CN109613775A - Array substrate and display device - Google Patents
Array substrate and display device Download PDFInfo
- Publication number
- CN109613775A CN109613775A CN201910040272.7A CN201910040272A CN109613775A CN 109613775 A CN109613775 A CN 109613775A CN 201910040272 A CN201910040272 A CN 201910040272A CN 109613775 A CN109613775 A CN 109613775A
- Authority
- CN
- China
- Prior art keywords
- hollow
- out parts
- array substrate
- groove
- cabling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
Abstract
This application involves a kind of array substrate and display devices.Array substrate includes public cabling.Public cabling includes vacancy section.Vacancy section includes the first hollow-out parts, and the first hollow-out parts are for placing conducting resinl.Solid area connects vacancy section, and is equipped with groove in the side being connected with vacancy section.Groove is oppositely arranged with the first hollow-out parts.The problem of spacing that the application display device can effectively prevent caused by conducting resinl dispensing misplaces between array substrate and color membrane substrates becomes larger.
Description
Technical field
This application involves field of display technology, more particularly to a kind of array substrate and display device.
Background technique
With the development of display technology, liquid crystal display device is applied to the production of people, in life more and more widely.Liquid
Crystal device generally includes array substrate, color membrane substrates and liquid crystal molecule between the two.Tool is equipped with public affairs on color membrane substrates
Common electrode, array substrate are equipped with pixel electrode.When display device works, electric field is formed between public electrode and pixel electrode
Drive liquid crystal molecule.
For this purpose, needing to be affixed by common voltage on public electrode to form electric field.And the voltage on public electrode is usually
It is provided by the public cabling of array substrate.It is electrically connected in order to enable being obtained between public electrode and public cabling, it usually will be
Therebetween point is equipped with conducting resinl, and common electrical cabling is equipped with the transfer electrode of hollow out in the position for being equipped with conducting resinl to solidify
Conducting resinl.
But in production process, conducting resinl dispensing is easy to be offset to the solid section of public cabling.At this point, conducting resinl station
Position can be relatively high, causes opposite its elsewhere of the array substrate near the dispensing position and the gap between color membrane substrates larger, and
With relatively large number of liquid crystal molecule.The liquid crystal molecule more phase difference that will cause between liquid crystal molecule is bigger, and then can will be more
The light of backlight penetrate to light emission side.Therefore, the brightness near the dispensing position can be relative to its elsewhere height.Especially in dark-state
Under will form bright spot (i.e. dark-state light leakage), display is abnormal obvious.
Summary of the invention
Based on this, it is necessary in view of the above technical problems, caused by providing one kind when can prevent conducting resinl dispensing from deviateing
Show abnormal array substrate and display device.
A kind of array substrate characterized by comprising
Public cabling, comprising:
Vacancy section, including the first hollow-out parts, first hollow-out parts are for placing conducting resinl；
Solid area connects the vacancy section, and is equipped with groove, the groove and institute in the side being connected with the vacancy section
The first hollow-out parts are stated to be oppositely arranged.
The vacancy section further includes attached increasing hollow-out parts in one of the embodiments, and the attached increasing hollow-out parts are located at described
In groove.
The central axis of the groove is overlapped with the central axis of first hollow-out parts in one of the embodiments,
The groove is first direction towards the direction of first hollow-out parts, and the direction vertical with the first direction is second party
To the length of the groove in this second direction is greater than the length of first hollow-out parts in this second direction.
The bottom wall of the groove is not less than 300 μm at a distance from first hollow-out parts in one of the embodiments,.
The conducting resinl includes multiple conducting particles in one of the embodiments, and the attached increasing hollow-out parts include a plurality of
Transverse and longitudinal attached increasing cabling arranged in a crossed manner, unidirectional described attached the distance between cabling that increases are greater than the straight of the conducting particles
Diameter.
The distance between unidirectional described attached increasing cabling is 15 μm~25 μm in one of the embodiments,.
The conducting resinl includes multiple conducting particles in one of the embodiments, and the attached increasing hollow-out parts include a plurality of
Transverse and longitudinal attached increasing cabling arranged in a crossed manner, the attached line width for increasing cabling are less than the diameter of the conducting particles.
The attached line width for increasing cabling is 3 μm~5 μm in one of the embodiments,.
