CN109613776B - Array substrate and display device - Google Patents

Array substrate and display device Download PDF

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Publication number
CN109613776B
CN109613776B CN201910040458.2A CN201910040458A CN109613776B CN 109613776 B CN109613776 B CN 109613776B CN 201910040458 A CN201910040458 A CN 201910040458A CN 109613776 B CN109613776 B CN 109613776B
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hollow
solid
area
array substrate
thinning
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CN109613776A (en
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黄世帅
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HKC Co Ltd
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HKC Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/13629—Multilayer wirings
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application relates to an array substrate and a display device. The array substrate includes a common trace. The public routing comprises a hollow area and a solid area. The hollow area comprises a first hollow part, and the first hollow part is used for placing conductive adhesive. The solid area is connected with the hollow-out area. The solid area includes a solid base portion and a thinned portion that are interconnected. The solid area is provided with a thinning part at one side connected with the hollow area. The thinning part is opposite to the first hollow-out part. And the thickness of the thinned portion is less than the thickness of the solid base portion. The display device can effectively prevent the problem that the distance between the array substrate and the color film substrate is enlarged due to the fact that conducting resin adhesive dispensing dislocation occurs.

Description

Array substrate and display device
Technical Field
The present application relates to the field of display technologies, and in particular, to an array substrate and a display device.
Background
With the development of display technology, liquid crystal display devices are widely used in the production and life of people. The liquid crystal display device generally includes an array substrate, a color filter substrate, and liquid crystal molecules therebetween. The color film substrate is provided with a common electrode, and the array substrate is provided with a pixel electrode. When the display device works, an electric field is formed between the common electrode and the pixel electrode to drive liquid crystal molecules.
For this purpose, a common voltage is applied to the common electrode to form an electric field. And the voltage on the common electrode is typically provided by a common trace of the display substrate. In order to make the common electrode electrically connected to the common trace, a conductive adhesive is usually disposed between the common electrode and the common trace, and the common trace is provided with a hollow transfer electrode at a position where the conductive adhesive is disposed so as to cure the conductive adhesive.
However, during the production process, the conductive paste is easily deviated to the solid portion of the common trace. At this time, the conductive adhesive station is higher, so that the gap between the array substrate and the color film substrate near the dispensing position is larger than other positions, and has relatively more liquid crystal molecules. The phase difference between the liquid crystal molecules is larger due to more liquid crystal molecules, and more light of the backlight source can be transmitted to the light emitting side. Therefore, the brightness near the dispensing position is higher than that at other positions. Particularly, in a dark state, a bright point is formed, and the display is extremely conspicuous.
Disclosure of Invention
Accordingly, in order to solve the above-mentioned problems, it is desirable to provide an array substrate and a display device capable of preventing abnormal display caused by the deviation of the conductive paste dispensing.
An array substrate, comprising:
a common trace, comprising:
the hollow area comprises a first hollow part, and the first hollow part is used for placing conductive adhesive;
the solid area is connected with the hollowed-out area and comprises a solid part and a thinning part which are mutually connected; the solid area is provided with the thinning part on one side connected with the hollowed-out area, the thinning part is opposite to the first hollowed-out part, and the thickness of the thinning part is smaller than that of the solid part.
In one embodiment, a plane perpendicular to the thickness direction of the common trace is taken as a reference plane, and an orthogonal projection of the central axis of the thinned portion on the reference plane overlaps with an orthogonal projection of the central axis of the first hollowed portion on the reference plane.
In one embodiment, a direction of the thinned portion toward the first hollowed-out portion is a first direction, a direction perpendicular to the first direction is a second direction, and a length of the thinned portion in the second direction is greater than a length of the first hollowed-out portion in the second direction.
In one embodiment, the hollow-out area further includes a second hollow-out portion, the solid area is connected to the second hollow-out portion, the second hollow-out portion surrounds the first hollow-out portion, and a distance between one side of the thinned portion, which is far away from the first hollow-out portion, and the first hollow-out portion is greater than or equal to 300 μm.
