CN109616449A - 柔性电子器件及其制作方法 - Google Patents
柔性电子器件及其制作方法 Download PDFInfo
- Publication number
- CN109616449A CN109616449A CN201811321073.5A CN201811321073A CN109616449A CN 109616449 A CN109616449 A CN 109616449A CN 201811321073 A CN201811321073 A CN 201811321073A CN 109616449 A CN109616449 A CN 109616449A
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- 238000002360 preparation method Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 239000012530 fluid Substances 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 12
- 238000005452 bending Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
- 229920002401 polyacrylamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004626 polylactic acid Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229920002160 Celluloid Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229920004933 Terylene® Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/067—Hermetically-sealed casings containing a dielectric fluid
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811321073.5A CN109616449B (zh) | 2018-11-07 | 2018-11-07 | 柔性电子器件及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811321073.5A CN109616449B (zh) | 2018-11-07 | 2018-11-07 | 柔性电子器件及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN109616449A true CN109616449A (zh) | 2019-04-12 |
CN109616449B CN109616449B (zh) | 2020-12-15 |
Family
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Family Applications (1)
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CN201811321073.5A Active CN109616449B (zh) | 2018-11-07 | 2018-11-07 | 柔性电子器件及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN109616449B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110139475A (zh) * | 2019-05-28 | 2019-08-16 | 杭州琼网计算机网络有限公司 | 基于非牛顿流体的防止意外折叠损坏的可伸缩柔性电子板 |
CN111110233A (zh) * | 2019-12-24 | 2020-05-08 | 浙江清华柔性电子技术研究院 | 多接口的柔性电极 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140043734A1 (en) * | 2012-08-09 | 2014-02-13 | Samsung Display Co., Ltd. | Flexible display apparatus and method of manufacturing the same |
CN105228823A (zh) * | 2013-02-27 | 2016-01-06 | 康宁股份有限公司 | 用于降低挠性玻璃基材的双轴弯曲和/或翘曲的方法和结构 |
CN108475692A (zh) * | 2015-12-28 | 2018-08-31 | 3M创新有限公司 | 具有流体腔设计的柔性电子设备 |
CN209497726U (zh) * | 2018-11-07 | 2019-10-15 | 浙江清华柔性电子技术研究院 | 柔性电子器件 |
-
2018
- 2018-11-07 CN CN201811321073.5A patent/CN109616449B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140043734A1 (en) * | 2012-08-09 | 2014-02-13 | Samsung Display Co., Ltd. | Flexible display apparatus and method of manufacturing the same |
CN105228823A (zh) * | 2013-02-27 | 2016-01-06 | 康宁股份有限公司 | 用于降低挠性玻璃基材的双轴弯曲和/或翘曲的方法和结构 |
CN108475692A (zh) * | 2015-12-28 | 2018-08-31 | 3M创新有限公司 | 具有流体腔设计的柔性电子设备 |
CN209497726U (zh) * | 2018-11-07 | 2019-10-15 | 浙江清华柔性电子技术研究院 | 柔性电子器件 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110139475A (zh) * | 2019-05-28 | 2019-08-16 | 杭州琼网计算机网络有限公司 | 基于非牛顿流体的防止意外折叠损坏的可伸缩柔性电子板 |
CN110139475B (zh) * | 2019-05-28 | 2020-06-05 | 方香玲 | 基于非牛顿流体的防止意外折叠损坏的可伸缩柔性电子板 |
CN111110233A (zh) * | 2019-12-24 | 2020-05-08 | 浙江清华柔性电子技术研究院 | 多接口的柔性电极 |
CN111110233B (zh) * | 2019-12-24 | 2022-10-11 | 浙江清华柔性电子技术研究院 | 多接口的柔性电极 |
Also Published As
Publication number | Publication date |
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CN109616449B (zh) | 2020-12-15 |
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Effective date of registration: 20190808 Address after: 314000 Building No. 17, 906 Asia-Pacific Road, Nanhu District, Jiaxing City, Zhejiang Province Applicant after: Zhejiang Tsinghua Flexible Electronic Technology Research Institute Applicant after: Tsinghua University Address before: 314000 Floor 15 of Block B of Zhejiang Tsinghua Yangtze River Delta Research Institute, Nanhu District, Jiaxing City, Zhejiang Province Applicant before: Zhejiang Tsinghua Flexible Electronic Technology Research Institute |
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