first test point connecting a first section of the signal trace, the second test point is connected to a second section of the signal trace, the method comprising the steps of:
s101, cutting off the surface of the bump at the edge of the flexible circuit board to disconnect the first test point and the second test point;
s102, correspondingly connecting the first test point and the second test point to an input end and an output end of an ammeter to perform current test;
s103, after the current test is finished, tin dotting treatment is carried out on the region to be connected between the first test point and the second test point so as to communicate the first test point and the second test point.
7. The method of claim 6, wherein the first test point is in communication with the second test point through the signal trace before the bump surface of the edge of the flexible circuit board is cut; after the surface of the bump at the edge of the flexible circuit board is cut off, the first test point is disconnected with the second test point.
8. The method of claim 6, wherein the spot-tin treatment is a spot-tin treatment of a point of the region to be connected between the first test point and the second test point.
9. The method of claim 6, wherein the spot-tin treatment is a spot-tin treatment of the entire region to be connected between the first test point and the second test point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811430668.4A CN109618485B (en) | 2018-11-28 | 2018-11-28 | Flexible circuit board and current testing method of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811430668.4A CN109618485B (en) | 2018-11-28 | 2018-11-28 | Flexible circuit board and current testing method of flexible circuit board |
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| Publication Number | Publication Date |
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| CN109618485A CN109618485A (en) | 2019-04-12 |
| CN109618485B true CN109618485B (en) | 2020-06-16 |
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| CN201811430668.4A Active CN109618485B (en) | 2018-11-28 | 2018-11-28 | Flexible circuit board and current testing method of flexible circuit board |
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| CN110501567B (en) * | 2019-08-01 | 2022-07-19 | RealMe重庆移动通信有限公司 | Power consumption testing device |
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| CN100433956C (en) * | 2005-03-21 | 2008-11-12 | 友达光电股份有限公司 | Patterned insulation layer and display paned using the same |
| CN106793487A (en) * | 2016-12-23 | 2017-05-31 | 武汉华星光电技术有限公司 | Display device and its flexible PCB |
| CN106658947B (en) * | 2016-12-30 | 2019-05-17 | 上海天马有机发光显示技术有限公司 | A kind of flexible circuit board and display panel |
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