A kind of array substrate, comprising:
Public cabling, comprising:
Vacancy section, including the first hollow-out parts, the second hollow-out parts and attached increasing hollow-out parts, first hollow-out parts are for placing
Conducting resinl, the conducting resinl include multiple conducting particles, and second hollow-out parts surround first hollow-out parts；
Solid area connects second hollow-out parts, and is equipped with groove in the side being connected with second hollow-out parts, described
Groove is oppositely arranged with first hollow-out parts；
The attached increasing hollow-out parts are located in the groove, also, the attached increasing hollow-out parts include that a plurality of transverse and longitudinal is arranged in a crossed manner
Attached increasing cabling, the unidirectional attached diameter for increasing the distance between cabling and being greater than the conducting particles, attached increase walk
The line width of line is less than the diameter of the conducting particles.
A kind of display device, including color membrane substrates, conducting resinl and array substrate, the color membrane substrates and the array base
Plate passes through the conductive glue connection；The array substrate includes public cabling；The public cabling includes vacancy section and solid
Area；The vacancy section includes the first hollow-out parts, and first hollow-out parts are for placing conducting resinl；It is engraved described in the solid area connection
Dead zone is simultaneously equipped with groove in the side being connected with the vacancy section, and the groove is oppositely arranged with first hollow-out parts.
The groove opposite with the first hollow-out parts is arranged in solid area for above-mentioned array substrate.Therefore, in process of production, lead
It when electric glue point glue misplaces, can flow into groove, and then prevent array substrate and color membrane substrates caused by conducting resinl dispensing dislocation
Between spacing the problem of becoming larger.
Detailed description of the invention
Fig. 1 is the schematic diagram of display device in one embodiment；
Fig. 2 is the schematic diagram of the public cabling of array substrate in one embodiment.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, not
For limiting the application.
Display device provided by the present application can be applied to LCD TV, computer, mobile phone and various other displays
Device.
In one embodiment, with reference to Fig. 1, display device includes color membrane substrates 100, conducting resinl 200 and array substrate
300.Color membrane substrates 100 are connect with array substrate 300 by conducting resinl 200, so that array substrate 300 can be color film base
Plate 300 is powered.Display device also typically includes liquid crystal molecule (not shown).Liquid crystal molecule is located at color membrane substrates 300 and array base
Between plate 300.
Specifically, color membrane substrates 100 may include color film substrate 110 and the common electrical that is formed on color film substrate 110
Pole 120.Public electrode 120 is located at color film substrate 110 towards the side of array substrate 300.Array substrate 300 may include public
Cabling 310 (referring to Fig. 2), thin film transistor (TFT) (not shown) and pixel electrode (not shown) etc..Public cabling 310 passes through conduction
Glue 200 is connect with public electrode 120, and then is powered for public electrode 120.Thin film transistor (TFT) is electrically connected pixel electrode, Jin Erwei
Pixel electrode is powered.When display device is powered on, there is potential difference and then shape between public electrode 120 and pixel electrode
At field, liquid crystal molecule between drive array substrate 300 and color membrane substrates 100 deflects it, and then light transmission is shown.
In one embodiment, with reference to Fig. 2, public cabling 310 includes vacancy section 311 and solid area 312.Vacancy section
311 are located at the non-display area at the edge of array substrate 300.Solid area 312 is connect with vacancy section 311, and is located at vacancy section 311
Close display area side.Vacancy section 311 includes the first hollow-out parts 3111.First hollow-out parts 3111 are for placing conducting resinl
200.That is the first hollow-out parts 3111 are transfer electrode, are used to conduct the electric signal on public cabling 310 by conducting resinl 200
It powers to public electrode 120, and then for public electrode 120.In production process, the first hollow-out parts 3111 are the mesh of conducting resinl 200
Punctuate glue position.
In the embodiment of the present application, solid area 312 is equipped with groove 3121 in the side being connected with vacancy section 311.Groove 3121
It is oppositely arranged with the first hollow-out parts 3111.Therefore, in process of production, even if exception occurs in dispensing processing procedure, so that conducting resinl 200
When deviateing target dispensing position (i.e. the first hollow-out parts 3111) and putting to solid area 312, conducting resinl 200 may also flow into recessed
In slot 3121, without station on solid area 312, and then prevent array substrate 300 caused by 200 dispensing of conducting resinl misplaces and coloured silk
The problem of spacing between ilm substrate 100 becomes larger.Therefore, dark-state light leakage etc. caused by when the application can effectively prevent dispensing to deviate
Display is abnormal.Meanwhile the application is not required to extra light shield, way of realization is simple and easy to do.
