CN109613775B - Array substrate and display device - Google Patents
Array substrate and display device Download PDFInfo
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- CN109613775B CN109613775B CN201910040272.7A CN201910040272A CN109613775B CN 109613775 B CN109613775 B CN 109613775B CN 201910040272 A CN201910040272 A CN 201910040272A CN 109613775 B CN109613775 B CN 109613775B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
Abstract
The application relates to an array substrate and a display device. The array substrate includes a common trace. The common trace includes a hollowed-out area. The hollow area comprises a first hollow part, and the first hollow part is used for placing conductive adhesive. The solid area is connected with the hollowed-out area, and one side connected with the hollowed-out area is provided with a groove. The groove is opposite to the first hollow-out part. The display device can effectively prevent the problem that the distance between the array substrate and the color film substrate is enlarged due to the fact that conducting resin adhesive dispensing dislocation occurs.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to an array substrate and a display device.
Background
With the development of display technology, liquid crystal display devices are widely used in the production and life of people. The liquid crystal display device generally includes an array substrate, a color filter substrate, and liquid crystal molecules therebetween. The color film substrate is provided with a common electrode, and the array substrate is provided with a pixel electrode. When the display device works, an electric field is formed between the common electrode and the pixel electrode to drive liquid crystal molecules.
For this purpose, a common voltage is applied to the common electrode to form an electric field. And the voltage on the common electrode is typically provided by a common trace of the display substrate. In order to make the common electrode electrically connected to the common trace, a conductive adhesive is usually disposed between the common electrode and the common trace, and the common trace is provided with a hollow transfer electrode at a position where the conductive adhesive is disposed so as to cure the conductive adhesive.
However, during the production process, the conductive paste is easily deviated to the solid portion of the common trace. At this time, the conductive adhesive station is higher, so that the gap between the array substrate and the color film substrate near the dispensing position is larger than other positions, and has relatively more liquid crystal molecules. The phase difference between the liquid crystal molecules is larger due to more liquid crystal molecules, and more light of the backlight source can be transmitted to the light emitting side. Therefore, the brightness near the dispensing position is higher than that at other positions. Especially, a bright point is formed in a dark state (i.e., dark-state light leakage), and the display is remarkably abnormal.
Disclosure of Invention
Accordingly, in order to solve the above-mentioned problems, it is desirable to provide an array substrate and a display device capable of preventing abnormal display caused by the deviation of the conductive paste.
An array substrate, comprising:
a common trace, comprising:
the hollow area comprises a first hollow part, and the first hollow part is used for placing conductive adhesive;
and the solid area is connected with the hollowed-out area, a groove is arranged on one side connected with the hollowed-out area, and the groove is opposite to the first hollowed-out part.
In one embodiment, the hollow-out area further comprises an additional hollow-out part, and the additional hollow-out part is located in the groove.
In one embodiment, a central axis of the groove coincides with a central axis of the first hollow portion, a direction of the groove toward the first hollow portion is a first direction, a direction perpendicular to the first direction is a second direction, and a length of the groove in the second direction is greater than a length of the first hollow portion in the second direction.
In one embodiment, the distance between the bottom wall of the groove and the first hollow part is not less than 300 μm.
In one embodiment, the conductive adhesive includes a plurality of conductive particles, the additional hollowed-out portion includes a plurality of additional wires arranged in a crossing manner, and a distance between the additional wires in the same direction is greater than a diameter of the conductive particles.
In one embodiment, the distance between the additional wires in the same direction is 15 μm to 25 μm.
In one embodiment, the conductive adhesive includes a plurality of conductive particles, the additional hollow-out portion includes a plurality of additional wires arranged in a cross manner, and a line width of the additional wires is smaller than a diameter of the conductive particles.
In one embodiment, the line width of the additional line is 3 μm to 5 μm.
An array substrate, comprising:
a common trace, comprising:
the conductive adhesive comprises a plurality of conductive particles, and a hollow-out area which comprises a first hollow-out part, a second hollow-out part and an additional hollow-out part, wherein the first hollow-out part is used for placing conductive adhesive, and the second hollow-out part surrounds the first hollow-out part;
the solid area is connected with the second hollow-out part, a groove is arranged on one side connected with the second hollow-out part, and the groove is opposite to the first hollow-out part;
the additional hollow parts are positioned in the grooves and comprise a plurality of additional wires which are arranged in a transverse and longitudinal crossed mode, the distance between the additional wires in the same direction is larger than the diameter of the conductive particles, and the line width of the additional wires is smaller than the diameter of the conductive particles.