In one embodiment, the common trace has a plurality of metal layers stacked on top of each other.
In one embodiment, the number of metal layers of the thinning portion is less than the number of metal layers of the solid base portion.
In one embodiment, the number of the metal layers of the thinning part is one, and the number of the metal layers of the solid base part is two.
In one embodiment, the material of the plurality of metal layers is aluminum and/or copper.
An array substrate, comprising:
a common trace, comprising:
the hollow area comprises a first hollow part and a second hollow part, the first hollow part is used for placing conductive adhesive, and the second hollow part surrounds the first hollow part;
the solid area is connected with the second hollow-out part and comprises a solid base part and a thinning part which are connected with each other; the solid area is provided with the thinning part at one side connected with the hollowed-out area, and the thinning part is opposite to the first hollowed-out part; the thinned portion has one metal layer and the solid base has two metal layers such that the thinned portion has a thickness less than the thickness of the solid base.
A display device comprises a color film substrate, a conductive adhesive and an array substrate, wherein the color film substrate is connected with the array substrate through the conductive adhesive; the array substrate comprises a common wire; the public routing comprises a hollow area and a solid area; the hollow area comprises a first hollow part, and the first hollow part is used for placing conductive adhesive; the solid area is connected with the hollowed-out area and comprises a solid base part and a thinning part which are connected with each other; the solid area is provided with the thinning part on one side connected with the hollowed-out area, the thinning part is opposite to the first hollowed-out part, and the thickness of the thinning part is smaller than that of the solid part.
Above-mentioned array substrate, solid district includes solid this portion and subtracts the thin portion, and the thin portion setting is in the one side that links to each other with the fretwork district in the solid district. Therefore, in the production process, even if the dispensing process is abnormal, and the conductive adhesive deviates from the target dispensing position and is dispensed to the vicinity of the solid area, the conductive adhesive can stand on the thinned part with smaller thickness and can not stand on the solid part with larger thickness. Therefore, the display device can effectively prevent the problem that the distance between the array substrate and the color film substrate is enlarged due to the dislocation of the conductive adhesive during dispensing.
Drawings
FIG. 1 is a schematic diagram of a display device in one embodiment;
FIG. 2 is a schematic plan view illustrating a common trace of an embodiment of an array substrate;
fig. 3 is a schematic cross-sectional view illustrating a common trace of an embodiment of an array substrate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The display device provided by the application can be applied to liquid crystal televisions, computers, mobile phones and various other display devices.
In one embodiment, referring to fig. 1, the display device includes a color film substrate 100, a conductive adhesive 200, and an array substrate 300. The color filter substrate 100 and the array substrate 300 are connected by the conductive adhesive 200, so that the array substrate 300 can supply power to the color filter substrate 300. In the embodiment of the present application, the conductive paste 200 may be conductive silver paste, conductive gold paste, or the like. Which may include a plurality of conductive particles 210 (e.g., conductive silver balls, conductive gold balls, etc.). The plurality of conductive particles can be bonded together by an adhesive such as a matrix resin to form a conductive path. The display device typically further includes liquid crystal molecules (not shown). The liquid crystal molecules are located between the color film substrate 300 and the array substrate 300.
Specifically, the color filter substrate 100 may include a color filter substrate 110 and a common electrode 120 formed on the color filter substrate 110. The common electrode 120 is located on a side of the color filter substrate 110 facing the array substrate 300. The array substrate 300 may include a common trace 310 (see fig. 2), a thin film transistor (not shown), a pixel electrode (not shown), and the like. The common trace 310 is connected to the common electrode 120 through the conductive paste 200, and further supplies power to the common electrode 120. The thin film transistor is electrically connected with the pixel electrode and further supplies power to the pixel electrode. When the display device is powered on, a potential difference exists between the common electrode 120 and the pixel electrode to form a field, and liquid crystal molecules between the array substrate 300 and the color film substrate 100 are driven to deflect, so that light-transmitting display is performed.