It should be noted that groove 3121 is oppositely arranged with the first hollow-out parts 3111 herein, entire groove 3121 can be
It is oppositely arranged with entire first hollow-out parts 3111, is also possible to part recess 3121 and is set relatively with entire first hollow-out parts 3111
It sets, is also possible to entire groove 3121 and is oppositely arranged with the first hollow-out parts of part 3111, be also possible to part recess 3121 and portion
The first hollow-out parts 3111 are divided to be oppositely arranged, the application is not restricted to this.
In one embodiment, with continued reference to Fig. 2, the vacancy section 311 of public cabling 310 in addition to include the first hollow-out parts with
It outside, further include attached increasing hollow-out parts 3112.Attached increasing hollow-out parts 312 are set in the groove 3121 of solid area 312, both have hollow out
Part, and with rat tail part.Therefore, the present embodiment on the one hand in process of production dispensing misplace when so that leading
Electric glue 200 can flow into the attached part for increasing 3112 hollow out of hollow-out parts, and then prevent between array substrate 300 and color membrane substrates 100
Spacing become larger；On the other hand, the part of the attached rat tail for increasing hollow-out parts 312, and conduction can be carried out, and then reduce public
Resistance value on cabling 310, and then reduce resistance capacitance (Resistance caused by the resistance value on public cabling 310
Capacitance, RC) delay effect etc., and then improve display device performance.The bigger situation especially done in groove 3121
Under, attached increasing hollow-out parts 312 add the resistance value that can effectively reduce public cabling 310 at the part.
Certainly, attached increasing hollow-out parts 3112 can also be not provided in the embodiment of the present application, in groove 3121.It is engraved with one first
The quantity for the groove 3121 that empty portion 3111 is oppositely arranged is also not necessarily limited to be one, may be multiple.The application to this not
Limitation.
In one embodiment, during due to production dispensing, it will usually towards the center of the first hollow-out parts 3111
Dispensing.So when dispensing deviates in more situation, being can be along the central axis of the first hollow-out parts 3111 (or in
Heart near axis) deviate.Therefore, the present embodiment by the central axis for the groove 3121 being oppositely arranged with the first hollow-out parts 3111 with
The central axis of first hollow-out parts 3111 is overlapped, so can the conducting resinl 200 of effectively pilot point dislocation flow in groove 3121, and
It will not stand in solid area 312.
Meanwhile set groove 3121 towards the direction of the first hollow-out parts 3111 as first direction (be in fig 2 vertical side
To), the direction vertical with first direction is second direction (being in fig 2 horizontal direction).Groove is also set up in the present embodiment
3121 length in a second direction is greater than the length of the first hollow-out parts 3111 in a second direction.In turn, it is further ensured that and leads
For electric glue 200 when the central axis from the first hollow-out parts 3111 remotely puts dislocation, conducting resinl 200 can also flow into groove 3121,
Without standing in solid area 312.Therefore, the present embodiment can ensure to limits that conducting resinl will not stand in solid area very much
On 312, and then the spacing effectively prevented caused by 200 dispensing of conducting resinl misplaces between array substrate 300 and color membrane substrates 100 becomes
Big problem.
In one embodiment, the bottom wall of the present embodiment setting groove 3121 and 3111 distance d1 of the first hollow-out parts be not small
It stops in 300 μm, and then for conducting resinl 200 and can deviate space, and then prevent display abnormal.
In the embodiment of the present application, vacancy section 311 can also include the second hollow-out parts 3113.Solid area 312 and the second hollow out
Portion 3113 is connected.Second hollow-out parts 3113 surround the first hollow-out parts 3111.Therefore, solid area 312 and the first hollow-out parts 3111 it
Between the second hollow-out parts 3113 allow when 200 dispensing of conducting resinl is offset slightly from conducting resinl 200 flow into.Second hollow-out parts 3113 with
Conducting resinl 200 is stood on solid area 312 when attached increasing hollow-out parts 3112 prevent dispensing from misplacing jointly.
Second hollow-out parts 3113 can be usually set to surround the ring-type (not shown) of display area.It is far from solid area
312 sides can be used for placing a circle sealant, so that the effectively sealing of array substrate 300 and color membrane substrates 100 assembles and shape
At display device.
In the embodiment of the present application, conducting resinl 200 can be conductive silver glue, conductive gold size etc..It may include multiple conductions
Particle (such as conductive ping-pong ball, conductive gold spacer etc.).Multiple conducting particles can pass through the bonding effect of the adhesives such as matrix resin
And be combined together, form conductive path.