A display device comprises a color film substrate, a conductive adhesive and an array substrate, wherein the color film substrate is connected with the array substrate through the conductive adhesive; the array substrate comprises a common wire; the public routing comprises a hollow area and a solid area; the hollow area comprises a first hollow part, and the first hollow part is used for placing conductive adhesive; the solid area is connected with the hollowed-out area, a groove is formed in one side, connected with the hollowed-out area, of the solid area, and the groove is opposite to the first hollowed-out portion.
In the array substrate, the solid area is provided with a groove opposite to the first hollow-out part. Therefore, in the production process, when the conductive adhesive is in adhesive offset, the conductive adhesive can flow into the groove, so that the problem that the distance between the array substrate and the color film substrate is increased due to the adhesive offset of the conductive adhesive is solved.
Drawings
FIG. 1 is a schematic diagram of a display device in one embodiment;
fig. 2 is a schematic view illustrating a common trace of the array substrate according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The display device provided by the application can be applied to liquid crystal televisions, computers, mobile phones and various other display devices.
In one embodiment, referring to fig. 1, the display device includes a color film substrate 100, a conductive adhesive 200, and an array substrate 300. The color filter substrate 100 and the array substrate 300 are connected by the conductive adhesive 200, so that the array substrate 300 can supply power to the color filter substrate 300. The display device typically further includes liquid crystal molecules (not shown). The liquid crystal molecules are located between the color film substrate 300 and the array substrate 300.
Specifically, the color filter substrate 100 may include a color filter substrate 110 and a common electrode 120 formed on the color filter substrate 110. The common electrode 120 is located on a side of the color filter substrate 110 facing the array substrate 300. The array substrate 300 may include a common trace 310 (see fig. 2), a thin film transistor (not shown), a pixel electrode (not shown), and the like. The common trace 310 is connected to the common electrode 120 through the conductive paste 200, and further supplies power to the common electrode 120. The thin film transistor is electrically connected with the pixel electrode and further supplies power to the pixel electrode. When the display device is powered on, a potential difference exists between the common electrode 120 and the pixel electrode to form a field, and liquid crystal molecules between the array substrate 300 and the color film substrate 100 are driven to deflect, so that light-transmitting display is performed.
In one embodiment, referring to fig. 2, the common trace 310 includes a hollow area 311 and a solid area 312. The hollow-out region 311 is located in a non-display region at an edge of the array substrate 300. The solid area 312 is connected to the hollow-out area 311 and is located at a side of the hollow-out area 311 close to the display area. The hollow-out region 311 includes a first hollow-out portion 3111. The first hollow portion 3111 is used for placing the conductive adhesive 200. That is, the first hollow portion 3111 is a transfer electrode, and is configured to conduct the electrical signal on the common trace 310 to the common electrode 120 through the conductive adhesive 200, so as to supply power to the common electrode 120. In the production process, the first hollow portion 3111 is a target dispensing position of the conductive adhesive 200.
In the embodiment of the present application, the solid area 312 is provided with a groove 3121 at a side connected to the hollow area 311. The groove 3121 is disposed opposite to the first hollow portion 3111. Therefore, in the production process, even if the dispensing process is abnormal, so that the conductive adhesive 200 deviates from the target dispensing position (i.e., the first hollow portion 3111) and is dispensed near the solid area 312, the conductive adhesive 200 may flow into the groove 3121 without standing on the solid area 312, thereby preventing the problem of the gap between the array substrate 300 and the color filter substrate 100 from being enlarged due to the dispensing dislocation of the conductive adhesive 200. Therefore, the display abnormity such as dark state light leakage and the like caused by deviation of dispensing can be effectively prevented. Meanwhile, the method does not need redundant light masks, and the realization form is simple and easy.
It should be noted that, here, the groove 3121 is disposed opposite to the first hollow portion 3111, the entire groove 3121 may be disposed opposite to the entire first hollow portion 3111, a partial groove 3121 may be disposed opposite to the entire first hollow portion 3111, the entire groove 3121 may be disposed opposite to the partial first hollow portion 3111, or the partial groove 3121 may be disposed opposite to the partial first hollow portion 3111, which is not limited in this application.
In one embodiment, with continued reference to fig. 2, the hollow-out area 311 of the common trace 310 includes an additional hollow-out portion 3112 in addition to the first hollow-out portion. The additional hollow portion 312 is disposed in the groove 3121 of the solid area 312, and has a hollow portion and a portion of a connecting line. Therefore, in the embodiment, when the dispensing is misplaced in the production process, the conductive adhesive 200 can flow into the hollowed-out portion of the additional hollowed-out portion 3112, so as to prevent the distance between the array substrate 300 and the color filter substrate 100 from increasing; on the other hand, the portion of the connection line with the additional hollow portion 312 can be electrically conducted, so as to reduce the Resistance value on the common line 310, further reduce the Resistance Capacitance (RC) delay effect caused by the Resistance value on the common line 310, and further improve the performance of the display device. Especially, in the case that the groove 3121 is made relatively large, the addition of the additional hollow portion 312 can effectively reduce the resistance value of the common trace 310 at the portion.