In one embodiment, referring to fig. 2, the common trace 310 includes a hollow area 311 and a solid area 312. The hollow-out region 311 is located in a non-display region at the edge of the array substrate 300. The solid area 312 is connected to the hollow-out area 311 and is located at a side of the hollow-out area 311 close to the display area. The hollow-out region 311 includes a first hollow-out portion 3111. The first hollow portion 3111 is used for placing the conductive adhesive 200. That is, the first hollow portion 3111 is a transfer electrode, and is configured to conduct the electrical signal on the common trace 310 to the common electrode 120 through the conductive adhesive 200, so as to supply power to the common electrode 120. In the production process, the first hollow portion 3111 is a target dispensing position of the conductive adhesive 200.
In the present embodiment, the solid area 312 includes a solid base portion 3121 and a thinned portion 3122. Solid base portion 3121 interconnects with reduced thickness portion 3122. The thinned portion 3122 is provided on the side of the solid area 312 that is connected to the hollow area 311. Meanwhile, the thinned portion 3122 is disposed opposite to the first hollowed portion 3111. Also, the thickness of thinned portion 3122 is less than the thickness of solid base portion 3121. Therefore, in the production process, even if the dispensing process is abnormal, so that the conductive adhesive 200 deviates from the target dispensing position (i.e., the first hollow portion 3111) and is dispensed to the vicinity of the solid area 312, the conductive adhesive 200 stands on the thinned portion 3122 with a smaller thickness and does not stand on the solid portion 3121 with a larger thickness, thereby preventing the problem of the increase of the distance between the array substrate 300 and the color filter substrate 100 caused by the dispensing dislocation of the conductive adhesive 200. Therefore, the display abnormity such as dark state light leakage and the like caused by deviation of dispensing can be effectively prevented.
Here, the thinned portion 3122 is disposed opposite to the first hollow portion 3111, the entire thinned portion 3122 may be disposed opposite to the entire first hollow portion 3111, the partial thinned portion 3122 may be disposed opposite to the entire first hollow portion 3111, the entire thinned portion 3122 may be disposed opposite to the partial first hollow portion 3111, or the partial thinned portion 3122 may be disposed opposite to the partial first hollow portion 3111, and the present application is not limited thereto.
Meanwhile, the number of the thinned portions 3122 provided opposite to one first hollow portion 3111 is also not limited to one, and may be plural. This is not a limitation of the present application.
In one embodiment, during the dispensing process, the dispensing is performed toward the center of the first hollow portion 3111. Therefore, the dispensing may be deviated along the central axis of the first hollow portion 3111 (or along the vicinity of the central axis).
A plane perpendicular to the thickness direction of the common trace 310 is taken as a reference plane. In this embodiment, an orthographic projection of the central axis of the thinned portion 3122 of the solid area 312 on the reference plane overlaps with an orthographic projection of the central axis of the first hollowed portion 3111 of the hollowed area 311 on the reference plane, so that the conductive adhesive 200 with a misplaced effective guide point can stand on the thinned portion 3122 without standing on the solid portion 3121.
A direction of the thinned portion 3122 toward the first hollow portion 3111 is set to a first direction (vertical direction in fig. 2), and a direction perpendicular to the first direction is set to a second direction (horizontal direction in fig. 2). In one embodiment, the length of the thinning portion 3122 in the second direction is provided to be greater than the length of the first hollowed portion 3111 in the second direction. Furthermore, when the conductive adhesive 200 is misaligned at a position far from the central axis of the first hollow portion 3111, the conductive adhesive 200 may stand on the thinned portion 3122, but not on the solid base 3121, thereby preventing an increase in the distance between the array substrate 300 and the color filter substrate 100 due to misalignment of the conductive adhesive 200.