In one embodiment, the attached hollow-out parts 3112 that increase include a plurality of transverse and longitudinal attached increasing cabling 3112a arranged in a crossed manner.It is same
The distance between the attached increasing cabling 3112a in direction d2 is greater than the diameter of conducting particles, and then falls into attached increasing convenient for conducting particles and engrave
The part of the hollow out in empty portion 3112.The diameter of conducting particles is usually 4 μm~7 μm.Therefore, unidirectional attached increasing can be set
The distance between cabling 3112a d2 is 15 μm~25 μm.Certainly, in the embodiment of the present application, the distance between attached increasing cabling 3112a
It can also be other values, the application is not limited in this respect.
In one embodiment, it is attached when attached increasing hollow-out parts 3112 include a plurality of transverse and longitudinal attached increasing cabling 3112a arranged in a crossed manner
The line width L for increasing cabling 3112a is less than the diameter of conducting particles, and then can prevent conductive particle substation on attached increasing cabling 3112a.It leads
The diameter of charged particle is usually 4 μm~7 μm.Therefore, it is 3 μm~5 μm that the attached line width L for increasing cabling 3112a, which can be set,.Certainly,
In the embodiment of the present application, the attached line width for increasing cabling 3112a can also be other values, and also there is no limit to this by the application.
In the embodiment of the present application, the attached specific hollow out shape for increasing hollow-out parts 3112 is not limited to the rectangular of above-described embodiment,
It can also be the arbitrary shapes such as circle, triangle, trapezoidal.
In one embodiment, array substrate 300 includes public cabling 310.Public cabling 310 include vacancy section 311 with
And solid area 312.Vacancy section 311 includes the first hollow-out parts 3111, the second hollow-out parts 3113 and attached increasing hollow-out parts 3112.First
Hollow-out parts 3111 are for placing conducting resinl 200.Conducting resinl 200 includes multiple conducting particles.Second hollow-out parts 3113 surround first
Hollow-out parts 3111.Solid area 312 connects the second hollow-out parts 3113, and is equipped with groove in the side being connected with the second hollow-out parts 3113
3121.Groove 3121 is oppositely arranged with the first hollow-out parts 3111.
Attached increasing hollow-out parts 3112 are located in groove 3121.Also, attached increasing hollow-out parts 3112 include that a plurality of transverse and longitudinal is arranged in a crossed manner
Attached increasing cabling 3112a, the unidirectional attached diameter for increasing the distance between cabling 3112a and being greater than conducting particles, attached increasing cabling
The line width of 3112a is less than the diameter of conducting particles.
In conclusion array substrate provided by the present application, the groove opposite with the first hollow-out parts is arranged in solid area.Cause
This when conducting resinl dispensing misplaces, can be flowed into groove in process of production, array caused by preventing conducting resinl dispensing from misplacing
Spacing between substrate and color membrane substrates becomes larger.Therefore, the application is shown caused by can be effectively prevented when conducting resinl dispensing deviates
Show exception.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (10)
1. a kind of array substrate characterized by comprising
Public cabling, comprising:
Vacancy section, including the first hollow-out parts, first hollow-out parts are for placing conducting resinl；
Solid area, connects the vacancy section, and is equipped with groove in the side being connected with the vacancy section, the groove and described the
One hollow-out parts are oppositely arranged.
2. array substrate according to claim 1, which is characterized in that the vacancy section further includes attached increasing hollow-out parts, described
Attached increasing hollow-out parts are located in the groove.
3. array substrate according to claim 1 or 2, which is characterized in that the central axis of the groove and described first
The central axis of hollow-out parts is overlapped, the groove towards the direction of first hollow-out parts be first direction, with the first party
It is second direction to vertical direction, the length of the groove in this second direction is greater than first hollow-out parts described
Length in second direction.
4. array substrate according to claim 1 or 2, which is characterized in that the bottom wall of the groove and first hollow out
The distance in portion is not less than 300 μm.
5. array substrate according to claim 2, which is characterized in that the conducting resinl includes multiple conducting particles, described
Attached increasing hollow-out parts include a plurality of transverse and longitudinal attached increasing cabling arranged in a crossed manner, and the distance between unidirectional described attached increasing cabling is greater than
The diameter of the conducting particles.
6. array substrate according to claim 5, which is characterized in that the distance between unidirectional described attached increasing cabling
It is 15 μm~25 μm.