Of course, in the embodiment of the present application, the additional hollow portion 3112 may not be disposed in the groove 3121. The number of the grooves 3121 disposed opposite to one first hollow portion 3111 is also not limited to one, and may be plural. This is not a limitation of the present application.
In one embodiment, during the dispensing process, the dispensing is performed toward the center of the first hollow portion 3111. Therefore, when the dispensing is performed in a relatively large amount, the dispensing is deviated along the central axis of the first hollow portion 3111 (or along the vicinity of the central axis). Therefore, in this embodiment, the central axis of the groove 3121 disposed opposite to the first hollow portion 3111 coincides with the central axis of the first hollow portion 3111, so that the conductive adhesive 200 with a staggered point can be effectively guided to flow into the groove 3121, and the conductive adhesive does not stand on the solid area 312.
Meanwhile, a direction of the setting groove 3121 toward the first hollow portion 3111 is a first direction (vertical direction in fig. 2), and a direction perpendicular to the first direction is a second direction (horizontal direction in fig. 2). In this embodiment, the length of the groove 3121 in the second direction is further greater than the length of the first hollow portion 3111 in the second direction. Furthermore, it is further ensured that when conductive paste 200 is dislocated at a point far from the central axis of first hollow portion 3111, conductive paste 200 also flows into groove 3121, and does not stand on solid area 312. Therefore, the embodiment can ensure that the conductive adhesive does not stand on the solid area 312 to a great extent, and further effectively prevent the problem that the distance between the array substrate 300 and the color film substrate 100 is increased due to the misalignment of the adhesive 200.
In one embodiment, the distance d1 between the bottom wall of the groove 3121 and the first hollow portion 3111 is not less than 300 μm, so as to leave a sufficient space for the conductive adhesive 200 to deviate, thereby preventing abnormal display.
In this embodiment, the hollow-out region 311 may further include a second hollow-out portion 3113. The solid area 312 is connected to the second hollow portion 3113. The second hollow portion 3113 surrounds the first hollow portion 3111. Therefore, the second hollow portion 3113 between the solid area 312 and the first hollow portion 3111 allows the conductive paste 200 to flow in when the conductive paste 200 is slightly deviated from the dispensing position. The second hollow portion 3113 and the additional hollow portion 3112 prevent the conductive paste 200 from standing on the solid area 312 when the dispensing is misaligned.
The second hollow portion 3113 may be generally provided in a ring shape (not shown) surrounding the display region. One side of the display panel, which is away from the solid area 312, may be used to place a circle of sealant, so that the array substrate 300 and the color film substrate 100 are effectively sealed and assembled to form the display device.
In the embodiment of the present application, the conductive paste 200 may be conductive silver paste, conductive gold paste, or the like. Which may include a plurality of conductive particles (e.g., conductive silver balls, conductive gold balls, etc.). The plurality of conductive particles can be bonded together by an adhesive such as a matrix resin to form a conductive path.
In one embodiment, the additional hollow portion 3112 includes a plurality of additional wires 3112a arranged crosswise. The distance d2 between the additional wires 3112a in the same direction is greater than the diameter of the conductive particles, so that the conductive particles can fall into the hollowed-out portion of the additional hollowed-out portion 3112. The diameter of the conductive particles is usually 4 μm to 7 μm. Therefore, the distance d2 between the additional lines 3112a in the same direction can be set to 15 μm to 25 μm. Of course, in the embodiment of the present application, the distance between the additional wires 3112a may also be other values, which is not limited in the present application.
In one embodiment, when the additional hollow portion 3112 includes a plurality of additional lines 3112a arranged crosswise, the line width L of the additional line 3112a is smaller than the diameter of the conductive particles, so as to prevent the conductive particles from being located on the additional line 3112 a. The diameter of the conductive particles is usually 4 μm to 7 μm. Therefore, the line width L of the additional trace 3112a can be set to 3 μm to 5 μm. Of course, in the embodiment of the present application, the line width of the additional line 3112a may also be other values, which is not limited in this application.
In the embodiment of the present application, the specific hollow-out shape of the additional hollow-out portion 3112 is not limited to the square shape of the above embodiment, and may be any shape such as a circle, a triangle, or a trapezoid.
In one embodiment, the array substrate 300 includes a common trace 310. The common trace 310 includes a hollow area 311 and a solid area 312. The hollow-out region 311 includes a first hollow-out portion 3111, a second hollow-out portion 3113, and an additional hollow-out portion 3112. The first hollow portion 3111 is used for placing the conductive adhesive 200. The conductive paste 200 includes a plurality of conductive particles. The second hollow portion 3113 surrounds the first hollow portion 3111. The solid area 312 is connected to the second hollow portion 3113, and a groove 3121 is formed at a side connected to the second hollow portion 3113. The groove 3121 is disposed opposite to the first hollow portion 3111.