In the embodiment of the present application, it is also possible to set the length of the thinned portion 3122 in the second direction to be larger than the length of the first hollowed portion 3111 in the second direction while setting the orthographic projection of the central axis of the thinned portion 3122 on the reference plane to overlap with the orthographic projection of the central axis of the first hollowed portion 3111 on the reference plane. Therefore, the possible dispensing dislocation mode can be comprehensively protected.
In one embodiment, the distance d between the side of the thinned portion 3122 away from the first hollow portion 3111 and the first hollow portion 3111 is greater than or equal to 300 μm, so as to leave enough space for the conductive adhesive 200 to deviate, thereby preventing abnormal display.
In this embodiment, the hollow-out region 311 may further include a second hollow-out portion 3112. The solid area 312 is connected to the second hollow portion 3112. The second hollow portion 3112 surrounds the first hollow portion 3111. Therefore, the second hollow portion 3112 between the solid area 312 and the first hollow portion 3111 allows the conductive paste 200 to flow in when the conductive paste 200 is slightly deviated from the dispensing position. The second hollow portion 3112 and the thinned portion 3122 prevent the conductive adhesive 200 from standing on the solid portion 3121 when the dispensing position is misaligned.
The second hollow portion 3112 may be generally provided in a ring shape (not shown) surrounding the display region. One side of the display panel, which is away from the solid area 312, may be used to place a circle of sealant, so that the array substrate 300 and the color film substrate 100 are effectively sealed and assembled to form the display device.
In one embodiment, referring to fig. 3, in order to increase the conductivity of the common trace 310, the common trace 310 may be provided with a plurality of metal layers 310a stacked. The plurality of metal layers 310a have a larger thickness than the single metal layer 310a, which advantageously increases the cross-sectional area of the common trace 310, thereby effectively reducing the resistance thereof.
In one embodiment, the number of metal layers 310a providing the thinned portion 3122 is less than the number of metal layers 310a of a solid base. Therefore, the metal layers with different pattern shapes can be directly formed in sequence, so that the number of the metal layers 310a at different parts of the common trace 310 is different, and the structure of the thinned portion 3122 can be realized by reducing the number of the metal layers 310 a. Specifically, the number of the metal layers 310a of the thinned portion 3122 may be set to one, and the number of the metal layers 310a of the solid portion 3121 may be set to two. During the process, the first metal layer 310a may be deposited on the thinned portion 3122 simultaneously with the solid base portion 3121, and then formed only on the solid base portion 3121 during the formation of the second metal layer 310 a. At this time, an unnecessary process may not be added.
Of course, in the embodiment of the present application, the thinned portion 3122 of the solid area 312 may be implemented differently. For example, the thinned portion 3122 may be formed by etching a partial region after forming the solid region 312 having the same thickness.
The material of each metal layer 310a is not limited, and may be aluminum, copper, or other conductive material, which may be selected according to the actual situation. For example, in order to improve conductivity, a highly conductive material such as copper may be selected as the material of each metal layer. In order to reduce the cost, the material of each metal layer may be an inexpensive material such as aluminum. Alternatively, materials such as aluminum and copper may be selected for different metal layers, taking into account both conductivity and cost. Alternatively, the selection may be made in combination with other factors. Alternatively, in some embodiments, the common trace 310 may also be made of other conductive materials instead of metal. Of course, in the embodiment of the present application, the common trace 310 may also have only one metal layer 310 a. The present application is not limited in this regard.
In one embodiment, the array substrate 300 includes a common trace 310. The common trace 310 includes a hollow area 311 and a solid area 312. The hollow-out region 311 includes a first hollow-out portion 3111 and a second hollow-out portion 3112. The first hollow portion 3111 is used for placing the conductive adhesive 200. The conductive paste 200 includes a plurality of conductive particles 210. The second hollow portion 3112 surrounds the first hollow portion 3111. The solid area 312 connects the second hollowed-out portion 3112 and includes a solid base portion 3121 and a thinned portion 3122 connected to each other. The solid area 312 is provided with a thinned portion 3122 at a side connected to the hollowed-out area 311. The thinned portion 3122 is disposed opposite to the first hollowed portion 3111. The thinned portion 3122 has one metal layer 310a and the solid base 3121 has two metal layers 310a so that the thickness of the thinned portion 3122 is smaller than the thickness of the solid base 3121.