7. array substrate according to claim 2, which is characterized in that the conducting resinl includes multiple conducting particles, described
Attached increasing hollow-out parts include a plurality of transverse and longitudinal attached increasing cabling arranged in a crossed manner, and the attached line width for increasing cabling is less than the conducting particles
Diameter.
8. array substrate according to claim 7, which is characterized in that the attached line width for increasing cabling is 3 μm~5 μm.
9. a kind of array substrate characterized by comprising
Public cabling, comprising:
Vacancy section, including the first hollow-out parts, the second hollow-out parts and attached increasing hollow-out parts, first hollow-out parts are for placing conduction
Glue, the conducting resinl include multiple conducting particles, and second hollow-out parts surround first hollow-out parts；
Solid area connects second hollow-out parts, and is equipped with groove, the groove in the side being connected with second hollow-out parts
It is oppositely arranged with first hollow-out parts；
The attached increasing hollow-out parts are located in the groove, also, the attached hollow-out parts that increase include arranged in a crossed manner attached of a plurality of transverse and longitudinal
Increase cabling, the distance between unidirectional described attached increasing cabling is greater than the diameter of the conducting particles, the attached increasing cabling
Line width is less than the diameter of the conducting particles.
10. a kind of display device, which is characterized in that including color membrane substrates, conducting resinl and array substrate, the color membrane substrates with
The array substrate passes through the conductive glue connection；The array substrate includes public cabling；The public cabling includes hollow out
Area and solid area；The vacancy section includes the first hollow-out parts, and first hollow-out parts are for placing conducting resinl；The solid area
It connects the vacancy section and is equipped with groove in the side being connected with the vacancy section, the groove is opposite with first hollow-out parts
Setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910040272.7A CN109613775B (en) | 2019-01-16 | 2019-01-16 | Array substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910040272.7A CN109613775B (en) | 2019-01-16 | 2019-01-16 | Array substrate and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109613775A true CN109613775A (en) | 2019-04-12 |
| CN109613775B CN109613775B (en) | 2020-11-24 |
Family
ID=66019703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910040272.7A Active CN109613775B (en) | 2019-01-16 | 2019-01-16 | Array substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109613775B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111292696A (en) * | 2020-02-27 | 2020-06-16 | 深圳市华星光电半导体显示技术有限公司 | GOA driving circuit, GOA array substrate, display panel and display device |
| CN112068360A (en) * | 2020-09-23 | 2020-12-11 | 北海惠科光电技术有限公司 | Array substrate, manufacturing method of array substrate and display device |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020089633A1 (en) * | 2001-01-09 | 2002-07-11 | International Business Machines Corporation | System and method for producing thin film patterns interspersed with voids to admit light to otherwise shadowed regions |
| CN1716005A (en) * | 2004-06-28 | 2006-01-04 | 鸿富锦精密工业（深圳）有限公司 | Display panels |
| KR20070003165A (en) * | 2005-06-30 | 2007-01-05 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and fabrication method thereof |
| JP2007226066A (en) * | 2006-02-25 | 2007-09-06 | Seiko Instruments Inc | Liquid crystal display device |
| CN101082745A (en) * | 2006-05-31 | 2007-12-05 | 株式会社日立显示器 | Liquid crystal display device |
| KR20070116511A (en) * | 2006-06-05 | 2007-12-10 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display and fabricating method thereof |
| CN101097364A (en) * | 2006-06-30 | 2008-01-02 | Lg.菲利浦Lcd株式会社 | Liquid crystal display device |
| CN101403837A (en) * | 2007-09-28 | 2009-04-08 | 卡西欧计算机株式会社 | Liquid crystal display device |
| CN202433650U (en) * | 2011-12-08 | 2012-09-12 | 上海天马微电子有限公司 | Array substrate, liquid crystal display panel and liquid crystal display |
| CN203133452U (en) * | 2012-09-14 | 2013-08-14 | 北京京东方光电科技有限公司 | Array substrate and liquid crystal display device |
| CN203983280U (en) * | 2014-07-30 | 2014-12-03 | 京东方科技集团股份有限公司 | A kind of array base palte and display unit |