The additional hollow 3112 is located in the groove 3121. The additional hollow portion 3112 includes a plurality of additional wires 3112a arranged crosswise, a distance between the additional wires 3112a in the same direction is greater than a diameter of the conductive particles, and a line width of the additional wires 3112a is smaller than the diameter of the conductive particles.
To sum up, the array substrate that this application provided sets up the recess relative with first fretwork portion in the solid area. Therefore, in the production process, when the conductive adhesive is in adhesive offset, the conductive adhesive can flow into the groove, and the increase of the distance between the array substrate and the color film substrate caused by the adhesive offset is prevented. Therefore, the display abnormity caused by the deviation of the conductive adhesive dispensing can be effectively prevented.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An array substrate, comprising:
a common trace, comprising:
the hollow area comprises a first hollow part and a second hollow part, the first hollow part is used for placing conductive adhesive, and the second hollow part surrounds the first hollow part;
and the solid area is provided with a second hollow part between the first hollow parts, connected with the second hollow parts, provided with a groove at one side connected with the second hollow parts, and arranged opposite to the first hollow parts.
2. The array substrate of claim 1, wherein the hollowed-out area further comprises an additional hollowed-out portion, and the additional hollowed-out portion is located in the groove.
3. The array substrate according to claim 1 or 2, wherein a central axis of the groove coincides with a central axis of the first hollow portion, a direction of the groove toward the first hollow portion is a first direction, a direction perpendicular to the first direction is a second direction, and a length of the groove in the second direction is greater than a length of the first hollow portion in the second direction.
4. The array substrate of claim 1 or 2, wherein the distance between the bottom wall of the groove and the first hollow part is not less than 300 μm.
5. The array substrate of claim 2, wherein the conductive adhesive comprises a plurality of conductive particles, the additional hollowed-out portion comprises a plurality of additional wires arranged in a crossing manner, and a distance between the additional wires in the same direction is greater than a diameter of the conductive particles.
6. The array substrate of claim 5, wherein the distance between the additional traces in the same direction is 15 μm to 25 μm.
7. The array substrate according to claim 2, wherein the conductive adhesive includes a plurality of conductive particles, the additional hollow portion includes a plurality of additional wires arranged in a crossing manner, and a line width of the additional wires is smaller than a diameter of the conductive particles.
8. The array substrate of claim 7, wherein the line width of the additional trace is 3 μm to 5 μm.
9. An array substrate, comprising:
a common trace, comprising:
the conductive adhesive comprises a plurality of conductive particles, and a hollow-out area which comprises a first hollow-out part, a second hollow-out part and an additional hollow-out part, wherein the first hollow-out part is used for placing conductive adhesive, and the second hollow-out part surrounds the first hollow-out part;
the solid area is provided with a second hollow part between the solid area and the first hollow part, the second hollow part is connected with the solid area, a groove is arranged on one side connected with the second hollow part, and the groove is opposite to the first hollow part;
the additional hollow parts are positioned in the grooves and comprise a plurality of additional wires which are arranged in a transverse and longitudinal crossed mode, the distance between the additional wires in the same direction is larger than the diameter of the conductive particles, and the line width of the additional wires is smaller than the diameter of the conductive particles.
10. The display device is characterized by comprising a color film substrate, conductive adhesive and an array substrate, wherein the color film substrate is connected with the array substrate through the conductive adhesive; the array substrate comprises a common wire; the public routing comprises a hollow area and a solid area; the hollow area comprises a first hollow part and a second hollow part, the first hollow part is used for placing conductive adhesive, and the second hollow part surrounds the first hollow part; and a second hollow part is arranged between the solid area and the first hollow part, a groove is connected with the hollow area and is arranged on one side connected with the hollow area, and the groove is opposite to the first hollow part.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910040272.7A CN109613775B (en) | 2019-01-16 | 2019-01-16 | Array substrate and display device |
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| CN201910040272.7A CN109613775B (en) | 2019-01-16 | 2019-01-16 | Array substrate and display device |
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| CN109613775B true CN109613775B (en) | 2020-11-24 |
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| CN111292696B (en) * | 2020-02-27 | 2021-07-06 | 深圳市华星光电半导体显示技术有限公司 | GOA driving circuit, GOA array substrate, display panel and display device |
| CN112068360A (en) * | 2020-09-23 | 2020-12-11 | 北海惠科光电技术有限公司 | Array substrate, manufacturing method of array substrate and display device |
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| KR20070116511A (en) * | 2006-06-05 | 2007-12-10 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display and fabricating method thereof |
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