To sum up, the solid area of the array substrate that this application provided includes solid this portion and the portion of reducing the thickness, and the portion of reducing the thickness sets up in the one side that links to each other with the fretwork district in the solid area. Therefore, in the production process, even if the dispensing process is abnormal, and the conductive adhesive deviates from the target dispensing position and is dispensed to the vicinity of the solid area, the conductive adhesive can stand on the thinned part with smaller thickness and can not stand on the solid part with larger thickness. Therefore, the display device can effectively prevent the problem that the distance between the array substrate and the color film substrate is enlarged due to the dislocation of the conductive adhesive during dispensing.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An array substrate, comprising:
a common trace, comprising:
the hollow area comprises a first hollow part and a second hollow part, the first hollow part is used for placing conductive adhesive, and the second hollow part surrounds the first hollow part;
the solid area is provided with a second hollow part between the solid area and the first hollow part, is connected with the second hollow part and comprises a solid body part and a thinning part which are connected with each other; the solid area is provided with the thinning part on one side connected with the second hollowed-out part, the thinning part is opposite to the first hollowed-out part, and the thickness of the thinning part is smaller than that of the solid part.
2. The array substrate of claim 1, wherein a plane perpendicular to a thickness direction of the common trace is taken as a reference plane, and an orthogonal projection of a central axis of the thinned portion on the reference plane overlaps an orthogonal projection of a central axis of the first hollow portion on the reference plane.
3. The array substrate of claim 1 or 2, wherein a direction of the thinning portion toward the first hollow portion is a first direction, a direction perpendicular to the first direction is a second direction, and a length of the thinning portion in the second direction is greater than a length of the first hollow portion in the second direction.
4. The array substrate of claim 1, wherein the hollow area further comprises a second hollow portion, the solid area is connected to the second hollow portion, the second hollow portion surrounds the first hollow portion, and a distance between a side of the thinned portion away from the first hollow portion and the first hollow portion is greater than or equal to 300 μm.
5. The array substrate of claim 1, wherein the common trace has a plurality of metal layers stacked.
6. The array substrate of claim 5, wherein the number of metal layers of the thinned portion is less than the number of metal layers of the solid base portion.
7. The array substrate of claim 6, wherein the number of the metal layers of the thinned portion is one, and the number of the metal layers of the solid portion is two.
8. The array substrate of claim 5, wherein the material of the plurality of metal layers is aluminum and/or copper.
9. An array substrate, comprising:
a common trace, comprising:
the hollow area comprises a first hollow part and a second hollow part, the first hollow part is used for placing conductive adhesive, and the second hollow part surrounds the first hollow part;
the solid area is provided with a second hollow part between the solid area and the first hollow part, is connected with the second hollow part and comprises a solid body part and a thinning part which are connected with each other; the solid area is provided with the thinning part at one side connected with the hollowed-out area, and the thinning part is opposite to the first hollowed-out part; the thinned portion has one metal layer and the solid base has two metal layers such that the thinned portion has a thickness less than the thickness of the solid base.
10. The display device is characterized by comprising a color film substrate, conductive adhesive and an array substrate, wherein the color film substrate is connected with the array substrate through the conductive adhesive; the array substrate comprises a common wire; the public routing comprises a hollow area and a solid area; the hollow area comprises a first hollow part and a second hollow part, the first hollow part is used for placing conductive adhesive, and the second hollow part surrounds the first hollow part; a second hollow part is arranged between the solid area and the first hollow part and is connected with the hollow area, and the solid area comprises a solid part and a thinning part which are connected with each other; the solid area is provided with the thinning part on one side connected with the second hollowed-out part, the thinning part is opposite to the first hollowed-out part, and the thickness of the thinning part is smaller than that of the solid part.
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