| CN105137664A (en) * | 2015-09-24 | 2015-12-09 | 南京中电熊猫液晶显示科技有限公司 | Array substrate |
| CN106990594A (en) * | 2017-04-24 | 2017-07-28 | 惠科股份有限公司 | Liquid crystal display panel and its manufacture method and the display device of application |
| CN208705627U (en) * | 2018-10-08 | 2019-04-05 | 惠科股份有限公司 | Display panel and display |
-
2019
- 2019-01-16 CN CN201910040272.7A patent/CN109613775B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020089633A1 (en) * | 2001-01-09 | 2002-07-11 | International Business Machines Corporation | System and method for producing thin film patterns interspersed with voids to admit light to otherwise shadowed regions |
| CN1716005A (en) * | 2004-06-28 | 2006-01-04 | 鸿富锦精密工业（深圳）有限公司 | Display panels |
| KR20070003165A (en) * | 2005-06-30 | 2007-01-05 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and fabrication method thereof |
| JP2007226066A (en) * | 2006-02-25 | 2007-09-06 | Seiko Instruments Inc | Liquid crystal display device |
| CN101082745A (en) * | 2006-05-31 | 2007-12-05 | 株式会社日立显示器 | Liquid crystal display device |
| KR20070116511A (en) * | 2006-06-05 | 2007-12-10 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display and fabricating method thereof |
| CN101097364A (en) * | 2006-06-30 | 2008-01-02 | Lg.菲利浦Lcd株式会社 | Liquid crystal display device |
| CN101403837A (en) * | 2007-09-28 | 2009-04-08 | 卡西欧计算机株式会社 | Liquid crystal display device |
| CN202433650U (en) * | 2011-12-08 | 2012-09-12 | 上海天马微电子有限公司 | Array substrate, liquid crystal display panel and liquid crystal display |
| CN203133452U (en) * | 2012-09-14 | 2013-08-14 | 北京京东方光电科技有限公司 | Array substrate and liquid crystal display device |
| CN203983280U (en) * | 2014-07-30 | 2014-12-03 | 京东方科技集团股份有限公司 | A kind of array base palte and display unit |
| CN105137664A (en) * | 2015-09-24 | 2015-12-09 | 南京中电熊猫液晶显示科技有限公司 | Array substrate |
| CN106990594A (en) * | 2017-04-24 | 2017-07-28 | 惠科股份有限公司 | Liquid crystal display panel and its manufacture method and the display device of application |
| CN208705627U (en) * | 2018-10-08 | 2019-04-05 | 惠科股份有限公司 | Display panel and display |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111292696A (en) * | 2020-02-27 | 2020-06-16 | 深圳市华星光电半导体显示技术有限公司 | GOA driving circuit, GOA array substrate, display panel and display device |
| CN111292696B (en) * | 2020-02-27 | 2021-07-06 | 深圳市华星光电半导体显示技术有限公司 | GOA driving circuit, GOA array substrate, display panel and display device |
| CN112068360A (en) * | 2020-09-23 | 2020-12-11 | 北海惠科光电技术有限公司 | Array substrate, manufacturing method of array substrate and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109613775B (en) | 2020-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102243405B (en) | Display panels and manufacture method thereof | |
| CN105223747B (en) | A kind of display panel | |
| CN105425457A (en) | Liquid crystal panel and display device | |
| CN109298574B (en) | Array substrate and display panel | |
| CN103268029B (en) | A kind of display module and display | |
| WO2017113470A1 (en) | Ltps display panel and process of manufacturing same | |
| CN104412315A (en) | Display device | |
| CN101923256B (en) | Method for manufacturing liquid crystal display | |
| CN109613775A (en) | Array substrate and display device | |
| US20200142536A1 (en) | Touch control display panel | |
| US20030122978A1 (en) | Liquid crystal display device having single bodied compensating pattern and method of fabricating the same | |
| CN109950289A (en) | Display device | |
| CN109613743B (en) | Display panel and display device | |
| CN107170783A (en) | Display panel and display device | |
| CN101114073A (en) | Liquid crystal display board | |
| CN105159002B (en) | pixel structure | |
| US20180321547A1 (en) | Color filter substrate structure and liquid crystal display (lcd) using the same | |
| CN102253536B (en) | Liquid crystal display device | |
| CN106652815B (en) | Display panel and display device | |
| US20180188571A1 (en) | Display panel, manufacturing method of the display panel and display device | |
| US20190155084A1 (en) | Polymer stabilization vertical alignment (psva) liquid crystal display panel | |
| CN111679521A (en) | Display module and electronic equipment | |
| US20140367659A1 (en) | Display devices | |
| CN109633996B (en) | Liquid crystal display device | |
| CN104597673B (en) | A kind of liquid crystal display panel and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |